TWI345534B - - Google Patents

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Publication number
TWI345534B
TWI345534B TW094145006A TW94145006A TWI345534B TW I345534 B TWI345534 B TW I345534B TW 094145006 A TW094145006 A TW 094145006A TW 94145006 A TW94145006 A TW 94145006A TW I345534 B TWI345534 B TW I345534B
Authority
TW
Taiwan
Prior art keywords
temperature regulating
plate
temperature
regulating plate
flow path
Prior art date
Application number
TW094145006A
Other languages
Chinese (zh)
Other versions
TW200621527A (en
Inventor
Toshiya Shintani
Mikio Minonishi
Akihiro Ohsawa
Koji Miyoshi
Original Assignee
Komatsu Ind Corp
Komatsu Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Ind Corp, Komatsu Mfg Co Ltd filed Critical Komatsu Ind Corp
Publication of TW200621527A publication Critical patent/TW200621527A/en
Application granted granted Critical
Publication of TWI345534B publication Critical patent/TWI345534B/zh

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/02Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B29C33/04Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using liquids, gas or steam
    • B29C33/048Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using liquids, gas or steam using steam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32Component parts, details or accessories; Auxiliary operations
    • B29C43/52Heating or cooling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/02Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B29C33/04Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using liquids, gas or steam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/04Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using liquids, gas or steam
    • B29C35/041Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould using liquids, gas or steam using liquids

Description

1345534 九、發明說明: 【發明所屬之技術領域】 本發明係關於調溫板(用⑫將凹凸圖案轉印至基材之熱 轉印模壓機械)及具備此調溫板之熱轉印模麼機械。 【先前技術】 作為製造於表面具有微細凹凸圖案之導光板等的製造 方法,已有一種熱轉印模壓機械,其係將在表面形成有凹 凸圖案之壓模加熱,藉由對熱可塑性樹脂板等之基材加壓 ^將壓模之凹凸圖案轉印至基材(例如,特開 號公報(第1圖))。此熱轉印模壓機械,係於上模及下模設 有加熱用之流體通路,藉由使流體流通於此等流體通路來 加熱上模及下模,以加熱安裝於此等上模及下模之壓模。 【發明内容】 然而,此種熱轉印模壓機械,當使流體流通於流體通 路以加熱上模及下模時,上模及下模有可能會因熱而膨脹 變形,使壓模產生翹曲。此種情形下,即無法良好地將壓 模之凹凸圖案轉印至基材,而不能得到具良好品質之導光 板。 本發明之主要目的,係提供能防止翹曲、良好地轉印 凹凸圖案的調溫板及具備此調溫板之熱轉印模壓機械。 本發明之調溫板,係設於用以將形成在壓模表面之凹 凸圖案轉印至基材表面的熱轉印模壓機械,並可安裝該壓 模且可調整該壓模之溫度,其特徵在於:於内部形成供用 以調整該調溫板溫度之流體流通的流路;流路,係形成於 5 1345534 該調溫板之厚度方向的大致中央。 根據此種本發明,由於流路係形成於調溫板之厚度方 向::致中央,因此再使流體流通於流路來加熱或冷卻調 溫板時,可使熱分布在調溫板之厚 β & + 厗度方向大致對稱。據此, 即使在調溫板因熱而膨脹或收縮時 ^ .., 叮办可防止調溫板之翹 曲。錯此’亦可防止壓模之翹曲, s ^ , 將凹凸圖案確實地轉印 至基材。 本發明之調溫板中’流路最好 ^ m 野係形成為截面形狀呈大 致圓形。 …根據此種本發明,由於流路係形成為截面形狀呈大致 0形’因此能簡單地進行將流路形成於板體内之作業。又, 當調溫板係用於熱轉印模壓機械時,由於將調溫板㈣於 基材因此被要求須具有某種程度之 . /又此時’由於流路 係形成為截面形狀呈大致_,因此不會在流路内周產生 應力集中之情形,而可提升調溫板之強度。 本發明之調溫板中 為通過該調溫板之至少 路之該一端面開口的開 此處,機械方式密 態下進行之密封,例如 用具貼片之螺栓來進行 根據此種本發明, 的至少一端面所形成, 内,又,由於流路之開1345534 IX. Description of the Invention: [Technical Field] The present invention relates to a temperature regulating plate (a thermal transfer molding machine that transfers a concave-convex pattern to a substrate by 12) and a thermal transfer mold having the temperature regulating plate. mechanical. [Prior Art] As a manufacturing method of a light guide plate or the like having a fine uneven pattern on its surface, there has been a thermal transfer molding machine which heats a stamper having a concave-convex pattern formed on its surface by a thermoplastic resin sheet. The base material is pressurized, and the uneven pattern of the stamper is transferred to the substrate (for example, JP-A Publication (Panel 1). The thermal transfer molding machine is provided with a fluid passage for heating in the upper mold and the lower mold, and the upper mold and the lower mold are heated by circulating the fluid through the fluid passages, thereby heating and mounting the upper mold and the lower mold. Die of the mold. SUMMARY OF THE INVENTION However, in such a thermal transfer molding machine, when a fluid is circulated through a fluid passage to heat the upper mold and the lower mold, the upper mold and the lower mold may be deformed by heat and warp, causing warpage of the mold. . In this case, the uneven pattern of the stamp cannot be transferred to the substrate well, and a light guide plate having good quality cannot be obtained. SUMMARY OF THE INVENTION A primary object of the present invention is to provide a temperature regulating plate capable of preventing warpage and transferring a concave-convex pattern well, and a heat transfer molding machine including the temperature regulating plate. The temperature regulating plate of the present invention is provided on a thermal transfer molding machine for transferring a concave-convex pattern formed on a surface of a stamper to a surface of a substrate, and the stamper can be mounted and the temperature of the stamper can be adjusted. The present invention is characterized in that a flow path for regulating the flow of the temperature of the temperature regulating plate is formed inside, and a flow path is formed at substantially the center of the thickness direction of the temperature regulating plate at 5 1345534. According to the present invention, since the flow path is formed in the thickness direction of the temperature regulating plate: the center is formed, when the fluid is caused to flow through the flow path to heat or cool the temperature regulating plate, the heat can be distributed in the thickness of the temperature regulating plate. The β & + twist direction is roughly symmetrical. According to this, even when the temperature regulating plate expands or contracts due to heat, it can prevent the warpage of the temperature regulating plate. This can also prevent the warpage of the stamper, s ^ , and the bump pattern is surely transferred to the substrate. In the temperature regulating plate of the present invention, the 'flow path is preferably ^ m field formed to have a substantially circular cross section. According to the present invention, since the flow path is formed to have a substantially zero cross-sectional shape, the operation of forming the flow path in the plate body can be easily performed. Moreover, when the temperature regulating plate is used in a thermal transfer molding machine, since the temperature regulating plate (four) is required to have a certain degree on the substrate, it is required to have a certain cross-sectional shape. _, therefore, no stress concentration occurs in the inner circumference of the flow path, and the strength of the temperature regulation plate can be improved. In the temperature regulating plate of the present invention, the opening of the one end surface of at least the path of the temperature regulating plate is opened, and the sealing is performed in a mechanically tight state, for example, a bolt of a patch, according to the present invention. At least one end face is formed, inside, and again, due to the opening of the flow path

’其方式較佳為’該流路,係形成 一端面而朝另-端面延伸;在該流 口部分係以機械方式密封。 封,係指在不溶解密封用構件之狀 使用柱塞來進行壓入之動作、或使 之鎖入動作等,即相當於此。 由於流路係通過調溫板之寬度方向 因此能將流路形成為從外部至板體 口部分係以機械方式密封,因此在 6 1345534 進行密封時無須另外進行熔接 路形成於板體内之作業。又, 生熱扭曲。 等作業’可簡單地進行將流 不會因進行熔接等使板體產 本發明之調溫板中,1古4·- h A认 极T具方式較佳為,該流路設有複數 條;該流路間之間距,小於該調溫板之厚度尺寸。 根據此種本發明,藉由透過複數條流路内之流體進交 換’而能有效率地進行調消把β两 Μ嗍/皿板及壓杈之溫度調整。又,由 於各流路間之間距小於該續、,田拉 必调,皿板之厚度尺寸,因此能使溫 度在調溫板内部均一化之壯能你 之狀態下傳達至表面。據此,即不 會產生表面溫度之分布不始,, mr_ 邛不均旎防止因壓模之溫度分布不 均而產生之轉印不良的情形。 本發月之調狐板中,其方式較佳為,於該調溫板端部 形成有連結部’該連結部係連接用以連通該流路與外部流 路之連通用管座;該連結部係與該連制管座以機械方式 連接。 此處’機械方式連接,係指在不溶解連結部、連通用 管座、以及用於連接此等之構件的狀態下進行的連接,例 如,以螺栓將連通用管座固定於連結部,即相當於此。 根據此種本發明,由於連結部與連通用管座係以機械 方式連接’因此在進行連接時無須另夕卜進行炫接等作業, 因此能簡單地進行將連通用管座安裝於連結部之作業。 又,不會因進行溶接等使板體產生熱扭曲。本發明之調溫 板,係設於用以將形成在壓模表面之凹凸圖案轉印至基材 表面的熱轉印模壓機械,並可安裝壓模且可調整壓模之溫 丄舛5534 =,其特徵在於:於内部形成供用以調整該調溫板溫度之 •流體流通的流路;於該調溫板端部形成有連結部該連結 部係連接用以連通該流路與外部流路之連通用管座;該壓 ’模能安裝於除了連結部以外之區域。 根據此種本發明,由於壓模能安裝於除了連結部以外 之區域,因此調溫板之截面形狀與壓模全面大致相等。據 此,可防止壓模之翹曲產生,使壓凹凸圖案確實地轉印至 φ 土材又,使壓模全面之溫度均一,藉此亦能使凹凸圖案 之轉印良好。 本發明之調溫板中,該連結部最好係與該連通用管座 以機械方式連接。 根據此種本發明,在進行連結部與連通用管座時之連 接時2無須另外進行炫接等作業,因此能簡單地進行將連 通用官座安裝於連結部之作業。χ,不會因進行溶接等使 板體產生熱扭曲》 • 本發明之調溫板中,該連結部,最好係設置成從該調 溫板突出》 根據此種本發明,由於將連結部之突出部分,作成將 連通用官座安裝於調溫板時之安裝裕度,因此能將壓模安 裝部分之調溫板的板後作成較薄。藉此,能將熱轉印模壓 機械作成較小。又,能使壓模安裝部分之溫度升降速度較 為快速。 本發明之調溫板,係設於用以將形成在壓模表面之凹 凸圖案轉印至基材表面的熱轉印模壓機械,並可安裝壓模 8 1345534 且可調整壓模之溫度,其特徵在於··具備用以規定該調溫 板對熱轉印模壓機械之安裝位置的第一定位孔及第二定位 孔,该第二定位孔為長孔形狀,且其長軸和將第一定位孔 之中心與第二定位孔之中心連結的線大致平行。根據此種 本發明,由於形成有第一定位孔及第二定位孔而能規定 調溫板對熱轉印模壓機械之位置,因此使對熱轉印模壓機 械之安裝作業較為容易。又,由於第二定位孔係長孔形狀, 因此即使調溫板因熱而膨脹或收縮時,亦能容許其膨脹量 或收縮量。據此,可防止調溫板之變幵》,且防止壓模之翹 曲產生。因此,能使壓模之凹凸圖g良好地轉印至基材。 又,由於可防止調溫板之變形,因此不會在調溫板產生應 力集中之情形,而能提升調溫板之耐久性,再者,由於第 二定位孔之長車由’係沿連結第—定位&中心肖第二定位孔 中之線所配置’因此調溫板即沿該線膨脹或收縮。據此, 可防止調溫板以第一定位孔為中心旋動,進而防止壓模之 凹凸圖案的文裝角度變化。承上所述’能使壓模之凹凸圖 案以正確之面向良好地轉印於基材。 本發明之調溫板中,第—定位孔與第二定位孔,最好 係沿该調溫板之長邊方向配置。 藉由此種本發明,由於調溫板係形成為俯視大致呈矩 二:此當使流體流通於流路時,調溫板即會因該熱而沿 長邊:向大幅膨脹或收縮。此處,第一定位孔及第二定位 ^實地Γ糸配置成與調溫板之長邊方向大致平行,因此能 確貫也谷許此膨脹量或收縮量。 ⑧ 9 本發明之熱轉印模壓機械,具肖前述之本#明的調溫 板其特徵在於:調溫板係對向設置一對;—調溫板之第 定位孔,係配置成與另一調溫板之第一定位孔對向。 g根據此種本發明,由於在對向配置之一對調溫板,一 調溫板之第一定位孔係g己置成與另一調溫板之第一定位孔 2向,因此一對調溫板在熱膨脹或收縮時由於係分別沿 同—方向膨脹或收縮,因此能防止調溫板之相對位置偏 移。藉此,能使壓模隻凹凸圖案良好地轉印至基材。 本發明之熱轉印模壓機械,其特徵在於:具備前述本 發明之任一調溫板。 根據此種本發明,由於熱轉印模壓機械具備前述調溫 反因此月b得到與别述調溫板同樣之效果,可防止壓模之 趣曲’使凹凸圖案良好地轉印至基材。 【實施方式】 [第1實施形態] 以下’根據圖式說明本發明第1實施形態。 圖1係顯示本發明第丨實施形態之熱轉印模壓機械i 的整體圖。本實施形態中,熱轉印模壓機械丨,係藉由將 凹凸圖案熱轉印於基材5(參照圖3),來製造用於液晶顯示 益之背光的導光板《此處,導光板之尺寸,例如可考量為 厚度約0.5mm〜8mm左右、17吋之導光板。此外,作為基 材5,例如能採用以丙烯酸或聚碳酸脂等之熱可塑性樹脂 構成的板狀構件。 如圖1所示’熱轉印模壓機械1,具備:四根立柱u, 10 1345534 係豎設於底床10上(圖1中僅圖示其中兩根);頂板12’ 係設置於立柱11上面;滑件13,係以可上下移動自如之 方式設於頂板12下方;承架14,係與滑件13對向,配置 於底床10上;絕熱材15,係分別安裝於滑件1 3下方及承 架14上方;調溫板丨6,係透過該絕熱材1 $分別安裝;壓 模1 7 ’係安裝於調溫板16 ;以及模壓用真空裝置1 8,係 在熱轉印模麼機械丨進行壓模時使壓模17周邊成為真空 狀態。 於頂板12内部内裝有使滑件13上下移動之滑件驅動 裝置13G(參照圖1 〇),當藉由此滑件驅動裝置1 μ使滑件 Π上下移動時’即可使對向之壓模17彼此接近或離開, 以對配置於壓模1 7間之美妯s,佳广 暴材5進仃杈壓加工。於滑件13 與承架14間沿上下方向罟古庙奴+ 1 石向配置有複數支(本實施形態為四支) 導件13 A,用以導引滑件n 之上下移動。此外,滑件驅動 裝置130,具備能將滑件13 油廢汽缸。 制在任-位置之飼服馬達或 圖2係顯示本實施形態之執 大圖。χ^ …p杈壓機械1的部份放 大圖X ® 3係顯示熱轉印模壓機械 等圖2及圖3所示,_ 上面圖。如此 熱材15,來防止教從…】,、有既定厚度’藉由此絕 …攸調溫板16往滑件丨 調溫板16,係分別g & 或承架14移動。 刀乃J緊貼女裝於絕埶松 調溫板10及壓槿17技、材 5» 久度模17係排列兩個 之前後方向(垂直於圖丨之祕 ' 17模壓機械1 壓加工可製造兩片導光板。 亦即進行一次模 1345534 圖4係顯示本實施形態之調溫板16的下面圖。又,圖 5係顯示調胍板16之側視截面圓。如此等圖4及圖5所示, 調溫板16係以鐵構成,具備形成為板狀之板體部16丨、以 及體形成於板體部1 61兩側之連結部1 6 2。 板體部161,其厚度約1〇111111且形成為俯視呈大致矩 形,其一面緊貼安裝於絕熱材15。於板體部161内部形成 有複數條供流體流通之流路163。流路163,係沿板體部ι6ι 之長邊方向以約7mm之間距形成為彼此平行,從板體部ι6ι 之一端面貫通至另一端面所形成。此等流路163端部之開 口部分皆藉由柱塞163A(參照W 2)之壓入等而密封。流路 163’形成為直徑,約5mm之截面大致圓形,其圓形中心配 置於板體冑161之厚度方向的大致中央。由於流路163之 截面形狀形成為大致圓形,因此欲沿板狀板體部ΐ6ι之平 面方向形成流路163時,亦能簡單地製造。又,由於流路 163係在板體部161之厚度方向、以流路163之中心為中 心線形成為線對稱,因此在使流體流通流路163以加熱或 冷卻調溫板16時,能使調溫板16之伸縮在厚度方向對稱。 據此’能良好地防止調溫板16之勉曲,確實地防止壓模η 之凹凸圖案的轉印不良產生。 此處,流路163,最好係將内周面積設定成較大,俾 使流通於内部之流體的熱可良好地傳達至調溫& 16,以迅 速地進行調溫板16及安裝於調溫板16之壓模17的加熱 及/或冷卻。具體而言,可考量將流路163之截面直徑^ 寸作成較大、或將各流路163間之間距作成較小等的方法。 12 丄J幷JJJ仔 然而另一方面,調溫板16, 由於係在滑件13斑承架14之 間被加壓,因此須確保某 〃 ’、 163 „ , 程度之強度。承上所述,流路 163之形狀、尺寸 '間距 適當設定。 4㈣係在考量上述條件後作 又’當各流路163間之卩卩,进, 之間距過大時,流路163及調溫 板1 ό表面間之距離即會 紅认士 會較各流路163間之距離短,使流 動於流路163之流體的埶, ,,,、 隹調/皿板Ιό内部均一分布前 即會到達調溫板16之矣而 , 表面如此’有可能會使調溫板16 之表面溫度產生分布不均,俏 J 便文裝於調溫板16表面之壓 模17的溫度分布亦不灼, 呷J小杓,而引起轉印*良之情形。據此, 各流路163間之間距,最好係作成較板體部161之厚度尺 寸小,使各流路163間之距離較流路163及調溫板16表 面間的距離短。 於板體部161之俯視(圖4之狀態)的短邊方向兩側, :成有用以將調溫板16安裝於絕熱材15之安裝孔164。 安裝孔164,係在板體部161中形成於較形成流路163之 區域更靠短邊方向兩側’沿板㈣161之長邊方向各形成 於三處,合計形成於六處。藉由將螺拴164A貫通此等安 裝孔164 (參照圖3),來將調溫板16安裝於絕熱材丨5。 此外,安裝孔164,係在一對調溫板丨6中以相異配置 所形成。亦即,在對向配置一對調溫板16之狀態下,彼 此對向之安裝扎164,其中心位置不一致,係沿板體部ΐ6ι 之長邊方向形成於彼此相鄰之位置。藉由此種配置,即可 防止在一對調溫板16彼此接近時、貫通—調溫板16安裝 13 孔164之螺拴164A的頭與貫通對向 之螺栓164A的頭彼此干涉。 又’安裝孔16 4之亩;-f* p L尺寸’係形成為稍微大於螺栓 164A之直徑尺寸,如此即使在因蒸氣或水流通於板體部⑹ 之流路163而使板體冑161伸縮時,亦可容許該伸縮量。 據此,能防止板體部161之伸縮產生的應力集中或變形等。 :各女裝孔1 64附近、沿調溫& i 6之長邊方向相鄰的Preferably, the flow path is formed by an end face extending toward the other end face; the flow port portion is mechanically sealed. The seal refers to an action of pressing in a plunger or a locking operation in a state in which the member for sealing is not dissolved, which corresponds to this. Since the flow path passes through the width direction of the temperature regulating plate, the flow path can be formed to be mechanically sealed from the outside to the mouth portion of the plate body. Therefore, it is not necessary to separately form the welding path in the plate body when sealing is performed at 6 1345534. . Also, the heat is distorted. The operation "can be carried out simply by not performing welding or the like, so that the plate body is produced in the temperature regulating plate of the present invention, and the first step is preferably a plurality of wires, and the flow path is provided with a plurality of strips. The distance between the flow paths is smaller than the thickness of the temperature regulating plate. According to the present invention, the temperature adjustment of the β Μ嗍 / plate and the pressure can be efficiently performed by passing through the fluid in the plurality of flow paths. Moreover, since the distance between the flow paths is smaller than the continuation, the thickness of the plate is adjusted, so that the temperature can be transmitted to the surface in a state where the temperature is uniform inside the temperature control plate. Accordingly, there is no possibility that the distribution of the surface temperature does not start, and mr_ 邛 is uneven, and the transfer failure due to the uneven temperature distribution of the stamper is prevented. Preferably, in the fox panel of the present month, a connecting portion is formed at an end portion of the temperature regulating plate, and the connecting portion is connected to a communicating socket for connecting the flow path and the external flow path; The department is mechanically connected to the connected socket. Here, the term "mechanical connection" refers to a connection that is made in a state in which the connection portion, the communication tube holder, and the member for connecting the members are not dissolved. For example, the communication tube holder is fixed to the connection portion by a bolt, that is, This is equivalent to this. According to the present invention, since the connection portion and the communication tube holder are mechanically connected, it is not necessary to perform another operation such as splicing at the time of connection, so that the communication tube holder can be easily attached to the connection portion. operation. Moreover, the plate body is not thermally distorted by welding or the like. The temperature regulating plate of the present invention is disposed on a thermal transfer molding machine for transferring the concave-convex pattern formed on the surface of the stamp to the surface of the substrate, and can be mounted with a stamper and can adjust the temperature of the stamper 5534 = a flow path through which a fluid flow for adjusting the temperature of the temperature regulating plate is formed, and a connecting portion is formed at an end of the temperature regulating plate. The connecting portion is connected to communicate the flow path and the external flow path. The connecting socket; the pressing mold can be installed in an area other than the connecting portion. According to the present invention, since the stamper can be attached to a region other than the joint portion, the cross-sectional shape of the temperature regulating plate is substantially equal to that of the stamper. Accordingly, warpage of the stamper can be prevented, and the embossed pattern can be surely transferred to the φ soil material, and the temperature of the stamper can be made uniform, whereby the transfer of the concave-convex pattern can be made good. In the temperature regulating plate of the present invention, the connecting portion is preferably mechanically connected to the connecting pipe holder. According to the present invention, it is not necessary to perform another work such as splicing when the connection portion and the communication header are connected. Therefore, the operation of attaching the common official seat to the connection portion can be easily performed. χ, the plate body is not thermally distorted by the welding or the like. • In the temperature regulating plate of the present invention, the connecting portion is preferably provided to protrude from the temperature regulating plate. According to the present invention, since the connecting portion is to be joined The protruding portion is formed to have a mounting margin when the communication seat is attached to the temperature regulating plate, so that the plate of the temperature regulating plate of the stamp mounting portion can be made thinner. Thereby, the thermal transfer molding machine can be made smaller. Further, the temperature rise and fall speed of the stamper mounting portion can be made relatively fast. The temperature regulating plate of the present invention is provided on a thermal transfer molding machine for transferring the concave-convex pattern formed on the surface of the stamp to the surface of the substrate, and the stamper 8 1345534 can be mounted and the temperature of the stamper can be adjusted. The first positioning hole and the second positioning hole for defining a mounting position of the temperature regulating plate to the thermal transfer molding machine, wherein the second positioning hole is a long hole shape, and the long axis thereof and the first The center of the positioning hole is substantially parallel to the line connecting the center of the second positioning hole. According to the present invention, since the position of the temperature regulating plate to the thermal transfer molding machine can be specified by the formation of the first positioning hole and the second positioning hole, the mounting work for the thermal transfer molding machine can be facilitated. Further, since the second positioning hole has a long hole shape, even if the temperature regulating plate expands or contracts due to heat, the amount of expansion or the amount of contraction can be allowed. According to this, it is possible to prevent the deformation of the temperature regulating plate and prevent the warpage of the stamper from occurring. Therefore, the uneven pattern g of the stamp can be favorably transferred to the substrate. Moreover, since the deformation of the temperature regulating plate can be prevented, the stress concentration of the temperature regulating plate is not generated, and the durability of the temperature regulating plate can be improved, and further, since the second positioning hole is connected by the 'system line The position of the second positioning hole in the first position and the center is configured to 'expand the temperature plate to expand or contract along the line. According to this, it is possible to prevent the temperature regulating plate from being rotated around the first positioning hole, thereby preventing the change in the angle of the decoration of the concave-convex pattern of the stamper. According to the above, the concave-convex pattern of the stamp can be transferred to the substrate with a correct orientation. In the temperature regulating plate of the present invention, the first positioning hole and the second positioning hole are preferably arranged along the longitudinal direction of the temperature regulating plate. According to the present invention, since the temperature regulating plate is formed to have a substantially rectangular shape in plan view, when the fluid is caused to flow through the flow path, the temperature regulating plate is greatly expanded or contracted along the long side due to the heat. Here, the first positioning hole and the second positioning hole are arranged substantially parallel to the longitudinal direction of the temperature regulating plate, so that the amount of expansion or contraction can be surely obtained. 8 9 The thermal transfer molding machine of the present invention has the above-mentioned temperature regulating plate of the present invention, characterized in that: the temperature regulating plate is disposed opposite to each other; the first positioning hole of the temperature regulating plate is configured to be The first positioning hole of a temperature regulating plate is opposite. g According to the invention, since one of the pair of temperature regulating plates is disposed oppositely, the first positioning hole g of one temperature regulating plate is placed opposite to the first positioning hole 2 of the other temperature regulating plate, so a pair of temperature adjustment When the plates are expanded or contracted in the same direction during thermal expansion or contraction, the relative positional deviation of the temperature regulating plates can be prevented. Thereby, the stamper can be transferred to the substrate only by the uneven pattern. The thermal transfer molding machine of the present invention is characterized by comprising any of the above-described temperature regulating plates of the present invention. According to the present invention, since the thermal transfer molding machine is provided with the above-described temperature adjustment, the same effect as that of the temperature adjustment plate described above can be obtained, and the stamper can be prevented from transferring the uneven pattern to the substrate. [Embodiment] [First Embodiment] Hereinafter, a first embodiment of the present invention will be described based on the drawings. Fig. 1 is a general view showing a thermal transfer molding machine i according to a third embodiment of the present invention. In the present embodiment, the thermal transfer molding machine is manufactured by thermally transferring a concave-convex pattern to the substrate 5 (see FIG. 3) to manufacture a light guide plate for a backlight of a liquid crystal display. Here, the light guide plate The size can be, for example, a light guide plate having a thickness of about 0.5 mm to 8 mm and a thickness of 17 inches. Further, as the substrate 5, for example, a plate-like member made of a thermoplastic resin such as acrylic or polycarbonate can be used. As shown in Fig. 1, the 'thermal transfer molding machine 1 has four pillars u, 10 1345534 erected on the bottom bed 10 (only two of which are shown in Fig. 1); the top plate 12' is disposed on the column 11 The sliding member 13 is disposed under the top plate 12 so as to be movable up and down; the frame 14 is disposed opposite to the sliding member 13 and disposed on the bottom bed 10; the heat insulating material 15 is respectively mounted on the sliding member 1 3 below and above the shelf 14; the temperature regulating plate 丨6 is separately installed through the insulating material 1 $; the stamper 1 7 ' is mounted on the temperature regulating plate 16; and the vacuuming device for molding 18 is attached to the thermal transfer When the mold is pressed, the periphery of the stamper 17 is brought into a vacuum state. A slider driving device 13G (refer to FIG. 1A) for moving the slider 13 up and down is mounted in the interior of the top plate 12, and when the slider member 1 μ is moved up and down by the slider driving device 1 μ, the opposite direction can be made. The stampers 17 are close to or away from each other, so as to press the embossing of the embossing material disposed between the stampers 17 and the slabs. A plurality of guides (four in this embodiment) are arranged between the slider 13 and the carrier 14 in the up and down direction, and the guide member 13A is guided to guide the slider n to move up and down. Further, the slider driving device 130 is provided with a fuel cylinder capable of discharging the slider 13 . The feeding motor in the position-and-position position or Fig. 2 shows the enlarged view of the embodiment. χ^ ...p Partial enlargement of the press machine 1 The X ® 3 series shows the heat transfer molding machine as shown in Fig. 2 and Fig. 3, _ above. Such a hot material 15 is provided to prevent the teaching from [...], having a predetermined thickness, by which the temperature regulating plate 16 is moved to the slider 丨 the temperature regulating plate 16, respectively, and the g & or the carrier 14 is moved. Knife is J close to women's clothing in the 埶 埶 调 调 调 及 及 及 及 及 技 技 技 技 技 技 » » » » 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 17 Two light guide plates are manufactured. That is, the primary mold 1345534 is performed. Fig. 4 is a view showing the lower side of the temperature regulating plate 16 of the present embodiment. Fig. 5 is a side view showing the circular cross section of the humidity control plate 16. Thus, Fig. 4 and Fig. As shown in Fig. 5, the temperature regulating plate 16 is made of iron, and includes a plate body portion 16A formed in a plate shape, and a connecting portion 162 formed on both sides of the plate body portion 61. The plate body portion 161 has a thickness It is approximately 1〇111111 and is formed in a substantially rectangular shape in plan view, and one surface thereof is closely attached to the heat insulating material 15. Inside the plate body portion 161, a plurality of flow paths 163 through which the fluid flows are formed. The flow path 163 is along the plate portion ι6 The longitudinal direction is formed to be parallel to each other at a distance of about 7 mm, and is formed from one end surface of the plate portion ι6 to the other end surface. The opening portions of the end portions of the flow paths 163 are all by the plunger 163A (refer to W 2 The valve 163' is formed into a diameter, and the cross section of about 5 mm is substantially circular, and its circular center is disposed at The plate body 161 is substantially at the center in the thickness direction. Since the cross-sectional shape of the flow path 163 is formed into a substantially circular shape, it is also possible to easily manufacture the flow path 163 in the planar direction of the plate-like plate portion ΐ6. Since the flow path 163 is formed in line symmetry in the thickness direction of the plate portion 161 and centered on the center of the flow path 163, the temperature regulating plate can be made when the fluid flow path 163 is heated or cooled by the temperature regulating plate 16. The expansion and contraction of the 16 is symmetrical in the thickness direction. According to this, it is possible to prevent the warp of the temperature regulating plate 16 well, and it is possible to surely prevent the transfer failure of the concave-convex pattern of the stamper η. Here, the flow path 163 is preferably inside. The area of the circumference is set to be large, so that the heat of the fluid flowing inside can be well transmitted to the temperature control & 16, to quickly perform the heating of the temperature regulating plate 16 and the stamper 17 attached to the temperature regulating plate 16 and/or Or cooling. Specifically, a method of making the cross-sectional diameter of the flow path 163 larger or making the distance between the flow paths 163 smaller may be considered. 12 丄J幷JJJ The warm plate 16, which is pressurized between the sliders 14 of the slider 13, Therefore, it is necessary to ensure the strength of a certain 〃 ', 163 „. As described above, the shape and size of the flow path 163 are appropriately set. 4 (4) After considering the above conditions, it is made to be 'between the flow paths 163'. When the distance between them is too large, the distance between the flow path 163 and the surface of the temperature regulating plate 1 is such that the distance between the red seals and the flow paths 163 is shorter, so that the fluid flowing through the flow path 163 is 埶, , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The temperature distribution of the stamper 17 on the surface of the plate 16 is also not burnt, and 呷J is small, causing the transfer to be good. Accordingly, the distance between the flow paths 163 is preferably made smaller than the thickness of the plate portion 161, so that the distance between the flow paths 163 is shorter than the distance between the surfaces of the flow path 163 and the temperature regulating plate 16. On both sides in the short-side direction of the plate body portion 161 in the plan view (the state of FIG. 4), it is useful to attach the temperature regulating plate 16 to the mounting hole 164 of the heat insulating material 15. The mounting holes 164 are formed at three sides in the longitudinal direction of the plate (four) 161 in the plate body portion 161 formed on the both sides in the short-side direction of the region where the flow path 163 is formed, and are formed at six places in total. The temperature regulating plate 16 is attached to the heat insulating material 丨5 by passing the thread 164A through the mounting holes 164 (see Fig. 3). Further, the mounting holes 164 are formed in a pair of temperature regulating plates 6 in a different arrangement. That is, in a state where a pair of temperature regulating plates 16 are disposed opposite to each other, the wires 164 are attached to each other, and their center positions are not uniform, and are formed adjacent to each other along the longitudinal direction of the plate body portion ΐ6ι. With this arrangement, it is possible to prevent the head of the thread 164A of the through-temperature-regulating plate 16 from which the 13-hole 164 is attached and the head of the bolt 164A penetrating against each other when the pair of temperature-regulating plates 16 approach each other. Further, 'the hole of the mounting hole 16 4; -f* p L size' is formed to be slightly larger than the diameter of the bolt 164A, so that the plate body 胄161 is formed even if the flow path 163 of the plate body portion (6) flows due to steam or water. When telescopic, the amount of expansion and contraction can also be tolerated. According to this, stress concentration, deformation, and the like due to expansion and contraction of the plate body portion 161 can be prevented. : adjacent to the women's hole 1 64, adjacent to the long side of the temperature control & i 6

位置,形成有直徑較安裝孔164更大之螺栓閃避孔心 此等螺检閃避孔165 ’係形成為在—對調溫板_此接近 時’貫通對向之調溫板16之安裝孔164的頭不干涉調溫 板16。例如當基材5之厚度尺寸或壓模之厚度尺寸較 J N· β進行模壓加工使調溫板i 6彼此接近時,調溫板丄6 之螺栓164A即有可能會干涉對向之調溫& i6。本實施形 •i、中由於形成有螺栓閃避孔1 65,因此可消除此種不良The position is formed with a bolt doping hole having a larger diameter than the mounting hole 164. The threaded dodging hole 165' is formed to be through the mounting hole 164 of the temperature regulating plate 16 facing the temperature regulating plate. The head does not interfere with the temperature regulating plate 16. For example, when the thickness dimension of the substrate 5 or the thickness dimension of the stamper is molded by JN·β so that the temperature regulating plates i 6 are close to each other, the bolt 164A of the temperature regulating plate 丄6 may interfere with the temperature adjustment &; i6. In this embodiment, i, and the bolt dosh hole 1 65 are formed, so that such a defect can be eliminated.

It开/ * =此,由於當基材5之厚度尺寸較小時亦可進行熱It ON / * = this, because the thickness of the substrate 5 is small, it can also be heat

之調溫板16安裝孔164 轉印模壓加:L ’因此能提升熱轉印模壓機# i之通用性。 又,由於能將壓模之厚度尺寸構成為較小,因此能縮小壓 模1 7之熱容量,在短時間進行壓模丨7之加熱、冷卻。 此處,螺栓閃避孔丨65,係與安裝孔丨64同樣地,其 直徑尺寸形成為較螺栓164A之頭的尺寸大,藉由此形狀, 使調溫板16即使在某種程度之尺寸範圍内伸縮,亦可容 許其伸縮。 於板體部161 ’形成有用以將調溫板丨6定位於絕熱材 15之定位孔166 ^定位孔166,係設於板體部ΐ6ι之短邊 ⑧ 14 1345534The temperature regulating plate 16 mounting hole 164 is transferred and molded: L ′ so that the versatility of the thermal transfer molding machine # i can be improved. Further, since the thickness of the stamper can be made small, the heat capacity of the stamper 17 can be reduced, and the stamper 7 can be heated and cooled in a short time. Here, the bolt doping hole 65 is formed to have a larger diameter than the mounting hole 64, and has a larger size than the head of the bolt 164A. By this shape, the temperature regulating plate 16 is even in a certain size range. Internal expansion and contraction can also allow it to expand and contract. A positioning hole 166 is formed in the plate body portion 161' to position the temperature regulating plate 6 at the positioning hole 166 of the heat insulating material 15, and is disposed on the short side of the plate portion ΐ6ι 8 14 1345534

方向一端側的兩處,此等定位孔166係沿板體部16ι之長 邊方向配置。於此等定位孔166,貫通有從絕熱材15、滑 件13、承架14突出設置之定位銷14A(參照圖3)。定位孔 166中疋位孔(第一定位孔)166A係形成為大致圓形,其 孔徑設定成與定位銷14 A之直徑尺寸大致相同。又,定位 孔166中另一定位孔(第二定位孔)166B係形成為大致橢圓 形之長孔形狀,其長軸沿連結一定位孔166A之中心與另 一定位孔166B之中心的線來加以配置,亦即沿板體部161 之長邊方向配置。又,定位孔166B之短軸方向尺寸係 設定成與定位銷14A之直徑尺寸大致相同。 據此,調溫板16即以定位孔166A及定位孔166B來 決定其短邊方向的位置,以定㈣166A $決定長邊方向 的位置。X,當因板Μ 161之伸縮或加I誤差等而與定 位銷14A之位置產生偏移時,該位置偏移可藉由定位孔 166B之長孔形狀來吸收。據此,調溫板16在因熱而伸縮 時,即沿;t位孔麗伸縮於調溫板16之長邊方向,而能 防止調溫板16之旋動。因此,能防止安裝於調溫板16之 塵模的旋動,防止凹凸圖案對基材5之相對位置偏移。 此外,另一定位孔166B之長轴方向,並不限於沿連 結一定位孔166A之中心與另—定位孔 配置’只要與該線大致成平行的話,亦 配置。 166B之中心的線來 可具有些許角度來 166,雖係設於 一調溫板16之 此處,形成於一對調溫板】6之定位孔 彼此對向之長邊’但在一調溫板16之與另 15 1345534 定位孔166A對向的位置形成有定位孔ι66Α〇且在一調溫 板16之與另一調溫板16之定位孔i 66Β對向的位置形成 有定位孔166Β。藉由此種配置,一對調溫板16可藉由彼 此對向之定位孔166Α來限制其位置,並藉由彼此對向之 定位孔166Β來限制其移動方向❶藉此,一對調溫板16, 由於分別以定位孔166Α為基準安裝成能伸縮自如某個程 度,因此在一對調溫板丨6伸縮時,能防止產生一對壓模Ρ 相對位置之偏移》此處,另一定位孔166Β之長軸方向, 當與連結一定位孔166Α之中心與另一定位孔166β之中心 的線夹有既定角度時,該既定角度,最好係設定成於—對 調溫板16為分別大致相等的角度,亦即此種情形下,在 使一對調溫板16對向之狀態下俯視為定位孔166Β之長軸 方向大致一致。如此一來,由於一對調溫板16之伸縮方 向-致,因此能防止一對壓模17相對之位置偏移。、 此外,本實施形態中,雖於調溫板16形成有定位孔 ⑹,於絕熱材15、滑件13、或承架14形成有定位銷“A, 但並不限於此,亦可於調溫板16設置定位銷 :◎、或承架Μ形成定位孔。扼要言之,只要::溫 、絕熱材15、滑件13、或承架14之任-方形成 位銷,於任一方形成有定位孔即可。 連結部,162,係、分別於板體部之長邊方向兩端沿短邊 向形成’形成為相對板體部161突出於厚度方向。因此 調溫板整體即形成為側視截面之形狀大致〔 : 專連結部162,沿柘驴部1ή1々| 於此 〜板體部161之紐邊方向分別形成有凹部 16 1345534 «· 167 ’藉由凹部1 67使複數條流路1 63彼此連通。藉由在 兩個凹部167中之一方安裝柱塞168(參照圖2),來密封凹 部167之開口部分。又,於另一凹部丨67之短邊方向大致 中央設有分隔凹部167的壁部169,藉由此壁部169來將 凹部167分離為二。亦即,流路163中之一半,係連通於 被壁部169分隔之一凹部167A,另一半則連通於另一凹部 167B。At two positions on one end side of the direction, the positioning holes 166 are arranged along the longitudinal direction of the plate portion 16i. The positioning holes 166 pass through the positioning pins 14A (see Fig. 3) which are protruded from the heat insulating material 15, the slider 13, and the holder 14. The positioning hole (first positioning hole) 166A in the positioning hole 166 is formed in a substantially circular shape, and its aperture is set to be substantially the same as the diameter of the positioning pin 14A. Moreover, the other positioning hole (second positioning hole) 166B of the positioning hole 166 is formed into a substantially elliptical long hole shape, and the long axis thereof is along a line connecting the center of one positioning hole 166A and the center of the other positioning hole 166B. It is arranged, that is, arranged along the longitudinal direction of the plate body portion 161. Further, the dimension of the positioning hole 166B in the minor axis direction is set to be substantially the same as the diameter of the positioning pin 14A. Accordingly, the temperature regulating plate 16 determines the position in the short side direction by the positioning hole 166A and the positioning hole 166B, and determines the position in the longitudinal direction by (4) 166A $ . X, when the position of the positioning pin 14A is shifted due to the expansion or contraction of the plate 161 or the addition of an I error, the positional deviation can be absorbed by the long hole shape of the positioning hole 166B. According to this, when the temperature regulating plate 16 expands and contracts due to heat, that is, the t-position is stretched in the longitudinal direction of the temperature regulating plate 16, the rotation of the temperature regulating plate 16 can be prevented. Therefore, the swirling of the dust mold attached to the temperature regulating plate 16 can be prevented, and the relative positional deviation of the concave-convex pattern on the substrate 5 can be prevented. Further, the long-axis direction of the other positioning hole 166B is not limited to being disposed along the center of the connection-positioning hole 166A and the other-positioning hole arrangement ' as long as it is substantially parallel to the line. The line of the center of the 166B may have a slight angle 166, although it is disposed at a temperature regulating plate 16, formed on a long side of the pair of temperature regulating plates 6 opposite to each other, but in a temperature regulating plate 16 and another 15 1345534 The positioning hole 166A is formed with a positioning hole ι 66 at a position opposite to the positioning hole 166A, and a positioning hole 166 is formed at a position of a temperature regulating plate 16 opposed to the positioning hole i 66 of the other temperature regulating plate 16. With this configuration, the pair of temperature regulating plates 16 can be restricted in position by positioning holes 166 对 opposite to each other, and the moving direction is restricted by the positioning holes 166 对 opposite to each other, whereby a pair of temperature regulating plates 16 are provided. Since the positioning holes 166 分别 are respectively mounted so as to be expandable and contractible to some extent, when the pair of temperature regulating plates 伸缩 6 are expanded and contracted, the offset of the relative positions of the pair of stampers 能 can be prevented. Here, another positioning hole When the long axis direction of 166 夹 is a predetermined angle with a line connecting the center of one positioning hole 166 与 and the center of the other positioning hole 166β, the predetermined angle is preferably set to be substantially equal to the temperature regulating plate 16 In this case, in the case where the pair of temperature regulating plates 16 are opposed to each other, the longitudinal direction of the positioning holes 166 is substantially uniform. As a result, due to the expansion and contraction of the pair of temperature regulating plates 16, the positional displacement of the pair of stampers 17 can be prevented. Further, in the present embodiment, the positioning hole (6) is formed in the temperature regulating plate 16, and the positioning pin "A" is formed in the heat insulating material 15, the slider 13, or the frame 14, but the present invention is not limited thereto. The temperature plate 16 is provided with a positioning pin: ◎, or a frame Μ forms a positioning hole. In other words, as long as: the temperature, the heat insulating material 15, the sliding member 13, or the carrier 14 form a position pin, formed on either side. The connecting portion, 162, and the respective portions in the longitudinal direction of the plate portion are formed along the short side so as to be formed so as to protrude from the plate body portion 161 in the thickness direction. Therefore, the entire temperature regulating plate is formed as The shape of the side cross section is substantially [: the dedicated connecting portion 162, along the 柘驴 1 ή 1 々 | 〜 〜 〜 板 板 板 板 161 板 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 The passages 1 63 are in communication with each other. The opening portion of the recessed portion 167 is sealed by attaching the plunger 168 (see Fig. 2) to one of the two recessed portions 167. Further, it is provided substantially at the center in the short side direction of the other recessed portion 丨67. The wall portion 169 of the partition recess 167 is separated from the recess portion 167 by the wall portion 169. That is, the flow path 1 One half of 63 is connected to one of the recesses 167A separated by the wall portion 169, and the other half is connected to the other recess 167B.

於設有壁部169側之連結部162,藉由將密封材失於 其間而以機械方式連接有岐管19(連通用管座。參照圖2 及圖3)。岐管19,具備對應連結部162之凹部167形狀的 凹部191、與連通於此凹部191之複數支(本實施形態為六 支)配管192。此等配管中之一半(三支)連通於被壁部 分隔之一凹部167A,另一半(三支)則連通於另一凹部 167B。配管192,係貫通模壓用真空裝£ 18突出至外部, 其端部可與用以將流體供應至流路163之流體供應裝置 3〇(參照圖1G)連接。此外,本實施形態中,係採用蒸氣或 水來作為流通於流路1 6 3之流體。 裝成彼此相反的方向。亦即,安裝於滑件13之調溫板、: 的連結部162係配置成朝上’安裝於承架14之調溫板i 的連結部!62則係配置成朝下。藉由此種配置,在—對’ 溫板16彼此接近時對向之連結部亦不會彼此干涉。°The connecting portion 162 provided on the side of the wall portion 169 is mechanically connected to the manifold 19 by a sealing member (the connecting socket is used. See Figs. 2 and 3). The manifold 19 is provided with a recess 191 corresponding to the shape of the recess 167 of the coupling portion 162, and a plurality of branches (six of the present embodiment) communicating with the recess 191. One half (three) of these pipes communicates with one of the recesses 167A separated by the wall portion, and the other half (three branches) communicates with the other recess 167B. The pipe 192 is protruded to the outside by a through-compression vacuum, and its end portion is connectable to a fluid supply device 3 (see Fig. 1G) for supplying a fluid to the flow path 163. Further, in the present embodiment, steam or water is used as the fluid flowing through the flow path 163. Installed in opposite directions to each other. In other words, the connecting portion 162 of the temperature regulating plate attached to the slider 13 is disposed so as to be attached upward to the connecting portion of the temperature regulating plate i of the rack 14! 62 is configured to face down. With this configuration, the opposing joint portions do not interfere with each other when the pair of the temperature plates 16 approach each other. °

又,調溫板16之長邊方向係沿和熱轉印模壓機械U 工件搬送方向大致正交的方向(與圖i之紙面正交的方向 17 所配置,藉此’例如進行模具交換等、欲使…… 轉印模壓機械1之左右方向移動時,由於配管192亦不會 干涉立柱11,因此能在不拆下調溫板16之狀態下移動承 架14。 接著,此種調溫板16,係藉由以下步驟來製造。此處, 圖6〜圖9,係用以簡略說明之示意圖。 首先,如圖6所示,在較板體材16Α(用於製造)之厚 度方向中心更靠壓模17安裝側的位置,藉由筒形鑽頭等, 開設複數個沿板體材16Α之長邊方向從一端面貫通至另一 端面、彼此平行之相同間距的貫通孔,以形成流路163。 其次,如圖7所示,大幅度地切出板體材16Α之長邊 方向的中央部分,以形成板體部丨6丨。板體部〖6丨被切削 之面為絕熱材15之安裝面,其兩端之突出部分為連結部 M2。此時,須決定板體材16A之切削量,俾使流路163 位於板體部161之厚度方向大致中心。 又,又,連結部162中,沿調溫板16之短邊方向、亦 即連結部162之長邊方向,挖通柱塞168及歧管19之安 裝面,以形成凹部167。 接著’如圖8所示,將柱塞163A壓入各流路163兩 端之開口部分,以機械方式密封流路163。 其後’如圖9所示,於連結部162之凹部167兩側開 孔’以形成用以將柱塞丨68及歧管1 9安裝於連結部i 62 之頂部170。 壓模17係形成為大致矩形板狀,以鎳構成,厚度尺寸 18 1345534 設定成約〇.3mm。壓模I?,係八 係分別安裝於滑件13下方之 調溫板16及承架14上方之調加此, 兩,皿板丨6,於此等壓模17之 彼此對向的面(表面)形成有微細凹凸圖案。本實施形態中, 壓模17’雖因係作成液晶顯示器之背光用導光板而凹凸圖 案為稜鏡圖案,但作為凹凸圖 並不限於此,亦可根據欲 轉印之圖案來採用任意圖案, 示 例如點圖案等。 壓模17,係藉由膠帶、 及附荨適當方法緊貼安裝於調 溫板16。此外,壓模17之尺汁]_^抽、 寸丨、於調溫板16之板體部161, 壓模17,配置於較調溫板 10肀叹有連結部J 62之部分 内側的部分(於圖3以一點鉍蠄固_、 .•鍵線圖不)。根據此種配置,由 於壓模1 7係配置於調溫板丨 双ίο中具有均一厚度尺寸的板體 部161,因此亦能使壓模w 之,皿度刀布均一。藉此,能使 凹凸圖案之轉印性能良好。 此處,5周溫板16及题描17 ^ 模17 ’為了防止因伸縮等造成 彼此相對位置偏銘,县> μ 、 最好係以熱膨脹係數相近之材料構 成’而以同一材料構成則 取幻又更佳。本貫施形態中,調溫板 16係以鐵構成,懕楛 ,,α, 、 則係以錄構成,為一熱膨張率彼 此相近之組合。 2壓用真空裝置18,具備分別從滑件13下方及承架14 上方大出所β又置之一對壁部丨81、設於壁部1 Η之〇型環 _8 及用以使被壁部181包圍之區域成為真空的未圖 丁工孔吸引裝置。壁部18卜係以包圍壓模17、調溫板Μ、 以及絕熱材1 5外月夕j r周之方式配置成大致矩形環狀。Ο型環182 係設於-對壁部181對向之端面。 19 1345534 圖1 〇係顯示使用熱轉印模壓機械1進行熱轉印模壓加 工8^·之熱轉印模壓系統1〇〇的構成方塊圖。如此圖6所示, 熱轉印模壓系統100,具備熱轉印模壓機械1、以及用以 將流體供應至調溫板1 6之流路1 63的流體供應裝置3〇。 熱轉印模壓機械1,除了前述各構成構件以外,尚具 備:壓力調整器(壓力調整機構)21,係調整流通於調溫板 16之流路的蒸氣壓力;流量調整器(流量調整機構)22,係 調整流通於流路163之水的流量;開關閥23,係設於調溫 板16之流路163兩側;作為溫度檢測機構之溫度感測器 24 ’係檢測調溫板16之溫度;以及作為控制機構之控制 器25 ’係根據來自溫度感測器24之訊號控制壓力調整器 21、流量調整器22、開關閥23、以及滑件13等之動作。 壓力調整器2 1,係分別獨立設置於一對調溫板丨6。藉 由此種構成,能分別獨立控制於一對調溫板16之流路163 流通之蒸氣的壓力,分別獨立控制調溫板16之加熱溫度 並加以調整。 又,壓力調整器21,係分別設於各調溫板16之流路163 的入口側(壓力調整器21A)與出口側(壓力調整器2iB)。藉 由此種構成,由於壓力調整器21(21A,21B)係在流路163 兩側進行流通於流& 163内之蒸氣的壓力,因此能以高精 度進行壓力調整》 流量調整器22,係分別獨立設置於一對調溫板16。藉 由此種構成,能分別獨立控制流通於一對調溫16之流 3之水的⑽畺,为別獨立控制調溫板16之冷卻溫度 20 1345534 並加以調整》流量調整器22,係設於調溫板16之流路163 的入口側。 此處,來自設於流路163入口測之壓力調整器21A的 流路4卜與來自流量調整器22之流路42,係連接於相同 之流路43,此流路43連接於調溫板16之配管19卜此處, 流路43,係連接於調溫板16之配管192中、連通於被壁 部169分隔之一凹部167A的三支配管192。又,在連接於 另一凹部167B之三支配管192,連接有用以排出流路163 内之流體的流路44,此流路44 ,係分歧成用以排出蒸氣 之流路45與用以排出水之流路46。又,於流路45安裝有 壓力調整器21B。 藉由此種構成,來自流體供應裝置3〇之蒸氣及水,即 能流通於連接在調溫板丨6之共通配管丨92的同一流路 163。據此,由於不須於調溫板16分別設置專用於加熱用 及冷卻用的流路,因此能將在調溫板16 β之蒸氣或冷卻 水的接觸面積作得較大,提升調溫板16之加熱效率或冷 卻效率。 開關閥23,係分別設於流路163之入口側及出口側, 具體而言,開關閥23 ,係設於流路41,42, 45, 46途中。 開關閥23’係以來自開關閥25之訊號來開關流路Μ,μ 46 ° 5 溫度感測器24係設於調溫板16。如前述圖4所示, 於調皿板1 6之長邊’沿調溫板i 6之短邊方向形成有安裝 孔241,其係用以將調溫感測器24安裝於厚度方向大致中 21 1345534 央。安裝孔241,係於補、、B , 4鬥, 调/m板1 6之相同側的長邊彼此相距 既定距離形成有兩處,公R丨丨献番机、* & & ^刀別配置於連結部162附近。溫度 感測器24,係分別檢測ψ咕Αβ八—.ra 、J出該口p刀之度,並將溫度檢測訊 號輪出至控制器25。 控制器25,係根據溫度感測器24之溫度檢測訊號將 調整訊號送至壓力調整器21或流量調整器22,以進行壓 力或流量之控制,俾使調溫板16之溫度值保持於既定溫 _度(既定加熱溫度或既定冷卻溫度,控 &係根 據溫度感測g 24之溫度檢測訊號;或内裝於控制@ 之計 時器等的訊號,來控制開關閥23之開關時序,以進行流 通於流路163内之蒸氣及水的切換’控制加熱及冷卻的時 •序》此夕卜,於滑件驅動裝置130,係設有用以檢測出作用 於滑件i3之加塵力的加壓力感測g 26、以及用以檢測出 滑件13之升降位置的滑件位置感測胃27 ’來自加壓力感 測器26之加壓力檢測訊號及來自滑件位置感測器27之滑 _ 件位置檢測訊號,係輸出至控制器25。控制器25,係祀 據溫度感測器24之溫度檢測訊號,來監測來自加麼力感 測器26之加壓力檢測訊號及來自滑件位置感測器之滑 件位置檢測訊號,且將滑件13之升降移動的驅動訊號Z 至滑件驅動裝置130,來控制模壓加工之時序。 仏 流體供應裝置30’具備將作為加熱流體之蒸氣供應至 調溫板1 6的蒸氣供應裝置3 1、以及將作為冷卻流體之水 供應至調溫板16的冷卻水供應裝置32。 蒸氣供應裝置3卜具備蒸氣鋼爐33與蒸氣、溫水回 22 1345534 收器34。蒸氣鋼爐33係連接於壓力货。。 ,_ ^ 刀调整态21 ’透過此壓 34遠/ Η將蒸氣供應至調溫板16。蒸氣、溫水回收器 連=流路45,用以回收從調溫板“排出之蒸氣或溫 =此外,以蒸氣、溫水回收器34目收之—部分温水, =回至蒸⑽33,並再次加熱成為蒸氣而供應至調溫 板16 〇 二處,由於係使用蒸氣來作為調溫板16之加熱媒體, =氣之凝結溫度係取決於飽和蒸氣壓,因此“調整調 }皿板16之流4 163的壓力’即能進行穩定且溫度分散較 少的溫度管理。又,由於係使用蒸氣來作為加熱媒體,而 能使傳至調溫板16之熱傳達率良好,因此能縮短調溫板Μ 之加熱時間,進而縮短熱轉印模壓加工之楯環時門。 /卻水供應裝置32’具備冷卻水循環裝置^5與工廠 冷卻水供應裝置36 〇冷卻水循環裝置35内 〇衣有禾圖不录, 係連接於調溫板16之入口側的配管192。透過安裝於途中 之流量調整器22將冷卻用水供應至調溫板16。又,冷卻 水循環裝置35連接於流路46 ’通過流路邨排出之水及從 蒸氣、溫水回收器34排出之蒸氣或一部分溫水,係被= 卻水循環裝置35回收。於冷卻水循環裝置35内裝有熱交 換器351,藉由和從工廠冷卻水供應裝置%供應之工廠用 冷卻水進行熱交換,來將從調溫板16及蒸氣、溫水回收 器34排出之蒸氣或水冷卻至既定溫度’再次供應至調溫 板16 〇 此處,由於係採用蒸氣作為加熱媒體,並採用水來作 23 1345534 為冷卻媒體,而即使使共通之流路163彼此流通亦不會降 低加熱性能或冷卻性能,因此能長期間進行穩定之加熱及Further, the longitudinal direction of the temperature regulating plate 16 is arranged in a direction substantially perpendicular to the direction in which the workpiece of the thermal transfer molding machine U is conveyed (the direction 17 orthogonal to the plane of the paper of FIG. i, whereby for example, mold exchange, etc. When the transfer molding machine 1 is moved in the left-right direction, the pipe 192 does not interfere with the column 11, so that the frame 14 can be moved without removing the temperature regulating plate 16. Next, the temperature regulating plate 16 It is manufactured by the following steps. Here, Fig. 6 to Fig. 9 are schematic diagrams for short description. First, as shown in Fig. 6, at the center of the thickness direction of the plate body 16 (for manufacturing) A plurality of through holes penetrating from the one end surface to the other end surface and parallel to each other in the longitudinal direction of the plate body 16Α are formed by a cylindrical drill or the like at a position on the mounting side of the stamper 17 to form a flow path. 163. Next, as shown in Fig. 7, the central portion of the longitudinal direction of the plate member 16 is roughly cut out to form a plate portion 丨6丨. The plate portion is cut into a heat insulating material 15 The mounting surface, the protruding portion at both ends is the connecting portion M2. The cutting amount of the fixed plate member 16A is such that the flow path 163 is located substantially at the center in the thickness direction of the plate body portion 161. Further, in the connecting portion 162, the short side direction of the temperature regulating plate 16, that is, the connecting portion 162 In the longitudinal direction, the mounting faces of the plunger 168 and the manifold 19 are drilled to form the recess 167. Next, as shown in Fig. 8, the plunger 163A is pressed into the opening portions at both ends of each flow path 163 to be mechanically sealed. The flow path 163. Thereafter, as shown in Fig. 9, a hole ' is formed in both sides of the concave portion 167 of the joint portion 162 to form a plunger 170 and a manifold 1 9 attached to the top portion 170 of the joint portion i 62. The mold 17 is formed in a substantially rectangular plate shape and is made of nickel, and the thickness of 18 1345534 is set to about 〇3 mm. The stamper I? is mounted on the temperature regulating plate 16 and the frame 14 below the slider 13 respectively. In addition, the plate 丨6 is formed with a fine concavo-convex pattern on the surfaces (surfaces) facing each other of the stamper 17. In the embodiment, the stamper 17' is used as a backlight for the liquid crystal display. The light guide plate and the concave-convex pattern are a 稜鏡 pattern, but the uneven pattern is not limited thereto, and may be transferred according to Any pattern, such as a dot pattern, etc., is used. The stamper 17 is attached to the temperature regulating plate 16 by a tape and a suitable method. In addition, the size of the stamper 17 is _^, inch inch The plate body portion 161 of the temperature regulating plate 16 and the stamper 17 are disposed at a portion of the temperature regulating plate 10 which is sighed inside the portion of the connecting portion J 62 (in FIG. 3, the shackle _, . . . According to this configuration, since the stamper 17 is disposed in the plate body portion 161 having a uniform thickness in the temperature regulating plate, the stamper w can be made uniform. Therefore, the transfer performance of the concave-convex pattern can be improved. Here, the 5-week temperature plate 16 and the title 17^ die 17' are preferably thermally expanded in order to prevent relative positional deviation from each other due to expansion or the like. Materials with similar coefficients form 'and the same material is illusory and better. In the present embodiment, the temperature regulating plate 16 is made of iron, and 懕楛, α, and 。 are composed of a combination of heat expansion rates close to each other. The pressurizing vacuum device 18 is provided with a pair of wall portions 丨81 which are separated from the lower side of the slider 13 and above the frame 14, and a 环-shaped ring _8 which is provided on the wall portion 1 and is used to make the wall The area surrounded by the portion 181 becomes a vacuum unillustrated hole suction device. The wall portion 18 is disposed in a substantially rectangular ring shape so as to surround the stamper 17, the temperature regulating plate, and the outer circumference of the heat insulating material 15 . The Ο-shaped ring 182 is attached to the end surface of the opposite wall portion 181. 19 1345534 Fig. 1 shows a block diagram of a thermal transfer molding system 1 热 using a thermal transfer molding machine 1 for thermal transfer molding. As shown in Fig. 6, the thermal transfer molding system 100 is provided with a thermal transfer molding machine 1, and a fluid supply device 3 for supplying a fluid to the flow path 163 of the temperature regulating plate 16. The thermal transfer molding machine 1 includes a pressure regulator (pressure adjusting mechanism) 21 for adjusting the vapor pressure of the flow path flowing through the temperature regulating plate 16 in addition to the above-described respective constituent members, and a flow rate adjuster (flow rate adjusting mechanism) 22, the flow rate of the water flowing through the flow path 163 is adjusted; the on-off valve 23 is disposed on both sides of the flow path 163 of the temperature regulating plate 16; and the temperature sensor 24' as the temperature detecting means detects the temperature regulating plate 16 The temperature and the controller 25' as the control mechanism control the operation of the pressure regulator 21, the flow regulator 22, the on-off valve 23, and the slider 13 based on the signal from the temperature sensor 24. The pressure regulators 2 1 are independently provided to a pair of temperature regulating plates 丨6. According to this configuration, the pressure of the vapor flowing through the flow path 163 of the pair of temperature regulating plates 16 can be independently controlled, and the heating temperature of the temperature regulating plate 16 can be independently controlled and adjusted. Further, the pressure regulator 21 is provided on the inlet side (pressure regulator 21A) and the outlet side (pressure regulator 2iB) of the flow path 163 of each temperature regulating plate 16, respectively. According to this configuration, since the pressure regulator 21 (21A, 21B) performs the pressure of the vapor flowing through the flow & 163 on both sides of the flow path 163, the pressure adjustment can be performed with high precision. They are independently disposed on a pair of temperature regulating plates 16 respectively. With this configuration, it is possible to independently control (10) 流通 of the water flowing through the pair of tempering flows 16 to independently control the cooling temperature 20 1345534 of the temperature regulating plate 16 and adjust the flow regulator 22 to be The inlet side of the flow path 163 of the temperature regulating plate 16. Here, the flow path 4 from the pressure regulator 21A provided at the inlet of the flow path 163 and the flow path 42 from the flow regulator 22 are connected to the same flow path 43, which is connected to the temperature regulating plate. In the pipe 19 of the 16th, the flow path 43 is connected to the pipe 192 of the temperature regulating plate 16, and communicates with the three pipes 192 which are separated by the recess 167A by the wall portion 169. Further, the three pipes 192 connected to the other concave portion 167B are connected to a flow path 44 for discharging the fluid in the flow path 163, and the flow path 44 is branched into a flow path 45 for discharging the steam and for discharging. Water flow path 46. Further, a pressure regulator 21B is attached to the flow path 45. With this configuration, the vapor and water from the fluid supply device 3 can flow through the same flow path 163 connected to the common piping 92 of the temperature regulating plate 丨6. According to this, since it is not necessary to separately provide a flow path dedicated to heating and cooling in the temperature regulating plate 16, the contact area of the steam or the cooling water in the temperature regulating plate 16 can be made large, and the temperature regulating plate can be raised. 16 heating efficiency or cooling efficiency. The on-off valve 23 is provided on the inlet side and the outlet side of the flow path 163, respectively. Specifically, the on-off valve 23 is provided in the middle of the flow paths 41, 42, 45, 46. The on-off valve 23' switches the flow path 以 with a signal from the on-off valve 25, and the μ 46 ° 5 temperature sensor 24 is provided on the temperature adjustment plate 16. As shown in FIG. 4 above, a mounting hole 241 is formed in the short side of the temperature regulating plate i 6 on the long side of the palette plate 16 for mounting the temperature sensor 24 in the thickness direction. 21 1345534 Central. The mounting hole 241 is attached to the complement, the B, and the 4th, and the long sides of the same side of the m/m plate 16 are formed at two distances apart from each other by a predetermined distance, and the male R 丨丨 丨丨 、 , * &&& It is not disposed near the connecting portion 162. The temperature sensor 24 detects the degree of the pβ8-.ra, J, and the p-knife, and rotates the temperature detection signal to the controller 25. The controller 25 sends the adjustment signal to the pressure regulator 21 or the flow regulator 22 according to the temperature detection signal of the temperature sensor 24 to control the pressure or the flow rate, so that the temperature value of the temperature regulating plate 16 is maintained at the predetermined value. Temperature _ degrees (established heating temperature or a predetermined cooling temperature, control & based on the temperature sensing g 24 temperature detection signal; or a signal built into the control @ timer, etc., to control the switching timing of the switching valve 23, The switching of the steam and the water flowing through the flow path 163, "the timing of controlling the heating and cooling", is provided in the slider driving device 130 for detecting the dusting force acting on the slider i3. The pressure sensing g 26 and the slider position for detecting the lifting position of the slider 13 sense the stomach 27' from the pressure sensor 26 and the slip from the slider position sensor 27. The position detection signal is output to the controller 25. The controller 25 monitors the pressure detection signal from the force sensor 26 and the position from the slider according to the temperature detection signal of the temperature sensor 24. Sensor position detection The timing signal, and the driving signal Z for moving the lifting and lowering of the slider 13 to the slider driving device 130, controls the timing of the molding process. The fluid supply device 30' is provided with a vapor as a heating fluid supplied to the temperature regulating plate 16 The steam supply device 31 and the cooling water supply device 32 that supplies the water as the cooling fluid to the temperature regulating plate 16. The steam supply device 3 is provided with a steam steel furnace 33 and steam, and a warm water back 22 1345534. The furnace 33 is connected to the pressure goods., _ ^ knife adjustment state 21 'through this pressure 34 far / Η steam is supplied to the temperature regulation plate 16. steam, warm water recovery unit = flow path 45, for recycling The temperature plate "exhaust steam or temperature = in addition, the steam, warm water recovery device 34 - part of the warm water, = back to steam (10) 33, and again heated to become steam and supplied to the temperature control plate 16 ,, due to the system Vapor is used as the heating medium of the temperature regulating plate 16, and the condensation temperature of the gas is determined by the saturated vapor pressure, so that the "pressure of the flow 4 163 of the plate 16 can be adjusted" to achieve a stable temperature with less temperature dispersion. Management. Also, due to the use of steam As the heating medium, the heat transfer rate to the temperature regulating plate 16 can be made good, so that the heating time of the temperature regulating plate 缩短 can be shortened, and the door of the heat transfer molding process can be shortened. 'The cooling water circulation device ^5 and the factory cooling water supply device 36 are disposed in the cooling water circulation device 35, and are connected to the piping 192 on the inlet side of the temperature regulating plate 16. Through the flow regulator installed on the way 22, the cooling water is supplied to the temperature regulating plate 16. Further, the cooling water circulation device 35 is connected to the water discharged from the flow path 46' through the flow path village and the steam or a part of the warm water discharged from the steam and the warm water recovery unit 34. However, the water circulation device 35 recovers. A heat exchanger 351 is installed in the cooling water circulation device 35, and is discharged from the temperature regulating plate 16 and the steam and warm water recovery unit 34 by heat exchange with the cooling water supplied from the factory cooling water supply device %. Steam or water is cooled to a predetermined temperature 're-supply to the temperature regulating plate 16 〇 Here, since steam is used as the heating medium, and water is used as the cooling medium 23 13345534, even if the common flow path 163 is circulated to each other Will reduce the heating performance or cooling performance, so it can be stably heated for a long period of time and

冷卻。又,藉由使流路163交互流通,使加熱媒體與冷卻 媒體即使混合亦不會產生不良㈣,因&能使加熱媒體(蒸 氣)及冷卻媒體(水)之操作性良好。再者,由於即使蒸氣與 水混合亦不會產生不良情形’因此藉由將蒸氣、溫水回收 器34(蒸氣供應裝置31之一部分)排出之蒸氣或溫水供應 至冷卻水循環裝置35(冷卻水供應裝置32之一部分)來冷 部蒸氣,使蒸氣迅速地成為水而減少體積,藉此即能將蒸 氣、溫水回收器34之壓力保持於較低,保持從蒸氣鍋爐33 通過調溫板16之蒸氣流動順暢。 、此種熱轉印模壓機械1,係藉由如下之熱轉印模壓方 法,來將壓模17之凹凸圖案熱轉印至基材5。 圖11,係顯示本實施形態之熱轉印模壓機械丨之熱轉 印壓方法的流程圖。此圖u中’首先’熱轉印模壓機械卜 具備:加熱步驟,係藉由蒸氣將調溫板16加熱至既定溫 度;轉印步驟,係將壓模17表面之凹凸圖案轉印至基材 冷卻步驟,係藉由水將調溫板16冷卻至既定溫度以使 基材5表面之凹凸圖案凝固。又,在加熱步驟與轉印步驟 之間,設有使壓模17周邊成為真空之真空步驟。 首先,加熱步驟中,步驟S1,控制器25藉由開啟連 接於流路41,45之開關閥23,來從蒸氣鋼爐Μ將蒸氣供 ='至調溫板16。蒸氣,係從六支配管192中之三支配管Μ 過調溫板16中被壁部169分隔之—凹部167流通至流 g 目㈣之連結部i62肖即通過相反側之 凹部167’並沿相反方向流通於另一半之流路163。接著, 通過被壁部169分隔之另一凹部167而到達岐管19,從剩 支配B 192排出至出口側的流路44。據此,蒸氣即 沿在,溫板16之俯視為大致U字形的方向流通。 —當蒸氣流通於流路163内時,在流路…,蒸氣之 > 刀即凝結成溫水。藉由此時產生之潛熱(凝結熱)及蒸 礼之熱旦將調溫板16力。熱至既定溫度。此處,既定溫度 :在考里基材5之材料或壓帛17之凹凸圖案尺寸等後適 :設定,本實施形態中’既定溫度係設定成約13(rc。又, 路163内之蒸氣壓力,係適當設定纟〇 u〜〇 2讀?丑 範圍。cool down. Further, by causing the flow paths 163 to flow alternately, the heating medium and the cooling medium are not mixed even if they are mixed (4), and the operability of the heating medium (vapor) and the cooling medium (water) can be improved. Further, since even if the steam is mixed with water, no problem occurs. Therefore, steam or warm water discharged from the steam, warm water collector 34 (a part of the steam supply device 31) is supplied to the cooling water circulation device 35 (cooling water) The portion of the supply unit 32) cools the vapor so that the vapor rapidly becomes water and reduces the volume, whereby the pressure of the vapor and warm water recovery unit 34 can be kept low, and the temperature control plate 16 is maintained from the steam boiler 33. The vapor flow is smooth. In the thermal transfer molding machine 1, the concave-convex pattern of the stamper 17 is thermally transferred to the substrate 5 by the following thermal transfer molding method. Fig. 11 is a flow chart showing the heat transfer printing method of the thermal transfer molding machine of the embodiment. The 'first' thermal transfer molding machine in this figure u has a heating step of heating the temperature regulating plate 16 to a predetermined temperature by steam; and a transfer step of transferring the concave and convex pattern on the surface of the stamper 17 to the substrate. In the cooling step, the temperature regulating plate 16 is cooled to a predetermined temperature by water to solidify the concave-convex pattern on the surface of the substrate 5. Further, between the heating step and the transfer step, a vacuum step of bringing the periphery of the stamper 17 into a vacuum is provided. First, in the heating step, in step S1, the controller 25 supplies steam from the steam steel furnace to the temperature regulating plate 16 by opening the on-off valve 23 connected to the flow paths 41, 45. The vapor is separated from the three pipes of the six pipes 192 by the wall portion 169 in the temperature regulating plate 16 - the concave portion 167 flows to the joint portion i62 of the flow g (4), that is, passes through the concave portion 167' on the opposite side and along The opposite direction flows through the other half of the flow path 163. Then, the other concave portion 167 partitioned by the wall portion 169 reaches the manifold 19, and is discharged from the remaining control B 192 to the flow path 44 on the outlet side. Accordingly, the vapor flows along the direction in which the temperature plate 16 is substantially U-shaped in plan view. - When the vapor circulates in the flow path 163, the steam is condensed into warm water in the flow path. The heat transfer plate 16 force is generated by the latent heat (condensation heat) generated at this time and the steaming heat. Heat to a given temperature. Here, the predetermined temperature is set after the material of the Kauri base material 5 or the size of the concavo-convex pattern of the pressurization 17 or the like: in the present embodiment, the predetermined temperature is set to about 13 (rc. Further, the vapor pressure in the road 163 is set. It is appropriate to set 纟〇u~〇2 to read the ugly range.

加其-人,步驟S2 ’與加熱步驟同時地,將基材5定位於 承木14上之壓模17上加以裝載,於彼此對向之壓模ο 間配置基材5 °步驟S3 ’控制器25發送使滑件13下降至 '月件驅動虞置130之驅動訊號。滑件驅動裝置130,將滑 件13下降至既定位置,使壓模用真空農置18之壁部181 彼此接觸,藉由0型環182密閉以壁部1 81包圍之空間。 在此狀態下’保持於滑件13之壓模17並不接觸於基材5。 步驟S4 ’藉由以空氣吸引裝置吸引壁部181内側之空間内 的二礼,開始進行該空間之抽真空。步驟S5,判斷壁部1 二4疋否已達既定壓力(既定真空壓),並持續 抽真空直到達到既定壓力為丨。 τ 精由上述步驟S3到步驟S5之真空步驟,能防止空氣 25 1345534 進入壓模17與基材5之間。據此,能確實防止壓模ι7之 凹凸圖案的轉印不良。 其次,步驟S6,以溫度感測器24檢測調溫板16之溫 度來自’里度感測器2 4之溫度檢測訊號輪出至控制器2 5。 控制器2 5,係在步驟s 7中監測溫度檢測訊號,判斷調溫 板1 6之/JBL度疋否已達既定溫度。此時,溫度感測器2 4雖 分別於各調溫板各設有兩個,但亦可藉由控制器25判斷 來自此等兩個溫度感測器24之溫度檢測訊號的平均是否 已達既定溫度,或亦可判斷來自兩個溫度感測器24之溫 度檢測訊號中任一方或兩方是否已達既定溫度。 此處,溫度感測器24係於一對調溫板16分別各設有 兩個,壓力調整器21,係分別獨立設置於基板5兩側之一 對調溫板16。藉此,蒸氣之壓力控制,係可對一對調溫板 16分別獨立進行。據此,能以更高精度進行調溫板16之 服度調整,容易地將一對調溫板丨6之加熱溫度控制成相 等。藉此,能防止因一對調溫板16之溫度差異造成基板5 的輕曲等。 又,由於壓力調整器21係分別設於調溫板16之入口 側與出口 則’因此能在該兩處調整蒸氣壓力。此點,由於 在蒸氣流通於流路163内來加熱調溫板16時,蒸氣溫度 會變化使壓力變動,因此在防止因此壓力變動造成調溫板 16溫度下降之方面係相當有用的。又,蒸氣在流路16:内 凝結:溫水時,由於流路163内之壓力容易變動因此藉 由在"IL路163之出口側亦設置壓力調整器21使調溫板w 26 丄3叶 之溫度易於管理,故特別有用。 當調溫板16之溫度到達既定溫度時,控制器25,即 在v驟S8中’對滑件驅動裝置⑽輸出使滑件η下降之 ㈣滑件驅動裝置咖,係使滑件13更加下降,使 壓模17接觸於基材5兩面。步驟S9’控制器25,即將滑 件13之保持位置的控制,從檢測滑件η之位置來進行控 制的位置控制、切換成檢測出作用於滑件13 t壓力來進 仃控制的壓力控制’並檢測滑件i 3對基# 5之壓力,以 既定壓力將壓模對基材5兩面進行加壓。 由於係藉由塵力控制來控制滑件13之動作,因此例如 基材5或壓模17產生製造上之尺寸誤差時,亦不會在屋 模Π與基材5之間產生誤差或以過大壓力加壓能將壓 模Π對基材5以適當的壓力進行加壓,確實地防止凹凸 圖案對基材5之轉印不良產生。 步驟S10,控制器25,在保持滑件丨3對基材5之加 壓力的狀態下’監測是否已經過既定時間(轉印步驟)。本 實施形態中,既定時間例如設定成1〇秒。藉由此轉印步 驟,將被調溫板16加熱之壓模17緊壓於基材5,而僅使 基材5之表面熔融,將形成於壓模17表面之凹凸圖案轉 印至基材5表面。 此外,本實施形態中,在進行轉印步驟之期間,亦持 續同時進行加熱步驟’控制ϋ 25,係監測來自溫度感測器 2 4之/JEL度檢測訊號來控制壓力調整器2 !,並調整蒸氣壓 力,藉此將調溫板16之溫度持續保持於既定溫度。具體 27 1345534 。田以'皿度感測器24檢測出之溫度低於既定溫度時, 即輪出使洛氣遷力增加之調整訊號,當溫度高於既定广戶 時’即輸出使蒸氣壓力減少之調整訊號。 又 此處’轉印步驟’由於係在以加熱步驟將調溫板1 6加 熱至既疋溫度後才開始進行,因此在以壓# 1 7對基材5 進行加麼既定時間時,能充分地確保基材5之熔融量,據 此能確實地防止壓模17之凹凸圖案轉印不良的情形產生。 又’由於藉由轉印步驟僅使基材5表面附近炫融來轉 印墨模17之凹凸圖案’因此例如與藉由習知之射出成形 來形成凹凸圖案的情形相較,能以較短時間成形。亦即, 驾知例如藉由射出成形來形成凹凸圖案之情形下,當產品 尺寸較大或產品厚度較大時,即須時間進行冷卻而無法縮 短循環時間。相對於此,太眘λi 了此本實粑形態中,由於藉由轉印步 驟僅使基材5表面附近炼融來轉印壓模17之凹凸圖案, 因此即使轉印對象之基# 5較大型時或板厚增加時,亦能 以短時間進行凹凸圖案之轉印,有彈性地對應基材$之大 型化。 步驟S10,當在愿描;丨ί· 一… 對基材5加遷之狀態下經過既 W节即進至步驟S11,控制器25,關閉連接於流路 ,5之蒸乳用開關閥23而結束加熱步驟。接著,步驟s口 令開放連接於流路41,46之水用開關閥23,藉 «裝置35供應冷卻用水’將流通於調溫板Μ之流路163 内的流體從蒸氣切換成水,而開始冷卻步驟。 由於切換蒸氣與水並使其流通於·板以共通流路 28 1M5534 163’因此不須分科備專用之流路,能將對調溫板^之 接觸面積作成較大。據此,能提升加熱效率及冷卻效率, 又,能以短時間加熱或冷卻調溫板16及壓模17。 在步驟SU開始壓模17之冷卻後,步驟⑴,即解除 模壓用真空裝置18對壁部181内之空間的真空狀態,而 結束真空步驟。此處,由於壓模17緊貼於基材5,使凹凸 圖案已轉印於基材5,因此已無須繼續保持真空狀態。Adding the person-in-person, step S2' simultaneously with the heating step, positioning the substrate 5 on the stamper 17 on the receiving block 14, and placing the substrate between the opposing stampers ο. Step S3 'Control The device 25 transmits a drive signal for lowering the slider 13 to the 'monthly drive unit 130. The slider driving device 130 lowers the slider 13 to a predetermined position, and the wall portions 181 of the vacuum mold 18 for the stamper are brought into contact with each other, and the space surrounded by the wall portion 1 81 is sealed by the O-ring 182. In this state, the stamper 17 held by the slider 13 does not contact the substrate 5. In step S4', the evacuation of the space is started by the second suction in the space inside the wall portion 181 by the air suction device. In step S5, it is judged whether or not the wall portion 1 has reached the predetermined pressure (established vacuum pressure), and the vacuum is continuously applied until the predetermined pressure is reached. The vacuum step of the above step S3 to step S5 prevents the air 25 1345534 from entering between the stamper 17 and the substrate 5. According to this, it is possible to surely prevent the transfer failure of the uneven pattern of the stamper ι7. Next, in step S6, the temperature sensor 24 detects the temperature of the temperature regulating plate 16 from the temperature detecting signal of the 'Rin sensor 24' to the controller 25. The controller 25 monitors the temperature detecting signal in step s7 to determine whether the temperature of the temperature regulating plate 16/JBL has reached a predetermined temperature. At this time, although the temperature sensor 24 is provided with two for each temperature regulating plate, it is also possible for the controller 25 to determine whether the average temperature detecting signals from the two temperature sensors 24 have reached the average. At a given temperature, it is also possible to determine whether one or both of the temperature detecting signals from the two temperature sensors 24 have reached a predetermined temperature. Here, the temperature sensor 24 is provided on each of the pair of temperature regulating plates 16 respectively, and the pressure regulator 21 is independently disposed on one of the two sides of the substrate 5 for the temperature regulating plate 16. Thereby, the pressure control of the vapor can be performed independently for each of the pair of temperature regulating plates 16. According to this, the adjustment of the temperature of the temperature regulating plate 16 can be performed with higher precision, and the heating temperatures of the pair of temperature regulating plates 6 can be easily controlled to be equal. Thereby, it is possible to prevent the substrate 5 from being gently bent or the like due to the temperature difference between the pair of temperature regulating plates 16. Further, since the pressure regulators 21 are respectively provided at the inlet side and the outlet of the temperature regulating plate 16, the vapor pressure can be adjusted at the two places. In this case, when the temperature regulating plate 16 is heated by the vapor flowing in the flow path 163, the vapor temperature changes and the pressure fluctuates. Therefore, it is useful in preventing the temperature fluctuation of the temperature regulating plate 16 from being lowered due to the pressure fluctuation. Further, when the vapor is condensed in the flow path 16: in the case of warm water, since the pressure in the flow path 163 is easily changed, the temperature adjustment plate w 26 丄 3 is also provided by the pressure regulator 21 on the outlet side of the "IL path 163. The temperature of the leaves is particularly manageable because it is easy to manage. When the temperature of the temperature regulating plate 16 reaches a predetermined temperature, the controller 25, that is, in the step S8, 'outputs the slider driving device for lowering the slider η to the slider driving device (10), so that the slider 13 is further lowered. The stamper 17 is brought into contact with both sides of the substrate 5. Step S9' controller 25, that is, the control of the holding position of the slider 13, the position control for controlling the position of the detecting slider η, and the switching to the pressure control for detecting the pressure applied to the slider 13 t. The pressure of the slider i 3 against the base # 5 is detected, and the stamper presses both sides of the substrate 5 at a predetermined pressure. Since the action of the slider 13 is controlled by the dust control, for example, when the substrate 5 or the stamper 17 produces manufacturing dimensional errors, there is no error or excessive between the house mold and the substrate 5. The pressure pressurization pressurizes the stamper 基材 against the substrate 5 at an appropriate pressure to reliably prevent the transfer failure of the uneven pattern on the substrate 5. In step S10, the controller 25 monitors whether or not a predetermined time has elapsed (the transfer step) while maintaining the pressure of the slider 丨3 against the substrate 5. In the present embodiment, the predetermined time is set, for example, to 1 second. By this transfer step, the stamper 17 heated by the temperature regulating plate 16 is pressed against the substrate 5, and only the surface of the substrate 5 is melted, and the uneven pattern formed on the surface of the stamper 17 is transferred to the substrate. 5 surface. Further, in the present embodiment, during the transfer step, the heating step 'control ϋ 25 is continuously performed, and the /JEL degree detection signal from the temperature sensor 24 is monitored to control the pressure regulator 2! The vapor pressure is adjusted to maintain the temperature of the temperature regulating plate 16 at a predetermined temperature. Specific 27 1345534. When the temperature detected by the dish sensor 24 is lower than the predetermined temperature, that is, the adjustment signal for increasing the gas migration force when the temperature is higher than the predetermined household, the output is adjusted to reduce the vapor pressure. . Further, since the 'transfer step' is started after the temperature adjustment plate 16 is heated to the temperature of the enthalpy in the heating step, it is sufficient when the substrate 5 is applied for a predetermined time by the pressure #17. The amount of melting of the substrate 5 is ensured, whereby the occurrence of poor transfer of the uneven pattern of the stamper 17 can be reliably prevented. Further, since the concave-convex pattern of the ink mold 17 is transferred by merely transferring the vicinity of the surface of the substrate 5 by the transfer step, for example, it can be formed in a shorter period of time than the case where the concave-convex pattern is formed by conventional injection molding. Forming. That is, in the case where the concave-convex pattern is formed by injection molding, for example, when the product size is large or the product thickness is large, it takes time to cool and the cycle time cannot be shortened. On the other hand, in the present embodiment, since the concave-convex pattern of the stamper 17 is transferred by merely smelting the vicinity of the surface of the substrate 5 by the transfer step, even if the basis of the transfer target is #5 When the size is large or the thickness is increased, the transfer of the uneven pattern can be performed in a short time, and the substrate can be elastically increased in size. In the step S10, when the substrate 5 is moved, the W branch is passed through the W section, and the controller 25 is turned on, and the controller 25 closes the steam switching valve 23 connected to the flow path. The heating step is ended. Next, the step s password is opened to the water switching valve 23 of the flow paths 41, 46, and the fluid flowing through the flow path 163 of the temperature regulating plate is switched from the vapor to the water by the "cooling water supplied from the device 35". Cooling step. Since the steam and the water are switched and flowed through the common flow path 28 1M5534 163', it is possible to make the contact area of the temperature control plate larger by the flow path. According to this, the heating efficiency and the cooling efficiency can be improved, and the temperature regulating plate 16 and the stamper 17 can be heated or cooled in a short time. After the cooling of the stamper 17 is started in step SU, the step (1) is to cancel the vacuum state of the space in the wall portion 181 by the vacuuming device 18 for molding, and the vacuum step is ended. Here, since the stamper 17 is in close contact with the substrate 5, the uneven pattern is transferred to the substrate 5, so that it is no longer necessary to maintain the vacuum state.

步驟S14,以溫度感測器24檢測調溫板16之溫度。 溫度感測H 24係將溫度檢測訊號輸出至控制器&控制 器25 ’根據此溫度檢測訊號將控制訊號輸出至流量調整写 22,藉由調整流通於…63之水的流量,來控制調溫板 16之溫度。 接著’步驟S15 ’控制器25監視來自溫度感測器24 之酿度檢測訊號,判斷此溫度檢測訊號是否已達既定严 度。 '皿 此外,調溫板16之冷卻的既定溫度,係在考量基材$ 之材料或壓模17 <凹凸圖案尺寸等後適當設定,本實施 形態中設定成約70°C。 此處,即使於冷卻步驟中,由於流量調整器22係分別 獨立設置於-對調溫板16,因此控制器25亦能分別獨立 控制-對調溫16之溫度。據此,能以高精度進行調溫 板16之值度調整。亦即,藉由將一對調溫板16之溫度控 制成相同’而能確實地防止基材5在冷卻時產絲曲广工 又,本實施形態中,於冷卻步驟中壓模丨7亦以既定壓 ⑧ 29 1345534 力緊磨於基材5,據此,加壓步驟係透過轉印步驟及冷卻 步驟來進行’而可在加壓步驟中進行冷卻步驟。 步驟Si5’在調溫板16之溫度已達既定溫度時,即進 至步驟S 1 6 ’控制器25對滑件驅動裝置i 3G發送使滑件i 3 升驅動訊號&了拆却基#5,滑件驅動控制裝置H 即根據此驅動訊號使滑件13上升至既^拆卸位置。 接著,步驟sn,藉由以未圖示空氣喷吹裝置將空氣 吹於基材5與壓模17之間,而使基材5可容易地從壓模17 剝離。 步驟S18 ’控制器25,對滑件㈣裝置13〇發送使滑 件13更加上升之驅動訊號。滑件驅動裝置即根據此 驅動訊號’使滑件13上升至用以將基材5搬出至熱轉印 模壓機械1外之既定搬出位置。 當滑件13在步驟18上升至既定位置時步驟si9, 即將於表面轉印有凹凸圖案之基材5(產品谈承架 出至熱轉印模壓機械1外。 其後,步驟S20 ’控制器25關閉連接於流路42, 46之 開關閥2 3,而結束冷卻步驟。 /當持續進行次-循環時,係在步驟S2Q中關閉開關闊 =後,開放連接於流路41,45之開關間23使蒸氣流通於 流路163,來再次開始加熱步驟(返回至步驟μ)。 [第2實施形態] 1以下,根據圖12及圖13,說明本發明之第2實施形 態之調溫板16。此處’熱轉印模壓機械i及熱轉印模壓系 30 統100之其他構成係與第1實施形態相同’ 符號省略其說明。 因此賦予同― 前述第1實施形態中,調溫板16,具備於長邊 端從板體部161突出之連結部ι62。 兩 相對於此,本實施形態之調溫板16,如圖12及圖U 所不,連結部162並非從板體部161突出之形狀,》 $為板體部161之平面形狀的—部分,此點與第i實施形 態大為不同。 如圖13所示,此種調溫板16,板體部IQ之板厚較 第1實施形態之情形厚。此時,由於調溫板16之熱:二 較大’與第1實施形態之情形相較,雖調溫板16或壓模二 ,:熱或冷卻須花較多時間’但另一方面,藉由使板體部 面與流路163分離,而能使板體冑161之表面溫度 均一,因此能防止壓模17<溫度分布以造成轉印不良 產生。又’由於調溫板16之強度提升,因此能更有效地 防止調溫板16之勉曲。 本實她形態之調溫板16,係藉由以下步驟來製造。此 外圖14〜圖17,與第1實施形態之製造步驟之說明時 同樣地,係用以簡略說明之示意圖。 首先,如圖14所示,於板體材16A之厚度方向中心, 開設彼此平行之相同間鉅的貫通孔,形成流路163。 ,、人如圓1 5所不,沿板體材16A之短邊方向挖通 板體材16A之長邊方向兩端,形成凹部167。 接者,如圖16所示,在將柱塞W3A壓入各流路163 31 1345534 =之開口部分來以機械方式密封流& 163後,如圖17 不於連結部162之凹冑167兩側形成頂部170。 :即’本實施形態之調溫板16之製造方法中,開設板 之厚度方向之貫通孔的位置、以及沒有為了形成 =4⑹而切出板體材16Α中央部分的步驟這兩點係 與=1實施形態相異。此情形下’由於流路163之定位較 :容易’且調溫板16《製造步驟數減少,因此能縮短調 溫板16之製造時間。In step S14, the temperature of the temperature regulating plate 16 is detected by the temperature sensor 24. The temperature sensing H 24 outputs a temperature detecting signal to the controller & controller 25 ' according to the temperature detecting signal, the control signal is output to the flow regulating write 22, and the flow is controlled by adjusting the flow of water flowing through ... 63 The temperature of the warm plate 16. Next, the 'step S15' controller 25 monitors the brewing detection signal from the temperature sensor 24 to determine whether the temperature detecting signal has reached a predetermined severity. In addition, the predetermined temperature for cooling the temperature regulating plate 16 is appropriately set after considering the material of the substrate $, the stamper 17 < the size of the concave-convex pattern, and the like, and is set to about 70 ° C in the present embodiment. Here, even in the cooling step, since the flow rate adjusters 22 are separately provided to the pair of temperature control plates 16, the controller 25 can independently control the temperature of the temperature adjustment 16 independently. According to this, the value of the temperature adjustment plate 16 can be adjusted with high precision. That is, by controlling the temperature of the pair of temperature regulating plates 16 to be the same ', it is possible to surely prevent the substrate 5 from being produced during cooling, and in the present embodiment, the stamper 7 is also set in the cooling step. The pressure 8 29 1345534 is pressed against the substrate 5, whereby the pressurizing step is carried out by the transfer step and the cooling step, and the cooling step can be carried out in the pressurizing step. Step Si5', when the temperature of the temperature regulating plate 16 has reached a predetermined temperature, the process proceeds to step S16. The controller 25 sends the slider driving device i3G to drive the slider i3 to drive the signal & 5. The slider drive control device H raises the slider 13 to the disengaged position based on the drive signal. Next, in step Sn, air is blown between the substrate 5 and the stamper 17 by an air blowing device (not shown), whereby the substrate 5 can be easily peeled off from the stamper 17. In step S18', the controller 25 transmits a drive signal for raising the slider 13 to the slider (4) device 13A. The slider driving device raises the slider 13 to a predetermined carry-out position for carrying out the substrate 5 to the outside of the thermal transfer molding machine 1 based on the drive signal '. When the slider 13 is raised to the predetermined position in step 18, step si9, that is, the substrate 5 having the concave-convex pattern transferred onto the surface (the product is placed outside the thermal transfer molding machine 1). Thereafter, the step S20' controller 25 closes the on-off valve 23 connected to the flow paths 42, 46, and ends the cooling step. / When the sub-cycle is continued, the switch is opened in step S2Q, and the switch connected to the flow paths 41, 45 is opened. In the space 23, the steam is circulated in the flow path 163, and the heating step is restarted (return to the step μ). [Second embodiment] 1 Hereinafter, a temperature regulating plate according to a second embodiment of the present invention will be described with reference to Figs. 12 and 13 . 16. Here, the other configurations of the thermal transfer molding machine i and the thermal transfer molding system 30 are the same as in the first embodiment. The description of the same reference numerals is omitted. Therefore, the temperature adjustment plate is provided in the first embodiment. 16 is provided with a connecting portion ι 62 that protrudes from the plate body portion 161 at the long side end. In contrast, in the temperature regulating plate 16 of the present embodiment, as shown in FIGS. 12 and 9 , the connecting portion 162 is not the plate body portion 161 . The shape of the protrusion, "$ is the part of the plane shape of the body 161, this point is The embodiment of the present invention is greatly different. As shown in Fig. 13, the thickness of the plate portion IQ of the temperature regulating plate 16 is thicker than that of the first embodiment. At this time, the heat of the temperature regulating plate 16 is larger: "Compared with the case of the first embodiment, although the temperature regulating plate 16 or the stamper 2: heat or cooling takes a lot of time", on the other hand, by separating the plate body surface from the flow path 163, The surface temperature of the plate body 161 can be made uniform, so that the stamper 17<temperature distribution can be prevented to cause transfer failure. Further, since the strength of the temperature regulating plate 16 is increased, the temperature control plate 16 can be more effectively prevented. The tempering plate 16 of the present embodiment is manufactured by the following steps. In addition, in the same manner as the description of the manufacturing steps of the first embodiment, FIG. 14 to FIG. As shown in Fig. 14, at the center of the thickness direction of the plate member 16A, the same through-holes are formed in parallel with each other to form a flow path 163. The number of people is not as long as 15, and is short along the plate body 16A. The both ends of the longitudinal direction of the plate member 16A are cut in the lateral direction to form a concave portion 167. As shown in Fig. 16, After the plunger W3A is pressed into the opening portions of the respective flow paths 163 31 1345534 = to mechanically seal the flow & 163, as shown in Fig. 17, the top portion 170 is not formed on both sides of the recess 167 of the joint portion 162. In the method of manufacturing the temperature regulating plate 16 of the present embodiment, the position of the through hole in the thickness direction of the plate is opened, and the step of cutting out the central portion of the plate body 16Α in order to form =4 (6) is performed. In this case, 'the positioning of the flow path 163 is easier:' and the number of manufacturing steps of the temperature regulating plate 16 is reduced, so that the manufacturing time of the temperature regulating plate 16 can be shortened.

此外,雖不須為了形成板體部161而切出板體材Μ 中央部分’但與此不同地,係須在安裝壓模ΐ7時稍微切 削或研磨板體部161表面。藉此,由於能將壓模Η緊貼 安裝於板體部161 ’因此能使調溫板16表面之均一化的熱 保持均一狀態傳達至壓模17。 此外,本發明並不限定於前述實施形態,在能達成本 發明目的之範圍内的變形、改良等,亦包含於本發明。 壓力調整機構,雖設於調溫板之流路的出口側及入口 側兩方,但並不限於此,例如圖18所示,亦可僅設於調 溫板16之流路的入口侧。或者,壓力調整機構,亦可僅 設於調溫板16之出口側。此時,雖多少會犧牲壓力設定 之正端度,但由於壓力調整機構之設置數變少,因此能簡 單地構成熱轉印模壓機械。 流量調整機構’雖僅設於調溫板之流路的入口側,但 並不限於此’例如亦可僅設於流路之出口側,或設於流路 之入口側及出口側兩方。又,流量調整機構,雖配置於開 32 34 關閥之上游侧,但並不限於此,亦可如圖 置於開關閥23之下游伽、允B 配 間。 下游側亦即開關閥23與調溫板16之 一作為在冷卻步驟中流通於流路内之冷卻媒體,並不— =:二’例如能採用全氟聚趟(pFpE)等之氟系惰性液體 荨任思冷料體。又,作為調整調溫板之冷卻溫度的方法, 並不限於藉由流量調整機構來調整流體流量者 他例如藉由調替内辦厭士斗、 诉具 調“L體壓力或溫度來調整調溫板溫度之方 式。 壓褀對調溫板之固定方法,可選擇能使壓模全面良好 緊、於調/皿板之適當方法,例如藉由空氣吸引來將壓模 吸附於調溫板時,例如亦可係如圖19所示之構造。如圖19 所不,於調溫板16之板體部161,在形成有流路⑹之區 域外側(短邊方向兩側),沿調溫板16之長邊方向形成有槽 52。又’於調溫板16之長邊方向大財央形成有連通於 槽52的貫通孔51。而亦可於此種形狀之調溫板Μ設置包 覆槽的壓模’透過槽52從貫通孔51吸附壓模。又, 因魘梹之大型化、而為了確實地吸附壓模之中央部分時, 可在調溫& 16與壓模之間設置塵模保持具。於麼模保持 具’在與調溫板16對向的面形成複數條沿短邊方向的槽, 使各槽之兩端與調溫板16之槽52連通。接著,亦可形成 連通於此等槽之貫通孔,透過此貫通孔來吸附;1模。此時, 由於將貫通孔形成於屢模保持具全面,因此能吸附麼模全 面,使其與調溫板16之緊貼性良好。 1345534 又’以上述方式使用壓模保持具時,亦可於調溫板i6 形成定位孔53,來進行壓模保持具對調溫板16之定位。 雖壓模係設於滑件下方及承架上方,熱轉印^壓機械 係將壓模表面之凹凸圖案轉印至基材兩面的裝置,但並不 限於此,例如壓模亦可設置於滑件下方或承架上方之任一 方’熱轉印模壓機械亦可係僅將凹凸圖案轉印至基材單面 之裝置。&時,於不轉印凹凸圖案之側的調溫心可:安 裝壓杈,或為使基材兩面之溫度分布相同,亦可將未形成 凹凸圖案之壓模作為假壓模安裝於調溫板。 調溫板16之凹部167,雖係沿調溫板16之短邊方向 形成連結部162,使複數調流路163彼此連通,彳曰例如圖 2〇所示,亦可就每-流路163形成個別之孔。此外,此情 形下:雖亦能在不改變歧管19之凹冑191形狀的狀態下 確保流體的密封性,但藉由使與凹部b 接之側的形狀對應調溫…凹部167,則能 加確實。 /調溫板之流路,其開口部分雖係被柱塞密封但只要 係月t防止流體從流路漏出之構件即可,也丨a ★ 及密封材來密封。 了例如亦可使用螺检 t’在進行調溫板之流路的加工時,雖 貫通至另一端面的貫通孔,…係不貫通另一 孔。亦I亦可係從板體部一端面延伸至設於另一 縞側之凹部的孔。此時, 一 个屑進仃柱塞之壓入等對另 開口部分的密封作業’因此使調溫板之製造更為 34 容易。 調溫板之流路雖係报士 ’、乂成為截面大致圓形,但並不限於 此’亦能形成為大致橢圄讲 ““ a 憜固形、矩形 '或大致稜形等任意之 截面形狀。當將調溫板 士 π 爪路截面形狀作成大致矩形或稜 形時,袁好係於角部开;{忐 成形成圓角,藉由此角部之形狀, 月I於加工時緩和作用於烟,-e; > 於調溫板之應力。此外,此情形下, 角部之圓角最好係半徑〇 m以上。又,雖調溫板係形成 為俯視大致矩形,流路俜 峪係b調溫板之長邊方向形成,但並 不限於此,例如流路亦可VL w /口調/皿板之紐邊方向形成。此時, 由於流路之長度變短, u此此間早地進行流路之形成作 業。又’雖連結部原本係伴隨流路形成於長邊方向兩側, 但在流路沿短邊方向形成之情形時,連結部亦形成於調溫Further, although it is not necessary to cut out the central portion □ of the plate body 161 in order to form the plate body portion 161, the surface of the plate body portion 161 must be slightly cut or ground when the stamper 7 is attached. Thereby, since the stamper can be attached to the plate portion 161', the heat uniformity state in which the surface of the temperature regulating plate 16 is uniform can be transmitted to the stamper 17. Further, the present invention is not limited to the above-described embodiments, and modifications, improvements, etc. within a scope that can achieve the object of the present invention are also included in the present invention. The pressure adjusting mechanism is provided on both the outlet side and the inlet side of the flow path of the temperature regulating plate. However, the pressure regulating mechanism is not limited thereto. For example, as shown in Fig. 18, it may be provided only on the inlet side of the flow path of the temperature regulating plate 16. Alternatively, the pressure adjusting mechanism may be provided only on the outlet side of the temperature regulating plate 16. At this time, although the positive end of the pressure setting is somewhat sacrificed, since the number of the pressure adjusting mechanisms is small, the thermal transfer molding machine can be simply constructed. The flow rate adjusting means is provided only on the inlet side of the flow path of the temperature regulating plate. However, the present invention is not limited to this. For example, it may be provided only on the outlet side of the flow path or on both the inlet side and the outlet side of the flow path. Further, the flow rate adjusting mechanism is disposed on the upstream side of the opening valve, but is not limited thereto, and may be placed in the downstream of the switching valve 23 as shown in Fig. The downstream side, that is, one of the on-off valve 23 and the temperature regulating plate 16, serves as a cooling medium that flows through the flow path in the cooling step, and does not—=: two', for example, fluorine-based inertness such as perfluoropolyfluorene (pFpE) can be used. The liquid is a cold material. Moreover, as a method of adjusting the cooling temperature of the temperature regulating plate, it is not limited to adjusting the fluid flow rate by the flow rate adjusting mechanism, for example, by adjusting the internal body, the body pressure, or the temperature to adjust the adjustment. The method of fixing the temperature of the temperature plate. The method for fixing the temperature regulating plate can be selected by a suitable method for making the pressing mold comprehensive and tight, and for adjusting the pressing plate to the temperature regulating plate by air suction. For example, it may be a structure as shown in Fig. 19. As shown in Fig. 19, the plate body portion 161 of the temperature regulating plate 16 is on the outer side (both sides in the short side direction) of the region where the flow path (6) is formed, along the temperature regulating plate. A groove 52 is formed in the longitudinal direction of the beam 16. Further, a through hole 51 communicating with the groove 52 is formed in the longitudinal direction of the temperature regulating plate 16 in the longitudinal direction of the temperature regulating plate 16. Alternatively, the shape of the temperature regulating plate may be covered. The stamper's stamper 'permeates the groove 52 to suck the stamper from the through hole 51. Further, since the central portion of the stamper is surely adsorbed due to the enlargement of the crucible, the temperature can be set between the thermostat & 16 and the stamper. Dust mold holder. In the mold holder, a plurality of edges are formed on the surface opposite to the temperature control plate 16. In the groove in the side direction, both ends of each groove are communicated with the groove 52 of the temperature regulating plate 16. Then, a through hole communicating with the groove may be formed, and the through hole may be adsorbed through the through hole; The through hole is formed in the full mold holder, so that the mold can be fully absorbed, and the adhesion to the temperature regulating plate 16 is good. 1345534 In addition, when the mold holder is used in the above manner, the temperature adjustment plate i6 can also be used. The positioning hole 53 is formed to position the mold holder to the temperature regulating plate 16. Although the stamper is disposed under the slider and above the frame, the thermal transfer press system transfers the concave and convex pattern on the surface of the stamp to the base. The device has two sides, but is not limited thereto. For example, the stamper may be disposed under the slider or above the carrier. The thermal transfer molding machine may also be a device for transferring only the concave and convex pattern to one side of the substrate. In the case of &, the temperature-regulating core on the side where the concave-convex pattern is not transferred may be: mounting pressure, or the same temperature distribution on both sides of the substrate, or a stamper having no concave-convex pattern may be mounted as a dummy mold The temperature regulating plate. The concave portion 167 of the temperature regulating plate 16 is along the short side of the temperature regulating plate 16 The connection portion 162 is formed to connect the plurality of flow passages 163 to each other. For example, as shown in Fig. 2A, individual holes may be formed in each of the flow paths 163. Further, in this case, although the difference can be made without change The sealing property of the fluid is ensured in the shape of the concave shape of the tube 19, but the shape of the side connected to the concave portion b can be adjusted according to the temperature of the concave portion 167. The flow path of the temperature regulating plate is opened. Although the part is sealed by the plunger, it is only required to prevent the fluid from leaking out from the flow path. It is also sealed with the sealing material. For example, it is also possible to use the screw check t' to carry out the flow path of the temperature regulating plate. At the time of processing, the through hole penetrating to the other end surface does not penetrate the other hole. I may also be a hole extending from one end surface of the plate body portion to the concave portion provided on the other side. The sealing operation of the chip into the other opening portion, such as the press-in of the chip plunger, makes the manufacture of the temperature regulating plate easier. Although the flow path of the temperature regulating plate is a reporter's, the 乂 becomes a substantially circular cross section, but it is not limited to this. It can also be formed into a substantially elliptical shape, such as "a 憜 solid shape, rectangular shape" or a substantially prismatic shape. . When the cross-sectional shape of the thermostat plate π claw path is made into a substantially rectangular or prismatic shape, Yuan Hao is attached to the corner portion; {忐 is formed into a rounded corner, and by the shape of the corner portion, the moon I is moderated during processing. Smoke, -e; > Stress on the temperature control plate. Further, in this case, it is preferable that the corners of the corners have a radius 〇 m or more. Further, although the temperature regulation plate is formed in a substantially rectangular shape in plan view, and the flow path is formed in the longitudinal direction of the temperature adjustment plate, the present invention is not limited thereto. For example, the flow path may be VL w / mouth adjustment / the direction of the plate edge form. At this time, since the length of the flow path becomes short, the formation of the flow path is performed early here. Further, although the connection portion is originally formed on both sides in the longitudinal direction with the flow path, when the flow path is formed in the short side direction, the connection portion is also formed in the temperature adjustment.

板之短邊方向兩側。此時,A 于由於紐邊方向之伸縮量變少, 因此能防止壓模之偏移等。 、壓模或基板具有充分厚度時,於調溫板並不一定要形 成用以避開安裝於對向調溫板之螺栓頭的螺栓閃避孔。 、調溫板雖係流體沿大致ϋ字形流通於流路之構成,但 並不限於此,例如亦可於流路兩端連接配管,使流體於所 有流路均沿相同方向流通。 調溫板之流路並不限於複數條形成為直線狀者,例如 亦可在考量曲線狀或螺旋狀後等之熱傳達效率等後,採用 任忍之形狀。 用 記載, 以實施本發明之最佳構成、方 但本發明並不限定於此《亦即 法專’雖揭示於上述 ’本發明主要係針對 35 1345534 特定實施形態’特別予以圖示並加以說明,但只要在不脫 離本發明之技術思想及目的的範圍,熟習此技藝之人士皆 . 可針對上述實施形態,在形狀、材質、數量、其他詳細構 • 成方面施加各種變形。 承上所述,限定上述所揭示之形狀、材質等的記載, 僅係為了更容易理解本發明而例示記載,並非限定本發 明’因此除了該等之形狀、材質等之限定一部分或全部限 疋以外之構件名稱的記載,亦為本發明所包含者。 •本發明’除了能利用於製造液晶面板之背光用導光板 的熱轉印模壓機械以外,亦可利用於例如用以製造燃料電 池單7G之分離器、或外型板的熱轉印模壓機械。 【圖式簡單說明】 圖1係顯7F本發明第1實施形態之熱轉印模壓機械的 整體圖。 圖2係前述笛 <第1實施形態之熱轉印模壓機械的部份放 大圖。 _ 圖3係前述笛】a $ 1貫施形態之熱轉印模壓機械的上面圖。 圖4係顯示前 引述第1實施形態之調溫板的下面圖。 圖5係顯示前、& ⑴迷第1實施形態之調溫板的側視截面圖。 圖6係用以_ 4不前述第1實施形態之調溫板之製造步 驟的示意圖。 圖7係用以_ ·''‘胃不前述第1實施形態之調溫板之製造步 驟的示意圖。 圖8係用以g …貝不前述第1實施形態之調溫板之製造步 36 ⑧ 1345534 踢的示意圖。 圖9係用 雜的示意圖。 以顯示前述第 1實施形態之調溫板之製造步 圖1 〇传辟-、,, 塊圖。 刚述第1實施形態之熱轉印模壓系統的構 圖11係海-义、丄. 。 ·’”不別述第1實施形態之熱轉印模壓方法的流Both sides of the short side of the board. At this time, since A has a small amount of expansion and contraction due to the direction of the rim, it is possible to prevent the offset of the stamper and the like. When the stamper or the substrate has a sufficient thickness, the temperature regulating plate does not have to be formed to avoid the bolt doping hole of the bolt head attached to the opposite temperature regulating plate. The temperature regulating plate is configured such that the fluid flows through the flow path in a substantially U shape, but the present invention is not limited thereto. For example, the piping may be connected to both ends of the flow path so that the fluid flows in the same direction in all the flow paths. The flow path of the temperature control plate is not limited to a plurality of strips formed in a straight line. For example, it is also possible to adopt a shape of Ren Ren after considering the heat transfer efficiency such as a curved shape or a spiral shape. The present invention is not limited to the description of the preferred embodiments of the present invention, and the present invention is not limited to the above description. The present invention is mainly described and described with respect to the specific embodiment of 35 1345534. However, those skilled in the art can apply various modifications to the above-described embodiments without departing from the spirit and scope of the invention. Various modifications can be made in terms of shape, material, number, and other details. As described above, the descriptions of the shapes, materials, and the like described above are merely exemplified for easier understanding of the present invention, and are not intended to limit the present invention. Therefore, some or all of the limitations of the shapes, materials, and the like are limited. The description of the names of the components other than those included in the present invention is also included. The present invention can be utilized, for example, in a heat transfer molding machine that can be used for manufacturing a backlight light guide plate for a liquid crystal panel, and can be used, for example, in a heat transfer molding machine for manufacturing a fuel cell single 7G separator or an outer plate. . BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a general view of a thermal transfer molding machine according to a first embodiment of the present invention. Fig. 2 is a partial enlarged view of the heat transfer molding machine of the first embodiment. _ Fig. 3 is a top view of the thermal transfer molding machine of the above-described flute] a $1 form. Fig. 4 is a view showing the lower side of the temperature regulating plate of the first embodiment. Fig. 5 is a side cross-sectional view showing the temperature regulating plate of the first embodiment before (1). Fig. 6 is a schematic view showing the steps of manufacturing the temperature regulating plate of the first embodiment without using the above. Fig. 7 is a schematic view showing a manufacturing step of a temperature regulating plate according to the first embodiment of the present invention. Fig. 8 is a schematic view showing the step of manufacturing the step of the temperature regulating plate of the first embodiment of the first embodiment. Figure 9 is a schematic diagram of the use of impurities. The manufacturing steps of the temperature regulating plate of the first embodiment are shown in Fig. 1. Fig. 1 〇 辟,,,, block diagram. The structure 11 of the thermal transfer molding system of the first embodiment is a sea-right, 丄. The flow of the thermal transfer molding method of the first embodiment is not described.

13 ^’4示本發明第2實施形態之調溫板的下面圖。 係顯不前述第2實施形態之調溫板的側視截面 圖14係用 驟的示意圖。 以顯示前述第2實施形態之調溫板之製造步 2實施形態之調溫板之製造步 2實施形態之調溫板之製造步 圖U係用 驟的示意圖。 圖16係用 驟的示意圖。 以顯示前述第 以顯示前述第13 ^'4 is a bottom view of the temperature regulating plate according to the second embodiment of the present invention. A side cross-sectional view of the temperature regulating plate of the second embodiment is not shown in Fig. 14 . The manufacturing step of the temperature regulating plate according to the embodiment of the manufacturing step 2 of the second embodiment is shown in Fig. U. Fig. U is a schematic view showing the steps of manufacturing the temperature regulating plate. Figure 16 is a schematic view of the use of the steps. To display the foregoing number to display the foregoing

圖丨7係用 驟的示意圖。 以顯示前述第2實施形態之調溫板之製造步 圓18係gg _丄於 圖19 .不本發明之熱轉印模壓系統變形例的圖 糸顯示本發明之調溫板變形例的上面圖。 =〇係顯不本發明之調溫板另一變形例的下面圖 主要元件符號說明】 1 熱轉印模壓機械 5 基材 37 ⑧ 1345534Figure 7 is a schematic diagram of the procedure. The manufacturing step circle 18 of the temperature regulating plate according to the second embodiment is shown in Fig. 19. Fig. 19 is a view showing a modification of the heat transfer molding system of the present invention, showing the above modification of the temperature regulating plate of the present invention. . = 〇 shows the following diagram of another modification of the temperature regulating plate of the present invention. Description of main components: 1 Thermal transfer molding machine 5 Substrate 37 8 1345534

10 底床 11 立柱 12 頂板 13 滑件 13A 導件 14 承架 14A 定位銷 15 絕熱材 16 真空吸引用構件 17 壓模 18 模壓用真空裝置 19 岐管 21,21 A,21B 壓力調整機構 22 流量調整機構 23 開關閥 24 溫度感測器 25 控制器 26 感測器 27 滑件位置感測器 30 流體供應裝置 31 蒸氣供應裝置 32 冷卻水供應裝置 33 蒸氣鋼爐 34 蒸氣、溫水回收器 38 ⑧ 134553410 Bottom bed 11 Column 12 Top plate 13 Slide 13A Guide 14 Shelf 14A Locating pin 15 Insulation material 16 Vacuum suction member 17 Compression mold 18 Molding vacuum device 19 Tube 21, 21 A, 21B Pressure adjustment mechanism 22 Flow adjustment Mechanism 23 Switching valve 24 Temperature sensor 25 Controller 26 Sensor 27 Slider position sensor 30 Fluid supply unit 31 Steam supply unit 32 Cooling water supply unit 33 Steam steel furnace 34 Vapor, warm water recovery unit 38 8 1345534

35 冷卻水循環裝置 36 工廠冷卻水供應 41,42,43,44,45,46,163 流路 51 貫通孔 52 槽 53 定位孔 100 熱轉印模壓系統 130 滑件驅動裝置 161 板體部 162 連結部 163A,168 柱塞 164,241 安裝孔 164A 螺栓 165 螺栓閃避孔 166,1 66 A, 166B 定位孔 167,167A,167B,191 凹部 169,181 壁部 170 頂部 182 0型環 192 配管 351 熱交換器 3935 Cooling water circulation device 36 Factory cooling water supply 41, 42, 43, 44, 45, 46, 163 Flow path 51 through hole 52 groove 53 positioning hole 100 thermal transfer molding system 130 slider driving device 161 plate portion 162 connecting portion 163A, 168 Plunger 164, 241 Mounting hole 164A Bolt 165 Bolt dosh hole 166, 1 66 A, 166B Positioning hole 167, 167A, 167B, 191 Recessed 169, 181 Wall 170 Top 182 0 ring 192 Pipe 351 Heat exchanger 39

Claims (1)

13455341345534 十、申請專利範圍: 1·一種調溫板,係設於用以將形成在壓模表面之凹凸圖 案轉印至基材表面的熱轉印模壓機械,並可安裝該壓模且 可調整該壓模之溫度,其特徵在於: 具備安裝有該壓模之板狀板體部; 於該板體部之内部形成有供用以調整該板體部之溫度 -之流體流通的流路; 皿又 該流路,係形成於該板體部之厚度方向的大致+央; 於該板體部之-面之端部,連通該流路與外部流路之 連通用管座之連接用連結部係從該板體部往厚度 設置; 該壓模係安裝於該板體部之與該連結部相反側之面。 、2·如申請專利範圍第i項之調溫板,其中,該流路係形 成為截面形狀呈大致圓形。 3. 如申請專利範圍第1項 心碉'皿板,其中,該流路,係 成為通過該調溫板之至少—她品工土 柒面而朝另一端面延伸; 在該流路之該一端面開ci A 封。 Ί的開口部分係以機械方式密 4. 如申請專利範圍第2項 rrf ,, ^ 之調&amp;板,其中,該流路,係 t成為通過該調溫板之至少一 ” 嗎面而朝另一端面延伸; 在該流路之該一端面開口 封。 的開口部分係以機械方式密 5. 如申請專利範圍第3項 複數條; &lt; 調▲板,其中,該流路設有 40 1345534X. Application Patent Range: 1. A temperature regulating plate is provided on a thermal transfer molding machine for transferring a concave-convex pattern formed on a surface of a stamp to a surface of a substrate, and the stamper can be mounted and adjusted a temperature of the stamper, comprising: a plate-shaped plate body portion to which the stamper is mounted; and a flow path for adjusting a temperature of the plate body portion to be circulated inside the plate body portion; The flow path is formed substantially in the thickness direction of the plate body portion, and the connection portion for connecting the communication pipe and the external flow path is connected to the end portion of the plate body portion. The plate body portion is provided to have a thickness; the stamper is attached to a surface of the plate body opposite to the joint portion. 2. The temperature regulating plate of claim i, wherein the flow path has a substantially circular cross-sectional shape. 3. For example, in the first paragraph of the patent application scope, the flow path is formed by the at least one of the temperature regulating plates and the other end face extending toward the other end face; One end opens the ci A seal. The opening portion of the crucible is mechanically dense. 4. As claimed in the second item of the patent scope rrf, , ^ the adjustment &amp; plate, wherein the flow path, the t becomes the at least one of the temperature regulating plates The other end face extends; the opening portion of the opening of the flow path is mechanically sealed. 5. The plurality of articles of the third item of the patent application; &lt; 调 板, wherein the flow path is provided with 40 1345534 該流路間之助f _ - ]之間距,小於該調溫板 6如Φ姓击立丨&gt; 厚度尺寸。 (&gt;.如甲明專利範圍第4項 複數條; 調,皿板,其中,該流路設有 該流路間之p彳, 7如卜皇 該調溫板之厚度尺寸。 7. 如申碩專利範圍第5項之 •盥該連通用μ ώ ^ ’姐扳,其中,該連結部係 興及迓逋用管座以機械方式連接。 8. 如申請專利範圍第6項之 ^ ii ffl ^ r- 调,夏板,其中,該連結部係 興该運通用官座以機械方式連接。 9·如申請專利範圍第丨 巧心调溫板,苴中, 該壓模能安裝於除了該板: 域。 4之該連結部以外之區 10·如申請專利範圍第9項 係盥呤、έm β 調恤板,其中,該連結部 係與該連通用管座以機械方式連接。 11 ·如申請專利範圍第1項 m ^ ^ 〈調》皿板’其具備用以規定 ^板體4對該熱轉印模壓機械 第二定位孔; *裝位置的第-定位孔及 該第二定位孔為長孔形狀, 凡其長轴和將該第一定位 孔之中心與該第二定位孔之中 “遷結的線大致平行。 12 ·如申請專利範圍第丨丨 % ^ &lt; 调伽板,其中,該調溫 板’係形成為俯視大致呈矩形; 該第一定位孔與該第二定位?丨 你、iL斗 皇 ^ ^ 疋孔,係沿該調溫板之長邊 万向配置。 13.—種熱轉印模壓機械,具 开埽申凊專利範圍第11或 12項之調溫板,其特徵在於: 1345534 100年4月;?日替換頁 該調溫板係對向設置一對; 一該調溫板之該第一定位孔,係配置成與另一該調溫 板之該第一定位孔對向。 14.一種熱轉印模壓機械,其特徵在於: 具備申請專利範圍第1至12項中任一項之調溫板。 十一、圖式: 如次頁 42The distance between the help points f _ - ] between the flow paths is smaller than the thickness of the temperature regulating plate 6 such as Φ. (&gt;. A plurality of articles in the fourth paragraph of the patent scope of the invention; a tray, wherein the flow path is provided with a p彳 between the flow paths, 7 such as the thickness dimension of the thermostat plate of the Emperor. Shen Shuo's patent scope is in the fifth item. • The connection is made with μ ώ ^ 'Sister's wrench, where the joint is tied and the tube socket is mechanically connected. 8. As claimed in item 6 of the patent ii Ffl ^ r- tune, the summer board, in which the joint part is mechanically connected to the general seat of the ship. 9·If the application scope of the patent 丨 心 心 调 调 苴 苴 苴 苴 苴 苴 该 该 该 该 该 该 该 该 该The board: the area 4 of the area other than the joint portion 10. The ninth item of the patent application scope is a 盥呤, έm β cardboard, wherein the joint portion is mechanically connected to the joint pipe socket. · For example, in the scope of the patent application, the first m ^ ^ <调调板' has a second positioning hole for the thermal transfer molding machine for specifying the plate body 4; * a positioning hole for the mounting position and the second The positioning hole is in the shape of a long hole, where the long axis and the center of the first positioning hole are in the second positioning hole The lines of the knots are substantially parallel. 12 · As claimed in the patent application 丨丨% ^ &lt; 调调板, wherein the temperature regulating plate 'is formed in a plan view substantially rectangular; the first positioning hole and the second positioning? You, iL Fighting Emperor ^ ^ 疋, is arranged along the long side of the temperature regulating plate. 13. - A kind of thermal transfer molding machine with a temperature regulating plate of the 11th or 12th patent of the patent application. The first positioning hole of the temperature regulating plate is disposed opposite to the other one of the temperature regulating plates. The first positioning hole of the temperature regulating plate is configured to be opposite to the other one of the temperature regulating plates. A positioning hole is opposed to each other. 14. A heat transfer molding machine, comprising: the temperature regulating plate according to any one of claims 1 to 12. XI.
TW094145006A 2004-12-20 2005-12-19 Temperature conditioning plate and thermal transfer pressing machine TW200621527A (en)

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