1343235 九、發明說明： 【所屬之技術領域】 本發明係關於一種散熱模組，特別是一種應用於具有開口之 電子裝置的散熱模組。 【先前技術】 隨著電子產品功能的提升，電子產品中有著越來越密集的各 種電子元件，且隨著電子元件的密集，各個電子元件的發熱功率 鲁也卩通之不斷提升，因此散熱問題越來越受到人們之重視。而這現 象在越小型的電子產品中越發顯得重要，例如：筆記型電腦、掌 上型電腦與手持式通訊裝置等。 在散熱領域中，目前業界通常採用散熱模組來直接對發熱電 子π件進行散熱。目前大多數筆記型電腦中所使用之散熱模組一 般係由風扇、熱導管及！|片組等組成。其中，熱導f—端與發熱 電子元件熱接觸’另-端與則組連接。散熱模_由熱導管將 籲發熱電子元件產生之熱量傳遞至鳍片組上，並利用風扇運轉產生 之氣流與鰭片組發生熱交換以將熱能散發到周圍環境中，從而達 到對發熱電子元件散熱之目的。 筆記型電财it常會在發熱f子元件上裝設有溫度感測器， 用以制發熱電子元件的溫度。當溫度_⑽_彳發熱電子元 =溫度上升時，㈣統加速風扇的運轉來加快散熱的效果。但 隨著風扇轉速的增加，伴隨而來的卻是因風扇轉速增加而帶來的 運轉聲與助聲㈣音。當弱的轉速增加，噪音也越發嚴重。 對於使用者而s 方城財其必要，但隨之*來的噪音卻是 [S3 1343235 無法忍受的。 【發明内容】 本發明提供—錄韻組’ W戦透過增加風扇轉速來加 速散熱而隨之產生的噪音問題。 本發明所揭露之散錢組，_於具錢口之電子裝置。 此電子裝置具有發熱元件。散熱模組包含有縣、第-鰭片 組、第二鰭片組、彈性元件、電動開關與控制單元。 • 風扇具有出風口，用以產生一氣流。 第-鰭片組設置於風扇的出風口處，熱連接發熱元件，用以 導出發熱元件所產生的熱能。 帛二鰭片組對應電子裝置的開口，可動式連接於第一續片 2 ’用以導出第-韓片組上的熱能。其中，風扇產生的氣流經由 出=口依序流經第—㈣組及第二鰭版，用以散除第一鑛片組 及第二鰭片組上的熱能。 彈性元件連接第二鰭片組。 電動，關用以選擇性將第二鰭片組固定於電子裝置内。 Ηέ控^疋雜連接電朗關，用以控制電細隨放第二韓 片組。其中，當電動開_放第二鰭片組時 元件的彈力而經由電子穿置的門口孩么 片、·且因彈!·生 雜片組騰於電付移動至電子裝置外，致使第二 =，散熱模組更包含有導軌、溫度感測器與熱導管。 導執ί二‘具有對應於導軌的—滑軌。滑執係可動式設置於 彈性70件連接於滑軌相對於電子裝置關π的另一 1343235 端。當電細關釋放第二.#|片、㈣，第二_片組的馳因彈性元 件的彈力而於導軌上向電子裝置的開口移動，致使第二鰭片組經 由電子裝置的開口移動至電子裝置外。 溫度感測H電性連接控制單元’肋偵測電子裝置的溫度。 其中’當溫度制H制得的溫度超過-定值時，控制單元致動 電動開關釋放第二鰭片組。 熱導管連接發熱元件與第-則組，用以導出發熱元件所產 Φ 生的熱能。 其巾’電關有電磁_及卡Θ，以及第二鰭片組具有 位於龍上的扣孔。其巾，卡勾常態地扣接於第m的扣孔 上且虽電磁開關接收到來自控制單元的控制訊號時，電磁開關 響應控制訊號拉回卡勾，以使卡勾退出扣孔而釋放第二續片組。 其中，第，纽包括複數個第—鰭片，對應於風扇的出風 口。複數個第-鰭>}係由風扇的外殼延伸而出，且複數個第一趙 鲁片沿至少-方向相互平行地間隔排序。第二鲒片組包括基底及^ 數個第一鰭片。複數個第二·鰭片係由基底延伸而出，且複數個第 二轉片沿至少-方向相互平行地間隔排序，其中複數個第一饋片 與複數個第二鰭片係交錯設置。其中，基底具有至少—貫孔，每 一貫孔係位於複數個第二㈣中之二之間，縣底的形狀大致上 相同於電子裝置的開口的形狀。 根據本發明所揭露之散熱模組，應用於具有開口之電子裝 置’且電子裝置具有發熱元件。其巾，先將t子裝置的發熱元件 所產生之熱能傳遞至第κ组上，並風扇運轉產生之氣流 1343235 敎^發*丨片組’致使第—則組與周圍環境發生熱交換，以將 2散發到朋觀中’ _對發熱元件輯散熱。當發熱元件 ^皿度上升¥，散熱她#由控解元控制電動卿，以釋放第 有關本發明_徵與實作’㈣合圖示作最佳實施例詳細說 二1組，致使第二㈣組由第-鰭片組向電子裝置的開口延伸 並^於電子裝置外。此時’發熱元件所產生之熱能藉由熱傳導 7、至第則組和第二鰭片組，並且藉由風扇運轉產生的氣 '"，致使第一鰭片組和第二鰭片組與周圍環境進行熱交換，以將 熱能紐到關環境中。於此，藉由第—則組和第二則电的 延伸連結’可增加賴_使得散触果城，而顧快速散熱， 並且避免僅透過提高風扇運轉的速度來達雜速散熱時，因而產 生較大的風切聲、風扇高速運轉等噪音„ 明如下 【實施方式】 「第1圖」係為根據本發明之散熱模組第一實施例之第一作 動示意圖。「第2圖」係為根據本發明之散熱模組第—實施例之第 二作動示意圖。 請參照「第1圖」與「第2圖」’散熱模組可應用於具有開口 220之電子裝置200，並且此電子裝置2〇〇具有發熱元件21〇。 散熱模組包含有風扇1〇、第一鰭片組2〇、第二鰭片組3〇、 彈性元件40、電動開關50、控制單元60。 風扇10具有出風口 12。 第一韓片組20設置於風扇1〇的出風口 12處。第一雜片組 1343235 20熱連接發熱元件2】〇。 第二鰭片組30對應電子裝置2〇〇的開口 22〇置， 妹 片組30可動式連接於第—則組如。 彈f生元件40連接第二韓片組3〇。彈性元件可以係彈簧或 彈片。 〆 電動開關50用以選擇性將第二鱗片組3G固定於電子裝置2〇〇 内。 控制單元60電性連接電動開關5〇。 於此’當電磁開關51接收到來自控制單元6〇的控制訊號時， 電磁開關51會響應控制訊號而釋放第二轄片組3〇。當電動開關 50釋放第二鰭片組30時，第二鰭片組3〇因彈性元件4〇的彈力 而經由電子裝置200的開口 220移動至電子裝置200外，致使第 二鰭片組30顯露於電子裝置2〇〇外， 其中，散熱模組更包含有導軌70、溫度感測器⑽與熱導管 90。 於此，可利用一溫度感測器80來感測發熱元件210周遭環境 的溫度。並且，此溫度感測器80電性連接控制單元60。當發熱 元件210周遭環境的溫度過高時，溫度感測器可通知控制單元 6〇產生控制訊號’以利用控制訊號控制電動開關5〇釋放第二鰭 片組30，來加速散熱。 其中，第一鰭片組20可包括複數個第一鰭片21，並且此些 第一鰭片21對應於風扇10的出風口 π 複數個第一鰭片21可 由風扇10的外殼11延伸而出，並且複數個第一縛片21沿至少一 1343235 方向相互平行地間隔排序。 第二鰭片組30可包括基底33及複數個第二鰭片34。複數個 第二鰭片34係由基底33延伸而出，且複數個第二韓片⑷皆至少 -方向相互平行地間隔排序。於此’複數個第一鰭片21與複數個 第二鰭片34係為交錯設置。 其中，基底33可具有至少-貫孔35，以供氣流流通電子裝 置200内外。換言之，電子裝置2〇〇内的熱可經由貫孔％擴散^ =子裝置200外，並且電子裝置· _熱氣流亦可經由貫孔％ 流出電子裝置200。於此，每-貫孔35係位於複數個第二續片从 中之一之間。並且’基底33的开多狀可大致上相同於電子裝置2〇〇 的開口 220的形狀，以致於畲第二鰭片組3〇位於電子裝置2⑻内 時，基底33可大致上嵌設於開口 22〇内。 散熱模組可設置有至少一導軌7〇。並且，第二縛片組3〇可 具有對應於導軌70的滑軌31。於此，導軌7〇的形狀可隨著第二 鰭片34的形狀而不同。滑軌31係可動式設置於導軌％上。 菖卡勾52釋放第一趙片組3〇時，因彈性元件4〇的彈力使得 滑軌31順著導軌70，致使第二鰭片34肖電子裝置·的開口 22〇 ’進而顯露於電子裝置細外。於此，導執7〇朝電子裝置· 的1 L伸。其中，導軌7〇的軌道可以係直線且平行於第一鰭片 的方向6又置’如「第1和2圖」所示。再者，導軌70的軌道 亦可以係為-近似s形的曲線，如「第3和4圖」所示。 其中’導軌70可設置於電子裝置2〇〇的殼體上。或者是，散 熱模組可具有絲，且料執7()設置於此底板上。 [S) 12 1343235 滑軌設置於第二韓片組3〇的底側，且對應於導軌％。而 弹性元件40設置於第二轉片組3〇相對於電子裝置的開口挪 的另一端。 此外，每-雜70的設置位置可以相對位於複數個第一縛片 21中之二之間’ *滑軌31則設置於第二鰭片^的下方。 其中’電動開關50可具有電磁開關51及卡勾52’以及第二 雜片組30可具有扣孔32。其中’卡勾52常態地扣接於第二韓片 組30的扣孔32上。當電磁開關51接收到來自控制單元⑹的控 制訊號時，電磁關51響應控舰財勾Μ，因而致 勾52退出扣孔32，從而釋放第二轉片組3〇。 於此，電磁開關51與卡勾52之間可銜接有連動桿53。舍電 關51接收到來_單祕的控制訊號時，铜關 應控制訊號細連動桿53，餅連動桿53雌於卡勾％，因二 =勾52受到連動桿53拉力而退出扣孔32,從而釋放第二結 η 組 30。 :中’ f-輪且20與發熱元件21〇之間的熱連接可透過献 B 90來貫現。亦即’熱導㈣連接發熱元件2ι㈣第一續片 熱導管90可以係透過導熱膏、導熱銀膠或銅_來盘發 的'讀2U)熱連接。熱導㈣可以係與第—鰭片組2〇 一體成型 熱連=可以係透過導熱膏、導熱銀膠或銅料來與第1片組⑽ 當電子裝置200開機後，發熱元件21〇 (例如：微處理器、 *，，不晶片、南僑晶片或北橋晶片等）開始產生熱能。熱導管別一 13 端熱連接於發熱元件210，另一端與第一鰭片組20連接，用以導 出發熱元件210所產生的熱能並將熱能傳遞至第一鰭片組2{^此 時，風扇10運轉產生之氣流流經第一鰭片組2〇，致使第一趙片 組20與周圍環境發生熱交換以將熱能散發到周圍環境中，進而對 發熱元件210進行散熱。 當電子裝置200運行負荷量較大的程式或運行過久時，使得 發熱元件210負何較重，而消耗較大功率。由於部分能量合轉換 成熱能消耗’使得發熱元件210溫度上升，同時造成電子裝置2〇〇 内的溫度也隨之上升。此時，用以偵測電子裝置綱溫度_熱 元件210溫度的溫度感測器80偵測得的溫度若超過一定值時 > 溫 度感測器傳遞一訊號給控制單元60 (例如：微處理器或控制晶片 等）。由控制單元60致動電動開關50以釋放第二鰭片組3〇。 當控制單元60接收訊號後，會傳遞一控制訊號給電動開關 50内的電磁開關51。當電磁開關51接收到來自控制單元6〇的控 制訊號時’電磁開關51響應控制訊號拉回連動桿兄，由於連動 桿53固接於卡勾2 ’因而致使卡勾52受到連動桿^拉力而退 出第二鰭片組30上的扣孔32，從而釋放第二鰭片組3〇。 當電動開關50釋放第二鰭片組30時，第二讀片組3〇的滑執 3!因彈性it件4G的彈力而於導執7〇上向電子裝置測的開口 22〇 移動，致使第二鰭片組3〇由第一則組2〇向電子裝置雇的開 口 220延伸並顯露於電子裝置外。此時，每一第二藉片^的 -側面部分貼合於對應的每—第―鰭片21的—側面上，藉由熱傳 導將發熱元件210所產生之熱能傳遞至第—韓片組％和第二轉片 1343235 組30。 當風扇10運轉產生的氣流流經第一鰭片組2〇與第二韓片組 3〇，致使第一鰭片組2〇與第二鰭片組30與周圍環境發生熱交換 時，以將熱能散發到周圍環境中。於此，藉由第一鰭片組2〇和第 二鰭片組30的延伸連結，可增加散熱面積使得散熱效果加快，而 達成快速散熱’並且避免僅透過提高風扇10運轉的速度來達到快 速散熱時，因而產生較大的風切聲、風扇1〇高速運轉等噪音。 • 請再參照「第1圖」與「第2圖」’每一第一鰭片21可以係 一侧面為平面，另一側面具有高起之第一凸部21a與相對第一凸 部21a較低的第一凹部21b的曲面。每一第一鰭片21與每一第二 鰭片34可以係形狀相互對稱。因此，每一第二鰭片34的相對兩 表面分別為平面和曲面。每一第二鰭片34的曲面具有高起之第二 凸部34a與相對第二凸部34a較低的第二凹部34b。其中，每一第 二鰭片34的第二凸部34a係對應每一第一鰭片21的第一凸部 φ 设置，每一第二鰭片34的第二凹部34b係對應每一第一鰭片21 的第凹21b s史置，且第二凸部34a 了頁點的水平切線與第一凸 部21a頂點的水平切線係在同一切線上。 於第二鰭片組30因彈性元件40的彈力而向電子裝置2〇〇的 開口 220移動後’第一結片组3〇的局部會凸出電子裝置的開 口 220 ’而顯露於電子裝置外。此時，參照「第2圖」，每一 =二· 34的第二凸部34a貼合於對應的每一第—韓片21的第 :凸部21a上，以致於可藉由熱傳導將發熱元件21〇所產生之熱 月匕傳遞至第一鰭片組2〇和第二鰭片組a [S] 15 1343235 第3圖」係為根據本發明之第二實施例之第一作動示意 圖。「第4圖」係為根據本發明之第二實施例之第二作動示意圖。 〇月多’、、、第3圖」與「第4圖」’本實施例大致與其述實施例 雷同，細部元件說明可參照前述實施例。 、 在此實施例中，每一第一鰭片21與每一第二鯖片34可以係 形狀相互對稱。每一第—鰭片21與每一第二鰭片34可以係兩側 面皆為平面。 虽卡勾52退出扣孔32而釋放第二鰭片組3〇時，第二鰭片組 30的滑軌31因彈性元件40的彈力而於導執7〇上向電子裝置2㈨ 的開口 220移動’致使第二鰭片組3〇自電子裝置2〇㈣開口挪 移動而顯露於電子裝置200外。於此，導執7()的執道可以係為一 近似S化的曲線，致使第—韓片組犯順著導軌移動後，;一 第二鳍片34相貼合於對應的每一第—韓片21的一側面上，藉由 熱傳導將發熱元件210所產生之熱能傳遞至第一鰭片组2〇和第二 韓片組30。 根據本發明所揭露之一種散熱模組，應用於具有開口 220之 電子裝置200，且電子裝置200具有發熱元件21〇。其中，先將電 子裝置200的發熱元件210所產生之熱能傳遞至第一鰭片組2〇 上，並利用風扇10運轉產生之氣流流經第一鰭片組2〇，致使第 —轉片組2G與朋環境發生熱交換，簡熱能散發到周圍環境 中，進而對發熱元件210進行散熱。當發熱元件21〇的溫度上升 時，散熱模組藉由控制單元60控制電動開關5〇 ,以釋放第二鰭 片組30，致使第二鰭片組30由第一鰭片組20向電子裝置2〇〇的 1343235 開口 220延伸並顯露於電子裝置2⑻外，藉由熱傳導將第一鰭片 組20上的熱能傳遞至第二鰭片組30上。此時，發熱元件21〇所 產生之熱藉由熱傳導而傳遶至第一鰭片組2〇和第二結片组 30，並且藉由風扇10運轉產生的氣流，致使第一鰭片組2〇和第 二鰭片組30與周圍環境進行熱交換，以將熱能散發到周圍環境 中。於此’藉由第一趙片組2〇和第二鰭片組3〇的延伸連結，可 增加散熱面紐得散熱效果域，而達紐速散熱，並且避免僅 •透過提高風扇10運轉的速度來達到快速散熱時，因而產生較大的 風切聲、風扇10高速運轉等聲噪音的產生。 —雜本發明以前叙触實酬揭露如上，財並非用以限 又本發明’任何热習相像技藝者，在不雌本發明之精神和範圍 内，所為之更域_ ’均屬本發明之專娜護朗，因此本發 明之專利保護範_視本_書_之申請專鄕圍所界定者為 準。 _ 【圖式簡單說明】 第1圖係為根據本發明之第一實施例之第一作動示音圖； 第2圖係為根據本發明之第_實施例之第q二二: 第3圖係為根據本發明之第二實施例之第—作動^意圖；以 作動示意圖 第4圖係為根據本發明之第二實施例之第二 【主要元件符號說明】 風扇 外殼 17 [S] 1343235 12.........................出風口 20 .........................第一鰭片組 21 .........................第一鰭片 21a.......................第一凸部 21b.......................第一凹部 30 .........................第二鰭片組 31 .........................滑軌1343235 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipation module, and more particularly to a heat dissipation module applied to an electronic device having an opening. [Prior Art] With the improvement of the functions of electronic products, electronic products have increasingly dense electronic components, and with the intensive electronic components, the heating power of various electronic components has been continuously improved, so the heat dissipation problem More and more people are paying attention to it. This is becoming more and more important in smaller electronic products such as notebook computers, handheld computers and handheld communication devices. In the field of heat dissipation, the heat dissipation module is usually used in the industry to directly dissipate heat from the heating element π. At present, the cooling modules used in most notebook computers are generally made up of fans, heat pipes and! | Piece group and other components. Wherein the heat conducting f-end is in thermal contact with the heat generating electronic component and the other end is connected to the group. Heat-dissipation mode_The heat generated by the heat-generating electronic components is transmitted to the fin set by the heat pipe, and the heat generated by the fan operation is exchanged with the fin group to dissipate the heat energy to the surrounding environment, thereby achieving the heat-generating electronic component. The purpose of heat dissipation. Note-type electric money is often installed on the heating element component with a temperature sensor for the temperature of the heating electronic components. When the temperature _ (10) _ 彳 heating electronic element = temperature rise, (four) accelerate the operation of the fan to accelerate the heat dissipation effect. However, as the fan speed increases, it is accompanied by a running sound and a sound (four) sound due to an increase in the fan speed. When the weak speed increases, the noise becomes more serious. For the user, it is necessary for the city, but the noise that comes with it is [S3 1343235 can't stand it. SUMMARY OF THE INVENTION The present invention provides a problem of noise associated with accelerating heat dissipation by increasing the fan speed by the recording group. The loose money group disclosed in the present invention is an electronic device with a money mouth. This electronic device has a heat generating component. The heat dissipation module includes a county, a fin-set, a second fin set, an elastic component, an electric switch, and a control unit. • The fan has an air outlet to create an air flow. The first fin set is disposed at the air outlet of the fan, and is thermally connected to the heating element for deriving thermal energy generated by the heating element. The second fin set corresponds to the opening of the electronic device, and is movably connected to the first continuous piece 2' for deriving thermal energy on the first-Korean group. The airflow generated by the fan flows through the first (four) group and the second fin through the output port to dissipate the thermal energy on the first and second fin sets. The elastic element is coupled to the second fin set. The motor is electrically closed to selectively fix the second fin set in the electronic device. ΗέControl ^ 疋 连接 连接 连接 , , , , , , , , , , , , , , , , , Wherein, when the second fin set is electrically opened, the elastic force of the component is passed through the door of the electronic device, and the bomb is used; and the biochip is moved to the electronic device, causing the second =, the thermal module further includes a guide rail, a temperature sensor and a heat pipe. The guide ί ‘ has a slide rail corresponding to the guide rail. The sliding mechanism is movably disposed on the other 1343235 end of the elastic 70 piece connected to the sliding rail relative to the electronic device π. When the electric fine close releases the second .#| piece, (4), the elastic force of the second elastic element of the second _ slice group moves on the guide rail toward the opening of the electronic device, so that the second fin set moves to the opening of the electronic device to the opening Outside the electronic device. The temperature sensing H electrical connection control unit 'ribs detects the temperature of the electronic device. Wherein the control unit actuates the electric switch to release the second fin set when the temperature produced by the temperature system H exceeds a predetermined value. The heat pipe is connected to the heating element and the first group to derive the heat energy generated by the heating element. The towel has an electromagnet and a cassette, and the second fin group has a buttonhole located on the dragon. The towel hook is normally fastened to the m-th buttonhole. When the electromagnetic switch receives the control signal from the control unit, the electromagnetic switch pulls back the hook in response to the control signal, so that the hook is released from the buttonhole and released. Two continuation groups. Among them, the first, the new one includes a plurality of first fins, corresponding to the air outlet of the fan. A plurality of first fins are extended from the outer casing of the fan, and the plurality of first slabs are sequentially spaced apart from each other in at least a direction. The second set of dies includes a base and a plurality of first fins. A plurality of second fins extend from the substrate, and the plurality of second fins are sequentially spaced apart from each other in at least a direction, wherein the plurality of first feeds are interleaved with the plurality of second fins. Wherein, the substrate has at least a through hole, and each of the consistent holes is located between two of the plurality of second (four), and the shape of the bottom of the county is substantially the same as the shape of the opening of the electronic device. The heat dissipation module according to the present invention is applied to an electronic device having an opening and the electronic device has a heat generating component. The towel first transmits the heat energy generated by the heating element of the t sub-device to the κ group, and the air flow generated by the fan operation 1343235 敎 发 发 丨 丨 丨 ' ' ' 则 则 则 则 则 则 则 则 则 则 则 则 则 则 则 则 则 则 则 则Dissipate 2 to the viewer's view. When the heating element ^ degree rises ¥, heats her #Control by the control element to control the electric Qing, to release the first relevant invention of the invention _ levy and implementation ' (four) as a best example to explain the second group, resulting in the second (4) The group extends from the first fin array to the opening of the electronic device and outside the electronic device. At this time, the thermal energy generated by the heating element is caused by heat conduction 7, to the first group and the second fin group, and the gas generated by the fan operation causes the first fin group and the second fin group to The surrounding environment is heat exchanged to bring the heat to the environment. Here, the extension link of the first group and the second electricity can increase the scatter, so that the touch of the fruit city can be dissipated, and the heat dissipation can be quickly avoided, and the heat dissipation of the fan can be avoided to achieve the heat dissipation at the same time. A noise such as a large wind cut, a fan running at a high speed, and the like are as follows. [Embodiment] FIG. 1 is a first actuation diagram of the first embodiment of the heat dissipation module according to the present invention. Fig. 2 is a schematic view showing the second operation of the first embodiment of the heat dissipation module according to the present invention. Please refer to "1" and "2". The heat dissipation module can be applied to the electronic device 200 having the opening 220, and the electronic device 2 has a heat generating component 21A. The heat dissipation module includes a fan 1 , a first fin set 2 , a second fin set 3 , an elastic element 40 , an electric switch 50 , and a control unit 60 . The fan 10 has an air outlet 12. The first Korean group 20 is disposed at the air outlet 12 of the fan 1〇. The first chip group 1343235 20 is thermally connected to the heating element 2] 〇. The second fin group 30 is disposed corresponding to the opening 22 of the electronic device 2, and the sister group 30 is movably connected to the first group. The bombing element 40 is connected to the second Korean group 3〇. The elastic element can be a spring or a spring.电动 The electric switch 50 is used to selectively fix the second scale group 3G in the electronic device 2A. The control unit 60 is electrically connected to the electric switch 5〇. Here, when the electromagnetic switch 51 receives the control signal from the control unit 6〇, the electromagnetic switch 51 releases the second slice group 3〇 in response to the control signal. When the electric switch 50 releases the second fin set 30, the second fin set 3 is moved outside the electronic device 200 via the opening 220 of the electronic device 200 due to the elastic force of the elastic member 4〇, so that the second fin set 30 is exposed. In addition to the electronic device 2, the heat dissipation module further includes a guide rail 70, a temperature sensor (10) and a heat pipe 90. Here, a temperature sensor 80 can be utilized to sense the temperature of the environment surrounding the heat generating component 210. Moreover, the temperature sensor 80 is electrically connected to the control unit 60. When the ambient temperature of the heating element 210 is too high, the temperature sensor can notify the control unit 6 to generate a control signal ' to control the electric switch 5 to release the second fin set 30 by the control signal to accelerate the heat dissipation. The first fin group 20 may include a plurality of first fins 21 , and the first fins 21 correspond to the air outlets of the fan 10 . The plurality of first fins 21 may be extended by the outer casing 11 of the fan 10 . And the plurality of first tabs 21 are spaced apart from each other in parallel along at least one 1343235 direction. The second fin set 30 can include a substrate 33 and a plurality of second fins 34. A plurality of second fins 34 are extended from the base 33, and a plurality of second Korean sheets (4) are at least - directionally spaced apart from each other. Here, the plurality of first fins 21 and the plurality of second fins 34 are arranged in a staggered manner. The base 33 may have at least a through hole 35 for airflow to the inside and outside of the electronic device 200. In other words, the heat in the electronic device 2 can be diffused outside the sub-device 200 via the through-hole, and the electronic device can also flow out of the electronic device 200 via the through-hole %. Here, each of the through holes 35 is located between one of the plurality of second slabs. And the opening shape of the substrate 33 can be substantially the same as the shape of the opening 220 of the electronic device 2〇〇, so that when the second fin group 3 is located in the electronic device 2 (8), the substrate 33 can be substantially embedded in the opening. 22 。. The heat dissipation module may be provided with at least one guide rail 7〇. Also, the second panel set 3A may have a slide rail 31 corresponding to the guide rail 70. Here, the shape of the guide rail 7〇 may vary depending on the shape of the second fin 34. The slide rail 31 is movably disposed on the guide rail %. When the first clip group 3 is released by the Leica hook 52, the slide rail 31 follows the guide rail 70 due to the elastic force of the elastic member 4, so that the opening 22 of the second fin 34 is exposed to the electronic device. Fine. Here, the guide 7 伸 extends toward the 1 L of the electronic device. Wherein, the track of the guide rail 7〇 may be straight and parallel to the direction 6 of the first fin, as shown in Figures 1 and 2. Furthermore, the track of the guide rail 70 can also be a curve similar to the s-shape, as shown in "3 and 4". The 'rail 70' may be disposed on the housing of the electronic device 2''. Alternatively, the heat dissipation module may have a wire and the material 7 () is disposed on the bottom plate. [S) 12 1343235 The slide rail is disposed on the bottom side of the second Korean group 3〇 and corresponds to the guide rail %. The elastic member 40 is disposed at the other end of the second rotor group 3 〇 relative to the opening of the electronic device. Further, the position of each of the miscellaneous 70 may be relatively located between two of the plurality of first tabs 21. * The slide rail 31 is disposed below the second fins ^. Wherein the 'electric switch 50 can have the electromagnetic switch 51 and the hook 52' and the second chip set 30 can have the buttonhole 32. The hook 52 is normally fastened to the buttonhole 32 of the second Korean group 30. When the electromagnetic switch 51 receives the control signal from the control unit (6), the electromagnetic switch 51 responds to the control of the ship, so that the hook 52 exits the buttonhole 32, thereby releasing the second rotor group 3〇. Here, a linkage rod 53 can be engaged between the electromagnetic switch 51 and the hook 52. When the power switch 51 receives the incoming control signal, the copper switch should control the signal linkage lever 53, and the cake linkage lever 53 is female to the hook %, because the second = hook 52 is pulled by the linkage lever 53 and exits the buckle hole 32. Thereby the second junction η group 30 is released. The thermal connection between the middle 'f-wheel and 20 and the heating element 21' can be achieved through the B 90. That is, the 'thermal guide (four) is connected to the heating element 2 (four) the first slab. The heat pipe 90 can be thermally connected through a thermal paste, a thermally conductive silver paste or a copper-like 'read 2U'. The heat conduction (4) may be integrally formed with the first fin group 2〇. The thermal connection may be transmitted through the thermal conductive paste, the thermal conductive silver paste or the copper material to the first chip group (10), after the electronic device 200 is turned on, the heating element 21 ( For example: microprocessors, *,, no wafers, South Pacific wafers, or Northbridge wafers, etc., begin to generate thermal energy. The other end of the heat pipe is thermally connected to the heat generating component 210, and the other end is connected to the first fin set 20 for guiding the heat energy generated by the heat generating component 210 and transferring the heat energy to the first fin set 2. The airflow generated by the operation of the fan 10 flows through the first fin set 2〇, so that the first Zhao set 20 exchanges heat with the surrounding environment to dissipate heat energy into the surrounding environment, thereby dissipating the heat generating component 210. When the electronic device 200 runs a program with a large load or runs for a long time, the heating element 210 is made heavy and consumes a large amount of power. Since the partial energy is converted into thermal energy consumption, the temperature of the heating element 210 rises, and the temperature inside the electronic device 2 也 also rises. At this time, if the temperature detected by the temperature sensor 80 for detecting the temperature of the electronic device_thermal element 210 exceeds a certain value, the temperature sensor transmits a signal to the control unit 60 (for example, micro processing) Or control chip, etc.). The electric switch 50 is actuated by the control unit 60 to release the second fin set 3〇. When the control unit 60 receives the signal, a control signal is transmitted to the electromagnetic switch 51 in the electric switch 50. When the electromagnetic switch 51 receives the control signal from the control unit 6〇, the electromagnetic switch 51 pulls back the linkage lever brother in response to the control signal, and the linkage rod 53 is fixed to the hook 2', thereby causing the hook 52 to be pulled by the linkage rod. The buttonhole 32 on the second fin set 30 is withdrawn, thereby releasing the second fin set 3〇. When the electric switch 50 releases the second fin set 30, the slipper 3 of the second reading set 3〇 moves to the opening 22 of the electronic device on the guide 7〇 due to the elastic force of the elastic member 4G, so that The second fin set 3〇 extends from the first set 2〇 to the opening 220 employed by the electronic device and is exposed outside the electronic device. At this time, the side portion of each of the second borrowing sheets is attached to the side surface of the corresponding each of the first fins 21, and the heat energy generated by the heat generating component 210 is transferred to the first Korean group by heat conduction. And the second rotor 1343235 group 30. When the airflow generated by the operation of the fan 10 flows through the first fin set 2〇 and the second Korean set 3〇, causing the first fin set 2〇 and the second fin set 30 to exchange heat with the surrounding environment, Heat is dissipated into the surrounding environment. Herein, by the extended connection of the first fin set 2〇 and the second fin set 30, the heat dissipation area can be increased to accelerate the heat dissipation effect, and the rapid heat dissipation is achieved, and the speed of the fan 10 is prevented from being fast. When the heat is dissipated, noise such as a large wind cut, a high speed operation of the fan, and the like are generated. • Referring again to “1st” and “2nd”, each of the first fins 21 may have a side surface as a plane, and the other side has a raised first convex portion 21a and a relatively first convex portion 21a. The curved surface of the low first recess 21b. Each of the first fins 21 and each of the second fins 34 may be symmetrical to each other in shape. Therefore, the opposite surfaces of each of the second fins 34 are plane and curved, respectively. The curved surface of each of the second fins 34 has a raised second convex portion 34a and a second concave portion 34b which is lower than the second convex portion 34a. The second convex portion 34a of each of the second fins 34 is disposed corresponding to the first convex portion φ of each of the first fins 21, and the second concave portion 34b of each of the second fins 34 corresponds to each of the first portions. The first recess 21b s of the fin 21 is set, and the horizontal tangent of the second convex portion 34a is on the same tangent to the horizontal tangent of the vertex of the first convex portion 21a. After the second fin set 30 moves toward the opening 220 of the electronic device 2 due to the elastic force of the elastic member 40, the portion of the first segment group 3〇 protrudes from the opening 220 of the electronic device and is exposed outside the electronic device. . At this time, referring to "Fig. 2", the second convex portion 34a of each = two 34 is attached to the corresponding convex portion 21a of each of the corresponding Korean films 21 so that heat can be generated by heat conduction. The heat generated by the element 21〇 is transmitted to the first fin group 2〇 and the second fin group a [S] 15 1343235. FIG. 3 is a first actuation diagram according to the second embodiment of the present invention. Fig. 4 is a schematic view showing the second operation according to the second embodiment of the present invention. The present invention is substantially the same as the embodiment described above, and the detailed description of the components can be referred to the foregoing embodiment. In this embodiment, each of the first fins 21 and each of the second fins 34 may be symmetrical to each other in shape. Each of the first fins 21 and each of the second fins 34 may be planar on both sides. When the hook 52 exits the buttonhole 32 and releases the second fin set 3〇, the slide rail 31 of the second fin set 30 moves on the guide 7〇 toward the opening 220 of the electronic device 2 (9) due to the elastic force of the elastic member 40. The second fin group 3 is caused to move from the electronic device 2 (4) to be exposed outside the electronic device 200. Here, the command of the guide 7 () can be an approximate S-shaped curve, so that the first Korean film is moved along the guide rail; a second fin 34 is attached to each corresponding On one side of the Korean sheet 21, heat energy generated by the heat generating element 210 is transferred to the first fin group 2'' and the second Korean sheet group 30 by heat conduction. A heat dissipation module according to the present invention is applied to an electronic device 200 having an opening 220, and the electronic device 200 has a heat generating component 21A. The heat energy generated by the heating element 210 of the electronic device 200 is first transmitted to the first fin group 2, and the airflow generated by the operation of the fan 10 flows through the first fin group 2〇, so that the first-rotor group The 2G exchanges heat with the friend's environment, and the heat is dissipated into the surrounding environment, thereby dissipating the heat generating component 210. When the temperature of the heating element 21 上升 rises, the heat dissipation module controls the electric switch 5 藉 by the control unit 60 to release the second fin set 30 , so that the second fin set 30 is moved from the first fin set 20 to the electronic device. The 2-inch 1343235 opening 220 extends and is exposed outside the electronic device 2 (8), and transfers thermal energy on the first fin set 20 to the second fin set 30 by thermal conduction. At this time, the heat generated by the heating element 21 is transferred to the first fin group 2〇 and the second wafer group 30 by heat conduction, and the airflow generated by the operation of the fan 10 causes the first fin group 2 to be generated. The crucible and the second fin set 30 exchange heat with the surrounding environment to dissipate thermal energy into the surrounding environment. Here, by the extension connection of the first Zhao film group 2〇 and the second fin group 3〇, the heat dissipation surface of the heat dissipation surface can be increased, and the heat dissipation effect can be increased, and the operation of the fan 10 can be avoided only. When the speed is reached to achieve rapid heat dissipation, a large wind cut sound and a high-speed operation of the fan 10 are generated. - Miscellaneous inventions have been disclosed in the past, and the financials are not limited to the invention. Any of the skilled artists are not in the spirit and scope of the invention, and are more The special protection of the lang, therefore, the patent protection of the invention is defined as the definition of the application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a first actuated sound diagram according to a first embodiment of the present invention; and FIG. 2 is a second bi-two of the first embodiment of the present invention: FIG. The second embodiment of the present invention is a second embodiment of the present invention. [The main component symbol description] The fan casing 17 [S] 1343235 12 .........................air outlet 20 ...................... ...first fin set 21 .........................first fin 21a........... ............first convex portion 21b....................first concave portion 30... ...................The second fin set 31 ......................... Slide rail
32 .........................扣孔 33 .........................基底 34 .........................第二鰭片 34a.......................第二凸部 34b.......................第二凹部 35 .........................貫孔 40.........................彈性元件 50 .........................電動開關32 ......................... buckle hole 33 ..................... ....substrate 34 .........................second fin 34a.............. .........the second convex portion 34b..........................the second concave portion 35 ......... ................through hole 40.........................elastic element 50 ... ......................electric switch
51 .........................電磁開關 52 .........................卡勾 53 .........................連動桿 60.........................控制單元 70.........................導軌 80.........................溫度感測器 90.........................熱導管 200.......................電子裝置 18 1343235 210.......................發熱元件 220.......................開口 1951 .........................Electromagnetic switch 52 ..................... ....卡勾53 ......................... linkage rod 60............... ..........Control unit 70......................... Guide rail 80.......... ...............temperature sensor 90.........................heat pipe 200.. .....................electronic device 18 1343235 210.........................Fever Element 220....................... opening 19