TWI349353B - - Google Patents

Info

Publication number
TWI349353B
TWI349353B TW096138726A TW96138726A TWI349353B TW I349353 B TWI349353 B TW I349353B TW 096138726 A TW096138726 A TW 096138726A TW 96138726 A TW96138726 A TW 96138726A TW I349353 B TWI349353 B TW I349353B
Authority
TW
Taiwan
Application number
TW096138726A
Other languages
Chinese (zh)
Other versions
TW200919662A (en
Inventor
Yi Shao Lai
Tsung Yueh Tsai
Hsiao Chuan Chang
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW96138726A priority Critical patent/TW200919662A/en
Publication of TW200919662A publication Critical patent/TW200919662A/en
Application granted granted Critical
Publication of TWI349353B publication Critical patent/TWI349353B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid
    • H01L2924/10158—Shape being other than a cuboid at the passive surface
TW96138726A 2007-10-16 2007-10-16 Tenon-type package structure and method thereof TW200919662A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96138726A TW200919662A (en) 2007-10-16 2007-10-16 Tenon-type package structure and method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96138726A TW200919662A (en) 2007-10-16 2007-10-16 Tenon-type package structure and method thereof

Publications (2)

Publication Number Publication Date
TW200919662A TW200919662A (en) 2009-05-01
TWI349353B true TWI349353B (en) 2011-09-21

Family

ID=44727187

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96138726A TW200919662A (en) 2007-10-16 2007-10-16 Tenon-type package structure and method thereof

Country Status (1)

Country Link
TW (1) TW200919662A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI608772B (en) * 2015-06-29 2017-12-11 鵬鼎科技股份有限公司 Circuit boards connecting structure and method for manufacturing same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI608772B (en) * 2015-06-29 2017-12-11 鵬鼎科技股份有限公司 Circuit boards connecting structure and method for manufacturing same

Also Published As

Publication number Publication date
TW200919662A (en) 2009-05-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees