TWI350824B - A pre-fixed position thermal fracturing method of brittle material and device for the same - Google Patents

A pre-fixed position thermal fracturing method of brittle material and device for the same

Info

Publication number
TWI350824B
TWI350824B TW095132078A TW95132078A TWI350824B TW I350824 B TWI350824 B TW I350824B TW 095132078 A TW095132078 A TW 095132078A TW 95132078 A TW95132078 A TW 95132078A TW I350824 B TWI350824 B TW I350824B
Authority
TW
Taiwan
Prior art keywords
same
fixed position
brittle material
fracturing method
position thermal
Prior art date
Application number
TW095132078A
Other languages
English (en)
Other versions
TW200811072A (en
Inventor
Wen Hong Wu
Kuo Cheng Huang
Shih Feng Tseng
Original Assignee
Nat Applied Res Laboratories
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Applied Res Laboratories filed Critical Nat Applied Res Laboratories
Priority to TW095132078A priority Critical patent/TWI350824B/zh
Publication of TW200811072A publication Critical patent/TW200811072A/zh
Application granted granted Critical
Publication of TWI350824B publication Critical patent/TWI350824B/zh

Links

TW095132078A 2006-08-30 2006-08-30 A pre-fixed position thermal fracturing method of brittle material and device for the same TWI350824B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW095132078A TWI350824B (en) 2006-08-30 2006-08-30 A pre-fixed position thermal fracturing method of brittle material and device for the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW095132078A TWI350824B (en) 2006-08-30 2006-08-30 A pre-fixed position thermal fracturing method of brittle material and device for the same

Publications (2)

Publication Number Publication Date
TW200811072A TW200811072A (en) 2008-03-01
TWI350824B true TWI350824B (en) 2011-10-21

Family

ID=44767619

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095132078A TWI350824B (en) 2006-08-30 2006-08-30 A pre-fixed position thermal fracturing method of brittle material and device for the same

Country Status (1)

Country Link
TW (1) TWI350824B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
KR101355807B1 (ko) * 2012-09-11 2014-02-03 로체 시스템즈(주) 비금속 재료의 곡선 절단방법
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby

Also Published As

Publication number Publication date
TW200811072A (en) 2008-03-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees