TWI352547B - Methods of making speakers - Google Patents

Methods of making speakers Download PDF

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Publication number
TWI352547B
TWI352547B TW98111488A TW98111488A TWI352547B TW I352547 B TWI352547 B TW I352547B TW 98111488 A TW98111488 A TW 98111488A TW 98111488 A TW98111488 A TW 98111488A TW I352547 B TWI352547 B TW I352547B
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TW
Taiwan
Prior art keywords
diaphragm
speaker
electrode
forming
substrate
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TW98111488A
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Chinese (zh)
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TW201018253A (en
Inventor
Ming Daw Chen
Chang Ho Liou
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Ind Tech Res Inst
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Priority claimed from US12/370,599 external-priority patent/US8196282B2/en
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Publication of TW201018253A publication Critical patent/TW201018253A/en
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Publication of TWI352547B publication Critical patent/TWI352547B/en

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1352547 P51970026TW 27666twf.d〇c/n 六、發明說明: 【發明所屬之技術領域】 本發明是有關於一種揚聲器(Speakers)的製造方法,且 特別是有關於一種可用以整合連續式捲帶製程之揚聲器的 製造方法。 【先前技術】1352547 P51970026TW 27666twf.d〇c/n VI. Description of the Invention: [Technical Field] The present invention relates to a method for manufacturing a speaker, and more particularly to a method for integrating a continuous tape winding process The method of manufacturing the speaker. [Prior Art]

現今視覺與聽覺是人類最直接的兩種感官反應,因此 長久以來,科學家們極力的發展各種可再生視覺與聽覺相 關系統。目前包括揚聲器的再生方式,其主要仍是由動圈 式揚鞋粒宰整卿場。但是隨著近料來人們對於感 官品質的日益要求,以及3C產品(Computer, C〇:unicati〇n,ConsumerElectr〇nics)在追求短小、輕薄 ^提下,—種省電、輕薄、可依人體工學需求設計的揚 聲盗’不技搭配大尺寸的平面縣胃 ^ 在可以預見的明天,此方面的技 術將有大置的需要與應用的發展。Today's vision and hearing are the two most direct sensory responses of human beings. Therefore, scientists have been developing various regenerative visual and auditory related systems for a long time. At present, it includes the way of regenerating the speaker, which is still mainly caused by the moving-ring type of shoes. However, with the increasing demand for sensory quality, and 3C products (Computer, C〇: unicati〇n, ConsumerElectr〇nics) are pursuing short, light and thin, it is energy-saving, light and thin, and can be used according to the human body. Engineering needs to design the sound of the thief 'not skill with large-scale flat county stomach ^ In the foreseeable tomorrow, this aspect of technology will have a large need and application development.

驅動揚聲^分齡要分為餘、間麵射型,而 式揚聲式技=及靜電式揚聲器。動圈 的缺點,並無法將體積扁平:成=二於;=構 小及家庭觀扁平化_勢,料符絲。“越來越 壓電式揚聲ϋ彻電壓材料的 場於壓電材料所造成姑4 窀>應虽附加一電 得扁千微小化’但於聲音品質上有所 3 1352547 P51970026TW 27666hvf.d〇c/n 限制 機和如揚聲^目㈣市場主要為觀(Hi·)的耳 固定、2統靜電式揚聲^的作用原理是將兩片開孔的 直流^壓、4導電振膜形成—種電容11,藉由供給振膜 負^所2給料電極音頻的交流電壓,利用正 出:二:的靜電力,帶動導電振膜振動並將聲音輻射 要卜接向單價及龐大體_擴大機,因此無法普及。、 2揚聲n㈣,歧計方式仍採料—單體的設計 產方式,如美國第3,894,199號專利内容。 9關於靜電式揚聲器,如美_ 3,894,l99 f虎專利,主 要疋揭路-種電聲轉換器(Electr〇ac〇ustic τ贿d咖)έ士 f,f ® 1所示,包括置於兩側的固定電極(Fixed Electrode°s) ,構110與120。此固定電極結構11〇與12〇具有多個孔 洞可政佈所產生的聲音。而一振膜(Vibrating即叫⑽則配 置在固定電極結構110與120之間。而固定結構14〇則為 絕緣材料所構成,並用以固定所述的固定電極結構110、 120以及振膜130。固定電極結構11〇與12〇分別經由變壓 器150連接到-交流電壓源16〇。當交流信號傳送到固定 電極結構110與120時’電位將會交替地改變而使振膜13〇 受到兩側電㈣差異產生震動,藉以產生對應的聲音。然 而’上述配置的方式需增強聲壓輸出,因此需格外的功率 元件配合驅動,如此一來,不但裝置體積龐大,且使用元 件較多,成本亦較高。另外,由於固定結構14〇必須固定 1352547 P51970026TW 27666twf.d〇c/n 所述的固定電極結構11G、12G以及振膜m,因此 的電聲轉㈣結構無法翻可撓曲的特性。 队 另外,傳統的技術於量產上需以逐 ,聲器基本都有一固定大小或外型的限制成因二 f大量製造鱗減本,纽在独上餘達到軟1有 低驅動電壓及可撓曲等特性。 守 【發明内容】 本發明提供-種揚聲器的製造方法。在此方法中 ^極、振膜與基底。在振膜之上形成導電層。而在電極 ,、振版其中之-之上形成多個第—支撐體(sup =mbers)。在基底與振膜其中之—之上形成多個第二^ 以及基底,以便在電極與振膜之 間k供第-音至,且在麵與基底之間提供第二音室。 本發明提供另一種揚聲器的製造方法。在此方法中, 形成導電層於-振膜上,在—電極與所述_其中之—之 上形成多個第-支撐體。在—基底與所述振膜其中之一之 上形成多«二支雜。組合上述電極、振膜以及基底, 以便在電歸賴之服供第―音室,踪所述振膜鱼基 (ΐ:Γ提二第二音室。而上述方法是以捲軸式材料 (歸如㈣他她)的形式提供電極、振膜以及基底。因 此,在振膜之上形成導電層、形成多個第一支擇體: 多個第二支撐體、以及組合電極、_以及絲之步驟當 中至少一個步驟能以連續式捲帶製程(R〇u_based processing)來進行。 P51970026TW 27666Uvf.d〇c/n 【實施方式】 可撓曲或可攜式電子裝置通常具有軟、薄或可撓曲之 士,亚且其各種應用具有低驅動電壓。本發明的實施例 1由1=部分或完整的連續式捲帶製程來製造揚聲器, Μ广具有可挽曲特性的揚聲器。對於具有駐極體 (el⑽m)振膜之可撓曲揚聲器而言,可使用以 =材料的捲帶式製程。在某些情況下,可以搭配沖壓^型 (die CaSting) ' ^/^^^^(bonding) 寻方法可使衣造過程的成本有效地控制。 依照所揭露之實施例,所提出的方法在製造且有大振 =具==其他的可客製化特性之揚聲器方面 裝置的例子將連同以下所述 化的額外說明可參閱由本申= 月1日’申請號為第97J29296穿)之Λ直Ί 申請人特此併入這申請案的容(包含;^ 範圍)作為參照。 谷I匕3甲5月專利 在某些實施例中,揚聲器裝置可包括基底、位於基底 上方之振動膜片或振膜、位於振 搞 ' ^ - 支撐體以及多個第二支擒體。多個第-(^㈣被包圍在電極與振膜之間,而第二或 在振ί與基底之間。在較高腔室的空間中提供第 支沒體,而在較低腔f的空間中提供第二支撐體,這些 (S) 6 1352547 P51970026TW 27666twf.doc/n 可以稱為音室(Sound-chamber)。 在某些實施例中,支撐體可具有不同的配置圖案或高 度’這些可依照不同的應用或規格而變化。可將音室結構 放置在對應於揚聲器的傳聲孔(Soniferous hole)區域對面 之空間,也就是較高的腔室,並且第一支撐體的位置與第 二支撐體的位置可以是對稱的。音室支樓'體 (Sound-chamber Supporting Members)的結構設計及佈置可 改善揚聲器的頻率響應。在各種實施例中,根據各種設計 需求或考量,第一支撐體的數目可大於、等於或小於1 支撐體的數目。 一 在部分實關巾,平面靜電揚㈣的音找構可經由 現有製造平面靜電揚聲H的製程予以製造,因此適人 大量生產。 σ 當振膜受到外部電麗激勵時,平面 =表面依照振膜材料的電荷特性與靜電力而;形 二===繞振膜的空氣"致產生聲音。 可以是整個揚聲器的電容乘以内部的 罨%及輪入電壓。一般而言,柏^J 音輪出變魏大。 ㈣在賴上的力越大,聲 靜電揚聲器可設計成輕、镇/ 例中,具有輕、肺或可撓二Z可在某些實施 位於揚聲ϋ的傳聲孔n域對面之二之2至結構可放置在 於基底之JL之多個適當的間。日室結構可包括位 曰至支撐體,這些音室支撐體可 1352547 P51970026TW 27666twf.doc/n 以是第二支撐體。音室支撐體與支撐體可分別予以製造或 形成於基底或振膜電極之上。支撐體可使用或不使用黏著 劑(Adhesives),而放置在音室電極或振膜電極之上。而這 些音室支撐體也可以事先製造完成,並接著放置在振膜電 極與基底之間。音室支撲體的佈局(Layout)可依照一項或 多項設計考量而變化’例如振膜的靜電效應、其頻率響應 等等。 音室支撐體的佈置設計可根據平面靜電揚聲器之中 支撐體的放置方式而改變。另一方面,可根據音頻特性以 不同的圖案或高度來設計位於音室支撐體對面的平面靜電 揚聲器空間内的支撐體’這些支撐體可以是第一支撐體。 在一貝加例中’音室可包含能增強音場(s〇und的遠場 效應(far-fleld effect)及/或全向效應(omnhdirectivity effect) 之吸音材料。 在一實施例中,平面靜電揚聲器的音室結構設計可包 括音室空間内的音室支撐體。可根據例如聽覺的頻率需 要、頻率響應或其他的聽覺或結構的因素之設計考量來調 整或最佳化音室支撐體的設計。上述設計變化至少可包括 支撐體的放置方式及尚度之變化。舉例來說,音室支擇體 可具有點狀、網狀、十字形、任何其他的形狀、或兩種或 更多種形狀的組合。在不同的設計考量下公式化設計也可 包括根據聽覺的頻率需要、解響應或其他的聽覺或結構 的考量來調整任兩__音室支撐體之_距離。 利用轉印(Transfer Priming)、轉貼(1[麵如 Adhesi〇n) 1352547 P51970026TW 27666twf.doc/n 或例如喷印(Inkjet Printing)或網版印刷(Screen Printing)之 直接印刷(Direct Printing)在基底之上以便製造音室支撐 體。在另一實施例之中,可藉由直接黏著(DirectAdhesi〇n) 來製造支撐體。舉例來說,可事先製造支撐體,接著將事 先製造的支撐體放置於具有孔洞的金屬電極與振膜之間。 利用直接黏著或不直接黏著至下面的振膜或電極可將支撐 體放置於振膜或具有孔洞的金屬電極之上。在其他的實施 例中,可利用蝕刻(Etching)、光微影(Photolithography;^/ 或黏著劑配料(Adhesive-dispensing)技術來製造支撐·體。 在某些實施例中,揚聲器單元可包括單一金屬電極及 具有電荷的單一振膜。利用具有駐極體之可撓曲的振膜, 能以連續的或部分連續的捲帶式製程來製造揚聲器單元。 相反地,習知之製程可能需要特定的設計及生產流程,這 =於大量生產的相同設計而言將產生特定的、個別的揚聲 器設計。大量生產的製造方法通常根據相同的設計分別來 形成揚聲H振膜與揚聲器,這在製程期間可能難以修改。 舉例來說’可利財壓、壓鑄以及黏著製縣輯符合所 ,露之實施例之捲帶式製程以形成揚聲器的初級產品(亦 =臈)。振膜能以大面積方式形成,例如形成―捲振膜。 ,提出之製程可明顯地降低揚聲器的製造成本。尤農,捲 2的初級產品在㈣或製造各種設計上可提供可繞曲的 二可能需要大面積、不規則形狀或客製化形狀 <§又叶或具有許多變化之設計。 参照圖2,對於位在任兩個相鄰的支撐體之間的振膜 1352547 P51970026TW 27666twf.doc/n 210’揚聲器200可具有幾個工作區。振膜21〇的兩邊能以 相同方式定義或以不同方式定義其工作區。所繪示之音室 結構可具有兩個腔室空間,以便產生揚聲器的共鳴音場或 效應,其中一個位於振膜210的上方且一個位於其下方。 揚聲器200可具有多個支撐體,這些支撐體可設計成具有 特定的形狀且放置在較高及較低腔室空間之内。在一實施 例中,圖2之較尚腔室空間可以是傳聲孔區域,並且在傳 聲孔區域對面的圖2之較低腔室空間可以是音室結構 272。位於基底260與振膜210之間的較低腔室的空間可經 由位於任兩個相鄰的音室支撐體之間的多個振膜工作區來 產生揚聲器200的共鳴音場。 揚聲盗單元200可包括振膜21〇、具有多個具有孔洞 之電極層220、框架或框架支撐體(Frame Supp〇rting Member)230以及位於電極層220與振膜21〇之間的多個較 高腔室支撐體(Upper-chamber Supporting Members)240。在 位於電極層220對面的振膜210 一侧,具有可被基底26〇 及位於振膜210與基底260之間的多個音室(或較低腔室) 支撐體270包圍或部分包圍之音室結構272。振膜21〇可 包括駐極體層212及金屬薄膜電極214。在某些實施例中, 駐極體層212的上表面212a可電耦合框架支撐體23〇及支 撐體240,並且駐極體層212的下表面212b可電耦合上述 金屬薄膜電極214。絕緣層216可夾在駐極體層212與電 極214之間。 η 具有孔洞的電極層220可由金屬所構成。在一實施例 P51970026TW 27666twf.doc/, ϋ GORE-TEX㊣薄膜所構成。g〇re te職類似的材 預防水及氧的效應,因而避免駐極體層2丨2漏失其電 荷及降低其駐電效應。 940 21G的多歉作區可形成於任兩個相鄰的支樓體 240之間以及上述電極層22〇與振膜21〇之間。較高腔室 242的這些工作區可用以產生揚聲器細的共鳴音場。振 膜210的多個工作區可形成於任兩個相鄰的音室支撐體 2J0之間以及基底260與振膜21〇之間。較低腔室奶的 攻些工作區也可用喊生揚聲器的共鳴音場。可調整 支撐體240及音室支撐體27〇兩者的室中位置、高度以及 形狀作為揚聲器設計的一部分。此外,音室支擇體27 數目可大於、等於或小於支樓體240的數目,並且可直接 製造支樓體240或音室支撐體27〇於電極層22〇 $戈基底26〇 之上或其上方。 、音+室結構接近振膜以〇的金屬薄膜電極2M的表面, 並土可藉由考量揚聲器的音頻雜或其他的聽覺或結構的 =予以料。音室可包滅音轉;並且支撑體或音室 支撐體可料成各種雜。框架切體挪所形成的室空 間可在框架支禮體230之中具有音孔274,以便釋放所^ 生的聲音的壓力,並且在某類子巾產生較好的音場效應。 參照上述ffl 2,揚聲n 200可包括具有駐極體材料之 振膜210、具孔洞的電極層22〇、框架23〇、支撐體2忉及 270。尤其’振膜21〇可包括駐極體層212、金屬薄膜電極 214以及絕緣層216。 1352547 P51970026TW 27666t\vf.doc/n 具有駐極體振膜之揚聲器裝置可利用部分或完全捲 繞式製造方法來製造。例如,藉由進行例如沖壓、壓鑄及/ 或接合之製程能以捲軸方式而非以個別單元方式形成揚聲 益。在某些實施例中,上述製程可明顯地降低製造成本。 並且,以捲軸方式製造的揚聲器或揚聲器材料可提供獲得 各種設計的彈性’例如具有大面積、不規則形狀或客製化 尺寸等等之揚聲器。 連、、另式捲*ητ製私(Roll-based processing)的例子將參考 圖3至圖5予以說明。上述製程分別繪示於圖3 '圖4以 及圖5’並且可根據設計或製造考量分別選擇其變化 合來製造揚聲器或揚聲器的元件。 參照圖3 ’所綠示之製程可用以在金屬電極之上 具有支樓體之金屬電極或電極層220。金屬電極^ 可由金屬材料或鏡金屬薄膜之可撓曲的材料所構成 可撓曲的材料可以是紙或超薄的不導電 = ;體的金屬電極之製程可藉由三個製程予以達成= ==屬有=的金屬電極、形成一 ‘ r 支撐體點著至金屬電極MO的表面,或者 法將 他的黏著方法予以黏著至振膜21〇的表面=劑或其 置在金屬電極220與振膜210之間。舉例來^ ^以放 黏合至金屬電極基底的表面。支撑體具有各種形^撑體可 / ,例如 14 1352547 P51970026TW 27666twf.doc/n - 三棱柱(Trian职1ar Prism)、圓柱形、六角形或長方形。如 ‘上所述,可減-種❹種料或製造考量來改變支撐體 的放置或佈置、高度、形狀以及其他的特徵。 參照圖3 ’藉由多個滾軸(r〇Uers)32〇或其他的材料進 料機械裝置可向前驅動或進料金屬電極基底。藉由可執行 沖壓、切割(切割器或雷射切割)或蝕刻等等之裝置3ι〇能 夠在金屬電極基底之中形成孔洞,以便形成具有孔洞的^ 鲁極302。於第二步驟,可形成具有不同的形狀之多個支撐 體(如圖中支撐體304所示)’例如顆粒狀、正方形或六角 形支撐體結構都可應用於此設計。舉例來說,可利用相同 的系統或藉由另一個機械來形成支撐。 一於第二步驟,可將支撐體黏合或黏附至具有孔洞的金 屬電極302。在另一實施例中,若不需要將支撐體黏著至 金屬電極302,可省略黏合步驟。因此,可製造大量的具 有支撐體之金屬電極。舉所繪示之例子為例,所製造的金 屬電極302可具有形成於或黏著至金屬電極3〇2之支撐體 • 240。 圖4A繪示製造具有固定的框架之振膜之實施例。滾 軸410或材料進料機械裝置可用以向前驅動或進料一捲材 料。上述製程可包括形成具有超薄的導電金屬層之振膜 層、利用框架基底形成有圖案的支撐層、對振膜層進行鐵 電或處理製程以形成駐極體振膜層以及切割駐極體振膜層 以提供個別的揚聲器之振膜。 在一實施例中,可在振膜或振膜材料基底402之上形 15 1352547 P51970026TW 27666twf.doc/n 成超薄的金屬層404,例如藉由藏锻(Sputtering)、電鍵 (Plating)或塗佈(Coating)電極層。在一實施例中,可選擇、 設計或伸張振膜層的捲軸式材料以獲得適合的張力讓有圖 案的支撐層與振膜層有較佳的組合。可在振膜層之上形成 能設計或選擇適當張力之框架基底406,以便提供圖中408 所指示的框架結構。在一實施例中,框架結構408具有由 支撐層或構件409所形成的多個長方形網格(Grids)。牡适 幾層當中,框架結構408(包括振膜402及超薄金屬層404) 内的振膜層可真有適當的張力準位或表面張力,而此特性 可幫助避免使某層脫落的捲曲問題。支撐體不限於所繪示 之長方形,並且可具有上述之各種形狀或排列。 此外,可對振膜402進行處理以提供電荷。舉例來說, 具有大端放電的設備420可用以進行鐵電製程 (Ferroelectric process)或處理,例如電暈放電。在一例子 中,利用排列成陣列之探針(probes),設備42〇從苴尖端放 電可執行放電程序。在―實施例中,控制例如溫度、濕产 以及放電雜之處雜件可肋碰錢善充電效廉’。ς ,上述處理緣示為在組合框架基底4G6與振膜術^後立 二較早或較晚發生。所繪示之 圖4B繪示另一個結合具有框架結 程。參照_,滚轴41G或其他的材料 動或進料—捲材料。上述製程 的編(位於框架基底之上)與振膜層、在包含;= 1352547 P51970026TW 27666twf.doc/n 製造方法,這些製程分別緣示於圖3、圖4A以及圖5 製程⑴及㈣_巾,可如許以_方法在金屬電極 或基底之上形成支碰,這些方法包括轉寫或轉寫印刷、 印刷技術(例如網版印刷、喷墨印刷等等)、直接黏著或安 裝、光阻成長(photoresist growing)或光微影、配料、沖墨、 捲繞以及侧。可利用製程(11)、组合製程(1)之電極的支 或衣私(III)之支撐體’其方式為接合,例如在振膜、電極 的支撐體及/或基底上的聲音支撐體之上塗佈黏 以組合在一起。 丁 在另一實施例中,若整合圖3、圖4B以及圖5所示 2驟’如圖7所示,則獲得—種可包括分別應用到—捲 金屬電極、-捲麵以及-捲基底之不同的製剛、製 (II)以及製程(III)之製造方法,這些製程分縣示於圖g、 圖4B以及圖5。同樣地’例如轉寫或轉寫印刷(例 T、喷墨印刷)、直接黏著、光阻成長或光微影、配料、 冲堡、捲軌及則之技術可用⑽合支撐體卿 :利用接合的方式組合製程(1)、製程(11)以及製程_ 式可包括在賴、電_支撐體及輪底之上塗 佈黏者劑且予以組合在一起。 土 ,聲H的製造方法可包括完全捲帶絲科 :式=:經由所繪示之製程可形成具有多層結構的4 卯二圖晴示-種可應用於形成振膜之鐵電裝置 8’精由排列成陣列的探針_,可利用如圖8所示之能= Ά端放電的設備_在振m 820之上進行鐵電製程。此 19 1352547 P51970026TW 27666twf.doc/n 製程可提供均勻的鐵電效應,因而改善經由此製程所產生 的駐極體振膜的品質及/或均勻度。 ^然本發明已以實關揭露如上,然其並_以限定 $明’任何所屬技術領域中具有通常知識者,在不脫離 ft明之精神和範_ ’當可作些許之更動與潤飾,故本 圍當視後附之^請專利範圍所界定者為準。 【圖式簡單說明】 ^加上關以提供本發明的進—步理解,並且予以 :^制^而構成本說明書的—部分。附圖綠示本發明的 見施例且相其制用輯釋本發明的原理。 圖1是習知之一種電聲換能器的結構圖。 圖。圖2讀照本發明之—實施例之—種揚聲器的截面 的捲^ =、、、本1明之—貫施例之—種可撓曲的揚聲器 ^捲帶仏程之形成具有支魏的金屬電極之步驟的示意 來η疋依'本發明之—實施例之—種捲帶式製程之 形成;有固定框架的駐極體振膜之步驟的示意圖。 之形成具有固定框尸例之—種捲帶式製程 心I木的駐極體振膜之步驟的示意圖。 成且有固本發明之—實施例之—種捲帶式製程之形 成具有固^框架的音室之步驟的示意圖。 製程照本發明之-實施例之-種揚聲器的捲帶式 1352547 P51970026TW 27666twf.doc/n • 圖7是依照本發明之另一實施例之一種揚聲器的捲帶 , 式製程的示意圖。 - 圖8是依照本發明之一實施例之一種形成駐極體振膜 之步驟所使用的鐵電處理裝置的示意圖。 【主要元件符號說明】 110、120 :電極 130、210、402、820 :振膜 150 :變壓器 # 160 :電源 200:揚聲器 212 :駐極體層 212a :駐極體層的上表面 212b :駐極體層的下表面 214 :金屬薄膜電極 216 :絕緣層 220 :電極層 • 23〇 :框架支撐體 240 :較高腔室支撐體 242 :較高腔室 250 :薄膜 260、502 :基底 270 :音室支撐體 272 :音室結構 302 :金屬電極 1352547 P51970026TW 27666twf.doc/n 304 :支撐體 310 :可執行沖壓、切割或蝕刻的裝置 320、410 :滾軸 404 超薄金屬層 406 框架基底 408 框架結構 409 長方形網格The driving sounds are divided into the remaining and the inter-surface type, and the speaker-type technology and the electrostatic speaker. The shortcomings of the dynamic circle, and can not flatten the volume: into = two; = small and family view flat _ potential, material wire. "More and more piezoelectric sounds are swayed by the field of voltage materials caused by piezoelectric materials." It should be added with a small amount of electricity. But the sound quality is 3 1352547 P51970026TW 27666hvf.d 〇c/n limiter and such as Yangsheng (4) The market is mainly for the observation of (Hi·) ear fixation, the 2 system electrostatic speaker ^ is the principle of the two-hole DC voltage, 4 conductive diaphragm Forming a kind of capacitor 11, by supplying the AC voltage of the feeding electrode of the diaphragm negatively, using the electrostatic force of the positive: two: to drive the vibration of the conductive diaphragm and to connect the sound radiation to the unit price and the bulky body _ The machine is enlarged, so it cannot be popularized. 2 The sound is n (four), and the method of sampling is still collected. The design method of the monomer, such as the US Patent No. 3,894,199. 9About the electrostatic speaker, such as _ 3,894, l99 f Tiger patent, mainly to expose the road - kind of electroacoustic converter (Electr〇ac〇ustic τ bribe d coffee) gentleman f, f ® 1, including fixed electrodes (Fixed Electrode °s) placed on both sides 110 and 120. The fixed electrode structure 11〇 and 12〇 have a plurality of holes and the sound generated by the politician A vibrating membrane (Vibrating (10) is disposed between the fixed electrode structures 110 and 120. The fixing structure 14A is composed of an insulating material and is used to fix the fixed electrode structures 110, 120 and the diaphragm 130. The fixed electrode structures 11A and 12B are respectively connected to the AC voltage source 16A via the transformer 150. When the AC signal is transmitted to the fixed electrode structures 110 and 120, the potential will be alternately changed to cause the diaphragm 13 to be electrically connected to both sides. (4) The difference produces vibration, so as to generate the corresponding sound. However, the above configuration needs to enhance the sound pressure output, so the extra power component needs to be driven together, so that the device is not only bulky, but also uses more components and costs. In addition, since the fixed structure 14〇 must fix the fixed electrode structures 11G, 12G and the diaphragm m described in 1352547 P51970026TW 27666twf.d〇c/n, the electroacoustic turn (4) structure cannot be turned into a flexible characteristic. In addition, the traditional technology needs to be used in mass production. The sounder basically has a fixed size or a shape restriction. The soft 1 has low driving voltage and flexibility. The present invention provides a method for manufacturing a speaker. In this method, a film, a diaphragm and a substrate are formed. A conductive layer is formed on the diaphragm. And a plurality of first support bodies (sup =mbers) are formed on the electrodes, and the vibration plate is formed thereon. A plurality of second electrodes and a substrate are formed on the substrate and the diaphragm, so as to be in the electrodes and the diaphragm The k is supplied to the first tone, and a second sound chamber is provided between the face and the substrate. The present invention provides another method of manufacturing the speaker. In this method, a conductive layer is formed on the - diaphragm, and a plurality of first-supports are formed on the -electrode and the _. A plurality of "two-components" are formed on one of the substrate and the diaphragm. Combining the above electrode, the diaphragm and the substrate, so as to supply the first sound chamber of the diaphragm in the service room of the electric refusal (the 音: Γ提二第二音室. The above method is a reel type material The electrode, the diaphragm and the substrate are provided in the form of (d) other. Therefore, a conductive layer is formed on the diaphragm to form a plurality of first supports: a plurality of second supports, and a combined electrode, _ and silk At least one of the steps can be performed in a continuous tape winding process. P51970026TW 27666Uvf.d〇c/n [Embodiment] Flexible or portable electronic devices are usually soft, thin or flexible. Quzhishi, and its various applications have a low driving voltage. Embodiment 1 of the present invention manufactures a speaker by a 1= partial or complete continuous tape winding process, and has a speaker with a twistable characteristic. For the flexible speaker of the el (10)m diaphragm, a tape-and-loop process with a material of = can be used. In some cases, it can be used with a die type (die CaSting) ' ^/^^^^(bonding) The method of finding can effectively control the cost of the garment manufacturing process. In accordance with the disclosed embodiments, the proposed method is an example of a device that is manufactured and has a large vibration = other = customizable characteristics of the speaker. Additional descriptions along with the following description can be found by this application = month 1 The application number of the application is 97J29296. The applicant hereby incorporates the contents of this application (including; ^ range) as a reference. In some embodiments, the speaker device can include a substrate, a vibrating diaphragm or diaphragm above the substrate, a vibrating '^-support and a plurality of second legs. A plurality of - (^ (4) are enclosed between the electrode and the diaphragm, and a second or between the vibration and the substrate. The first body is provided in the space of the higher chamber, and the space in the lower cavity f A second support is provided, and these (S) 6 1352547 P51970026TW 27666twf.doc/n may be referred to as a sound-chamber. In some embodiments, the support may have a different configuration pattern or height 'these Depending on the application or specification, the chamber structure can be placed in the space opposite the Soniferous hole area of the speaker, ie the higher chamber, and the position of the first support and the second The position of the support can be symmetrical. The structural design and arrangement of the Sound-chamber Supporting Members can improve the frequency response of the speaker. In various embodiments, the first support is based on various design needs or considerations. The number of the bodies may be greater than, equal to, or less than the number of the support members. In the case of a partially closed towel, the sound finding of the plane electrostatic lift (four) can be manufactured by the existing process for manufacturing the planar electrostatic speaker H, so that a large number of people are suitable. σ When the diaphragm is excited by external electric sensation, the plane=surface depends on the charge characteristics of the diaphragm material and the electrostatic force; the shape 2===the air around the diaphragm" causes sound. It can be the capacitance of the whole speaker. Multiply the internal 罨% and the wheeling voltage. Generally speaking, the cymbal ^J sound wheel changes to Wei Da. (4) The greater the force on the singer, the acoustic static speaker can be designed to be light, town / example, with light, The lung or flexible two Z may be in the presence of two of the two opposite sides of the sounding aperture n field of the loudspeaker, to a suitable location where the structure may be placed in the JL of the substrate. The day chamber structure may include a position to the support The sound chamber support body can be 1352547 P51970026TW 27666twf.doc/n to be the second support body. The sound chamber support body and the support body can be separately manufactured or formed on the base or the diaphragm electrode. The support body can be used or not. Adhesives are used to place on the chamber electrode or diaphragm electrode. These chamber supports can also be fabricated in advance and then placed between the diaphragm electrode and the substrate. Layout can be designed according to one or more designs Considering changes such as the electrostatic effect of the diaphragm, its frequency response, etc. The layout of the chamber support can be changed according to the placement of the support in the planar electrostatic speaker. On the other hand, it can be different depending on the audio characteristics. Pattern or height to design the support in the plane of the electrostatic speaker space opposite the sound chamber support. These supports may be the first support. In a case of a case, the sound chamber may contain an enhanced sound field (s〇und The far-fleld effect and/or the omnhdirectivity effect of the sound absorbing material. In one embodiment, the sound chamber structure design of the planar electrostatic speaker can include a sound chamber support within the sound chamber space. The design of the chamber support can be adjusted or optimized based on design considerations such as auditory frequency requirements, frequency response, or other auditory or structural factors. The above design changes may include at least the change in the placement and the degree of the support. For example, the chamber accommodation body can have a dot shape, a mesh shape, a cross shape, any other shape, or a combination of two or more shapes. Formulating the design under different design considerations may also include adjusting the distance of any two __ chamber supports based on the frequency requirements of the hearing, the solution response, or other auditory or structural considerations. Transfer Priming, Transfer (1 [face], Adhesi〇n) 1352547 P51970026TW 27666twf.doc/n or Direct Printing, such as Inkjet Printing or Screen Printing, on the substrate Above to make the sound chamber support. In another embodiment, the support can be fabricated by direct adhesion (DirectAdhesi〇n). For example, the support can be manufactured in advance, and then the previously manufactured support is placed between the metal electrode having the hole and the diaphragm. The support can be placed over the diaphragm or metal electrode with holes by means of a diaphragm or electrode that is directly adhered or not directly attached to the underside. In other embodiments, the support can be fabricated using Etching, Photolithography, or Adhesive-dispensing techniques. In some embodiments, the speaker unit can include a single unit. Metal electrode and single diaphragm with charge. The speaker unit can be manufactured in a continuous or partially continuous tape-and-roll process using a flexible diaphragm with an electret. Conversely, conventional processes may require specific Design and production processes, which will produce specific, individual speaker designs for the same design in mass production. Mass-produced manufacturing methods typically form a loudspeaker H diaphragm and loudspeakers, respectively, according to the same design, during the process It may be difficult to modify. For example, 'Keli Financial Pressure, Die Casting, and Adhesive County Compliance, the tape-and-roll process of the disclosed embodiment to form the primary product of the speaker (also = 臈). The diaphragm can be used in a large area. Forming, for example, forming a "revolving diaphragm." The proposed process can significantly reduce the manufacturing cost of the speaker. Younon, Volume 2's primary product is at (4) or A variety of designs can be provided that can provide a large area, an irregular shape, or a customized shape. § Further leaves or designs with many variations. Referring to Figure 2, for any two adjacent supports The diaphragm 1352547 P51970026TW 27666twf.doc/n 210' speaker 200 can have several working areas. Both sides of the diaphragm 21 can define or define the working area in different ways in the same way. There may be two chamber spaces to create a resonant sound field or effect of the speaker, one of which is above and one below the diaphragm 210. The speaker 200 may have a plurality of supports that may be designed to have specific Shaped and placed within the upper and lower chamber spaces. In one embodiment, the more chamber space of Figure 2 may be the sound hole area and the lower cavity of Figure 2 opposite the sound hole area. The chamber space may be a sound chamber structure 272. The space of the lower chamber between the substrate 260 and the diaphragm 210 may be generated via a plurality of diaphragm working areas between any two adjacent sound chamber supports The sounding sound field of 200. The sounding unit 200 may include a diaphragm 21A, a plurality of electrode layers 220 having holes, a frame or frame support member 230, and the electrode layer 220 and the diaphragm 21. A plurality of upper-chamber support members 240 between the crucibles. On the side of the diaphragm 210 opposite the electrode layer 220, there is a substrate 26 that is disposed between the diaphragm 210 and the substrate 260. The plurality of sound chambers (or lower chambers) support body 270 surrounds or partially surrounds the sound chamber structure 272. The diaphragm 21A may include an electret layer 212 and a metal film electrode 214. In some embodiments, the upper surface 212a of the electret layer 212 can electrically couple the frame support 23 and the support 240, and the lower surface 212b of the electret layer 212 can electrically couple the metal thin film electrode 214 described above. The insulating layer 216 can be sandwiched between the electret layer 212 and the electrode 214. η The electrode layer 220 having holes may be composed of metal. In an embodiment P51970026TW 27666twf.doc/, ϋ GORE-TEX positive film. The similar material of g〇re te prevents the effects of water and oxygen, thus avoiding the electret layer 2丨2 losing its charge and reducing its electrification effect. A apology area of 940 21G may be formed between any two adjacent branch bodies 240 and between the electrode layer 22 and the diaphragm 21A. These working areas of the higher chamber 242 can be used to create a fine resonance sound field for the speaker. A plurality of working areas of the diaphragm 210 may be formed between any two adjacent sound chamber supports 2J0 and between the substrate 260 and the diaphragm 21A. The lower chamber milk can also be used to resonate the sound field of the speaker. The position, height, and shape of the chamber of both the support body 240 and the sound chamber support body 27 can be adjusted as part of the speaker design. In addition, the number of the sound chamber supporting bodies 27 may be greater than, equal to, or smaller than the number of the building body bodies 240, and the branch body 240 or the sound chamber supporting body 27 may be directly fabricated on the electrode layer 22 or the base 26 〇 or Above it. The sound + chamber structure is close to the surface of the metal film electrode 2M of the diaphragm, and the soil can be fed by considering the audio noise of the speaker or other hearing or structure. The sound chamber can be used to extinguish the sound; and the support or the sound chamber support can be made into various kinds of impurities. The chamber space formed by the frame cutout can have a sound hole 274 in the frame limb 230 to release the pressure of the generated sound and produce a better sound field effect in a certain type of sub-zone. Referring to the above ffl 2, the speaker n 200 may include a diaphragm 210 having an electret material, an electrode layer 22 having a hole, a frame 23, and supports 2 and 270. In particular, the diaphragm 21A may include an electret layer 212, a metal thin film electrode 214, and an insulating layer 216. 1352547 P51970026TW 27666t\vf.doc/n Loudspeaker units with electret diaphragms can be manufactured using partial or complete winding manufacturing methods. For example, by performing processes such as stamping, die casting, and/or bonding, the sound benefits can be formed in a reel manner rather than in individual units. In some embodiments, the above process can significantly reduce manufacturing costs. Also, speaker or speaker materials fabricated in a reel manner can provide flexibility in obtaining various designs, such as speakers having large areas, irregular shapes, custom sizes, and the like. An example of a Roll-based processing will be described with reference to Figs. 3 to 5. The above processes are illustrated in Figures 3 & 4 and Figure 5, respectively, and the components of the speaker or speaker can be fabricated by selecting variations thereof depending on design or manufacturing considerations. Referring to Fig. 3, the green process can be used to have a metal electrode or electrode layer 220 having a support body above the metal electrode. The metal electrode ^ can be made of a flexible material of a metal material or a mirror metal film. The flexible material can be paper or ultra-thin non-conductive =; the process of the body metal electrode can be achieved by three processes == = a metal electrode with =, forming a 'r support point to the surface of the metal electrode MO, or a method of adhering his adhesion method to the surface of the diaphragm 21 = or placing it on the metal electrode 220 and vibrating Between the membranes 210. For example, it is bonded to the surface of the metal electrode substrate. The support body has various shapes and/or for example, 14 1352547 P51970026TW 27666twf.doc/n - Triangular column (Trian 1ar Prism), cylindrical, hexagonal or rectangular. As described above, the placement or arrangement, height, shape, and other characteristics of the support can be varied by subtracting the seed material or manufacturing considerations. Referring to Figure 3, the metal electrode substrate can be driven or fed forward by a plurality of rollers (R〇Uers) 32 or other material feed mechanism. A hole 3 can be formed in the metal electrode substrate by means of a device 3, which can perform stamping, cutting (cutter or laser cutting) or etching, etc., to form a luer 302 having a hole. In the second step, a plurality of supports having different shapes (as shown by the support 304 in the drawing) can be formed. For example, a granular, square or hexagonal support structure can be applied to this design. For example, the same system can be utilized or formed by another machine. In the second step, the support can be bonded or adhered to the metal electrode 302 having the holes. In another embodiment, if it is not necessary to adhere the support to the metal electrode 302, the bonding step can be omitted. Therefore, a large number of metal electrodes having a support can be manufactured. Taking the illustrated example as an example, the fabricated metal electrode 302 may have a support body 240 formed or adhered to the metal electrode 3〇2. Figure 4A illustrates an embodiment of making a diaphragm having a fixed frame. Roller 410 or material feed mechanism can be used to drive or feed a roll of material forward. The above process may include forming a diaphragm layer having an ultra-thin conductive metal layer, forming a patterned support layer using the frame substrate, performing a ferroelectric or processing process on the diaphragm layer to form an electret diaphragm layer, and cutting the electret. The diaphragm layer provides a diaphragm for individual speakers. In one embodiment, an ultra-thin metal layer 404 may be formed on the diaphragm or diaphragm material substrate 402 by 15 1352547 P51970026TW 27666 twf.doc/n, for example by means of sputtering, plating or coating. Coating electrode layer. In one embodiment, the roll material of the diaphragm layer can be selected, designed or stretched to achieve a suitable tension for a preferred combination of the patterned support layer and the diaphragm layer. A frame substrate 406 that can be designed or selected for proper tension can be formed over the diaphragm layer to provide the frame structure indicated by 408 in the Figure. In an embodiment, the frame structure 408 has a plurality of rectangular grids formed by a support layer or member 409. Among the several layers of the yam, the diaphragm layer in the frame structure 408 (including the diaphragm 402 and the ultra-thin metal layer 404) can have a proper tension level or surface tension, and this feature can help avoid the problem of curling off a layer. . The support is not limited to the illustrated rectangle and may have various shapes or arrangements as described above. Additionally, diaphragm 402 can be processed to provide electrical charge. For example, device 420 with large end discharges can be used to perform a Ferroelectric process or process, such as corona discharge. In one example, the devices 42 are discharged from the tip of the crucible using an array of probes to discharge the executable discharge program. In the embodiment, the control of, for example, temperature, wet production, and miscellaneous parts of the discharge may be arbitrarily charged and charged. ς , the above treatment is shown to occur earlier or later in the composite frame substrate 4G6 and the diaphragm. Figure 4B depicts another combination having a frame finish. Refer to _, Roller 41G or other material moving or feed-roll material. The above process is programmed (on the frame substrate) and the diaphragm layer is included; = 1352547 P51970026TW 27666twf.doc/n manufacturing method, these processes are shown in Fig. 3, Fig. 4A and Fig. 5 respectively (1) and (4) The method can be used to form a bump on the metal electrode or substrate. These methods include transfer or transfer printing, printing techniques (such as screen printing, inkjet printing, etc.), direct adhesion or mounting, and photoresist growth. (photoresist growing) or photolithography, furnishing, inking, winding, and side. The process (11), the support of the electrode of the combination process (1) or the support of the clothing (III) may be used in the manner of bonding, for example, on the diaphragm, the support of the electrode and/or the sound support on the substrate. Apply the top coat together. In another embodiment, if the two steps shown in FIG. 3, FIG. 4B and FIG. 5 are integrated as shown in FIG. 7, the obtained types may include respectively applied to the rolled metal electrode, the rolled surface, and the rolled substrate. The manufacturing methods of the different systems, the system (II) and the process (III) are shown in Fig. g, Fig. 4B and Fig. 5. Similarly, 'for example, transfer or transfer printing (eg T, inkjet printing), direct adhesion, photoresist growth or photolithography, ingredients, punching, rolling rail and the technology available (10) support body: use the joint The method of combining the process (1), the process (11), and the process _ can include applying the adhesive on the lava, the support, and the bottom of the wheel and combining them. The manufacturing method of the soil, the sound H may include a complete winding tape: formula =: a four-layer structure having a multi-layer structure can be formed through the illustrated process - a ferroelectric device 8' which can be applied to form a diaphragm The fine electrode is arranged in an array of probes _, and the ferroelectric process can be performed on the vibration m 820 by using the device capable of = terminal discharge as shown in FIG. This 19 1352547 P51970026TW 27666twf.doc/n process provides a uniform ferroelectric effect, thereby improving the quality and/or uniformity of the electret diaphragm produced by this process. However, the present invention has been disclosed above in terms of actuality, and it is intended to limit the scope of the invention to any of the technical fields of the art, and it is possible to make some changes and refinements without departing from the spirit of ft. The scope of the patent application is subject to the scope of the patent. [Simple Description of the Drawings] ^Additional to provide a further understanding of the present invention, and to constitute a part of the present specification. BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings illustrate the principles of the invention and the invention. 1 is a structural view of a conventional electroacoustic transducer. Figure. 2 is a perspective view of a cross-section of a speaker of the present invention - a flexible speaker of the present invention is formed by a roll of a cross section of the speaker. The steps of the steps of the electrode are exemplified by the formation of the roll-to-roll process of the present invention; the schematic of the step of the electret diaphragm of the fixed frame. A schematic diagram of the steps of forming an electret diaphragm having a fixed-frame corpse-type tape-type process. There is shown a schematic view of the steps of forming a sound chamber having a solid frame by the method of the invention. The present invention is a roll-to-roll type of a speaker of the present invention. 1352547 P51970026TW 27666twf.doc/n FIG. 7 is a schematic view showing a winding process of a speaker according to another embodiment of the present invention. - Figure 8 is a schematic illustration of a ferroelectric processing apparatus used in the step of forming an electret diaphragm in accordance with an embodiment of the present invention. [Description of main component symbols] 110, 120: electrodes 130, 210, 402, 820: diaphragm 150: transformer # 160: power supply 200: speaker 212: electret layer 212a: upper surface 212b of the electret layer: electret layer Lower surface 214: metal thin film electrode 216: insulating layer 220: electrode layer • 23 〇: frame support 240: higher chamber support 242: higher chamber 250: film 260, 502: substrate 270: sound chamber support 272: Sound chamber structure 302: metal electrode 1352547 P51970026TW 27666twf.doc/n 304: support body 310: means for performing stamping, cutting or etching 320, 410: roller 404 ultra-thin metal layer 406 frame base 408 frame structure 409 rectangular grid

420、800 :具尖端放電之設備 504 :較低腔室支撐體 810 :探針420, 800: equipment with tip discharge 504: lower chamber support 810: probe

(S) 22(S) 22

Claims (1)

丄 100-6-23 忒6月j修正替換頁 七、申請專利範圍: 1. 一種揚聲器的製造方法,包括 提供電極; 膜’對所述振膜進行鐵電製程以形成駐極體振 二-°亥鐵電製程包括藉由排列成陣列的多個探針的尖 鳊放電在所述振膜上進行該鐵電製程; 在所述振膜之上形成導電層; 在所述電極與所述振膜之—之上形成多個第一支撐 體; 提供基底; 在所述基底與所述振膜之一之上形成多個第二支撐 體;以及 組合所述電極、所述振膜以及所述基底 ,以便在所述 電極與所述振膜之S提供第—音室,且在所述振膜與所述 基底之間提供第二音室。 2. 如申請專利範圍第1項所述之揚聲器的製造方法, 其中以捲軸式材料的形式提供所述電極、所述振膜以及所 述基底當中至少一個。 3. 如申請專利範圍第i項所述之揚聲器的製造方法, 更包括切騎組合之所述電極、所述振膜以及所述基底以 形成至少一個揚聲器。 4. 如申睛專利範圍第1項所述之揚聲器的製造方法, 更包括在所述振膜之上形成有圖案的支撐層。 23 丄乃2547丄100-6-23 忒June j correction replacement page VII. Patent application scope: 1. A method for manufacturing a speaker, comprising providing an electrode; a film 'ferroelectric process for the diaphragm to form an electret body vibration II- The ferroelectric process includes performing the ferroelectric process on the diaphragm by a tip discharge of a plurality of probes arranged in an array; forming a conductive layer over the diaphragm; at the electrode and the Forming a plurality of first supports on the diaphragm; providing a substrate; forming a plurality of second supports on one of the substrate and the diaphragm; and combining the electrodes, the diaphragm, and the The substrate is provided to provide a first sound chamber between the electrode and the diaphragm S, and a second sound chamber is provided between the diaphragm and the substrate. 2. The method of manufacturing a speaker according to claim 1, wherein the electrode, the diaphragm, and at least one of the substrates are provided in the form of a roll material. 3. The method of manufacturing a speaker according to claim i, further comprising the electrode of the cut-and-ride combination, the diaphragm, and the substrate to form at least one speaker. 4. The method of manufacturing a speaker according to claim 1, further comprising forming a patterned support layer on the diaphragm. 23 丄乃 2547 100-6-23 範:第1項所述之揚聲器的製造方法, 處理所振膜之步驟包括以包含渴 之受控制的外部條件在所述振ς之=行^製 更包括形:揚聲器的製造方法, 以提供至少一個具有堆叠』及所述電極之框架 7·如申請專利範圍第!項所述之揚 更包括移賴述電極的—A 方法’ 個孔洞。 的心以便在所述電極之中提供多 8. 如申請專利範圍第i項所述之 其中所述第一支禮體位於所述第一音室^的^方法, 二支樓體位於所述第二音室之巾。之中’並且所述第 9. 如申請專利範園第!項所述 其中所述電極是由金屬薄膜與 :: = , 當中至少一種材料所構成的。 、之了撓曲的材料 10. 如申請專利範園第9項所述 法,其中所述可撓曲的材料包 二導電 中至少一種材料。 涛的不導電材料當 11.如申請專利範圍第】項所述 法,其中所述第一支撑體與所述方 是以圓形、長方形、三角形以及六角形當至:一個 來形成。 鬥〜田中至少—種形狀 i2.如申請專利範圍第1項所述之揚聲器的製造方 24 1352547 修正替換頁 100-6-23 法,其中在所述振膜之上形成所述導電層之步驟包括在所 述振膜之上以濺鍍、電鍍以及塗佈當中至少一種方 所述導電層。 13. 如申請專利範圍帛i項所述之揚聲器的製造方 法’其中在所述電極與所述振膜之—之上形成所述多 一支撐體之步驟包括: 形成所述多個第一支撑體;以及 之一=述多個第-支龍放置於所述電極與所述振膜 14. 如申請專利範圍帛i項所述之揚聲器的 法:其中摘述基底與所述振社—之上形朗 二支撐體之步驟包括: 弟 形成所述多個第二支撐體;以及 之一=述多個第二支賴放置於所述基底與所述振膜 15. 如巾請專利範圍第!項所述之揚聲 法,更包括在所述基底與所述振膜之—之表&方 與所述振膜之-之上至少-部分的所述第—切^電極 相對應之位置,形成至少—部分的所述第二支^體。、立置 如中請專利範圍第丨項所述之揚聲器 更包括至少根據當作駐極體振膜的 二2 性與要製造的揚聲器的頻率響應當中至少一::,電特 所述第-支樓體與所述第二支撐體當中至 供排列 17. —種揚聲器的製造方法,包括: 之圖案。 25 1352547 1 6月⑽日修正刪 100-6-23 提供電極; 提供振膜; 在所述振膜之上形成導電層; 在所述電極與所述振膜之一之上形成多個第一支撐 體; 提供基底; 在所述基底與所述振膜之一之上形成多個第二 體;以及 # 、’且&所述電極、所述振膜以及所述基底,以便在所述 電極與所述振膜之間提供第—音室,且在所述振膜與所述 基底之間提供第二音室, 其中以捲軸式材料的形式提供所述電極、所述振膜以 及所述基底w中至少—個,並且在所述振膜之上形成所述 導電層之步驟;在所述電極與所述振膜之—之上形成所述 多個第一支撐體之步驟;在所述基底與所述振膜之一之上 形成所述多個第二支雜之步驟;錢組合所述電極、所 述振膜以及所述基底之步驟當中至少一個步驟包 捲帶製程。 18.如申請專利範圍第17項所述之揚聲器的製造方 法,更包括切割所述電極、所述振膜以及所述基底之三層 結構以形成至少一個揚聲器。 、I9.如申請專利範圍第17項所述之揚聲器的製造方 法,更包括在所述振膜之上形成有圖案的支撐層。 20.如申請專利範圍第17項所述之揚聲器的製造方 26 47 47100-6-23. The method of manufacturing the speaker according to Item 1, the step of processing the diaphragm includes: controlling the external condition of the thirst to include the shape of the speaker: a manufacturing method to provide at least one frame having the stack and the electrode 7 as claimed in the patent scope! The mention of the item further includes the hole of the -A method of the electrode. The heart is provided in the electrode to provide a plurality of 8. The method according to the item i of claim 1 wherein the first church is located in the first chamber, the two buildings are located in the The second chamber of the towel. Among the 'and the 9.th as the patent application Fan Park! The electrode is composed of a metal film and :: = , at least one of the materials. The material of the flexure 10. The method of claim 9, wherein the flexible material comprises at least one of two conductive materials. The non-conductive material of Tao. 11. The method of claim 1, wherein the first support and the square are formed by a circle, a rectangle, a triangle, and a hexagon. At least one of the shapes i2. The manufacturer of the speaker according to the first aspect of the patent application No. 2 1352547, the replacement page 100-6-23, wherein the step of forming the conductive layer over the diaphragm The conductive layer is included on at least one of sputtering, plating, and coating over the diaphragm. 13. The method of manufacturing a speaker according to the invention of claim 2, wherein the forming the plurality of supports on the electrode and the diaphragm comprises: forming the plurality of first supports And one of the plurality of first-dragons placed on the electrode and the diaphragm 14. The method of the speaker as described in the patent application 帛i: wherein the base and the Zhenshe- The step of forming the upper support body includes: forming the plurality of second support bodies; and one of the plurality of second support members is placed on the substrate and the diaphragm 15. ! The speaker method of the present invention further includes a position corresponding to the first-cut electrode of the substrate and the diaphragm and the at least part of the diaphragm Forming at least a portion of the second support. The speaker according to the above-mentioned patent scope is further included, at least according to at least one of the frequency response of the speaker to be manufactured as the electret diaphragm and the speaker to be manufactured:: And a manufacturing method of the speaker for the arrangement of the speaker body and the second support body, comprising: a pattern. 25 1352547 1 June (10) day correction delete 100-6-23 provide electrode; provide diaphragm; form a conductive layer on the diaphragm; form a plurality of first on the electrode and one of the diaphragm a support; providing a substrate; forming a plurality of second bodies on one of the substrate and the diaphragm; and #, 'and & the electrodes, the diaphragm, and the substrate to Providing a first sound chamber between the electrode and the diaphragm, and providing a second sound chamber between the diaphragm and the substrate, wherein the electrode, the diaphragm and the body are provided in the form of a roll material a step of forming at least one of the substrates w and forming the conductive layer over the diaphragm; forming the plurality of first supports on the electrode and the diaphragm; Forming the plurality of second branchings on the substrate and the one of the diaphragms; at least one of the steps of combining the electrodes, the diaphragm, and the substrate comprises a tape winding process. 18. The method of fabricating a speaker of claim 17, further comprising cutting the electrode, the diaphragm, and the three-layer structure of the substrate to form at least one speaker. The method of manufacturing a speaker according to claim 17, further comprising forming a patterned support layer on the diaphragm. 20. The manufacturer of the loudspeaker as described in claim 17 of the patent scope 26 47 47 100-6-23 法,更包括處理所述振膜以形成駐極體振膜。 法,H申請專利範圍第20項所述之揚聲器的製造方 電製程中處理所述振膜之步驟包括在所述振膜之上進行鐵 法,Γφ如/請專利範圍第20項所述之揚聲器的製造方 當步驟包括以包含濕度及溫度條件 電製程^ 制的外部條件在所述振膜之上進行鐵 法,i3二申請專利範圍第20項所述之揚聲器的製造方 個探針的!之步驟包括藉由在排列成陣列的多 24 f 顧之上進行鐵電製程。 法,圍第17項所述之揚聲器的製造方 框令述基底、所述振臈以及所述電極之 忙木以七供至4-個具鋒疊結構之揚聲器。 =如申請專利範圍帛17項所述之揚 法,更包括移除所述電極的 方 供多個孔洞。 |刀以便在所逃電極之中提 26. 如申請專利範圍第 土立中所、十、笛+ 項所述之揚聲器的製造方 法,其中所逃第-支撑體位於所述第一 述第二支撐體位於所述第二音室之中。 +並且所 27. 如申δ青專利範圍第17 j§张、+、 本,立中所沭雪;K a丄 、迷之揚聲器的製造方 ίΓΙ 疋由金屬薄膜或鑛金屬薄膜之可挽曲的 材料當中至少-種㈣。 專膜之叮撓曲的 28. 如申請專利範圍第27項所述之揚聲器的製造方 盖6月2§修正替換頁 100-6-23 中至少-種材〔料Γ曲的材料包括紙與超薄的不導電材料當 法:^17項所述之揚聲器的製造方 是以圓形、長方形、支撐體當中至少-個 來形成。 角^及,、角形當中至少一種形狀 法,^之揚聲_造方 所述導電層。電鑛以及塗佈當令至少一種方式處理 2由如申請專利範圍第17項所述之揚聲器的製造方 二支撐與所述一上形成所述多個第 形成所述多個第一支撐體;以及 將所述多個第-支撑體放置於所述電極與所述振膜 之一之上。 32. 如申請專利範圍第π項所述之揚聲器的製造方 法’其中在所述基底與所述振膜之一之上形成所述多個第 二支撐體之步驟包括: 形成所述多個第二支撐體;以及 將所述多個第二支撐體放置於所述基底與所述振膜 之一之上。 33. 如申請專利範圍第17項所述之揚聲器的製造方 法,其中在所述基底與所述振膜之一之上且與所述電極與 28The 100-6-23 method further includes treating the diaphragm to form an electret diaphragm. The method of processing the diaphragm in the manufacturing process of the speaker of the invention of claim 20, comprising the method of performing the iron method on the diaphragm, Γφ as / please refer to the scope of claim 20 The manufacturing method of the speaker includes performing an iron method on the diaphragm under external conditions including a humidity and a temperature condition, and the probe of the speaker of the invention of claim 20 is applied. The steps include performing a ferroelectric process on top of multiple arrays arranged in an array. The method of manufacturing the speaker described in item 17 indicates that the substrate, the vibrating body, and the busy wood of the electrode are supplied by seven to four speakers having a front-end structure. = The method of claim 17, wherein the method of removing the electrode is provided for a plurality of holes. The knives are provided in the escaped electrode. 26. The method for manufacturing a speaker according to the patent application No. 1, No. 4-1, wherein the escaped first support is located in the first second A support is located in the second chamber. + and 27. 27. Such as the application of the δ green patent range 17 j § Zhang, +, Ben, Lizhong 沭 snow; K a 丄, fan of the speaker manufacturer ΓΙ 疋 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属 金属At least one of the materials (four).专 叮 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 28 Ultra-thin non-conductive material method: The speaker of the item referred to in item 17 is formed by at least one of a circular shape, a rectangular shape, and a support body. At least one of the angles ^ and , and the shape of the angle, the sound of the sound _ the square of the conductive layer. The electric ore and the coating are processed in at least one manner, and the plurality of first forming bodies are formed by forming the plurality of first forming bodies of the speaker as described in claim 17 of the patent application; The plurality of first-supports are placed on one of the electrodes and the diaphragm. 32. The method of manufacturing a speaker according to claim π, wherein the forming the plurality of second supports on one of the substrate and the diaphragm comprises: forming the plurality of a second support; and placing the plurality of second supports on the substrate and one of the diaphragms. The method of manufacturing a speaker according to claim 17, wherein the substrate and one of the diaphragms and the electrodes are 100-6-23 所述振膜之一之上至小 對應之位置,形成1少a刀的所迷弟一支撐體的位置相 34.如申請專料所迷第二支撐體。 冰,立中至Φ奸诚先2弗17項所述之揚聲器的製造方 2 g ^田卞駐極體振膜的所述振膜的靜電特性 與要彖过的揚聲H的頻转應當中至少—項來提供排列所 述第〆支撐體與所述第二支撐體當中至少一個之圖案。 29100-6-23 One of the diaphragms is located at a position corresponding to a small one, forming a position phase of a support body of a less a knife. 34. A second support body as claimed in the application. Ice, Lizhong to Φ 诚 先 2 2 2 弗 17 17 speaker of the manufacturer of the speaker 2 g ^ 卞 卞 卞 卞 的 的 的 的 的 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电 静电At least the item provides a pattern for arranging at least one of the second support and the second support. 29
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DE102013221140A1 (en) * 2013-10-17 2015-04-23 Robert Bosch Gmbh Electret
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