TWI339868B - Semiconductor device and method for fabricating the same - Google Patents
Semiconductor device and method for fabricating the sameInfo
- Publication number
- TWI339868B TWI339868B TW096130102A TW96130102A TWI339868B TW I339868 B TWI339868 B TW I339868B TW 096130102 A TW096130102 A TW 096130102A TW 96130102 A TW96130102 A TW 96130102A TW I339868 B TWI339868 B TW I339868B
- Authority
- TW
- Taiwan
- Prior art keywords
- fabricating
- same
- semiconductor device
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW096130102A TWI339868B (en) | 2007-08-15 | 2007-08-15 | Semiconductor device and method for fabricating the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW096130102A TWI339868B (en) | 2007-08-15 | 2007-08-15 | Semiconductor device and method for fabricating the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200908173A TW200908173A (en) | 2009-02-16 |
| TWI339868B true TWI339868B (en) | 2011-04-01 |
Family
ID=44723601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096130102A TWI339868B (en) | 2007-08-15 | 2007-08-15 | Semiconductor device and method for fabricating the same |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWI339868B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8610270B2 (en) | 2010-02-09 | 2013-12-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and semiconductor assembly with lead-free solder |
-
2007
- 2007-08-15 TW TW096130102A patent/TWI339868B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TW200908173A (en) | 2009-02-16 |
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