TWI340062B - Continuous and uninterruptible slurry dispense device and method thereof - Google Patents

Continuous and uninterruptible slurry dispense device and method thereof

Info

Publication number
TWI340062B
TWI340062B TW096148906A TW96148906A TWI340062B TW I340062 B TWI340062 B TW I340062B TW 096148906 A TW096148906 A TW 096148906A TW 96148906 A TW96148906 A TW 96148906A TW I340062 B TWI340062 B TW I340062B
Authority
TW
Taiwan
Prior art keywords
uninterruptible
continuous
dispense device
slurry dispense
slurry
Prior art date
Application number
TW096148906A
Other languages
Chinese (zh)
Other versions
TW200906551A (en
Inventor
Yoon Won Han
Original Assignee
Plus Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plus Tech Co Ltd filed Critical Plus Tech Co Ltd
Publication of TW200906551A publication Critical patent/TW200906551A/en
Application granted granted Critical
Publication of TWI340062B publication Critical patent/TWI340062B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
TW096148906A 2007-08-13 2007-12-20 Continuous and uninterruptible slurry dispense device and method thereof TWI340062B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070081215A KR100893109B1 (en) 2007-08-13 2007-08-13 Slurry Continuous Supply System and Method of The Same

Publications (2)

Publication Number Publication Date
TW200906551A TW200906551A (en) 2009-02-16
TWI340062B true TWI340062B (en) 2011-04-11

Family

ID=40350809

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096148906A TWI340062B (en) 2007-08-13 2007-12-20 Continuous and uninterruptible slurry dispense device and method thereof

Country Status (3)

Country Link
KR (1) KR100893109B1 (en)
TW (1) TWI340062B (en)
WO (1) WO2009022765A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110173626B (en) * 2019-06-28 2024-02-13 恒力石化（大连）有限公司 Slurry system intermodal transportation and mutual supply control system of PTA refining device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3382138B2 (en) * 1997-08-21 2003-03-04 富士通株式会社 Chemical liquid supply device and chemical liquid supply method
JP3538042B2 (en) * 1998-11-24 2004-06-14 松下電器産業株式会社 Slurry supply device and slurry supply method
JP3774688B2 (en) 2002-09-03 2006-05-17 エム・エフエスアイ株式会社 Slurry supply method and slurry supply apparatus
KR100692910B1 (en) * 2005-07-26 2007-03-12 비아이 이엠티 주식회사 Back up system and method for slurry delivery system
KR20080011910A (en) * 2006-08-01 2008-02-11 세메스 주식회사 Chemical mixing apparatus and method

Also Published As

Publication number Publication date
KR20090016895A (en) 2009-02-18
TW200906551A (en) 2009-02-16
KR100893109B1 (en) 2009-04-10
WO2009022765A1 (en) 2009-02-19

Similar Documents

Publication Publication Date Title
EP2129429A4 (en) Anchoring apparatus and methods for use
GB2443823B (en) Devices and methods for use in construction
IL188970A0 (en) Dispenser and method
IL200266A0 (en) Endo-surgical device and method
TWI366870B (en) Polishing method and polishing device
EP2169956A4 (en) Receiving device and receiving method
HK1153112A1 (en) Self-expanding devices and methods therefor
EP2129301A4 (en) Methods and devices for reducing gastric volume
HK1140721A1 (en) Liquid material discharge device and liquid material discharge method
EP2121511A4 (en) Micropackaging method and devices
EP2127617A4 (en) Coating method and coating device
EP2113169A4 (en) Cleaning device and cleaning method for the device
GB0613500D0 (en) Apparatus and Methods
EP2141804A4 (en) Receiving device and receiving method
GB0707201D0 (en) Dispensing method and device for dispensing
ZA201000622B (en) Ice agitation and dispensing device and method
ZA200906242B (en) Endo-surgical device and method
GB2455384B (en) Receiving apparatus and receiving method
GB0717518D0 (en) Process and device
TWI340062B (en) Continuous and uninterruptible slurry dispense device and method thereof
EP2195481A4 (en) Dispenser system and method
GB0704558D0 (en) Assay method and apparatus
GB0703579D0 (en) Container and Method
TWI350414B (en) Alignment device and alignment method
GB0722121D0 (en) Apparatus and System