1337513 [0001] [0002] [0003] [0004] [0005] 096115846 099年11月09日核正替换頁 發明說明： 【發明所屬之技術領域】 本發明涉及電路板黏著技術，尤其涉及一種電路板承載 裝置及電路板固定方法。 【先前技術】 隨著電子產品往體積小变化、功能多樣化、線路精密化 方向發展，表面黏著技術（Surface Mounted Technology， SMT) 亦從單面黏著發展為雙面黏著 ，以實現電 子產品組裝要求。 電路板之單面黏著製程為將電路板一面固定放置於承載 托盤，以防止表面黏著過程中電路板發生移位，然後於 電路板另一面進行錫膏印刷 ' 器件置放、回流焊接等步 驟。其中，錫膏印刷係指將錫膏藉由預定圖形之範本印 刷至電路板表面之焊墊上，器件置放係指將電子元器件 之引腳放置於已印好錫膏之電路板焊墊上，回流焊接係 指將電路板送入回流爐重新熔化錫膏而使得電子元器件 引腳與電路板焊墊之間實現機械與電氣連接之過程。 電路板雙面黏著製程通常為先將電路板進行單面黏著， 單面黏著後將電路板翻面再進行該電路板未黏著面之黏 著流程，即，將電路板已黏著電子元器件之一面固定於 承載托盤，然後於電路板未黏著面進行錫膏印刷、器件 置放、回流焊接等流程。 由於已黏著面之各種電子元器件形狀、尺寸各異，而承 載托盤為平板狀，因此該已進行單面黏著之電路板放置 於承載托盤時容易產生移位、晃動，從而造成表面黏著 表單編號A0101 第3頁/共24頁 0993401541-0 1337513 099年11月09日按正替换頁 時錫膏印刷圖形、器件置放位置之誤差，進而引起電子 元器件與電路板之間連接不良。另外，該已進行單面黏 著之電路板僅依黏著於其表面之電子元器件與承載托盤 接觸固定，因而電子元器件易於因應力集中而損壞、脫 落。 [0006] 有鑑於此，有必要提供一種可穩定固定電路板之方法及 電路板承載裝置。 【發明内容】 [0007] 以下以實施例說明可穩定固定電路板之方法及電路板承 載裝置。 t ' ^ .»· · ' · ·, [0008] —種電路板承載裝置，其用私表載電.路板，'所述電路板 ... 具有一第一表面，所述第面、輕著有‘盖:少一電子元器 件。所述電路板承載裝置具有一承載表面，所述承載表 面與第一表面配合接觸，用於承載電路板，所述承載表 面設有至少一凹槽，該凹槽之形狀與電子元器件之形狀 相配合。所述凹槽具有一與承載表面相對之凹槽底面， 所述凹槽底面設置有黏合層，該黏合層用於將電子元器 件固定於凹槽中。 [0009] 一種電路板固定方法，包括步驟： [0010] 提供一種電路板承載裝置，其具有一用於承載電路板之 承載表面，所述承載表面設有至少一凹槽，所述凹槽具 有一與承載表面相對之凹槽底面，所述凹槽底面設置有 黏合層； [0011] 提供一種電路板，所述電路板具有相對之第一表面與第 096115846 表單編號A0101 第4頁/共24頁 0993401541-0 1337513 ._ 099年11月09日梭正替換百 二表面，所述第一表面黏著有至少一電子元器件，所述 第二表面為待黏著面； [0012] 將所述電路板放置於所述電路板承載裝置，使電路板之 第一表面與所述承載表面相接觸，並使所述電子元器件 收容於所述凹槽，所述電子元器件藉由黏合層固定於凹 槽底面。 [0013] 相較於先前技術，本技術方案中之電路板承載裝置及電 路板之固定方法具有如下優點：首先，電路板承載裝置 之凹槽與電路板第一表面之電子元器件相對應，使得所 述電子元器件可恰好容置於所述凹槽，從而，電路板可 穩定放置於所述電路板承載裝置。其次，電路板與電路 板承載裝置之間之接觸面大，第一表面與承載表面可充 分接觸，避免了電子元器件應力集中狀況之產生。再次 ，凹槽底面設置有黏合層，可進一步固定電子元器件及 電路板’防止設置有電子元Is件之電路板區域產生曲勉 。另外，所述黏合層具有一定彈性，可進一步緩解電子 元器件之受力狀況，獲得更優良之黏著效果。 【實施方式】 [0014] 以下結合附圖對本技術方案實施方式之電路板承載裝置 及電路板之固定方法作進一步詳細說明。 [0015] 請參閱圖1及圖2，本技術方案第一實施例提供之電路板 承載裝置100具有一用於承載電路板之承載表面101。所 述承載表面101設置有至少一凹槽110，所述凹槽110用 於容置電路板第一表面設置之電子元器件。因此，所述 凹槽110之結構與電子元器件之結構相配合，所謂相配合 096115846 表單編號 A0101 第 5 頁/共 24 頁 0993401541-0 1337513 099年11月〇9日修正替換頁 為才曰電子元器件可恰好容置於所述凹槽110中。凹槽no 由複數側面111與一底面112圍合而成。所述凹槽110底 面112設置有黏合層150，以黏結、固定容置於凹槽11〇 中之電子元器件。 [0016] 所述電路板承載裝置1〇〇可為銅板、鋁板、鐵板、合金板 、有機複合板或其他可耐高溫之底板。本實施例中，所 述電路板承載裝置100為表面平整之鋁板。 [0017] 所述凹槽110之數量、開設部位、形狀及尺寸均與電路板 表面之電子元器件相配合。本實施例中，所述凹槽110之 數量為一，其設置於承載表面之中央部位。所述凹槽 110為長方體形嵌槽，記所述如槽〖丨⑴之長-^為^ ，寬度 .1 為\，深度為H,。 [0018] 所述凹槽110可藉由鑄造形成，亦可藉由銑、線切割、雷 射切割等加工製程形成，亦可藉由其他精密加工製程形 成。 [0019] 所述黏合層150除設置於所述凹槽110底面112外，亦可 設置於所述凹槽110側面lu，以進一步黏結電路板表面 之電子元器件。本實施例中，所述黏合層15〇僅設置於凹 槽110底面112。該黏合層15〇為具有一定黏性之膠層， 其可為矽膠層，亦可為其他膠層。記所述黏合層15〇之高 度為。 黏合層150可藉由點膠機、塗膠機等塗布設備設置於凹槽 110底面112»通常來說，黏合層15〇設置於凹槽11〇底面 Π2後需進行預固化處理。預固化處理—方面使得黏合層 096115846 表單編號A0101 0993401541-0 [0020] 1337513 099年11月09日核正替换頁 150表面黏性適中，既可黏附電路板表面之電子元器件， 又易於取下所黏附之電路板且不會造成電子元器件之損 壞；另一方面使得黏合層150緊密黏結於凹槽110底面 112，當從凹槽110底面112取下電路板時，黏合層150不 會隨著電路板一起脫離凹槽110底面112。從而，黏合層 150可重復使用多次，降低了電路板表面黏著之成本。預 固化處理製程應根據黏合層150之性質進行選擇。通常來 說，矽膠層之預固化處理製程為熱固化，具體為600-700 攝氏度環境固化下2-10分鐘。 [0021] 請參閱圖3 ’本技術方案第一實施例提供之電路板2〇〇具 有相對之第一表面201與第二表面202 »所述第一表面 201為與電路板承載裝置1〇〇之未載表面1〇1配合之面， · % 該第一表面201中央部位設置有一電子元器件21〇。所述 第二表面202為待黏著面，待電路板2〇〇配合固定於電路 板承載裝置100後’將於第二表面1〇2進行後續表面黏著 流程，如錫膏印刷 '器件置放、回流焊接等。 [0022] 所述電子元器件210為長方體，其具有複數側面211及一 頂面212。記所述電子元器件21〇之長度為、，寬度為、 ’高度為h 1。 [0023] 由於所述凹槽11〇與所述電子元器件21()相對應，因此， 所述凹槽11〇之長度！^與電子元器件21〇之長度、相等， 凹槽110之寬度\與電子元器件21〇之寬度、相等，凹槽 110之深度Ηι等於電子元器件210之高度、與黏合層150 之南度A&之加和。 096115846 表單編號A0101 第7頁/共24頁 0993401541-0 1337513 099年11月09日核正 [0024」當然，所述凹檜1 1 0之尺寸與電子元器件2 1 〇、黏合層 150之尺寸間可具有一定補償值。通常來說 ，所述凹槽 110之長度、寬度可較電子元器件21()之長度、寬度略大 0〜0. 1毫米，所述凹槽丨10之深度可較電子元器件21〇之 西度與黏合層150南度之加和大〇〜Q.i毫来。 [0025] 如此，當將所述電路板200固定設置於電路板承載裝置 1 00時’所述電子元器件21 〇可恰好容置於所述凹槽丨i 〇 ，如圖4所示。 [0026] 具體地，固定所述電路板200時，使電路板2〇〇之第一表 面201與所述承載表面1〇1 _择觸，所述電子元器件21〇 之側面211與所述凹槽11〇之雄I]备π士，所述電 子元器件2丨〇之頂面2i2與黏，即，所述 電子元器件210藉由黏合層150黏結於凹槽11〇底面112。 [0027] 從而，所述電路板200可穩定固定於所述電路板承載裝置 100，不會產主電路板200之移位，亦不會使電子元器件 210上產生應力集中。 [0028] 請參閱圖5及圖6，本技術方案第二實施例提供之電路板 承載裝置300之承載表面301設置有依次排列之第一凹槽 310、第二凹槽320、第三凹槽330。 [0029] 所述第一凹槽310為長方體形嵌槽，其由四矩形第一側面 311及一矩形第一底面312圍合而成。記所述第一凹槽 310之長度為、，寬度為\，深度為H2。 [0030] 所述第二凹槽320亦為長方體形嵌槽，其由四矩形第二側 面321及一矩形第二底面322圍合而成。記所述第二凹槽 096115846 表單編號A0101 第8頁/共24頁 0993401541-0 1337513 [0031] [0032] [0033] [0034] [0035] 096115846 099年11月09日後正替換頁 320之長度為、，寬度為V深度為\。且，L3小於L， B3小於B2，H3小於Η。 3 2 所述第三凹槽330為圓柱體形嵌槽，具有一圓筒形第三側 面331及-圓形第三底面332 β記所述第三凹槽33〇之直 徑為D,，深度為Η 。 1 4 本實施例中’所述第-底面312、第二底面322、第三底 面332均設置有厚度為'之黏合層35〇。當然所述第一 底面312 '第二底面322、第三底面332所設置之黏合層 350之厚度亦可不同，僅需黏合層35〇具有預定附著力以 黏附、固定電子元器件即可。 所述電路板承載裝置300用吟承栽與其相對應之電路板 400，請參閱圖7，電路板4〇〇具有相對之第一表面4〇1與 第一表面402。所述第一表面4〇1依次設置有第一電子元 器件410、第二電子元器件420及第三電子元器件43〇。 所述第二表面402為待進行表面黏著之面。 所述第一電子元器件410為長方體，具有四矩形第四側面 411及一矩形第一頂面412。記該第一電子元器件41〇之 長度為，寬度為b。，高度為h 。 ώ ώ 2 所述第二電子元器件420亦為長方體，具有四矩形第五側 面421及一矩形第二頂面422。記該第二電子元器件420 之長度為13，寬度為b3，高度為h3，且13小於丨2，、小 於、，h3小於h2。 所述第三電子元器件430為圓枉體，具有一圓筒形第六側 面431及一圓形第三頂面432。記所述第三電子元器件 表單編號 A0101 第 9 頁/共 24 ! 0993401541-0 [0036] 1337513 1099年u月〇9日梭正替换ιΓ] 之直彳i為d ’深度為卜 1 4 剛•所述第-凹槽加、第二凹槽32Q、第三凹槽33〇依 次與第-電子元器件410、第二電子元器件42〇、第三電 子元器件430對應，亦即，所述第一凹槽“ο之尺寸與第 電子元器件41 0及黏結層3 5 0之尺寸相對應，l等於1 2 2 等於b2，H2等於}12與人1之加和；所述第二凹槽320之 尺寸與第二電子元器件42〇及黏結層350之尺寸相對應， L3等於13，B3等於b3，H3等於113與八丨之加和；所述第三 凹槽330之尺寸與第三電子元器件430及黏結層35〇之尺 寸相對應，等於心，Η#等於\與〜之加和。 [0038] 因此，當將所述電路板400固丨定i置於:電路板承載裝置 300時，所述第一電子元器科41;〇_、第丄^電字元器件42〇 、第三電子元器件430可恰好依次容置於所述第一凹槽 310、第二凹槽320、第三凹槽330，如圖8所示。 [0039] 具體之，固定所述電路板400時，使電路板400之第一表1337513 [0001] [0001] [0003] [0005] [0005] 096115846 November 09, 099 nuclear replacement page invention description: [Technical Field] The present invention relates to circuit board adhesion technology, and more particularly to a circuit board Carrier device and circuit board fixing method. [Prior Art] With the development of electronic products in small size, diversified functions, and circuit precision, Surface Mounted Technology (SMT) has also developed from single-sided adhesion to double-sided adhesion to meet electronic product assembly requirements. . The single-sided adhesion process of the circuit board is to fix one side of the circuit board on the carrying tray to prevent the circuit board from being displaced during the surface adhesion process, and then perform solder paste printing on the other side of the circuit board, such as device placement and reflow soldering. Wherein, the solder paste printing refers to printing the solder paste onto the soldering pad on the surface of the circuit board by using a predetermined pattern, and the device placing refers to placing the pins of the electronic component on the circuit board solder pad on which the solder paste has been printed. Reflow soldering refers to the process of feeding a circuit board into a reflow oven to re-melt solder paste to mechanically and electrically connect the electronic component leads to the board pads. The double-sided adhesion process of the circuit board usually firstly adheres the circuit board to one side, and after the single-sided adhesion, the circuit board is turned over and then the adhesive process of the non-adhesive surface of the circuit board is adhered, that is, the circuit board has adhered to one side of the electronic component. It is fixed on the carrier tray, and then the process of solder paste printing, device placement, reflow soldering, etc. on the non-adhesive surface of the circuit board. Since the shape and size of the various electronic components that have been adhered to each other are different, and the carrier tray is in the form of a flat plate, the board on which the single-sided adhesive is placed is likely to be displaced and shaken when placed on the carrying tray, thereby causing the surface adhesion form number. A0101 Page 3 of 24 0993401541-0 1337513 On November 9, 099, the error of solder paste pattern and device placement position was caused by the replacement of the page, which caused the connection between the electronic components and the board. Further, the circuit board which has been subjected to single-sided adhesion is only fixed in contact with the carrier by the electronic component adhered to the surface thereof, so that the electronic component is liable to be damaged or dropped due to stress concentration. In view of the above, it is necessary to provide a method and a circuit board carrying device that can stably fix a circuit board. SUMMARY OF THE INVENTION [0007] Hereinafter, a method of stably fixing a circuit board and a circuit board carrier device will be described by way of embodiments. t ' ^ .»····, [0008] a circuit board carrying device that carries a power meter with a private meter. The circuit board has a first surface, the first surface, Lightly has a 'cover: one less electronic component. The circuit board carrying device has a bearing surface, the bearing surface is in mating contact with the first surface for carrying the circuit board, and the carrying surface is provided with at least one groove, the shape of the groove and the shape of the electronic component Match. The groove has a bottom surface of the groove opposite to the bearing surface, and the bottom surface of the groove is provided with an adhesive layer for fixing the electronic component in the groove. [0009] A circuit board fixing method, comprising the steps of: [0010] providing a circuit board carrying device having a bearing surface for carrying a circuit board, the bearing surface being provided with at least one groove, the groove having a bottom surface of the recess opposite to the bearing surface, the bottom surface of the recess is provided with an adhesive layer; [0011] a circuit board is provided, the circuit board having a first surface opposite to the 096115846 Form No. A0101 Page 4 of 24 Page 0993401541-0 1337513 ._ November 09, 999, the shuttle is replacing the surface of the surface, the first surface is adhered to at least one electronic component, and the second surface is the surface to be adhered; [0012] The board is placed on the circuit board carrying device such that the first surface of the circuit board is in contact with the carrying surface, and the electronic component is received in the recess, and the electronic component is fixed by the adhesive layer The bottom of the groove. [0013] Compared with the prior art, the circuit board carrying device and the circuit board fixing method in the technical solution have the following advantages: first, the groove of the circuit board carrying device corresponds to the electronic component of the first surface of the circuit board, The electronic component can be placed in the recess so that the circuit board can be stably placed on the circuit board carrying device. Secondly, the contact surface between the circuit board and the circuit board carrying device is large, and the first surface and the carrying surface can be fully contacted, thereby avoiding the stress concentration of the electronic components. Again, an adhesive layer is provided on the bottom surface of the recess to further secure the electronic component and the circuit board to prevent the circuit board region in which the electronic component Is is provided from generating a meander. In addition, the adhesive layer has a certain elasticity, which can further alleviate the stress condition of the electronic component and obtain a better adhesion effect. [Embodiment] Hereinafter, a circuit board carrying device and a method for fixing a circuit board according to embodiments of the present technical solution will be further described in detail with reference to the accompanying drawings. Referring to FIG. 1 and FIG. 2, the circuit board carrying device 100 provided by the first embodiment of the present technical solution has a bearing surface 101 for carrying a circuit board. The carrying surface 101 is provided with at least one recess 110 for accommodating electronic components disposed on the first surface of the circuit board. Therefore, the structure of the groove 110 is matched with the structure of the electronic component, so-called phase matching 096115846 Form No. A0101 Page 5 / Total 24 Page 0993401541-0 1337513 November 999 Correction replacement page is the electronic The components can be placed just in the recess 110. The groove no is formed by enclosing the plurality of sides 111 and a bottom surface 112. The bottom surface 112 of the recess 110 is provided with an adhesive layer 150 for bonding and fixing the electronic components housed in the recess 11〇. [0016] The circuit board carrying device 1 can be a copper plate, an aluminum plate, an iron plate, an alloy plate, an organic composite plate or other high temperature resistant bottom plate. In this embodiment, the circuit board carrying device 100 is an aluminum plate with a flat surface. [0017] The number, opening position, shape and size of the grooves 110 are matched with the electronic components on the surface of the circuit board. In this embodiment, the number of the grooves 110 is one, which is disposed at a central portion of the bearing surface. The groove 110 is a rectangular parallelepiped groove, and the length of the groove 〖丨(1) is ^, the width .1 is \, and the depth is H. [0018] The groove 110 may be formed by casting, or may be formed by a machining process such as milling, wire cutting, laser cutting, or the like, or may be formed by other precision machining processes. [0019] The adhesive layer 150 may be disposed on the side surface 112 of the recess 110 to further bond the electronic components on the surface of the circuit board. In this embodiment, the adhesive layer 15 is disposed only on the bottom surface 112 of the recess 110. The adhesive layer 15 is a glue layer having a certain viscosity, which may be a silicone layer or other glue layers. The height of the adhesive layer 15 is as follows. The adhesive layer 150 can be disposed on the bottom surface 112 of the groove 110 by a coating device such as a dispenser or a glue applicator. Generally, the adhesive layer 15 is disposed on the bottom surface Π2 of the groove 11 to be pre-cured. Pre-curing treatment - aspects of the adhesive layer 096115846 Form No. A0101 0993401541-0 [0020] 1337513 November 09, 099 nuclear replacement page 150 surface viscosity is moderate, can adhere to the electronic components of the board surface, and easy to remove The adhered circuit board does not cause damage to the electronic components; on the other hand, the adhesive layer 150 is closely adhered to the bottom surface 112 of the recess 110, and when the circuit board is removed from the bottom surface 112 of the recess 110, the adhesive layer 150 does not follow The circuit boards are separated from the bottom surface 112 of the recess 110. Thus, the adhesive layer 150 can be reused multiple times, reducing the cost of board surface adhesion. The pre-curing process should be selected based on the nature of the adhesive layer 150. Generally speaking, the pre-curing process of the silicone layer is heat-curing, specifically 2-10 minutes under 600-700 ° C ambient curing. [0021] Please refer to FIG. 3 'The first embodiment of the present invention provides a circuit board 2 having an opposite first surface 201 and a second surface 202. The first surface 201 is associated with the circuit board carrying device. The surface of the unloaded surface 1〇1, · % The electronic component 21〇 is disposed at the center of the first surface 201. The second surface 202 is a surface to be adhered. After the circuit board 2 is affixed and fixed to the circuit board carrying device 100, a subsequent surface adhesion process, such as solder paste printing, is performed on the second surface 1 . Reflow soldering, etc. [0022] The electronic component 210 is a rectangular parallelepiped having a plurality of sides 211 and a top surface 212. It is noted that the length of the electronic component 21 is , and the width is 'h'. [0023] Since the groove 11〇 corresponds to the electronic component 21(), the length of the groove 11〇! ^The length of the electronic component 21 is equal to, the width of the recess 110 is equal to the width of the electronic component 21, and the depth of the recess 110 is equal to the height of the electronic component 210 and the south of the adhesive layer 150. Addition of A& 096115846 Form No. A0101 Page 7 / Total 24 Page 0993401541-0 1337513 November 09, 999 Nuclear [0024] Of course, the size of the concave 桧 1 10 and the size of the electronic component 2 1 〇, the adhesive layer 150 There may be a certain compensation value. Generally, the length and width of the recess 110 may be slightly larger than the length and width of the electronic component 21 () by 0 to 0.1 mm, and the depth of the recess 10 may be higher than that of the electronic component 21 West and the adhesive layer 150 South and the big 〇 ~Qi come. [0025] Thus, when the circuit board 200 is fixedly disposed on the circuit board carrying device 100, the electronic component 21 can be accommodated in the recess 丨i 〇 as shown in FIG. 4 . [0026] Specifically, when the circuit board 200 is fixed, the first surface 201 of the circuit board 2 is contacted with the bearing surface 1〇1, the side surface 211 of the electronic component 21〇 is The top surface 2i2 of the electronic component 2 is adhesive, that is, the electronic component 210 is bonded to the bottom surface 112 of the recess 11 by the adhesive layer 150. Therefore, the circuit board 200 can be stably fixed to the circuit board carrying device 100, and the displacement of the main circuit board 200 is not generated, and stress concentration on the electronic component 210 is not generated. Referring to FIG. 5 and FIG. 6 , the bearing surface 301 of the circuit board carrying device 300 provided by the second embodiment of the present invention is provided with a first groove 310 , a second groove 320 , and a third groove arranged in sequence. 330. [0029] The first groove 310 is a rectangular parallelepiped groove formed by a four-square first side 311 and a rectangular first bottom surface 312. The length of the first groove 310 is , and the width is \ and the depth is H2. [0030] The second groove 320 is also a rectangular parallelepiped groove, which is surrounded by a quadrangular second side surface 321 and a rectangular second bottom surface 322. Note the second groove 096115846 Form No. A0101 Page 8 / Total 24 Page 0993401541-0 1337513 [0031] [0033] [0035] 096115846 The length of page 320 is being replaced after November 09, 099 For , the width is V depth is \. Moreover, L3 is smaller than L, B3 is smaller than B2, and H3 is smaller than Η. 3 2 The third groove 330 is a cylindrical recessed groove, and has a cylindrical third side surface 331 and a circular third bottom surface 332. The third recess 33 has a diameter D and a depth of Η. . In the present embodiment, the first bottom surface 312, the second bottom surface 322, and the third bottom surface 332 are each provided with an adhesive layer 35〇 having a thickness of '. Of course, the thickness of the adhesive layer 350 disposed on the second bottom surface 322 and the third bottom surface 332 of the first bottom surface 312 ′′ may be different, and only the adhesive layer 35 〇 has a predetermined adhesion to adhere and fix the electronic components. The circuit board carrying device 300 carries a circuit board 400 corresponding thereto, and referring to FIG. 7, the circuit board 4 has an opposite first surface 〇1 and a first surface 402. The first surface 4〇1 is sequentially provided with a first electronic component 410, a second electronic component 420, and a third electronic component 43A. The second surface 402 is the surface to be surface-bonded. The first electronic component 410 is a rectangular parallelepiped having a fourth rectangular fourth side 411 and a rectangular first top surface 412. It is noted that the length of the first electronic component 41 is Δ and the width is b. , the height is h. The second electronic component 420 is also a rectangular parallelepiped having a fourth rectangular fifth side surface 421 and a rectangular second top surface 422. The second electronic component 420 has a length of 13, a width b3, a height h3, and 13 is smaller than 丨2, smaller than, and h3 is smaller than h2. The third electronic component 430 is a round body having a cylindrical sixth side surface 431 and a circular third top surface 432. Record the third electronic component form number A0101 page 9 / total 24 ! 0993401541-0 [0036] 1337513 1099 u month 〇 9th shuttle is replacing ιΓ] straight 彳 i for d 'depth for Bu 1 4 just The first groove, the second groove 32Q, and the third groove 33 are sequentially corresponding to the first electronic component 410, the second electronic component 42, and the third electronic component 430, that is, The size of the first groove "o corresponds to the size of the electronic component 41 0 and the bonding layer 350, l is equal to 1 2 2 equals b2, and H2 is equal to the sum of |12 and human 1; the second The size of the groove 320 corresponds to the size of the second electronic component 42A and the adhesive layer 350, L3 is equal to 13, B3 is equal to b3, and H3 is equal to the sum of 113 and gossip; the size of the third groove 330 is The size of the third electronic component 430 and the bonding layer 35〇 corresponds to the sum of the heart, Η# is equal to \ and 〜. [0038] Therefore, when the circuit board 400 is fixed, the circuit board 400 is placed on: the circuit board When the device 300 is carried, the first electronic component 41; the 〇_, the 电^ electrical component 42〇, and the third electronic component 430 may be sequentially accommodated in the first concave The groove 310, the second groove 320, and the third groove 330 are as shown in Fig. 8. [0039] Specifically, when the circuit board 400 is fixed, the first table of the circuit board 400 is made
N 面401與所述承載表面301相接觸，所述第一電子元器件 41 0之第四側面411與所述第一凹槽310之第一側面311配 合接觸，所述第一電子元器件410之第一頂面412與黏合 層350相接觸，即，所述第一電子元器件410藉由黏合層 350黏結於第一凹槽310底面312 ;所述第二電子元器件 420之第五側面421與所述第二凹槽320之第二側面321配 合接觸，所述第二電子元器件420之第二頂面422與黏合 層350相接觸，所述第二電子元器件420藉由黏合層350 黏結於第二凹槽320底面322 ;所述第三電子元器件430 之第六側面431與所述第三凹槽330之第三側面311配合 0993401541-0The N-side 401 is in contact with the bearing surface 301, and the fourth side surface 411 of the first electronic component 41 0 is in mating contact with the first side surface 311 of the first recess 310. The first electronic component 410 The first top surface 412 is in contact with the adhesive layer 350, that is, the first electronic component 410 is bonded to the bottom surface 312 of the first recess 310 by the adhesive layer 350; the fifth side of the second electronic component 420 The second surface 422 of the second electronic component 420 is in contact with the adhesive layer 350, and the second electronic component 420 is bonded by the adhesive layer. 350 is bonded to the bottom surface 322 of the second recess 320; the sixth side surface 431 of the third electronic component 430 and the third side surface 311 of the third recess 330 cooperate with 0993401541-0
表單編號A010I 096115846 第10黃/共24頁 1337513 099年11月〇9日按正 接觸，所述第三電子元器件430之第三頂面432與黏合層 350相接觸，所述第三電子元器件430藉由黏合層350黏 結於第三凹槽330底面332。從而’，所述電路板4〇〇可穩 定固定於所述電路板承載裝置300。 [0040] 由於電路板承載裝置300與電路板400之間之接觸面大， 因此表面黏著時受到之應力均勻分佈於電路板400各處， 避免了電子元益件上應力集中狀況之產生。另外，黏著 有電子元器件之電路板區域易於產生曲短，本技術方案 中，凹槽底面設置有黏合層350以黏附、固定電子元器件 及該區域之電路板，因此，電路板300可被平穩固定於所 述電路板承載裝置3〇〇。 [0041] 本技術方案中之電路板承載裝置及電路板之固定方法之 優點在於：首先’電路板承載裝置之凹槽與電路板第一 表面之電子元器件相對應，使得所述電子元器件可恰好 容置於所述凹槽，從而，電路板可穩定玫置於所述電路 板承載裝置。其次’電路板與電路板承載裝置之間之接 觸面大，第一表面與承載表面之充分接觸避免了電子元 器件應力集中狀況之產生。再次，凹槽底面設置有黏合 層’可進一步固定電子元器件及電路板，防止設置有電 子元器件之電路板區域產生曲組。另外，所述黏合層具 有—定彈性，可進一步緩解電子元器件之受力狀況，獲 得更優良之黏著效果。 [0042] 综上所述，本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 096Π5846 式’自不能以此限制本案之申請專利範圍《舉凡熟悉本 表單塢號Α010丨 第11頁/共24頁 0993401541-0 1337513 099年11月09日按正替換页 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0043] 圖1係本技術方案實施方式第一實施例提供之電路板承載 裝置之示意圖。 [0044] 圖2係本技術方案實施方式第一實施例提供之電路板承載 裝置沿圖1之11 ~· II方向之剖面示意圖。 [0045] 圖3係本技術方案實施方式第一實施例提供之電路板之示 意圖。 [0046] 圖4係本技術方案實施方式策-角施例提猶炙電路板固定 . . · '· 於電路板承載裝置之剖面示寒丨:圖 ... . η. .., ^ *·.Form No. A010I 096115846 10th Yellow/Total 24 Page 1337513 On November 9th, 999, in positive contact, the third top surface 432 of the third electronic component 430 is in contact with the adhesive layer 350, the third electronic element The device 430 is bonded to the bottom surface 332 of the third recess 330 by the adhesive layer 350. Thus, the circuit board 4 can be stably fixed to the circuit board carrying device 300. [0040] Since the contact surface between the circuit board carrying device 300 and the circuit board 400 is large, the stress applied to the surface is evenly distributed throughout the circuit board 400, thereby avoiding the stress concentration on the electronic component. In addition, the circuit board area to which the electronic component is adhered is apt to be shortened. In the technical solution, the bottom surface of the groove is provided with an adhesive layer 350 for adhering and fixing the electronic component and the circuit board of the area. Therefore, the circuit board 300 can be It is smoothly fixed to the circuit board carrying device 3〇〇. [0041] The circuit board carrying device and the method for fixing the circuit board in the technical solution have the advantages that: first, the recess of the circuit board carrying device corresponds to the electronic component of the first surface of the circuit board, so that the electronic component It can be placed just in the recess so that the circuit board can be stably placed on the circuit board carrying device. Secondly, the contact surface between the circuit board and the circuit board carrying device is large, and sufficient contact between the first surface and the bearing surface avoids the stress concentration of the electronic component. Again, the bottom surface of the recess is provided with an adhesive layer' to further secure the electronic components and the circuit board to prevent the formation of a curved group in the area of the circuit board on which the electronic component is disposed. In addition, the adhesive layer has a constant elasticity, which can further alleviate the stress condition of the electronic component and obtain a better adhesion effect. [0042] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only the preferred embodiment of the present invention, 096Π5846, which is not intended to limit the scope of the patent application of the present invention. "Familiar with this form, dock number Α 010 丨 page 11 / 24 pages 0993401541-0 1337513 099 Equivalent modifications or variations in accordance with the spirit of the present invention by those skilled in the art of replacing the page on November 09 shall be covered by the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0043] FIG. 1 is a schematic diagram of a circuit board carrying device according to a first embodiment of the present technical solution. 2 is a cross-sectional view of the circuit board carrying device according to the first embodiment of the present embodiment, taken along the direction of 11 to II in FIG. 3 is a schematic diagram of a circuit board provided by a first embodiment of the embodiment of the present technical solution. [0046] FIG. 4 is a schematic diagram of the embodiment of the present technical solution. The circuit board is fixed. . . . '· The section of the circuit board carrying device shows the cold: Fig.... η. .., ^ * ·.
[0047] 圖5係本技術方案實施方式第二實施例提供之電路板承載 裝置之示意圖。 [0048] 圖6係本技術方案實施方式第二實施例提供之電路板承載 裝置沿圖5之VI - VI方向之剖面示意圖。 [0049] 圖7係本技術方案實施方式第二實施例提供之電路板之示 意圖。 [0050] 圖8係本技術方案實施方式第二實施例提供之電路板固定 於電路板承載裝置之剖面示意圖。 【主要元件符號說明】 [0051] 100、300 :電路板承載裝置 [0052] 101、301 :承載表面 096115846 表單編號Α0101 第12頁/共24頁 0993401541-0 1337513 [0053] 1 1 0 :凹槽 [0054] 1 1 1 :側面 [0055] 1 12 :底面 [0056] 150、350 :黏合層 [0057] 200、400 :電路板 [0058] 201、401 :第一表面 [0059] 202、402 :第二表面 [0060] 21 0 :電子元器件 [0061] 211 :器件側面 [0062] 212 :器件頂面 [0063] 310 :第一凹槽 [0064] 311 :第一側面 [0065] 312 :第一底面 [0066] 320 :第二凹槽 [0067] 321 :第二側面 [0068] 322 :第二底面 [0069] 330 :第三凹槽 [0070] 331 :第三側面 [0071] 332 :第三底面 096115846 表單編號A0101 第13頁/共24頁 099年11月09日核1 正替換頁 0993401541-0 1337513 099年11月09日核:正替換頁 [0072] 41 0 ·•第一電子元器件 [0073] 4 1 1 :第四側面 [0074] 41 2 ·•第一頂面 [0075] 420 :第二電子元器件 [0076] 421 :第五側面 [0077] 422 :第二頂面 [0078] 430 :第三電子元器件 [0079] 431 :第六側面 [0080] 432 ··第三頂面 0993401541-0 096115846 表單編號A0101 第14頁/共24頁5 is a schematic diagram of a circuit board carrying device according to a second embodiment of the present technical solution. 6 is a cross-sectional view of the circuit board carrying device according to the second embodiment of the present embodiment, taken along line VI-VI of FIG. 5. 7 is a schematic diagram of a circuit board provided by a second embodiment of the embodiment of the present technical solution. 8 is a schematic cross-sectional view showing a circuit board according to a second embodiment of the present technical solution fixed to a circuit board carrying device. [Main component symbol description] [0051] 100, 300: circuit board carrying device [0052] 101, 301: bearing surface 096115846 Form number Α 0101 Page 12 / Total 24 page 0993401541-0 1337513 [0053] 1 1 0 : groove 1 1 1 : side [0055] 1 12 : bottom surface [0056] 150, 350: adhesive layer [0057] 200, 400: circuit board [0058] 201, 401: first surface [0059] 202, 402: Second surface [0060] 21 0 : electronic component [0061] 211 : device side [0062] 212 : device top surface [0063] 310 : first groove [0064] 311 : first side [0065] 312 : a bottom surface [0066] 320: a second groove [0067] 321 : a second side [0068] 322: a second bottom surface [0069] 330: a third groove [0070] 331: a third side [0071] 332: Three bottom surface 096115846 Form number A0101 Page 13 / Total 24 pages November 09, 099 Nuclear 1 Positive replacement page 0993401541-0 1337513 November 09, 1999 Core: Positive replacement page [0072] 41 0 ·• First electronic element Device [0073] 4 1 1 : Fourth Side [0074] 41 2 ·• First Top Surface [0075] 420: Second Electronic Component [0076] 421: Fifth Side [0077] 422: Second Top Surface [ 0078] 430: Three Electronic Component [0079] 431: sixth side [0080] The third top surface 432 ·· 0993401541-0 Form Number A0101 096 115 846 Page 14/24 Total