TWI348552B - - Google Patents
Info
- Publication number
- TWI348552B TWI348552B TW096142516A TW96142516A TWI348552B TW I348552 B TWI348552 B TW I348552B TW 096142516 A TW096142516 A TW 096142516A TW 96142516 A TW96142516 A TW 96142516A TW I348552 B TWI348552 B TW I348552B
- Authority
- TW
- Taiwan
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
- G01R1/07321—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support the probes being of different lengths
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Micromachines (AREA)
- Measurement And Recording Of Electrical Phenomena And Electrical Characteristics Of The Living Body (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096142516A TW200921109A (en) | 2007-11-09 | 2007-11-09 | Assembly structure of 3D probe array |
US12/128,804 US7946050B2 (en) | 2007-11-09 | 2008-05-29 | Three-dimensional microprobe array |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW096142516A TW200921109A (en) | 2007-11-09 | 2007-11-09 | Assembly structure of 3D probe array |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200921109A TW200921109A (en) | 2009-05-16 |
TWI348552B true TWI348552B (zh) | 2011-09-11 |
Family
ID=40622461
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW096142516A TW200921109A (en) | 2007-11-09 | 2007-11-09 | Assembly structure of 3D probe array |
Country Status (2)
Country | Link |
---|---|
US (1) | US7946050B2 (zh) |
TW (1) | TW200921109A (zh) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8261428B2 (en) * | 2009-11-25 | 2012-09-11 | National Tsing Hua University | Method for assembling a 3-dimensional microelectrode structure |
JP6221234B2 (ja) * | 2012-04-03 | 2017-11-01 | 大日本印刷株式会社 | 複数の突出した針を備える針体治具およびその製造方法 |
US11185271B2 (en) * | 2013-09-13 | 2021-11-30 | University Of Utah Research Foundation | Methods of making micro-molded electrodes and arrays |
US10327655B2 (en) | 2016-04-11 | 2019-06-25 | Paradromics, Inc. | Neural-interface probe and methods of packaging the same |
WO2018183967A1 (en) | 2017-03-30 | 2018-10-04 | Paradromics, Inc. | Patterned microwire bundles and methods of producing the same |
US11959874B2 (en) | 2018-11-29 | 2024-04-16 | International Business Machines Corporation | Nanostructure featuring nano-topography with optimized electrical and biochemical properties |
US20200170523A1 (en) * | 2018-11-29 | 2020-06-04 | International Business Machines Corporation | Three-dimensional silicon-based comb probe with optimized biocompatible dimensions for neural sensing & stimulation |
CN113655102A (zh) * | 2021-08-25 | 2021-11-16 | 深圳市溢鑫科技研发有限公司 | 一种电化学测量微电极结构及其制作方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4578279A (en) * | 1981-05-26 | 1986-03-25 | International Business Machines Corporation | Inspection of multilayer ceramic circuit modules by electrical inspection of unfired green sheets |
US5091694A (en) * | 1989-01-31 | 1992-02-25 | Tokyo Electron Limited | Quartz probe apparatus |
US5475318A (en) * | 1993-10-29 | 1995-12-12 | Robert B. Marcus | Microprobe |
US5724315A (en) * | 1996-05-29 | 1998-03-03 | The United States Of America As Represented By The Secretary Of The Navy | Omnidirectional ultrasonic microprobe hydrophone |
US6245444B1 (en) * | 1997-10-02 | 2001-06-12 | New Jersey Institute Of Technology | Micromachined element and method of fabrication thereof |
US7304486B2 (en) * | 1998-07-08 | 2007-12-04 | Capres A/S | Nano-drive for high resolution positioning and for positioning of a multi-point probe |
US6359757B1 (en) * | 1999-06-02 | 2002-03-19 | Maxtor Corporation | Electrostatic actuator |
TWI224676B (en) | 2001-05-09 | 2004-12-01 | Chipmos Technologies Inc | Method of manufacturing 3-dimensional probe needles |
US7640651B2 (en) * | 2003-12-31 | 2010-01-05 | Microfabrica Inc. | Fabrication process for co-fabricating multilayer probe array and a space transformer |
US7531077B2 (en) * | 2003-02-04 | 2009-05-12 | Microfabrica Inc. | Electrochemical fabrication process for forming multilayer multimaterial microprobe structures |
US7567089B2 (en) * | 2003-02-04 | 2009-07-28 | Microfabrica Inc. | Two-part microprobes for contacting electronic components and methods for making such probes |
TW200534519A (en) * | 2003-12-31 | 2005-10-16 | Microfabrica Inc | Probe arrays and method for making |
WO2006031280A2 (en) * | 2004-09-13 | 2006-03-23 | Microfabrica Inc. | Probe arrays and method for making |
US20060212978A1 (en) * | 2005-03-15 | 2006-09-21 | Sarah Brandenberger | Apparatus and method for reading bit values using microprobe on a cantilever |
TW200744534A (en) * | 2006-06-09 | 2007-12-16 | Univ Nat Chiao Tung | Microprobe array structure and manufacturing method thereof |
KR100775415B1 (ko) * | 2006-06-19 | 2007-11-12 | 주식회사 코넴 | 전기적 검사 장치 제조 방법 |
EP1985579B1 (en) * | 2007-04-27 | 2018-01-10 | IMEC vzw | Connecting scheme for the orthogonal assembly of microstructures |
-
2007
- 2007-11-09 TW TW096142516A patent/TW200921109A/zh not_active IP Right Cessation
-
2008
- 2008-05-29 US US12/128,804 patent/US7946050B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
TW200921109A (en) | 2009-05-16 |
US20090120216A1 (en) | 2009-05-14 |
US7946050B2 (en) | 2011-05-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |