TWI349612B - - Google Patents

Info

Publication number
TWI349612B
TWI349612B TW094107008A TW94107008A TWI349612B TW I349612 B TWI349612 B TW I349612B TW 094107008 A TW094107008 A TW 094107008A TW 94107008 A TW94107008 A TW 94107008A TW I349612 B TWI349612 B TW I349612B
Authority
TW
Taiwan
Application number
TW094107008A
Other languages
Chinese (zh)
Other versions
TW200533513A (en
Inventor
Ryuzo Shinta
Yasufumi Matsumura
Original Assignee
Nippon Steel Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel Chemical Co filed Critical Nippon Steel Chemical Co
Publication of TW200533513A publication Critical patent/TW200533513A/en
Application granted granted Critical
Publication of TWI349612B publication Critical patent/TWI349612B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/002—Pretreatement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2202/00—Metallic substrate
    • B05D2202/10—Metallic substrate based on Fe
TW094107008A 2004-03-25 2005-03-08 Surface treatment method for copper foil and method for producing copper-coating laminated board TW200533513A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004089274 2004-03-25

Publications (2)

Publication Number Publication Date
TW200533513A TW200533513A (en) 2005-10-16
TWI349612B true TWI349612B (en) 2011-10-01

Family

ID=35046942

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094107008A TW200533513A (en) 2004-03-25 2005-03-08 Surface treatment method for copper foil and method for producing copper-coating laminated board

Country Status (3)

Country Link
KR (1) KR101058277B1 (en)
CN (1) CN100452949C (en)
TW (1) TW200533513A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100789562B1 (en) * 2005-12-01 2007-12-28 주식회사 엘지화학 Method for preparing metallic laminate and metallic laminate prepared by the method
CN109234752A (en) * 2018-10-30 2019-01-18 广东坚美铝型材厂（集团）有限公司 A kind of Aluminum alloy surface treatment agent and its preparation method and application
CN116275057B (en) * 2023-03-17 2023-10-10 广西广投正润新材料科技有限公司 Corrosion pretreatment method for preparing electronic aluminum foil with micro-couple based on powder sintering

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3909920B2 (en) * 1997-07-24 2007-04-25 メック株式会社 Surface treatment methods for copper and copper alloys
JP4016078B2 (en) * 2000-01-18 2007-12-05 株式会社東亜電化 Printed wiring board manufacturing method and multilayer printed wiring board
US6831236B2 (en) * 2001-03-23 2004-12-14 Fujikura Ltd. Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
TW591671B (en) * 2001-06-27 2004-06-11 Shinetsu Chemical Co Substrate for flexible printed wiring
JP2003013156A (en) * 2001-07-04 2003-01-15 Nippon Mining & Metals Co Ltd Copper alloy foil for laminate
CN1180006C (en) * 2002-11-22 2004-12-15 中国科学院长春应用化学研究所 Preparation method of polyether imide flexible printed circuit substrate material

Also Published As

Publication number Publication date
KR20060044767A (en) 2006-05-16
KR101058277B1 (en) 2011-08-22
CN100452949C (en) 2009-01-14
TW200533513A (en) 2005-10-16
CN1674769A (en) 2005-09-28

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees