TWI337774B - Sorting method of bonding wire drawn by diamond dice and management method for diamond dice - Google Patents

Sorting method of bonding wire drawn by diamond dice and management method for diamond dice Download PDF

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Publication number
TWI337774B
TWI337774B TW096109830A TW96109830A TWI337774B TW I337774 B TWI337774 B TW I337774B TW 096109830 A TW096109830 A TW 096109830A TW 96109830 A TW96109830 A TW 96109830A TW I337774 B TWI337774 B TW I337774B
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Taiwan
Prior art keywords
wire
maximum
difference
minimum
moment
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TW096109830A
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Chinese (zh)
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TW200737467A (en
Inventor
Mitsuo Takada
Toshitaka Mimura
Hiroyuki Amano
Yuichi Hirata
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Tanaka Electronics Ind
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Publication of TW200737467A publication Critical patent/TW200737467A/en
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Publication of TWI337774B publication Critical patent/TWI337774B/en

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Wire Processing (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To eliminate the generation of any leaning faultiness in bonding processes, by judging whether the leanings of extra-fine gold bonding wires are good or bad before their connections. <P>SOLUTION: In a sorting method of bonding wires the whole circumference of a bonding wire before its connection is divided finely, and the wire diameters of the divided circumferential portions are measured, and further, the circumferential portions are so integrated in the respective divided axial directions by using their wire diameter values as to determine the respective cross-sectional nth moments of the wire cross sections in the directions, and moreover, the maximum and minimum values of the determined cross-sectional nth moments are so compared with each other as to sort the bonding wires by the magnitudes of the moment values. In A-D having the small differences or ratios (%) of their cross-sectional second moments measured by using their second moments as their nth moments, the faultiness of their leanings are not generated, even though they have polygonal shapes wherein the differences between the measured values of their wire diameters are large. According to this method, wires having deformed cross sections, inclusive of ellipse wherein their leaning faultiness are generated can be sorted and managed, by using as a reference their cross-sectional second moment ratios (%) not larger than 1%, and this method is effective for managing the wear rates of diamond dies. <P>COPYRIGHT: (C)2008,JPO&amp;INPIT

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1337774 九、發明說明： .【發明所屬之技術領域】 本發明係有關經鑽石切割機進行切割的銲接線之分選方法及 銲接線用鑽;5切韻之管财法，尤麟絲於接料形成環狀 (1⑺P)之偏斜缺陷（leaning defect)的預測方法及銲接線之 1 瀬形線的分選方法，及最後_線加工_石切·; (diamond dices)之轴承部的管理方法。 ^ 【先前技術】 . 銲接線通常係指連接晶#與⑽縣之端子的麵線，經予 三度空間的佈線於半導體封裝體内。金屬線之義雖有各式各樣 ，，者被開發著，絲本上以純度99. 99質量％以上的Au為代表。鲜 - 躲_較用著⑶或阳細純金麟或合金_，但為表示 與純度99. 99質量％以上的高純度Au線相同的性質，可被代用作 貴金屬線。銲接線通常係U由—糊騎機之拉擠加工予 鲁w連續延伸至成線獲25㈣的極細線。如此而子製造的銲接線在 接線後會發生不良現象。此不良現象係主要在密封樹脂時發生， 通常鮮接線與樹關時流動，婉輯動或靖。此種銲接線之不 良現象’可利用X射線進行非破壞穿透測試，可使用適當的影像 處理程式檢測出。例如’若依非破壞性檢查第53號卷第四期第ι92 頁月木a也著作的「積體電路銲接線之檢查」時，則於第挪頁 第10圖予關7TT㈣接線之紛輯動、切斷的偵測例。 ____________提高，節I精細化與 1337774 銲線之細線化可同時進展著。節距間隔係由100⑽急劇的予以節 距精細至如m，銲線自30㈣予以細線化至15⑽。結果，被 稱作偏斜缺陷的新不良現象即被視作問題所在。 在此，所辦斜缺陷’係指接合_線之_球至半導體晶 片之A1銲塾並形成第一接合點後，利用毛細管壓接工具（卿ι Wary)抽_接線並猶出環狀時於第—接合點之驗處附近 所生成的銲接線之異常傾向（參閱圖1()，日本特開綱㈠娜 # =公報所刊載的圖）。此種偏斜缺陷係相鄰接的録線間隔過於狹 ,窄、接近而發生的。節距間隔由100_急劇的予以節距精細至 35㈣，隨着節距精細化的進行，銲線與銲線的間隔即變成狹窄。 因此’於銲線與銲線的間隔較廣闊時，有少許的傾斜即被判定成 偏斜缺陷，隨賴隔變成狹窄的結果，被判定成偏斜缺陷的情況 亦增加著。 相對於該_點，細線用鑽石切割機製造時對真圓度的誤 •差，即I線徑變細，如後述般，雖未减少，但偏斜缺陷主要歸 因於銲線形狀’於細線方面以少許的形狀誤差即可使偏斜缺陷發 ^因此，即有需要徹底進行最後鑽石切割機内徑之形狀（轴承 部等）的管理，防止偏斜缺陷現象之發生。 、上述偏斜·，結束接合後的細旨密封之前發生的，若 能恰於製造接線前的輝接線後立即的階段即予發現時 已接線的半導體裝置之不良，而有可能大幅的降低製造成本。至 1337774 於偏斜缺陷生成的原因，有日本特開2004__146715號公報作爲其 先前技術文獻。於此先前技術文獻、第【0007】段落，揭示著「採 用以高精確度測量極細線域面形狀的裝置，測量銲接線用極細 線之截面形狀’被發現有如®1所示的環狀異常係銲接線用極細 線之戴面形狀呈橢圓、或接近橢圓的扭曲狀態時所引起的。」。 然而’上敍前技術内已揭示作對絲略的「以對拉擠加工 後的接合用極細線之線方向成直角的截面之最大直徑及最小直徑 • 間的差異超過線徑之3%者，作為不良品」之作法，雖在管理鑽石 切割機之哥命上係有效的，但對形成第一接合點形成時發生的偏 斜缺陷’並不-定有效。若姻鑽石切割機連續的對極細線確實 • 的拉擠加工時，則鑽石切割機之切割孔會磨耗，鑽石切割機之切 _ 割孔敎’此時鑽石切賴之切割孔的磨耗視情況會於鑽石切割 機之切割·關上產生不均勻現象。因此，極細線之線徑的最 大直徑及最小直徑間的差異亦漸漸變大，終於亦變成超過線徑之3 Φ % 。 然而，如此戴面形狀之最大直徑及最小直徑的差異因係隨著 鑽石切割機之磨耗而發生者，故於繼續使用鑽石切割機之前直至 最大直徑及最小直徑之差異超越線徑的3%爲止，銲線之（平均） 線直徑終會超過許可度。 . 針對此點’銲接線之（平均）線徑需予嚴密的管理，鑽石切 、 割機之哥命管理方面，通常對鑽石切割機在最大直徑及最小直徑 1337774 之差異較少超過線徑之2%。 另一方面，即使最大直徑及最小直徑之差異，在線徑之1%以 下亦會發生偏斜缺陷現象，反之即使在線徑之3%以上亦有不發生 偏斜缺陷的銲接線。 此事雖然有即使此等差異超過1%亦不成爲偏斜缺陷者，但意 指於品質管理上許可低限值須予降低至較1%低，另一方面伴隨著 生成廢棄不發生偏斜缺陷的銲接線等顯著的損失。 鲁 終九’最大直徑及最小直徑之差異係對銲線之全圓周形狀的 -部分的計測值’並非表示銲線整體的性狀之測定值。因此視必 要時亦較難_賴差麵_。於是，欲由最大紐及最小直 ，徑之差異求取銲祕體祕狀並对際，㈣確度極度的降低。 .如此，以先·術絲的至目前為止的作法，並未能解除偏斜缺 陷現象’結果亦域管理最後的舰加I騎石蝴機上的轴承 部。另外，僅銲線之全M形狀中最大直徑及最小直徑之差異， •如後述般未能分選出橢圓形銲線與多邊形銲線。 ' 【專利文獻1】日本特開2004_146715號公報 【非專利文獻1】「非破壞破壞」第53卷第4期刊載論文、「積 體電路銲接線之檢查」青木公也、第195頁之圖10 【發明内容】 、本發月絲本上使於接合步驟不致發生上賴偏斜缺陷而予 凡成的亦即本發明係對至今爲止的鲜接線在接線時形成環狀 1337774 究竟為何形成偏斜缺陷而未能釐清的原因予以解釋清楚而完成的 本發明人等在此-解赫楚的獅，魏於含有翻的歪扭曲 的形狀之不同形狀戴面銲線係於銲線截最大銲線直徑及最小直徑 之差異或銲線最大直徑及最小直徑之差異為銲線線徑所除的值與 截面2 -人力矩卩植比例關係，而已確認^多邊形__彳無比例關 係。利用最大銲、線直徑及最小直徑之差異與戴面2次力矩比，而 可分類出至今爲止的麵轉線及多邊麟線’以至成功的解決 未能辨識的課題。另外，本發明人等料偏斜缺陷現象之原因係 一知接線之裁面开^狀有關，因此在接線前的階段藉由分選輝接線 ，可解決偏斜缺陷現象。另外，轉知偏斜缺陷係介經鲜接線而 與最後的鑽石切賴之軸承㈣形狀錢，故藉由管理最後的劃 線鑽石切割機，可釐清解決偏斜缺陷的方法。 爲解決上述課題，本發明於接合前預測的分選方法，係如下 所述。 (a )對半導體晶片與引線框架等的端子間進行三度空間接 線之偏斜缺陷的分選方法， 〇將接線前的銲接線之全周予以微細的分割，測定該經予 分割的圓周部分之線徑的步驟， 、2)採職線徑_周部分之各個經予分割的軸向進行積分 ’求取各該方向上的戴面2次力矩之步驟， 3)利用比較該軒求得_面2次力矩之最大值及最小值 9 1337774 . 的步驟， - 判斷銲接線在接線時形成環狀之偏斜缺陷的分選銲接線之方 法。 (b)對半導體晶片與引線框架等的端子間進行三度空間接 線之銲接線的不同形狀戴面銲線及_形銲線之分選方法， 1)將接線前的銲麟之全周Μ微細的分割，測定該經 予分割的圓周部分之線徑的步驟， • 、2)知用該線徑對圓周部分之各個經予分割的輪向進行積分 ，求取各該方向上的截面2次力矩之步驟， 3) 由該等測定值求取各關周部分之線徑的最大值及最小 。 值，及各_周部分之軸域面2次力矩的最大似最小值間的 &quot; 差異之步驟， 4) 利用以該經予求得的線徑之最大值及最小值的差異作為 X座標’域面2次力矩之最大值及最小值的^異作為γ座標予 籲以緣圖並比較的步驟’判斷銲接線在接線時形成環狀之偏斜缺陷 的分選銲接線之方法。 (c)對半導體晶片與引線框架等的端子間進行三度空間接 線之銲接線用鑽石切割機的管理方法， 1)將接線別的輝接線之全周予以微細的分割，測定該經 予力割的圓周部分之線徑的步驟， . 2)採用該線徑值對圓周部分之各個經予分割的軸向進行積 10 刀求取各该方向上的截面2次力矩之步驟， 3)由比㈣經予求得的_ 2次力矩之最大值及最 小值的 沾’ |斷於供最_線加坪接線__石洲機之轴承部 的適當與否的管理方法。 ⑷對半導體^與⑽框料的端子間進行三度空間接線之鲜 接線用鑽石切割機的管理方法， 1)將接線前的銲接線之全舒以微細的分割，測定該經予 分割的圓周部分之線徑的步驟， 、、2)採用該線徑值對圓周部分之各個經予分割的轴向進行積 分’求取各财向上_面2 :欠力矩之步驟， 3) 由轉測定值求取各該關部分之線徑的最大值及最小 值’及各_周部分讀面2次力矩的最大值及最小制的差異 之步驟， ' 4) 求取該、雜之最大值及最小值_差異域面2次力矩 之最大值及最小值間的差異之步驟， 5) 利用以δ亥經予求得的線徑之最大值及最小值的差異作為 Χ座標，賴面2次力矩之最大值及最小值的差别作為γ座標予 以繪圖並比較的步驟，判斷於供最後劃線加工銲接線而用的鑽石 切割機之軸承部的適當與否的管理方法。 另外，具體性的要件進一步如下所述。 (f)以前述的戴面Ν次力矩之最大值及最小值的比較、最 最！值間的差異’爲最大值或最小值所除時的戴面2次力 ，τ平估為特徵之上述（a).或（b)所記載的預測銲接線 之良否的銲接線之分選方法。 (g )以w述_面1^次力矩之最大值及最小值的比較、最 最J值間的差異’爲最大值或最小值所除時的戴面2次力 矩比進行評估树徵之上述⑷《⑷·_銲絲用鑽石 切割機之管理方法。 首先，説明偏斜缺陷與本發明之Μ。於#躲之尖端上製 聽㈣解接合至半導體晶片上，形成第-接合‘_情况下， 銲接線之尖端部分雖辭以至練擠加卫引起_性變形， 而不受影響的部分則塑性變形保持原狀的殘留著。遭受及不遭受 此-熱影響的部分_界線雜在於機械强度鋪的位置，較易 又f折的位置’但是於形成第—接合點後，使毛細管壓接工具正 、-升運動之間，因不致對鮮接線施力口較大的管折應力，故鮮 接線係完全約略成垂直的站立著。然而，毛細管壓接工具自第一 接口點移動至第二接合點並於使銲制始描繪成環料，立即對 銲接線施加-折應力且輯折應力針至上述的熱影響之境界部 且使於境界部f折。本發日狀等已_高速度攝賴確認出此現 象。 換^之利用毛細管壓接工具自第一接合點繪製環狀至第二 接合點之際，銲接線係受_且騎躲自第—接合點施加應力 12 部分施加較_折應力。環狀係自第-接 、，s接工具進行至大受彎_位置驗行之間對線 置施加明顯過度的應力㈣機弯折。此-鋅線之f :係被_折至與毛細管壓接工具之軌跡不_方向，亦即分 政性不良係偏斜缺陷之主要現象。 本發日狀料_折向魅細麵缸具之輪柯的方向 (肅均）係歸因於銲線形狀在圓周方向之不均勾引起的截面 N次力矩。亦即，藉域面N次力矩表示銲_面形狀之全體圓 周的性狀’可成功的評轉鱗機械雜賦予辟力的銲線形狀 不句勻以下以代表性截面2次力矩説明戴面n次力矩。 通常於彎折線材的加工情况下，較易f折或較料折係歸因 於線材之性狀的物理特性所致。最後由鑽石切割機之拉擠加工而 製造的線控在25_以下的極細線時，鑽石切割機之轴承部係最 大直控與最小直徑之差異，至今爲止通常在未滿找而作為真圓予 以處理，但本發明人等係再擴大該真圓部分且予以把握作由多數 的大i圓弧曲騎構成者。若卿此種大小雜鱗評估截面形 狀時’則可將至目前為止被視作真圓部分者與以分類成2種類。 一者為橢_狀者（惟，最大直徑與最小直徑之差異為通常未滿1 另-者為多邊形形狀者（惟，最大直徑與最小直徑之差異為 通常未滿1% )。因此，可知橢圓形形狀者係引起偏斜缺陷，多邊 13 料y狀者係生成刺目亂反射的原賊在。欲區分此種橢圓形形狀 者與多邊形形狀者時，可知叫面2次力輯有效的。 心月人等接&amp;夕數條橢圓形形狀的銲接線並進一步詳細調 查時彻毛細官壓接I具對銲接線施加橫向的應力時 ，可知由 =接線之帛接合點為中心點時的垂直方向之傾斜能描繪出常 刀布此吊癌为布係隨著擴圓傾向性愈强時，寬幅有擴大的傾 向此吊“布之寬幅擴大係表示銲接線之傾斜變大，傾斜度在 特定值以上者即成爲偏斜缺陷。 本發明人等認爲可以源自_線之截面雜賴面2次力矩 表現線性的程度。由而，在接合以前將銲接線之戴面於大多數的 方向上分割並精密的測量各自方向上的截面2次力矩時，則可預 測較難弯折的程度。因此，本發明人等藉由在相同圓周上進行複 數方向測定銲接線讀面2次力矩’並由該_紐求取戴面2 次力矩之最大值及最小值的差異，藉由比較該值的步驟，以至成 的預娜出!干接線之第一接合點後的偏斜缺陷之良好與否。進行 ^一接合點的銲線之傾斜係以常態分布表示。對偏斜缺陷之良好 =與截W次力狀最大似最小值_啸，吨大值或最 tr除的比值予以比較為宜。且，銲接線之長度方向的截面2 2矩’係因利灣石切割機進拉擠加工高純度的Au等較易變形 細線，故為於最後鑽石切割機之轴承部的形狀反映著，超細 長度方向係可處理作表示出約略__向亦可。 且’戴面2次力矩雖係對線材之騎應力有關聯的物性值， 但不論戴面1次力矩錢面3次力矩均可被視作錢理作作力學 的力矩時，顯示出與戴面2次力矩同樣傾向者。 其次，說明成為騎缺陷之原_則騎線 之多邊形銲線的區分方法。 ^ 於前述的先行肋之橢_銲線的分選法方面，雖係比較鲜線 線性之最大值及最小值者’但糊雷職射的败值係由繞射影 像測定測粒Ϊ麟線餘者，因並非表示截面職者，故此等 差異亦有對應於橢圓的情况，亦有表示多邊形之稜線及邊間的差 異之情况。 本發明人等認為偏斜缺陷的原因係在於戴面形狀之不均勻， 亦即歸因於包含侧在内之已扭曲喊面形狀之機械特性的異向 性，截面形狀為多邊形形狀者由於並無此種機械特性的異向性， 不發生偏斜缺陷，故作為區分出與包含橢圓在内之已扭曲的戴面 形狀亦即異形戴面之銲線的方法，本發明人已察明以戴面N次力 矩之評估法係較有效的。 若隨著多邊形銲線之變形程度變大時，則形成被稱作刺眼間 耀的外觀不良現象。刺眼閃耀係意指銲線之來自超細線的亂反射 引起的刺眼現象。此現象係已射入焊接線的光遭受反射時而於銲 線表面不均勻時所發生的。亦即，係歸因於銲線截面非為完全的 圓形之多邊形引起的。然而，至目前為止並未發現有完全區分橢 1337774 圓形銲線及多邊形銲線之方法。本發明人料由味戴面2次力 矩之最大似最小侧的差異為最大值或最彳、制除的比值，與 線徑之最大值及則、㈣差異或雜之最大值及最小值為線徑所 除的比值，可成功的鑑識橢圓形銲線與多邊形銲線，定量出摘圓 形銲線。 且，在此不論戴面1次力矩域面3次力矩，在評估截面形 狀之起因的機猶性之異向性上，被認為賊面2次力矩顯示出 相同的傾向。 本發明之功效果係在接線以前的階段藉由分選銲接線，使偏 斜缺陷成為可解決的。再者，U由定量出翻形銲線，而可解決 偏斜缺陷。另外’因銲接線之表面形狀係與最後鑽石切割機之轴 承部的形狀錢聯，故藉由管理最後劃線鑽石_機，結果可解 決偏斜缺陷。 【實施方式】 實施内容 於本發明被利用作銲接線的金屬線，以純度99.的質量％的 如線爲宜。爲使高純度且錄，針拉擠加讀鑽邱割機之抽 承部的形狀縣制狀的予以反映在銲接線之外形上。同理，可 使用高純度的Cu或軟質的貴金屬合金，例如，使於ΑιΗ5質量％ g &amp;金，Au-1質量％ Pd合金或此等金屬或合金内含有以、Be、 ίη、Sn、稀土元素等的微量添加元素者等。 1337774 本發明之銲接線的線徑若為30以m以下時，雖未予特別限制， 但以在10〜25«的範圍為宜。偏斜缺陷係在精細節距領域内發生 的不良現象，因通常係被使用於細線。 實施例1 使於純度99. 999質量％以上的高純度金内含有特定量微量元 素並製備純度99. 99質量％以上的高純度金。以真空轉爐鱗^ 此-製備品’進行拉線加X。因此，在最後線徑23_時，準備 籲 模孔形狀各自不同的6種的鑽石模孔（公稱直徑任一者均為烈以 m) ’並製作6種超細線，各自進行最後熱處理。藉由已利用雷射 __徑測定器各自測定此6種録線之外徑。至於此種線徑測 定器，可採用日本KEYENCE股份公司製造的數位尺度測定器（以一 7000)或東京光電子工業股份公司製造的雷射微測器阢或。蛇sA 公司製造的LDSN-200等。 6種銲線線徑之測定結果示於第丨圖的圖表A~F内。另外， • 6擴大銲線截面之半徑方向戴面形狀示於第2圖的圖表A〜F内。 第1圖的圖表A〜F係與第2圖的圖表A〜F相對應。在此，〇vality (橢圓率）係指「銲線最大直徑及最小直徑之差異為銲線線徑所 除的值（％ )」，定義作1〇〇χ ((銲接線之線徑的最大值）_ (鲜接 線之線徑的最小值）)/(銲接線之線徑），而「戴面2次力矩比⑴」 係對半® 180度於每U. 25度步驟測定16個位置所測定之中，求 出最大值及最小值，利用驗（最大值-最小值）/ (最大值）予 1337774 以定義。 截面2次力矩係依下述方法而得。 將#線戴面如m半騎示，以每1125度步驟均等分 成16刀之關部分，對各自棚周部分測定直徑，求取各自的1337774 IX. Description of the invention: . [Technical field to which the invention belongs] The present invention relates to a method for sorting a welding wire which is cut by a diamond cutting machine and a welding wire for a welding line; Method for predicting the formation of a ring-shaped (1(7)P) deflection defect and a method for sorting the first line of the weld line, and finally the method of managing the bearing portion of the diamond dices . ^ [Prior Art] . The bonding wire usually refers to the upper line connecting the terminals of the crystal # and (10) counties, and is routed to the semiconductor package through a three-dimensional space. Although the meaning of the metal wire is various, it is developed, and the silk is represented by Au having a purity of 99.99 mass% or more. Fresh - hiding _ is more useful than the (3) or the fine pure gold lining or alloy _, but it is the same as the high purity Au wire having a purity of 99.99 mass% or more, and can be used as a noble metal wire. The welding line is usually U-pulled by a pultrusion machine to a very thin line extending continuously to a line of 25 (four). The welding wire thus manufactured will be defective after wiring. This unfavorable phenomenon occurs mainly when the resin is sealed. Usually, the fresh wiring and the tree flow are closed, and the cockroach is activated or tempered. This type of weld line defect can be detected by X-ray non-destructive penetration and can be detected using an appropriate image processing program. For example, if the "inspection of the integrated circuit welding line" of the work of the moon is also made, the 10th figure of the first page is the 7TT (four) wiring. Detection example of moving and cutting. ____________ improvement, section I refinement and 1337774 wire line thinning can progress at the same time. The pitch interval is sharply pitched from 100 (10) to as fine as m, and the bonding wire is thinned from 30 (4) to 15 (10). As a result, a new undesirable phenomenon called a skew defect is considered to be the problem. Here, the oblique defect is referred to as the bonding of the _ ball to the A1 soldering of the semiconductor wafer and forming the first bonding point, and then using the capillary crimping tool (clearing the wiring) The abnormal tendency of the weld line generated near the inspection point of the first joint (see Fig. 1 (), Japan's special open plan (1) Na # = the picture published in the bulletin). Such a skew defect occurs when the adjacent recording lines are too narrow, narrow, and close. The pitch interval is fined by 100_ sharply to a pitch of 35 (four), and as the pitch is refined, the interval between the bonding wire and the bonding wire becomes narrow. Therefore, when the interval between the bonding wire and the bonding wire is wide, it is judged to be a skew defect with a slight inclination, and as a result of the narrowing, the case where the skew defect is determined is also increased. With respect to this point, the thin line is made of a diamond cutter, and the error of the roundness is reduced, that is, the diameter of the I line is thinned. As described later, although it is not reduced, the skew defect is mainly attributed to the shape of the wire. In the thin line, the skew defect can be caused by a slight shape error. Therefore, it is necessary to thoroughly manage the shape of the inner diameter of the final diamond cutter (bearing portion, etc.) to prevent the occurrence of skew defects. The above-mentioned skewing, which occurs before the sealing after the completion of the bonding, can be found in the stage immediately after the wiring is cleaned, and the semiconductor device that has been wired is defective, and the manufacturing may be greatly reduced. cost. To the reason of the generation of the skew defect, there is Japanese Laid-Open Patent Publication No. 2004__146715 as its prior art document. The prior art document, paragraph [0007], discloses that "the apparatus for measuring the shape of an extremely thin line surface with high accuracy, and measuring the cross-sectional shape of the ultrafine line for a weld line" was found to have an annular anomaly as shown by ®1. The shape of the wear line of the welding line is caused by an elliptical shape or a nearly elliptical twisted state.". However, it has been revealed in the prior art that the difference between the maximum diameter and the minimum diameter of the section at right angles to the direction of the line of the ultrafine line for the pultrusion process exceeds 3% of the wire diameter. As a method of "defective product", although it is effective in managing the life of a diamond cutting machine, it is not effective for forming a deflection defect that occurs when the first joint is formed. If the diamond cutting machine is continuously pultrusion to the extremely thin wire, the cutting hole of the diamond cutting machine will be worn, and the cutting of the diamond cutting machine _ cutting hole 敎' at this time the wear of the cutting hole of the diamond depends on the situation. It will cause unevenness in the cutting and closing of the diamond cutting machine. Therefore, the difference between the maximum diameter and the minimum diameter of the wire diameter of the extremely thin wire is gradually increased, and finally becomes 3 Φ % exceeding the wire diameter. However, the difference between the maximum diameter and the minimum diameter of the wearing shape is due to the wear of the diamond cutter, so until the difference between the maximum diameter and the minimum diameter exceeds 3% of the wire diameter before continuing to use the diamond cutter. The (average) wire diameter of the wire will eventually exceed the allowable degree. For this point, the (average) wire diameter of the welding line needs to be strictly managed. In terms of diamond cutting and cutting machine management, the difference between the maximum diameter and the minimum diameter of the diamond cutting machine is usually less than the wire diameter. 2%. On the other hand, even if the difference between the maximum diameter and the minimum diameter occurs, a skew defect occurs under 1% of the wire diameter, and even if the wire diameter is 3% or more, there is a weld line in which the skew defect does not occur. Although this matter does not become a skew defect even if the difference exceeds 1%, it means that the lower limit of the quality management permission must be reduced to less than 1%, and on the other hand, there is no skew accompanying the generation of waste. Significant losses such as defective weld lines. The difference between the maximum diameter and the minimum diameter of Lu's final nine is that the measured value of the portion of the full circumference of the weld line does not indicate the measured value of the overall properties of the weld line. Therefore, it is also difficult to see when it is necessary. Therefore, it is necessary to obtain the secret of the welding secret by the difference between the maximum and minimum straight and the diameter, and (4) the accuracy is extremely lowered. In this way, the result of the first-hand technique has not been able to eliminate the phenomenon of skewed defects, and the result is the management of the last bearing on the ship. In addition, only the difference between the maximum diameter and the minimum diameter of the entire M shape of the bonding wire, • the elliptical bonding wire and the polygonal bonding wire cannot be sorted as described later. [Patent Document 1] Japanese Laid-Open Patent Publication No. 2004-146715 [Non-Patent Document 1] "Non-Destructive Destruction", Volume 53, 4th issue, "Inspection of Integrated Circuit Welding Lines", Aoki Kazuya, pp. 195 10 [Summary of the Invention] The present invention is based on the fact that the bonding step does not cause the deflection defect to occur, that is, the present invention forms a ring 1337774 for the fresh wiring so far. The reason why the oblique defect is not clarified is explained clearly and the inventor of the present invention is hereby--the lion of the sorcerer, the different shape of the fascinating wire containing the twisted twisted shape is tied to the maximum welding of the wire. The difference between the diameter of the wire and the minimum diameter or the difference between the maximum diameter and the minimum diameter of the wire is the relationship between the value of the wire diameter divided by the wire and the ratio of the section 2 - human moment, and it has been confirmed that the polygon __彳 has no proportional relationship. By using the difference between the maximum welding, the diameter of the wire and the minimum diameter and the ratio of the secondary torque of the wearing surface, it is possible to classify the surface transition line and the multilateral lining line so far, and successfully solve the unrecognized problem. In addition, the reason why the inventors of the present invention have a skew defect phenomenon is that the cutting surface of the wiring is related to the open shape, so that the skew defect phenomenon can be solved by sorting the glow wiring at the stage before wiring. In addition, by knowing that the skew defect is shaped by the fresh wire and the bearing of the last diamond (4), the method of solving the skew defect can be clarified by managing the final scribing diamond cutter. In order to solve the above problems, the sorting method of the present invention for predicting before joining is as follows. (a) A method of sorting skew defects in a three-dimensional space between terminals of a semiconductor wafer and a lead frame, and finely dividing the entire circumference of the bonding wire before wiring, and measuring the circumferential portion of the pre-divided portion The step of the wire diameter, 2) the tapping of the wire diameter _ the circumferential portion of each of the divided portions, the step of obtaining the second moment of the wearing surface in each direction, 3) using the comparison _ face 2 times the maximum and minimum torque 9 1337774 . The steps, - to determine the welding line in the wiring to form a circular deflection defect of the sorting welding line. (b) Sorting method of different shapes of the surface welding wire and the _ wire bonding wire for the three-dimensionally wired welding line between the semiconductor wafer and the lead frame, etc. 1) The entire circumference of the welding lining before the wiring Finely dividing the step of measuring the wire diameter of the divided circumferential portion, and 2) knowing the wire diameter to integrate the respective divided wheel directions of the circumferential portion, and obtaining the cross section 2 in each direction The step of the secondary moment, 3) determining the maximum value and the minimum of the wire diameter of each of the closed portions from the measured values. The value, and the difference between the maximum and minimum values of the secondary moment of the axial region of each _week portion, 4) using the difference between the maximum and minimum values of the obtained wire diameter as the X coordinate 'The method of comparing the maximum value and the minimum value of the second-order moment of the domain surface as the γ-coordinate to the edge map and comparing the 'measuring the welding line to form a ring-shaped skew defect when the welding line is wired. (c) A method of managing a diamond cutting machine for a welding wire that is three-dimensionally wired between terminals of a semiconductor wafer and a lead frame, and 1) finely dividing the entire circumference of the wiring of the wiring and measuring the force. The step of cutting the wire diameter of the circumferential portion, 2) using the wire diameter value to perform a step of obtaining a cross-sectional secondary moment in each of the circumferentially divided portions of the circumferential portion, 3) (4) The method of managing the appropriateness of the bearing part of the _ 2 times of the torque and the minimum value of the _ 2 times of the torque. (4) The management method of the diamond cutting machine for fresh wiring for the three-dimensional connection between the terminals of the semiconductor and (10) frame material, 1) The total division of the welding line before the wiring is finely divided, and the divided circumference is measured. Part of the wire diameter step, , 2) using the wire diameter value to integrate each of the pre-divided axial directions of the circumferential portion to obtain the respective financial upwards _ face 2: under-torque step, 3) The steps of obtaining the maximum value and the minimum value of the wire diameters of the respective closing portions and the difference between the maximum value and the minimum system of the secondary moments of each of the partial reading portions, '4) obtaining the maximum and minimum of the miscellaneous The value_the difference between the maximum and minimum values of the second moment of the difference domain, 5) using the difference between the maximum and minimum values of the line diameter obtained by the δHei as the Χ coordinate, the second moment of the surface The difference between the maximum value and the minimum value is plotted and compared as a gamma coordinate, and a method of managing the properness of the bearing portion of the diamond cutting machine for the last line processing of the welding line is determined. In addition, the specific requirements are further described below. (f) Comparison of the maximum and minimum values of the aforementioned wearing moments, the highest! The difference between the values is the second-order force of the wearing surface when the maximum value or the minimum value is divided, and the τ is estimated to be the sorting of the welding line for predicting the quality of the welding line as described in (a) or (b) above. method. (g) The evaluation of the second-order moment ratio of the wearing surface when the difference between the maximum value and the minimum value of the first-order moment and the difference between the most-most J values is the maximum or minimum value (4) "(4)·_ Management method of diamond cutting machine for welding wire. First, the skew defect and the flaw of the present invention will be explained. At the tip of the #hising, the fourth part of the welding wire is unbonded to the semiconductor wafer to form the first joint. In the case of the first joint, the tip end portion of the weld line is reluctantly deformed, and the unaffected portion is plastically deformed. It remains as it is. The part that suffers and does not suffer from this-heat influence is the position of the mechanical strength shop, and the position of the f-fold is easier. However, after forming the first-joint point, the capillary crimping tool is between the positive and the -lift motions. Because the pipe bending stress is not applied to the fresh wire, the fresh wire is completely standing vertically. However, the capillary crimping tool is moved from the first interface point to the second joint point and the weld is initially depicted as a loop, and the weld line is immediately subjected to a -fold stress and the stress needle is folded to the boundary of the heat effect described above and Make a discount to the realm. This issue has been confirmed by the _ high speed photo. When the annular crimping tool is used to draw the annular shape from the first joint to the second joint, the weld line is subjected to stress and the ride is hidden from the first joint. The annular system exerts a significant excessive stress (4) machine bending between the first and second, s-joint tools to the large-bend_position test. The f-line of the zinc wire is the main phenomenon that the trajectory of the capillary crimping tool is not _ direction, that is, the deviating defect of the sub-government system. The direction of the hair _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ That is to say, the N-th moment of the surface area indicates the property of the entire circumference of the weld _ face shape, which can successfully evaluate the shape of the weld line of the scale mechanical miscellaneous force, and the shape of the weld line is not uniform. Secondary moment. Generally, in the case of processing of a bent wire, it is easier to fold or the material is due to the physical properties of the properties of the wire. Finally, when the wire cutter manufactured by the pultrusion processing of the diamond cutter is in the ultra-fine line of 25_ or less, the difference between the maximum direct control and the minimum diameter of the bearing part of the diamond cutting machine is usually not found in the true circle. However, the present inventors have further expanded the true-circle portion and grasped it as a majority of the large i-curved riders. If the size of the size of the scale is evaluated, then the one that is considered to be the true circle so far can be classified into two types. One is an ellipsoid (only, the difference between the largest diameter and the smallest diameter is usually less than 1 and the other is a polygonal shape (however, the difference between the largest diameter and the smallest diameter is usually less than 1%). Therefore, it is known The elliptical shape causes the deflection defect, and the multi-layered material y-shaped is the original thief who produces the glare-reflex. When it is desired to distinguish between the elliptical shape and the polygonal shape, it is known that the two-dimensional force is effective. When the heart of the moon is connected to the elliptical shape of the elliptical shape and is further investigated in detail, when the transverse crimping force is applied to the welding line, it is known that the joint point of the wiring is the center point. The inclination of the vertical direction can describe the regular knife cloth. This hanging cancer is the cloth system. As the tendency to expand the circle becomes stronger, the width is enlarged. The width of the cloth is wide, indicating that the inclination of the welding line becomes large and inclined. If the degree is greater than or equal to a certain value, it becomes a skew defect. The present inventors believe that the second moment of the cross-section of the cross-section of the _ line can be linear. Thus, the wear line is worn before the joint. Split and precision in most directions When measuring the secondary moment of the section in the respective directions, it is possible to predict the degree of difficulty in bending. Therefore, the inventors of the present invention measured the secondary moment of the welding line by performing the complex direction on the same circumference and by the Find the difference between the maximum and minimum values of the 2nd moment of the wearing surface, and compare the steps of the value to the pre-existence of the deviation. The skew defect after the first joint of the dry wiring is good or not. The inclination of the weld line of a joint is expressed by a normal distribution. It is preferable to compare the deviation of the defect with the maximum value of the cut-off W-force, the ratio of the whistle, the large value of the ton, or the most tr. The section 2 2 moment of the length of the welding line is the easy-deformed thin line of the high-purity Au such as the In-Bay stone cutting machine. Therefore, the shape of the bearing part of the final diamond cutting machine reflects the ultra-fine length. The direction can be processed to show the approximate __ direction. And the '2nd moment of the wearing surface is related to the physical value of the riding stress of the wire, but the torque can be regarded as the 3rd moment of the face. When the money is used as the moment of mechanics, it shows the force twice with the face. The second tendency is to explain the method of distinguishing the polygon welding wire of the riding line. The minimum value of the person who is the minimum value of the job is determined by the diffraction image. The difference is also the case of the ellipse, and the difference also corresponds to the case of the ellipse. The difference between the ridge line and the edge. The inventors of the present invention considered that the cause of the skew defect is the unevenness of the shape of the worn surface, that is, the anisotropy attributed to the mechanical characteristics of the twisted face shape including the side. In the case where the cross-sectional shape is a polygonal shape, since there is no anisotropy of such mechanical characteristics, no skew defect occurs, and thus the wire shape of the distorted wearing surface including the ellipse is distinguished. Methods, the inventors have found that the evaluation of the N-th moment of the wearing surface is more effective. When the degree of deformation of the polygonal wire is increased, an appearance defect called glare is formed. The glare of the glare means the glare caused by the chaotic reflection of the wire from the ultra-fine wire. This phenomenon occurs when light that has entered the weld line is reflected and uneven when the surface of the wire is uneven. That is, it is caused by the fact that the wire cross section is not a completely circular polygon. However, until now, no method has been found to completely distinguish the elliptical 1337774 round wire and the polygonal wire. The inventors expect that the difference between the maximum and minimum sides of the secondary moment of the taste wear surface is the maximum value or the maximum value, the ratio of the elimination, the maximum value of the wire diameter, and the difference between the maximum value and the minimum value of the wire diameter is The ratio of the wire diameter can be successfully identified for the elliptical wire and the polygonal wire, and the round wire can be quantitatively extracted. Further, in this case, regardless of the third moment of the moment surface of the wearing surface, it is considered that the second moment of the thief surface shows the same tendency in evaluating the anisotropy of the cause of the cross-sectional shape. The effect of the present invention is that the deflection defects can be solved by sorting the welding lines at a stage before wiring. Furthermore, U can solve the skew defect by quantifying the wire bond wire. In addition, since the surface shape of the weld line is linked to the shape of the bearing portion of the final diamond cutter, the skew defect can be solved by managing the final scribing diamond. [Embodiment] The present invention is applied to a metal wire used as a bonding wire in the present invention, and is preferably a wire having a purity of 99.% by mass. In order to make the high-purity and recording, the needle squeezing and the shape of the suction part of the reading and cutting machine are reflected in the shape of the welding line. Similarly, high-purity Cu or a soft precious metal alloy can be used, for example, ΑιΗ5 mass% g &amp; gold, Au-1 mass% Pd alloy or such metals or alloys containing Be, ηη, Sn, A trace element such as a rare earth element or the like. 1337774 When the wire diameter of the welding wire of the present invention is 30 or less, it is not particularly limited, but it is preferably in the range of 10 to 25 Å. Deviation defects are undesirable phenomena in the fine-grain area because they are usually used for thin lines. Example 1 A high-purity gold having a purity of 99.999 mass% or more is contained in a specific amount of a trace element and a purity of 99.99 mass% or more is prepared. Pull the wire with the vacuum converter scale ^ this - preparation '. Therefore, at the last wire diameter 23_, six types of diamond die holes (any of which is nominally m) are prepared in which the shape of the die hole is different, and six kinds of ultrafine wires are produced, and the final heat treatment is performed. The outer diameters of the six types of recording lines were each measured by a laser __ diameter measuring device. As for such a wire diameter measuring device, a digital scale measuring device (a 7000) manufactured by KEYENCE Co., Ltd. of Japan or a laser micro-detector manufactured by Tokyo Optoelectronics Co., Ltd. can be used. LDSN-200 manufactured by Snake sA Company. The measurement results of the six types of wire diameters are shown in the graphs A to F of the figure. In addition, the shape of the wearing surface in the radial direction of the expanded wire cross section is shown in the graphs A to F of Fig. 2 . The graphs A to F of Fig. 1 correspond to the graphs A to F of Fig. 2 . Here, 〇vality means that the difference between the maximum diameter and the minimum diameter of the wire is the value (%) of the wire diameter, which is defined as 1〇〇χ ((the maximum diameter of the weld line) Value)_ (minimum of the wire diameter of the fresh wire)) / (wire diameter of the welding wire), and "wearing the second torque ratio (1)" is a half-180 degree measurement at 16 positions per U. 25 degree step Among the measurements, the maximum value and the minimum value were determined, and the test (maximum-minimum value)/(maximum value) was used to define 1337774. The secondary moment of the section is obtained by the following method. Put the #线 Wearing surface as a half-riding, and divide it into 16-knife parts every 1125 degrees, and measure the diameter of each part of the shed to find the respective

如第4圖所不’由所測量的半徑r自對應於各圓周部分之半徑 Γ而對X軸的高度y及已投影至X軸的寬度，各由rw及麵 Θ求得 …具體而言，高度y係由軒分割的關部分之幅的Θ值及 該經予測定的r值’或與該_範圍再予細分_與該r測定值 算出的平均值等相近似，寬度之X值係由麟Μ部分之前後的 0值,、由射值异出各自的χ值並進行減算，而可得作為其間的As shown in Fig. 4, the measured radius y from the radius 对应 corresponding to each circumferential portion and the height y to the X-axis and the width projected onto the X-axis are determined by rw and surface ......specifically , the height y is the Θ value of the width of the closed portion divided by Xuan and the measured r value ' or subdivided with the _ range _ is similar to the average value calculated by the r measured value, and the X value of the width It is based on the value of 0 before and after the part of the lining, and the enthalpy of each value is subtracted from the value of the radiance, and can be obtained as

由如此而得的各個_部分的X、y值絲料近似於長方形 的截面綠4則成為如第5圖所讀。藉峻算對如此近似的 各個截面形狀之截面2次力矩，可求得作為魏截面之2次力矩。 以下，同法依序對應於分難16，以各_丨⑶度 個方向的半圓之截面2次力矩。 &amp; 於乂上的。U ’等分贿_面並於各自的半徑 於長方形狀，雖可求出銲_面之2次力矩作私自長方形的截 面2次力矩’但是轉係、不外灯座標上的積分值而作為銲線截面 !337774 之2次力矩。 此等的分割數並非限制於16，·但是若加大分割間隔時，則因 為能正確的反映载面形狀，故大致以分割成16以上並予計測為宜。 此外’第2圖之較濃的實線及較淡的實線，係顯示出銲線截面之 半圓形狀’同樣的使銲線之測定位置於銲線的長度方向上錯開i〇m 並變化’而進行二次測定的結果。此外，下中央部之四角係銲線 截面之中心點。 若邊比較第1圔之A〜F的6種銲線線徑之測定結果及已放大 銲線截面的半徑方向之第2 _面形狀並予參考時，則 (1)第1圖之A圖表係指「銲線最大直徑及最小直徑之差異為銲 線線徑所除的值（％)」與「戴面2次力矩比（％)」之任二較低 值，由第2圖A可知係接近真圓的形狀。（2)第i圖之c、F圖表 係指「銲線最大餘及最小直徑之差異為銲線_崎的值 與「戴面2次力矩比（％)」之任—者均增加著，第2圖之圖表c、 F可確認出係接近於_的形狀。（3)另—方面，第i圖之圖表8、 D、E係即使「銲線最大直徑及最小直徑之差異為銲線線徑所除的 值（％)」增加，*「截面2次力矩比（％)」較少增加，由第2 圖之圖表B、D、E可知係接近多邊形的形狀。因此，由⑴〜⑻ «之關係’藉由「截面2次力矩」或「戴面2次力矩比(％)」 之大小，可辨識出橢圓銲線及多邊形銲線。 實施例2 19 ^37774 與實施例1同法使用最後線徑25emi6種鑽石切割機（公 %直奴均為25 # m )，製作6種超細線，各自進行最後熱處理。 6種~線線徑之測定結果示於第6圖的圖表ς〜l内。另外，已擴大 銲線戴面之半徑方向戴面形狀示於第7圖的圖表G〜L内。第6圖 的圖表G〜L係與第7圖的圖表相對應。在此，於第7圖之戴 面形狀較濃的實線係表示出由測定值之銲線直徑推測的戴面之半 圓形狀，較淡的實線係表示出銲線已假設成完全的真圓之情況下 的截面之半圓形狀。此外，下中央部之四角係銲線截面之中心點。 由比較第6圖之圖表G~L及表示其戴面形狀的第7圖之圖表 G〜L，可顯而得知截面形狀為橢圓形的K、L係被認為與「銲線最 大直徑及最小直徑之差異為銲線線徑所除的值（％)」及「戴面2 次力矩比（％)」有關的，但銲線形狀為多邊形之Η、丨、j係即使 「銲線最大直徑及最小直徑之差異為銲線線徑所除的值（％)」增 加，而「戴面2次力矩比（％)」較少增加，可知此等之間並盔 ·“、个曰 關的關係。 因此，由實施例1及實施例2之結果，藉由「銲線最大直徑 及最小直徑之差異為銲線線徑所除的值（％)」及「截两2次力矩 比（％)」間的相關關係’可辨識出橢圓銲線及多邊形銲線，可確 認出線徑之測定值間的差異並不具特別的依賴關係。 實施例3 其次’採用實施例2之6種銲線，使用日本新川股份有限公 20 1337774 司製作的麟銲類（聰-彻型），膽大齡〇.5毫粆的放電 時間製作出㈣銲球（球徑·m)，以壓接直#45_並用特定 的環狀條件（高度«、高度㈣鲜接H)，_次於_m 邊長的’’4A1銲塾上之時’發生如第1()圖所示的偏斜缺陷現象。 此偏斜缺陷（條數）之結果係以「銲線最大直徑及最小直徑之差 異為銲線線撕_值（％)」及「絲2次力触（％)」間的 相關關係，示於第8圖、第9 _。若依第8圖時，則「偏斜缺 陷（條數）」及「銲線最大直徑及最小倾之差異為銲線線徑所除 的值（％)」_相關係數低至Q 64，而相對的，若依第9围時， 則「偏斜缺陷（條數）」及「銲線最大直徑及最小直徑之差異為銲 線線徑所_值⑻」間__數高至Q. 9?，可知係分布成約 略直線上。 因此，會發生騎缺陷係予線定於橢_狀的銲線，欲辨識 橢圓形狀的銲線即以「截面2次力矩比（％)」為賴條件亦即， 由「銲線最大直徑及最小直徑之差異為銲線線徑所除的值⑼）」 即使高至3%左右，若「戴面2次力矩比（％)」為較低的值時: 則不發生偏斜_，且事實上有财的該種鮮線。 由而’由「銲線最大直徑及最小直徑之差異為銲線線徑所除 的值（％)」未能細偏斜缺陷，未能分選銲接線。此外，亦未能 管理最後劃線鑽石切割機。 b 亦即以載面2-人力矩比（％)」為管理值，以辨識最後劃 1337774 線鑽石切·或銲線的方法管理偏斜賴即成可能。偏斜缺陷因 係視所使_銲線線徑、組裝體細、接合條件的不同而使許可 值變化，故欲限定「戴面2次力矩比（％)」之固定值並不容易， 但可被視作由第9辭理成1%以下係可抑制極度的偏斜缺陷。 【圖式簡單説明】 第1圖係表示以截面2次力矩比（％)與銲線最大直徑及最 小直徑之差異為銲線線徑所除的值間之關係的實施例。 第2圖A〜F係表示由實測值放大30倍的載面形狀之於僅阊周 方向對與圓周方向垂直的方向上的實施例。 第3圖係表示已分割銲線成16等分的圓周部分之實施例模式 圖。 第4圖係由等分割銲線截面並予測定的半徑厂算出圓周部分 之高度及寬度的模式圖。 第5圖係使輝線截面近似於長方形並算出戴面2次力矩之近 似值的模式說明圖。 第6圖係表示以截面2次力矩比（％)與銲線最大直徑及最 小直徑之差異為銲線線徑所除的值（〇va丨丨炒）間之關係的實施例。 第7圖G〜L係表示由實測值放大30倍的戴面形狀之於僅圓周 方向對與圓周方向垂直的方向上的實施例。 第8圖係表示銲線最大直徑及最小直徑之差異與偏斜缺陷間 的關係之實施例。 22 1337774 第9圖係表示於本發明之實施例中的截面2次力矩比（％) 與偏斜缺陷間的關係之實施例。 第10圖係表示由正上方觀察銲接線已形成環狀時所發生的偏 斜缺陷之圖（日本特開2004-146715號公報揭示圖）。 【主要元件符號說明】 無The X and y values of the respective _ portions obtained in this way approximate the rectangular cross section green 4 as read in Fig. 5. By using the second moment of the section of each cross-sectional shape so approximated, the second moment of the Wei section can be obtained. Hereinafter, the same method sequentially corresponds to the difficulty of 16, and the second moment of the cross section of the semicircle in each direction of _丨(3) degrees. &amp; U 'equal bribe _ face and their respective radius in a rectangular shape, although the second moment of the welding _ face can be obtained as a rectangular second-order moment of the rectangular 'but the integral value on the coordinate system and the external lamp coordinates is used as the welding Line section! 337774 2 times torque. The number of divisions is not limited to 16. However, if the division interval is increased, the shape of the carrier surface can be accurately reflected. Therefore, it is preferable to divide it into 16 or more and measure it. In addition, the thicker solid line and the lighter solid line in Fig. 2 show the semicircular shape of the cross section of the wire. Similarly, the measurement position of the wire is shifted by i〇m in the longitudinal direction of the wire and changes. The result of the second measurement was performed. In addition, the corner of the lower central portion is the center point of the wire cross section. When comparing the measurement results of the six types of wire diameters of the first to the second and the second _ plane shape in the radial direction of the cross section of the welded wire, (1) the A chart of Fig. 1 It means that the difference between the maximum diameter and the minimum diameter of the wire is the value (%) of the wire diameter and the ratio of the second moment of the wearer (%), as shown in Figure 2A. It is close to the shape of a true circle. (2) The c and F diagrams in Figure i indicate that the difference between the maximum and minimum diameter of the weld line is the value of the weld line _ saki and the ratio of the wearer's secondary torque ratio (%). The graphs c and F in Fig. 2 confirm that the shape is close to _. (3) On the other hand, in the graphs 8, D and E of the figure i, even if the difference between the maximum diameter and the minimum diameter of the weld line is the value (%) of the wire diameter removed, * "the second moment of the section" The ratio (%) is less increased, and it can be seen from the graphs B, D, and E of Fig. 2 that the shape is close to a polygon. Therefore, the elliptical wire and the polygonal wire can be recognized by the relationship of (1) to (8) «the relationship between the "secondary moment of the cross section" or the "second moment ratio (%) of the wearing surface". Example 2 19 ^37774 In the same manner as in Example 1, the final wire diameter of 25 emi 6 diamond cutting machines (25 % of each of the male straight slaves) was used to prepare six kinds of ultrafine wires, each of which was subjected to final heat treatment. The results of the measurement of the six kinds of wire diameters are shown in the graph ς l of Fig. 6. Further, the radial wear surface shape of the expanded wire wear surface is shown in the graphs G to L of Fig. 7. The graphs G to L of Fig. 6 correspond to the graph of Fig. 7. Here, the solid line in which the shape of the wearing surface is thicker in Fig. 7 indicates the semicircular shape of the wearing surface estimated from the wire diameter of the measured value, and the lighter solid line indicates that the bonding wire has been assumed to be completely true. The semicircular shape of the cross section in the case of a circle. In addition, the four corners of the lower central portion are the center points of the wire cross section. By comparing the graphs G to L in Fig. 6 and the graphs G to L in Fig. 7 showing the shape of the wearing surface, it can be clearly seen that the K and L systems in which the cross-sectional shape is elliptical are considered to be the largest diameter of the bonding wire and The difference in the minimum diameter is related to the value (%) of the wire diameter of the wire and the "second moment ratio (%) of the surface of the wire), but the shape of the wire is polygonal, 丨, j, even if the wire is the largest. The difference between the diameter and the minimum diameter is increased by the value (%) of the wire diameter, and the "2nd moment ratio (%) of the wearing surface is increased". It is known that there is a helmet between the two. Therefore, from the results of the first embodiment and the second embodiment, the value (%) divided by the wire diameter of the wire is "the difference between the maximum diameter and the minimum diameter of the wire" and the two torque ratios are cut. The correlation between %) can identify elliptical weld lines and polygonal weld lines, and it can be confirmed that the difference between the measured values of the wire diameters is not particularly dependent. Example 3 Next, using the six kinds of bonding wires of Example 2, using the lining welding type (Cong-Chee type) produced by the Japanese company Shinkawa Co., Ltd. 20 1337774, the discharge time of the biliary age 〇 5 粆 is produced (4) Solder ball (ball diameter · m), with crimping straight #45_ and using specific ring conditions (height«, height (four) freshly connected to H), _ times on the '4A1 soldering ' on the _m side length' A skew defect phenomenon as shown in Fig. 1() occurs. The result of this skew defect (number of strips) is shown as the relationship between the difference between the maximum diameter and the minimum diameter of the wire and the relationship between the wire tearing value (%) and the wire 2 force contact (%). In Figure 8, the 9th _. According to Figure 8, the "skew defect (number of strips)" and "the difference between the maximum diameter and the minimum tilt of the weld line are the values (%) of the wire diameter)"_the correlation coefficient is as low as Q 64, and In contrast, if the ninth circumference is used, the difference between the "deviation defect (number of strips)" and "the maximum diameter and the minimum diameter of the weld line is the wire diameter _ value (8)" __ number is as high as Q. 9 ?, it can be seen that the system is distributed in an approximate straight line. Therefore, there is a welding line in which the riding defect is set to an ellipse shape, and the elliptical shape of the bonding wire is determined by the "secondary torque ratio (%) of the section", that is, the "maximum diameter of the bonding wire and The difference in the minimum diameter is the value divided by the wire diameter (9))) Even if the value is as low as 3%, if the "2nd moment ratio (%) of the wearing surface is a lower value), the skew _ does not occur, and In fact, there are such fresh lines of money. From the fact that the value (%) divided by the difference between the maximum diameter and the minimum diameter of the bonding wire is the wire diameter, the welding line cannot be sorted. In addition, the final crossed diamond cutter was not managed. b, that is, the carrier-to-human torque ratio (%) is the management value, and it is possible to identify the deviation of the last stroke of the 1337774 line of diamond cutting or welding wire. Since the deflection value varies depending on the wire diameter, the assembly size, and the bonding conditions, it is not easy to limit the fixed value of the "wearing secondary torque ratio (%)". It can be considered that the ninth grammar is 1% or less, and the extreme skew defect can be suppressed. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing an example in which the relationship between the secondary torque ratio (%) of the cross section and the difference between the maximum diameter and the minimum diameter of the bonding wire is a value divided by the wire diameter. Figs. 2A to 1F show an embodiment in which the shape of the carrier surface magnified 30 times from the measured value is in the direction perpendicular to the circumferential direction only in the circumferential direction. Fig. 3 is a view showing an embodiment of a circumferential portion in which the divided bonding wires are divided into 16 equal parts. Fig. 4 is a schematic view showing the height and width of the circumferential portion by a radius factory which is divided into sections and measured. Fig. 5 is a schematic diagram showing the approximated value of the secondary moment of the wearing surface by making the cross section of the ray line approximate a rectangle. Fig. 6 is a view showing an example in which the relationship between the second-order moment ratio (%) of the cross-section and the difference between the maximum diameter and the minimum diameter of the bonding wire is the value of the wire diameter (〇va丨丨). Fig. 7 to Fig. G to L show an embodiment in which the wearing shape which is magnified 30 times from the measured value is in the direction in which only the circumferential direction is perpendicular to the circumferential direction. Fig. 8 is a view showing an example of the relationship between the difference in the maximum diameter and the minimum diameter of the bonding wire and the skew defect. 22 1337774 Fig. 9 is a view showing an example of the relationship between the secondary moment ratio (%) of the section and the deflection defect in the embodiment of the present invention. Fig. 10 is a view showing a deflection defect which occurs when the weld line has been formed into a ring shape from the upper side (Japanese Unexamined Patent Publication No. 2004-146715). [Main component symbol description] None

23twenty three

Claims (1)

月/罚修正替換頁 99年10月6曰 申請專利範囷： 種銲接線之分選方法，係對半導體晶片與引線框架等的端子 曰進行二度空間接線之偏斜缺陷的分選方： 成： 法’由下述步驟而 1) 將接線㈣銲接線之全辭以賴隔的分割成多數的圓周 部分’測定該軒分__部分之線徑的步驟， 2) 採用該線徑對圓周部分之各個經予分割的轴向進行積分， 求取各該方向上的截面2次力矩之步驟，及 3) 利用比較该經予求得的截面2次力矩之最大值及最小值的 步驟判斷銲接線在接線時形成環狀之偏斜缺陷。 2.-種鮮接線之分選方法，係對半導體晶片與引線框架等的端子 間進行二度空間接線之銲接線的不同形狀截面鋅線及麵形鲜 線之分選方法，由下述步驟而成： 1) 將接線刖的銲接線之全周予以等間隔的分割成多數的圓周 部分，測定該經予分割的圓周部分之線徑的步驟， 2) 採用該線徑對圓周部分之各個經予分割的軸向進行積分， 求取各該方向上的截面2次力矩之步驟， 3) 由該等測定值求取各該圓周部分之線徑的最大值及最小值， 及各該圓周部分之各予分割的軸向戴面2次力矩的最大值及最 小值間的差異之步驟， 4) 求取該線徑之最大值及最小值的差異與該戴面2次力矩之 1337774 —Ί 99年1〇月6曰 月（日修正替換頁 最大值及最小值的差異之步驟，及. 5)以該經予求得的線徑之最大值及最小值的差異作為χ座標， 該截面2次力矩之最大值及最小值的差異作為γ座標予以繪圖 並比較的步驟，判斷銲接線在接線時形成環狀之偏斜缺陷。 3.如請求項1或2所述的銲接線之分選方法，係以前述截面2次 力矩之最大值及最小值的差異為最大值或最小值所除的戴面2 、 次力矩比評估㈣紅2次力矩之f'大缺最小朗的比較。 4‘-種鑽石切s彳機之轴承部的管理方法，係對半導體晶片與化線 忙架等的％子間進行二度空間接線之銲接線用鑽石切割機的管 理方法，由下述步驟而成： 1) 將接線前的銲接線之全周予以等間隔的分割成多數的圓周 _ 部分，測定該經予分部ϋ線徑的步驟， 2) 採用树徑值對_部分之各個軒分·軸向進行積 分’求取各該方向上的截面2次力矩之步驟， 3) 由比較雜予求得喊面2次力矩之最大值及最小值的 步驟而成的—序列的管理步驟，管理於供最後劃線加工銲接線 而用的鑽石切割機之軸承部是否適當。 —5·種鑽石切割機之轴承部的管理方法，係對半導體晶片與引線 -· - - — 25 1337774 99年丨〇月6日 的管 W。月έ日修正替換頁 :::子間進行三度空間接線之_線用鑽石切割機 方法，由下述步驟而成： )將接線則的銲接線之全軒以賴隔的分割❹數的圓周 測定該經予分割的圓周部分之線徑的步驟， 2) 採用該線徑值對圓周部分之各個經予分割的軸向進行積分， 求取各該方向上的戴面2次力矩之步驟， 參 3) 由麟測定值求取㈣關部分之線徑的最大值及 及各該圓周部分之戴面2次力矩的最大值及最小值間_ 步驟， ―一 4) 求取魏徑之最域及最顿_差異域面2次力矩之 最大值及最小值間的差異之步驟，及 5) 利用以該經予求得輯徑之最大值及最小值的差異作為乂 座標，該截© 2次力矩之最大值及最小_差_為γ座標予 以繪圖並比較的步驟而成的一序列的管理步驟，管理於供最後 劃線加工銲接線而用的鑽石切割機之軸承部是否適當。 6.如請求項4或5所述的管理方法’係以前述截面2次力矩之最 大值及最小值的差異為最大值或最小值所除的截面2次力矩比 s平估刖述截面2次力矩之最大值及最小值間的比較。 26Month / Penalty Correction Replacement Page 99 October 6 曰 Patent Application: The sorting method of the welding line is a sorting method for the deflection of the second dimension of the terminal 半导体 of the semiconductor wafer and the lead frame: The method of the following method: 1) The step of dividing the wire (4) of the weld line into a plurality of circumferential portions to measure the wire diameter of the portion of the branch __, and 2) adopting the wire diameter pair The steps of integrating the pre-divided axial directions of the circumferential portion to obtain the secondary moments of the cross-sections in each of the directions, and 3) the steps of comparing the maximum and minimum values of the second-order moments of the cross-section obtained It is judged that the welding wire forms a ring-shaped skew defect when wiring. 2.- Sorting method of fresh wiring, which is a method for sorting different shape cross-section zinc lines and surface fresh lines of a welding line for two-dimensionally connecting between semiconductor wafers and lead frames, etc., by the following steps The following steps are made: 1) dividing the entire circumference of the welding line of the wiring raft into a plurality of circumferential portions at equal intervals, measuring the diameter of the circumferential portion of the pre-divided portion, and 2) using each of the circumferential portions of the wire diameter Integrating the divided axial directions to obtain the second-order moment of each section in the direction, and 3) obtaining the maximum value and the minimum value of the wire diameters of the circumferential portions from the measured values, and each of the circumferences The step of dividing the difference between the maximum value and the minimum value of the secondary moments of the partial axial wear, 4) obtaining the difference between the maximum value and the minimum value of the wire diameter and the 1337774 of the wearable secondary moment. Ί 99 years 1 month 6 months (the step of correcting the difference between the maximum and minimum values of the replacement page, and . 5) using the difference between the maximum and minimum values of the obtained wire diameter as the χ coordinate, The difference between the maximum and minimum values of the secondary moment of the section Step be drawing as γ and the coordinates of the comparison, the skew is determined defective weld line is formed at the annular junction. 3. The method for sorting weld lines according to claim 1 or 2, wherein the wearer 2 and the second moment ratio are divided by the difference between the maximum value and the minimum value of the second-order moment of the cross section as the maximum value or the minimum value. (4) Comparison of the minimum and minimum of the f's large red moment. The management method of the bearing part of the 4'-type diamond cutting machine is a management method of the diamond cutting machine for the welding line which performs the second space connection between the semiconductor wafer and the line of the busy line, and the following steps are performed. It is made up of: 1) The whole circumference of the welding line before the wiring is divided into a plurality of circumferences _ part, the step of measuring the diameter of the pre-section, and 2) The step of integrating the axis and the axial direction to obtain the second-order moment of the cross-section in each direction, and 3) the step of managing the sequence by comparing the maximum and minimum values of the second-order moment of the shouting surface It is appropriate to manage the bearing portion of the diamond cutter used for the last line of the welding line. -5·Management method for the bearing part of a diamond cutting machine, which is a pair of semiconductor wafers and leads -· - - 25 1337774 tube 6 of the 6th of January. Correction replacement page on the following day::: The three-dimensional space wiring between the sub-dimensions uses the diamond cutting machine method, which is made up of the following steps:) The wiring of the welding line is divided into the number of the dividing lines. The step of measuring the wire diameter of the pre-divided circumferential portion by the circumference, 2) integrating the pre-divided axial directions of the circumferential portion by the wire diameter value, and obtaining the step of the secondary moment of the wearing surface in each direction , Ref. 3) Find the maximum value of the wire diameter of the closed part (4) and the maximum and minimum values of the secondary moment of the wearing part of the circumferential part _ Step, ―一4) Find the Wei diameter The steps of the difference between the maximum value and the minimum value of the second-order and most-timed-regional moments, and 5) using the difference between the maximum value and the minimum value of the desired radius as the 乂 coordinate, the cut © The second-order torque maximum and minimum_difference _ is a sequence of management steps for drawing and comparing the gamma coordinates, and managing whether the bearing part of the diamond cutting machine used for the last-line processing of the welding line is appropriate . 6. The management method according to claim 4 or 5 is a cross-sectional secondary moment ratio s divided by the difference between the maximum value and the minimum value of the second-order moment of the cross section as a maximum or minimum value. Comparison between the maximum and minimum values of the secondary moment. 26
TW096109830A 2006-03-28 2007-03-22 Sorting method of bonding wire drawn by diamond dice and management method for diamond dice TWI337774B (en)

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