TWI351209B - Electronic apparatus and flexible printed circuit board thereof - Google Patents

Electronic apparatus and flexible printed circuit board thereof

Info

Publication number
TWI351209B
TWI351209B TW096127144A TW96127144A TWI351209B TW I351209 B TWI351209 B TW I351209B TW 096127144 A TW096127144 A TW 096127144A TW 96127144 A TW96127144 A TW 96127144A TW I351209 B TWI351209 B TW I351209B
Authority
TW
Taiwan
Prior art keywords
circuit board
printed circuit
electronic apparatus
flexible printed
flexible
Prior art date
Application number
TW096127144A
Other languages
English (en)
Other versions
TW200906137A (en
Inventor
Chinchung Shih
Ching Shih Chen
Original Assignee
High Tech Comp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by High Tech Comp Corp filed Critical High Tech Comp Corp
Priority to TW096127144A priority Critical patent/TWI351209B/zh
Priority to DE602008001212T priority patent/DE602008001212D1/de
Priority to EP08157535A priority patent/EP2019537B1/en
Priority to US12/157,750 priority patent/US7996052B2/en
Publication of TW200906137A publication Critical patent/TW200906137A/zh
Application granted granted Critical
Publication of TWI351209B publication Critical patent/TWI351209B/zh

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0274Details of the structure or mounting of specific components for an electrical connector module
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0206Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings
    • H04M1/0208Portable telephones comprising a plurality of mechanically joined movable body parts, e.g. hinged housings characterized by the relative motions of the body parts
    • H04M1/0235Slidable or telescopic telephones, i.e. with a relative translation movement of the body parts; Telephones using a combination of translation and other relative motions of the body parts
    • H04M1/0239Sliding mechanism with two degree of freedom, e.g. translation in two different directions
TW096127144A 2007-07-25 2007-07-25 Electronic apparatus and flexible printed circuit board thereof TWI351209B (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW096127144A TWI351209B (en) 2007-07-25 2007-07-25 Electronic apparatus and flexible printed circuit board thereof
DE602008001212T DE602008001212D1 (de) 2007-07-25 2008-06-04 Elektronische Vorrichtung und flexible Schaltplatte
EP08157535A EP2019537B1 (en) 2007-07-25 2008-06-04 Electronic apparatus and flexible circuit board
US12/157,750 US7996052B2 (en) 2007-07-25 2008-06-13 Electronic apparatus and flexible circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW096127144A TWI351209B (en) 2007-07-25 2007-07-25 Electronic apparatus and flexible printed circuit board thereof

Publications (2)

Publication Number Publication Date
TW200906137A TW200906137A (en) 2009-02-01
TWI351209B true TWI351209B (en) 2011-10-21

Family

ID=39832315

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096127144A TWI351209B (en) 2007-07-25 2007-07-25 Electronic apparatus and flexible printed circuit board thereof

Country Status (4)

Country Link
US (1) US7996052B2 (zh)
EP (1) EP2019537B1 (zh)
DE (1) DE602008001212D1 (zh)
TW (1) TWI351209B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI387427B (zh) * 2009-01-22 2013-02-21 Asustek Comp Inc 手持電子裝置
TWI424804B (zh) 2009-09-02 2014-01-21 Htc Corp 電子裝置及其連接機構
CN102014177B (zh) * 2009-09-04 2013-09-11 宏达国际电子股份有限公司 电子装置
CN102014178B (zh) * 2009-09-04 2013-07-31 宏达国际电子股份有限公司 电子装置
US8749962B2 (en) * 2011-02-07 2014-06-10 Qualcomm Incorporated Keypad assembly with a contoured keypad facade for a mobile computing device
TWI429375B (zh) * 2011-11-18 2014-03-01 Wistron Corp 具有軟性電路板導引機構之電子裝置
US20130163158A1 (en) * 2011-12-02 2013-06-27 Sony Mobile Communications Japan, Inc. Terminal apparatus
KR102216674B1 (ko) * 2014-02-10 2021-02-18 삼성디스플레이 주식회사 폴딩 가능한 디스플레이 장치
USD896809S1 (en) * 2018-02-28 2020-09-22 Shenzhen Hastech Industries Co., Ltd. Bluetooth keyboard
USD902928S1 (en) * 2018-07-12 2020-11-24 Shenzhen Hastech Industries Co., Ltd. Bluetooth keyboard
USD925534S1 (en) * 2020-02-18 2021-07-20 Wen Ma Air mouse keyboard

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AUPN755196A0 (en) * 1996-01-15 1996-02-08 Benson, Keith Improvements relating to mobile phones
KR100721337B1 (ko) * 2004-12-22 2007-05-28 엘지전자 주식회사 사이드 슬라이딩형 전자장치
US20070142101A1 (en) * 2005-08-23 2007-06-21 Sudhir Seshagiri Mobile electronic device having a rotatable keypad
KR100810263B1 (ko) * 2005-10-11 2008-03-07 삼성전자주식회사 휴대용 단말기의 키패드, 슬라이딩 모듈 및 그의 연성 회로
US7520781B2 (en) * 2006-03-08 2009-04-21 Microelectronics Assembly Technologies Thin multichip flex-module
US7596396B2 (en) * 2006-05-26 2009-09-29 Sony Ericsson Mobile Communications Ab Flexible gaskets for wireless terminals with sliding members

Also Published As

Publication number Publication date
DE602008001212D1 (de) 2010-06-24
EP2019537A2 (en) 2009-01-28
EP2019537B1 (en) 2010-05-12
US7996052B2 (en) 2011-08-09
US20090027841A1 (en) 2009-01-29
EP2019537A3 (en) 2009-03-25
TW200906137A (en) 2009-02-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees