TWI349347B - Heat dissipating device, chip including the same, and heat dissipating method for chip - Google Patents

Heat dissipating device, chip including the same, and heat dissipating method for chip

Info

Publication number
TWI349347B
TWI349347B TW097101898A TW97101898A TWI349347B TW I349347 B TWI349347 B TW I349347B TW 097101898 A TW097101898 A TW 097101898A TW 97101898 A TW97101898 A TW 97101898A TW I349347 B TWI349347 B TW I349347B
Authority
TW
Taiwan
Prior art keywords
heat dissipating
chip
same
dissipating device
chip including
Prior art date
Application number
TW097101898A
Other languages
Chinese (zh)
Other versions
TW200933832A (en
Inventor
Chung Cheng Chou
Chia Hung Hsu
Wai Wang
Chin Yung Chen
Ta Yuan Lee
Original Assignee
Raydium Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raydium Semiconductor Corp filed Critical Raydium Semiconductor Corp
Priority to TW097101898A priority Critical patent/TWI349347B/en
Publication of TW200933832A publication Critical patent/TW200933832A/en
Application granted granted Critical
Publication of TWI349347B publication Critical patent/TWI349347B/en

Links

TW097101898A 2008-01-18 2008-01-18 Heat dissipating device, chip including the same, and heat dissipating method for chip TWI349347B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW097101898A TWI349347B (en) 2008-01-18 2008-01-18 Heat dissipating device, chip including the same, and heat dissipating method for chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW097101898A TWI349347B (en) 2008-01-18 2008-01-18 Heat dissipating device, chip including the same, and heat dissipating method for chip

Publications (2)

Publication Number Publication Date
TW200933832A TW200933832A (en) 2009-08-01
TWI349347B true TWI349347B (en) 2011-09-21

Family

ID=44866072

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097101898A TWI349347B (en) 2008-01-18 2008-01-18 Heat dissipating device, chip including the same, and heat dissipating method for chip

Country Status (1)

Country Link
TW (1) TWI349347B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI489674B (en) * 2014-01-13 2015-06-21 新普科技股份有限公司 Heat spreader and battery module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI489674B (en) * 2014-01-13 2015-06-21 新普科技股份有限公司 Heat spreader and battery module

Also Published As

Publication number Publication date
TW200933832A (en) 2009-08-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees