TWI350598B - Side view type led package - Google Patents

Side view type led package

Info

Publication number
TWI350598B
TWI350598B TW096123198A TW96123198A TWI350598B TW I350598 B TWI350598 B TW I350598B TW 096123198 A TW096123198 A TW 096123198A TW 96123198 A TW96123198 A TW 96123198A TW I350598 B TWI350598 B TW I350598B
Authority
TW
Taiwan
Prior art keywords
led package
type led
view type
view
package
Prior art date
Application number
TW096123198A
Other languages
English (en)
Other versions
TW200807772A (en
Inventor
Nam Young Kim
Myung Hee Lee
Kyoung Bo Han
Tae Kwang Kim
Original Assignee
Seoul Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020060057853A external-priority patent/KR100747642B1/ko
Priority claimed from KR1020060057854A external-priority patent/KR100749666B1/ko
Application filed by Seoul Semiconductor Co Ltd filed Critical Seoul Semiconductor Co Ltd
Publication of TW200807772A publication Critical patent/TW200807772A/zh
Application granted granted Critical
Publication of TWI350598B publication Critical patent/TWI350598B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
TW096123198A 2006-06-27 2007-06-27 Side view type led package TWI350598B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020060057853A KR100747642B1 (ko) 2006-06-27 2006-06-27 측면 발광형 ｌｅｄ 패키지
KR1020060057854A KR100749666B1 (ko) 2006-06-27 2006-06-27 방열돌기를 갖는 측면 발광형 ｌｅｄ 패키지

Publications (2)

Publication Number Publication Date
TW200807772A TW200807772A (en) 2008-02-01
TWI350598B true TWI350598B (en) 2011-10-11

Family

ID=38845782

Family Applications (2)

Application Number Title Priority Date Filing Date
TW100106485A TWI384655B (zh) 2006-06-27 2007-06-27 側視式ｌｅｄ封裝
TW096123198A TWI350598B (en) 2006-06-27 2007-06-27 Side view type led package

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW100106485A TWI384655B (zh) 2006-06-27 2007-06-27 側視式ｌｅｄ封裝

Country Status (3)

Country Link
US (2) US7804105B2 (zh)
TW (2) TWI384655B (zh)
WO (1) WO2008002068A1 (zh)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008002068A1 (en) * 2006-06-27 2008-01-03 Seoul Semiconductor Co., Ltd. Side view type led package
JP2010003743A (ja) * 2008-06-18 2010-01-07 Toshiba Corp 発光装置
US9022632B2 (en) * 2008-07-03 2015-05-05 Samsung Electronics Co., Ltd. LED package and a backlight unit unit comprising said LED package
US8120055B2 (en) 2009-04-20 2012-02-21 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light source
KR101662487B1 (ko) * 2009-10-27 2016-10-17 삼성전자주식회사 백라이트 유닛
KR101028195B1 (ko) 2010-01-18 2011-04-11 엘지이노텍 주식회사 발광 소자 패키지 및 이를 구비한 라이트 유닛
KR200462269Y1 (ko) 2010-03-30 2012-09-03 에스디아이 코퍼레이션 향상된 신뢰성을 구비한 발광 장치 패키지 프레임
US9159893B2 (en) * 2010-09-03 2015-10-13 Nichia Corporation Light emitting device including lead having terminal part and exposed part, and method for manufacturing the same
CN202024182U (zh) * 2010-12-02 2011-11-02 旭丽电子(广州)有限公司 背光模块的光源装置及其led封装结构
US9081226B2 (en) * 2012-03-29 2015-07-14 Samsung Display Co., Ltd. Light-emitting module
DE102012109139A1 (de) * 2012-09-27 2014-03-27 Osram Opto Semiconductors Gmbh Gehäuse für ein optoelektronisches Bauelement, Elektronische Baugruppe, Verfahren zum Herstellen von Gehäusen und Verfahren zum Herstellen elektronischer Baugruppen
DE102013103226A1 (de) * 2013-03-28 2014-10-02 Osram Opto Semiconductors Gmbh Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements
KR102173117B1 (ko) * 2014-03-13 2020-11-03 엘지이노텍 주식회사 차량용 조명유닛
JP6578735B2 (ja) 2014-05-21 2019-09-25 日亜化学工業株式会社 半導体装置の実装構造、バックライト装置及び実装基板
KR101532878B1 (ko) * 2014-05-29 2015-06-30 성균관대학교산학협력단 발광다이오드 패키지
JP6521017B2 (ja) * 2017-09-29 2019-05-29 日亜化学工業株式会社 発光装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3636079B2 (ja) 2001-01-26 2005-04-06 日亜化学工業株式会社 パッケージ成形体と発光装置
JP3910144B2 (ja) * 2003-01-06 2007-04-25 シャープ株式会社 半導体発光装置およびその製造方法
JP4370158B2 (ja) * 2003-12-24 2009-11-25 シャープ株式会社 光結合器およびそれを用いた電子機器
KR100616597B1 (ko) * 2004-07-28 2006-08-28 삼성전기주식회사 광장치용 ｌｅｄ 패키지 및 어셈블리
US20060135156A1 (en) * 2004-12-21 2006-06-22 Nokia Corporation Method and system for providing sponsored events for a mobile terminal
KR100638721B1 (ko) * 2005-01-28 2006-10-30 삼성전기주식회사 수지 흐름 개선용 리드 프레임 구조를 갖는 측면형발광다이오드 패키지
WO2006095949A1 (en) * 2005-03-11 2006-09-14 Seoul Semiconductor Co., Ltd. Led package having an array of light emitting cells coupled in series
KR100637476B1 (ko) * 2005-11-09 2006-10-23 알티전자 주식회사 측면발광 다이오드 및 그 제조방법
KR100780176B1 (ko) * 2005-11-25 2007-11-27 삼성전기주식회사 측면 방출 발광다이오드 패키지
WO2007135707A1 (ja) * 2006-05-18 2007-11-29 Nichia Corporation 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
WO2008002068A1 (en) * 2006-06-27 2008-01-03 Seoul Semiconductor Co., Ltd. Side view type led package

Also Published As

Publication number Publication date
WO2008002068A1 (en) 2008-01-03
US7804105B2 (en) 2010-09-28
TW201135964A (en) 2011-10-16
US7935982B2 (en) 2011-05-03
US20090179219A1 (en) 2009-07-16
US20100301376A1 (en) 2010-12-02
TWI384655B (zh) 2013-02-01
TW200807772A (en) 2008-02-01

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