1335056 玟、發明說明： 【發明所屬之技術領域】 . 本發明係有關使形成於基板上的凸塊高度—致㈣塊 平坦化裝置、其平坦化方法以及凸塊接合裝置。 【先前技術】 以往已知的方法，係在半導體元件上的複數電極形成 稱為凸塊的突起電極，藉此連接組裝何體元件上的電極 與配線基板上的電極。凸塊係指熔融狀態的金屬附著於半 導體元件上的電極的部分。並且，藉由以凸塊與配線基板 上的電極連接的方式來安裝此半導體元件於配線基板上， 以使該等形成電氣連接。 為了進行此種連接，較佳係使凸塊頭部的高度一致。 其原因在於，在凸塊的高度不一致情形下，一部分電極會 發生連接不良。又，較佳係其上面（壓潰面）大致為圓形， 且凸塊本身不會傾倒。在凸塊的壓潰面為橢圓形的情形， 作為接觸面的壓潰面會自配線基板的電極擠出等，構成短 路或連接不良的原因。又’如果於凸塊發生傾倒，即會出 現與配線基板接觸的面、即壓潰面的位置偏移的問題。因 此，以往，在凸塊形成後，以使其高度一致方式來邈行平 坦化。 例如’於專利文獻1揭示，以具有緊壓面的加壓構件 對形成有複數凸塊的半導體元件加壓，以一定的凸塊高度 使其一致的凸塊平坦化裝置。藉此，可使半導體元件上的 1335056 複數凸塊的高度一致。然而，專#文獻1的裝置僅能以由 晶圓單片化的半導體元件單位來進行平坦化。亦即，於晶 圓狀態下形成凸塊後’將其單片化，逐一取出各半導體元 件，將其平坦化。因此，全體的步驟複雜，半導體裝置的 生產時間變長。 於此考慮到擴大專利文獻1的加壓構件的緊壓面，以 將晶圓全體平坦化的技術。然而，形成於晶圓全體的凸塊 非常多，為了對其全部緊壓，需要非常大的緊壓力。具有 此緊壓力的凸塊平坦化裝置大型且昂貴，缺乏實用性。 就解決此問題的技術而言，於專利文獻2揭示，藉由 移動輥於形成有凸塊的晶圓上緊壓凸塊的方法。藉由如此 一面以輥局部加壓一面移動，可用較小的力量來緊壓凸塊 (專利文獻1) 曰本專利特開2000 - 40766號公報 (專利文獻2 ) 日本專利特公平7 — 93305號公報 山…而，專利文獻2所記載的方法，會有凸塊的形狀容 :崩毀的問題。亦即’若一面以輥局部加壓，—面移動， :對凸塊頭部不僅施加垂直向下的緊壓力，還施加輥沿移 方向的力量。因此，雖然凸塊頭部平坦化，@同時沿移 向拉伸’壓潰面容易變成橢圓形。又，亦容易發生凸 移於此情形下，會如上述發生短路或位置偏 1335056 【發明内容】 因此，本發明目的在於提供，可使形成有多數凸塊的 諸如晶圓的基板形狀良好地將其平坦化的裝置及方法。 本發明之凸塊平坦化裝置之特徵在於具備··载台，用 以載置上面配設有複數個凸塊的基板；旋轉輥，以其下端 部緊壓於基板上的凸塊頭部；旋轉驅動機構，用以使旋轉 輥旋轉；以及水平移動機構’相對於旋轉輥來水平移動載 台；且旋轉輥的下端部係與載台大致呈相對靜止。 因此，可一面僅對基板上的凸塊頭部施加垂直向下的 緊壓力，-面移動輥。藉此，可使形成於如晶圓之大面積 基板的凸塊頭部的高度一致。 於此，雖然基板較佳為晶圓，不過，亦可例如為形成 有多數凸塊的半導體元件。成為平坦化對象的凸塊的材質 雖然較佳為金凸塊，不過，亦可為其他材質的凸塊。又， 水平移動機構，可係使載台與旋轉輥相對移動的機構，或 使載台、旋轉輥中任一個移動的機構。又，所謂旋轉輥的 下端部與載台大致呈相對靜止，係指旋轉輥與載台的移動 速度及方向一致。 【實施方式】 以下就本發明之實施形態加以說明。 第1圖係表不本發明之實細*形態之凸塊平扭化裝置1〇 之方境圖。此裝置大致分成裝置本體12及其控制部14。 裝置本體12係具備：供載置晶圓40的載台16、旋轉 1335056 輥18及其周邊機構◎於載台16上，設置由水平移動機構 26、上下移動機構22、旋轉機構24構成的移動單元。 載台16可藉自此移動單元2〇傳輸的驅動力水平、上下及 旋轉移動。又，載纟16的位置、角度及移動速度分別藉 檢測器28、30檢測而輸出至後述之控制部14。控制部η 係根據所輸出之資訊算出、輸出用以驅動控制移動單元 的信號。 於旋轉輥18附設用來旋轉驅動旋轉輥18的輥驅動機 構32,其根據來自驅動控制裝置犯的信號驅動。又，旋 轉輥18的旋轉速度藉速度檢測器34檢測後，輸出至主控 制部36。 控制部14大致分成：驅動控制裝置38，係用以輸出 移動單元20及輥驅動機構32的驅動控制信號；以及主控 制部36，係根據來自速度檢測器3〇、34等的資訊算出护 =值。主控制部36係記錄以位置/角度檢測器或速度檢= 裔30、34檢出的速度等，且根據這些資訊算出驅動控制 用之控制值。將所算出之值輸出至驅動控制裝置⑽後， 驅動控制裝置根據此值，將驅動控制信號輸出至移動單元 20及輥驅動機構32。 又，此凸塊平坦化裝置1〇可為單體，且裝入或併設 於凸塊接合裝置。 接著，使用第2圖就凸塊平坦化裝置1〇的裝置本體 12詳加說明。第2圖係、裝置本體的立體圖。且，第2圖中 省略附η又於各移動機構以產生驅動力的馬達的圖示。 1335056 旋轉輥18係設於載台16上方，直徑5_的旋轉報 18配置成可以X方向的軸為中心旋轉。於旋轉輥u附 設馬達，藉驅動控制裝置38控制馬達的旋轉方向及速度 。藉此，控制旋轉輥18的旋轉方向及速度。 載口 16係用來載置、保持晶圓4Q之載台，形成有晶 圓40對準位置用缺口部…。於載置晶圓4〇情形下，對 齊此缺口部 16a盥晶ID Λ , ，、日日圓40的定向平面部。又，為了防止 所載置晶圓40的偏移，載台16具有真空吸附機構，藉其 吸附力保持晶圓40。 進步於載台16設置未圖示的旋轉機構24，其可在 水平面内360度旋轉載台16β此旋轉機構的驅動亦藉驅動 控制裝置38控制。又藉角度檢測器28檢測旋轉角度後， 輸出至主控制部3 6。 上下移動機構22係具備：固設於載台16的滑動構件 42、設於其下側的傾斜構件44、以及使滑動構件U沿γ 方向滑動的驅動機構(未圖示）。傾斜構件“的上面形成 具有既定角度的傾斜面’於第2圖中，越靠近前側，其上 面位置越高。滑動構件42的底面形成與傾斜構件44的傾 斜角度相同的傾斜面，可藉驅動機構朝γ方向，沿 件44的上面滑動。並且’藉由使滑動構件42㈣斜構件 44上面滑動，可沿上下方向移動固設於滑動構件“上面 =二此滑動構件42的移動距離及方向藉驅動控制 裝置38控制’可以！“單位調整載台16的高度。 於傾斜構件44下側設置水平移動機構^又其為藉未 1335056 圖示之馬達沿 Y He i 万向移動傾斜構件44的狡私二-丄 動傾斜構件44，可机v ' 44的移動台。稭由移 的方向移動位於1 f彳向、亦即沿朝著旋轉輥18直行 勒位於其上側的載台1 6。 又’本實施形態雖係使載台^ 若其係與旋轉耝動的構w不過， 可。例如，可A ^目、移動’來移動旋轉輥18的構造亦 旋棘趙1« °固疋載台16 ’具備沿水平、上下方向移動 ㈣輥18的移動機構的構造。又，旋轉 移動機構為上述任一個以冰、 十上下的 旋轉、及上下的移動機槿 進而，雖然適於具有 機構。 冑機構，不過’亦可省略其中任一移動 其次’就成為平坦化對象的金凸塊46及晶圓加以 說明。於晶圓40上面配設多數個金凸塊46。如第3⑴圖 所示，平坦化前的金凸速 凸塊46係呈其頭部尖細突出的形狀 。然而’其高度為概略數值’金凸塊4"高度全體不一 致。若在此狀態下組裝於配線基板，會於 46中發生連接不良。目此， ^金凸塊 ^ 划乐八圆所不，於凸塊平 坦化中將金凸塊46的頭部的尖細突出部分壓潰，使之平 坦化’並且’使其高度一致。此時’金凸塊46的高度h 約為35"m。亦即，壓潰，約25"m。此時，較佳係金凸塊 46的上面、即壓潰面46a大致為圓形’金凸塊本身不會傾 倒。 又，例如於8忖晶圓40中，金凸塊46以每職28個（8 凸塊/mm2)的比例形成情形下，於晶圓4〇全體中，其凸塊 數約250000個。緊壓一個此種金凸塊需要1N(牛頓）的力 1335056 量，同時成面狀緊壓其全部約需25 51;(噸）的力量。具有 此種緊壓力的凸塊平坦化裝置缺乏實用性。因此，如後述 ，藉由一面以可施加緊壓力的輥局部緊壓，一面移動，來 進行凸塊平坦化。 其次，說明使用此凸塊平坦化裝置10使配設於晶圓 4 0上面的金凸塊4 6平坦化的流程。 於使金凸塊46平坦化的情形，首先，載置晶圓4〇於 載台16。於此情形下，使滑動構件42滑動，將載台16移 動至最低位置。又，驅動水平移動機構26 ,將載台丨6移 動至偏離旋轉輥18的位置。接著，於此狀態下，載置晶 圓40於載台16。此時，以使設於載台16的缺口部16&與 晶圓40的定向平口部對齊的方式載置。载置的晶圓4〇藉 設於載台16的真空吸附機構保持，並且，防止其位置偏 離。 其次，藉旋轉機構旋轉載台16，以調整晶圓4〇的角 度。其使旋轉輥18與金凸塊46的配設方向交叉的方式來 調整角度。使用第4圖就此加以說明。第4圖係自上面俯 視載置於載台16的晶圓40及旋轉輥18的圖。由此可知 ，在旋轉輥18與金凸塊46的配設方向不平行情形下旋轉 報18所緊壓金凸& 46的數目（圖中藉由塗黑表示）較旋轉 輥18與金凸塊46的配設方向平行情形少。如上述，緊壓 1個金ύ塊46需要、約1N，在所緊壓金凸塊的數目很多情 形下，需要更大的緊壓力。亦即，若旋轉挺18與金凸塊 46的配設方向平行，即需要大的緊壓力。因此，以旋轉機 1335056 構旋轉載台16，使旋轉輥18變4與金凸塊46的配設方向 交叉的方向。藉此，可用較少的力量緊壓》 其次，旋轉旋轉輥18，藉水平移動機構26往復水平 移動載台16。又，於往復中折返之際，藉由使滑動 42滑動微小距離’將載台16上昇約1/ζπι。亦即，一面逐 漸：小旋轉輥18與載台16間的距離，一面往復水平移動 載台16。藉此’可逐漸緊壓金凸塊46的頭部。 茲使用第5圖就此更詳細說明。於每次縮小_距 離情形下’旋轉輥18緊壓金凸塊46的頭部若旋轉 輥18的半徑為R，載台16的上昇距離為p，此時的緊壓 寬度d即可以式（1)表示。 C數1 ) d = ^J(2xpxR^JT)......... (1) 於此，本實施形態中，旋轉耗18的半徑為25mra，d 約為220 ”。亦即’於某—瞬間，金凸塊46為旋轉輥“ 所壓緊壓面為220 “ £，此時，若與上述同條件，受壓 金塊46的數目最大即的失 P約為350個。此情形下需要的緊 壓力約為350N。藉由不進杆而铬两二 个运仃面緊壓而以旋轉輥18進行線 緊壓，可用小緊壓力進行凸抽亚& 仃凸塊+坦化。由於藉由載台16 的移動來移動此寬度小的緊懕而 .,, J家坠面，故如晶圓40之大面積 全體的凸塊平坦化亦可短時間進行。 藉由如此旋轉旋轉輕* 並且稭水平移動機構26水 平移動載台1 6，可用很少力晷、隹—丄 里進订大面積的凸塊平坦化。 又，本實施形態雖然每攻μ β 令人上幵移動lym，不過，亦可 12 1335056 為此以外的數值。此上昇距離為p亦可配合緊壓力或晶圓 40的面積、金凸塊46的數目或凸塊平坦化速度適當變更 〇 其次’就緊壓之際旋轉輥18的旋轉及載台16的移動 速度及方向加以說明。緊壓之際旋轉輥18的旋轉及載台 16的移動，係以旋轉輥18下端部與金凸塊46的頭部大: 呈相對靜止的速度及方向來進行。 旋轉輥18以一定速度旋轉，金凸塊46亦藉由載台16 的水平移動以一定速度水平移動。於此，由於旋轉輥18 遠大於金凸塊46’故其下端部18a的移動可視為相對於金 凸塊46大致水平移動。因此，若使載台16的移動速度與 旋轉輥18的旋轉速度大致相同，並且使其移動方向相同 ，旋轉輥18的下端部18a與金凸塊46的頭部即大致呈相 對靜止。 若下端部18a與金凸塊46的頭部如此大致呈相對靜 止’則可對金凸塊46僅施加垂直方向的緊壓力。因此， 旋轉輥18不會擦過金凸塊46的頭部，金凸塊仏的壓潰 面不會朋毁。亦即，在對金凸塊46施加移動方向的力量 情形下’如第6(A)圖所示，金凸塊46沿移動方向拉伸， :第6(B)圖所示，其壓潰面呈大致橢圓形。又，視情況而 疋，亦有如第7(A)圖所示，金凸塊46本身傾倒的情形發 生。不過，藉由對金凸塊46僅施加垂直方向的緊壓力， 可防止此種問題。 又，藉由一面逐漸縮小旋轉輥18與載台16間的距離 1335056 ，一面反覆進行水平移動，可逐·漸壓潰金凸塊4 6的頭部 ，減輕金凸塊4 6的崩毀。亦即’雖然藉由如上述旋轉輥 18與載台16相對靜止，可僅施加垂直方向的緊壓力，不 過，實際上會發生微小速度差。此際，若壓潰量p多，速 度差的影響即增大。因此，發生上述問題，壓潰面變成搞 圓形’或金凸塊容易傾倒《又，在壓潰量p多情形下，亦 即在緊壓力大情形下’施加遠大於金凸塊的反作用力的緊 壓力。於此情形下’緊壓力不會遍及於金凸塊全體，僅施 加大的緊壓力於其上面。結果，只有上面（壓潰面）形成大 的不穩定形狀（第7(B)圖）^若如本實施形態一面逐漸縮小 旋轉輥18與載台16間的距離，一面反覆進行水平移動， 即可避免這方面種種問題。 如以上說明，一面逐漸縮小旋轉輥丨8與載台丨6間的 距離’-面反覆進行水平移動。並且，藉由反覆進行約1〇 人的往復，第3(A)圖所示形狀的金凸塊a即如第 3(B)圖所示’形狀良好地平坦化。 又、，在往復中折返之際，不僅進行载台16的垂直移 亦進仃角度的變更。亦即，在折返之際，變更旋轉親 ”金凸塊46的配設方向間的角度。其可藉由在折返之 :以旋轉機構旋轉載台16來變更。藉由如此變更與旋轉 述二的配設方向間的角度，可更有效防止壓潰面形狀變 成橢圓形》 如上述， 以成立，如第 旋轉報18與載纟16大致相對靜止的狀態難 6(A)圖所不，有金凸塊祁的頭部沿載台16 14 1335056 的移動方向拉伸的情形發生。此?見象在壓潰量多情形下， 亦即在垂直移動距離大情形下特別顯著。此時，金凸塊46 的壓潰面常會如第6(Β)圖所示，變成橢圓形。為了防止此 問題’在往復移動中折返之際旋轉載台16’於各水平移動 時’變更旋轉輥18與金凸塊46的配設方向間的角度，可 自不同方向緊壓金凸塊46,可防止緊壓成橢圓形。 如以上說明，根據本實施形態，可容易將在如晶圓4〇 之大面積上配設多數個的金凸塊46形狀良好地平坦化。 如此’依本發明，可對如晶圓之形成有多數個金凸塊 的基板進行形狀良好地平坦化。 【圖式簡單說明】 (一）圖式部分 第1圖係本發明實施形態的凸塊平坦化裝置的方塊圖 第2圖係凸塊平坦化裝置的裝置本體的立體圖。 第3(A)、（Β)圖係成為平坦化對象的金凸塊的側視圖 第4圖係自上面俯視晶圓及旋轉輥的圖。 第5圖係凸塊平坦化的側視圖。 第6(A)圖係凸塊平坦化的側視圖。 第6(B)圖係金凸塊的俯視圖。 第7(A)圖係發生傾倒的金凸塊的側視圖。 第7(B)圖係只有上面壓潰的金凸塊側視圖。 15 1335056 (二）元件代表符號 10 12 16 18 18a 20 22 24 26 28 30 32 36 38 40 42 44 46 凸塊平坦化裝置 裝置本體 載台 旋轉輥 下端部 移動單元 上下移動機構 旋轉機構 水平移動機構 位置/角度檢測器 速度檢測器 輥驅動機構 主控制部 驅動控制部 晶圓 滑動構件 傾斜構件 金凸塊 161335056 发明 发明 发明 发明 . . . . . . . . . . . . . . . . . . . . . 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 [Prior Art] A conventionally known method is to form a bump electrode called a bump on a plurality of electrodes on a semiconductor element, thereby connecting an electrode on a body element and an electrode on a wiring board. A bump refers to a portion of a metal in a molten state attached to an electrode on a semiconductor element. Further, the semiconductor element is mounted on the wiring substrate by bumps and electrodes on the wiring substrate to electrically connect the semiconductor elements. In order to make such a connection, it is preferred to make the heights of the bump heads uniform. The reason for this is that in the case where the heights of the bumps are not uniform, a part of the electrodes may be poorly connected. Further, it is preferable that the upper surface (crushed surface) is substantially circular, and the bump itself does not fall. In the case where the crushing surface of the bump is elliptical, the crushing surface as the contact surface is extruded from the electrode of the wiring board, and causes a short circuit or a connection failure. Further, if the bump is tilted, there is a problem that the surface in contact with the wiring board, that is, the position of the crush surface is shifted. Therefore, in the past, after the bumps were formed, the bumps were flattened in such a manner that their heights were uniform. For example, Patent Document 1 discloses a bump flattening device that presses a semiconductor element on which a plurality of bumps are formed by a pressing member having a pressing surface, and that is uniform with a constant bump height. Thereby, the height of the 1335056 plurality of bumps on the semiconductor element can be made uniform. However, the device of Document 1 can only be planarized in units of semiconductor elements singulated by wafers. That is, after the bumps are formed in the wafer state, they are singulated, and the semiconductor elements are taken out one by one and planarized. Therefore, the overall steps are complicated, and the production time of the semiconductor device becomes long. In this regard, a technique of flattening the entire surface of the wafer by expanding the pressing surface of the pressing member of Patent Document 1 is considered. However, there are many bumps formed on the entire wafer, and in order to press them all, a very large pressing force is required. The bump flattening device having this tight pressure is large and expensive, and lacks practicality. In the technique for solving this problem, Patent Document 2 discloses a method of pressing a bump on a wafer on which a bump is formed by moving a roller. By moving on one side with a partial pressure of the roller, the projection can be pressed with a small force (Patent Document 1) Patent Publication No. 2000-40766 (Patent Document 2) Japanese Patent Special Publication No. 7-93305 In the method described in Patent Document 2, there is a problem that the shape of the bump is collapsed. That is, if the surface is partially pressurized by the roller, the surface is moved, and not only the vertical downward pressing pressure is applied to the bump head but also the force of the roller in the direction of the movement is applied. Therefore, although the bump head is flattened, @also tends to become elliptical along the moving direction of the crushing surface. Moreover, it is also prone to a convex shift. In this case, a short circuit or a positional deviation 1335056 may occur as described above. Accordingly, it is an object of the present invention to provide a substrate such as a wafer in which a plurality of bumps are formed in a good shape. The device and method for flattening. The bump flattening device of the present invention is characterized in that: a loading stage for mounting a substrate on which a plurality of bumps are arranged; and a rotating roller, wherein a lower end portion thereof is pressed against a bump head on the substrate; a rotation driving mechanism for rotating the rotating roller; and a horizontal moving mechanism 'moving the stage horizontally with respect to the rotating roller; and the lower end portion of the rotating roller is substantially stationary with the stage. Therefore, it is possible to apply a vertical downward pressing pressure only to the bump head on the substrate, and to move the roller in a face-to-face manner. Thereby, the heights of the bump heads formed on the large-area substrate such as the wafer can be made uniform. Here, although the substrate is preferably a wafer, it may be, for example, a semiconductor element in which a plurality of bumps are formed. The material of the bump to be flattened is preferably a gold bump, but may be a bump of another material. Further, the horizontal moving mechanism may be a mechanism for moving the stage relative to the rotating roller or a mechanism for moving either the stage or the rotating roller. Further, the lower end portion of the rotating roller is substantially stationary with the stage, and means that the moving speed and direction of the rotating roller coincide with the stage. [Embodiment] Hereinafter, embodiments of the present invention will be described. Fig. 1 is a view showing a state of a bump flattening device 1 of the actual thin form of the present invention. This device is roughly divided into a device body 12 and its control portion 14. The apparatus main body 12 includes a stage 16 on which the wafer 40 is placed, a rotating 1335056 roller 18, and a peripheral mechanism ◎. The stage 16 is provided with a movement including a horizontal movement mechanism 26, a vertical movement mechanism 22, and a rotation mechanism 24. unit. The stage 16 can be moved by the driving force level, up and down, and rotation transmitted from the moving unit 2〇. Further, the position, angle, and moving speed of the magazine 16 are detected by the detectors 28 and 30, and output to the control unit 14 which will be described later. The control unit η calculates and outputs a signal for driving and controlling the mobile unit based on the outputted information. A roller drive mechanism 32 for rotationally driving the rotary roller 18 is attached to the rotary roller 18, which is driven in accordance with a signal from the drive control device. Further, the rotational speed of the rotary roller 18 is detected by the speed detector 34, and then output to the main control unit 36. The control unit 14 is roughly divided into a drive control device 38 for outputting drive control signals of the moving unit 20 and the roller drive mechanism 32, and a main control unit 36 for calculating protection based on information from the speed detectors 3, 34, and the like. value. The main control unit 36 records the speed detected by the position/angle detector or the speed detection system 30, 34, and the like, and calculates the control value for the drive control based on the information. After the calculated value is output to the drive control device (10), the drive control device outputs a drive control signal to the moving unit 20 and the roller drive mechanism 32 based on this value. Further, the bump flattening device 1 may be a single body and may be incorporated or provided in the bump bonding device. Next, the device body 12 of the bump flattening device 1A will be described in detail using Fig. 2 . Fig. 2 is a perspective view of the apparatus body. Further, in Fig. 2, a diagram of a motor including η and each moving mechanism to generate a driving force is omitted. 1335056 The rotating roller 18 is disposed above the stage 16, and the rotation of the diameter 5_ is arranged so as to be rotatable about the axis in the X direction. A motor is attached to the rotating roller u, and the rotation direction and speed of the motor are controlled by the drive control unit 38. Thereby, the rotation direction and speed of the rotating roller 18 are controlled. The carrier 16 is for mounting and holding a stage of the wafer 4Q, and a notch portion for aligning the wafer 40 is formed. In the case where the wafer 4 is placed, the notch portion 16a is twisted with the ID Λ , and the plane of the plane of the sun circle 40 is aligned. Further, in order to prevent the offset of the wafer 40 to be placed, the stage 16 has a vacuum suction mechanism, and the wafer 40 is held by the adsorption force. The stage 16 is provided with a rotating mechanism 24 (not shown) which can rotate the stage 16β 360 degrees in the horizontal plane. The driving of the rotating mechanism is also controlled by the drive control unit 38. Further, the angle detector 28 detects the rotation angle and outputs it to the main control unit 36. The vertical movement mechanism 22 includes a sliding member 42 fixed to the stage 16, a tilting member 44 provided on the lower side thereof, and a driving mechanism (not shown) for sliding the sliding member U in the γ direction. The upper surface of the inclined member "forms an inclined surface having a predetermined angle" in Fig. 2, the position on the upper side is higher as it is closer to the front side. The bottom surface of the sliding member 42 forms an inclined surface having the same inclination angle as that of the inclined member 44, and can be driven by The mechanism slides along the upper surface of the member 44 in the gamma direction, and 'by sliding the upper member of the sliding member 42 (four) oblique member 44, it can be moved in the up and down direction and fixed to the sliding member "above = two moving distances and directions of the sliding member 42 Drive control unit 38 controls 'may! "The unit adjusts the height of the stage 16. A horizontal moving mechanism is provided on the lower side of the tilting member 44, and it is a self-propelled two-tilt tilting member 44 that moves the tilting member 44 along the Y He i by the motor shown in Fig. 1335056. The mobile station of the machine v '44. The straw moves in the direction of the movement in the direction of the movement, that is, the stage 16 which is located on the upper side of the rotating roller 18, and the present embodiment is台 ^ If the structure and the rotation of the structure w, however, for example, A ^ mesh, move 'to move the rotating roller 18 structure is also a spine 1 « ° solid platform 16 ' with horizontal, up and down The direction moves (four) the structure of the moving mechanism of the roller 18. Further, the rotation moving mechanism is any one of the above-described ones, which is arbitrarily rotated by ice, up and down, and up and down, and is adapted to have a mechanism. Any of the next steps will be described as a gold bump 46 and a wafer to be planarized. A plurality of gold bumps 46 are disposed on the wafer 40. As shown in the third figure (1), the gold bump speed before planarization The bump 46 has a shape in which the head is pointed and pointed. However, ' The height is a rough value of 'gold bumps 4' and the height is not uniform. If it is assembled on the wiring board in this state, a connection failure will occur in 46. Therefore, the gold bumps are not round, but the convex In the block flattening, the sharp projections of the head of the gold bump 46 are crushed to be flattened 'and' to be uniform in height. At this time, the height h of the gold bump 46 is about 35 " m. , crush, about 25 " m. At this time, it is preferable that the upper surface of the gold bump 46, that is, the crush surface 46a is substantially circular, the gold bump itself does not fall. Also, for example, in the 8-inch wafer 40 In the case where the gold bumps 46 are formed at a ratio of 28 jobs per job (8 bumps/mm2), the number of bumps in the entire wafer 4 is about 250,000. It takes 1N to press one such gold bump. Newton's force is 1335056, and it is about 25 51; (ton) of force to press it all in. The bump flattening device with such tight pressure lacks practicality. Therefore, as will be described later, The roller that can apply the pressing pressure is partially pressed and moved to perform the flattening of the bump. Next, the use of the bump is described. The chemical device 10 planarizes the gold bumps 46 disposed on the wafer 40. When the gold bumps 46 are flattened, first, the wafer 4 is placed on the stage 16. Next, the sliding member 42 is slid to move the stage 16 to the lowest position. Further, the horizontal moving mechanism 26 is driven to move the stage 6 to a position deviated from the rotating roller 18. Then, in this state, the wafer is placed. 40 is placed on the stage 16. At this time, the notch portion 16 & provided on the stage 16 is placed in alignment with the oriented flat portion of the wafer 40. The deposited wafer 4 is vacuumed on the stage 16 The absorbing mechanism maintains and prevents its positional deviation. Next, the stage 16 is rotated by a rotating mechanism to adjust the angle of the wafer 4 turns. This adjusts the angle so that the rotating roller 18 intersects with the arrangement direction of the gold bumps 46. This will be explained using Figure 4. Fig. 4 is a view in which the wafer 40 and the rotating roller 18 placed on the stage 16 are viewed from above. Therefore, it can be seen that the number of the pressed gold bumps & 46 (indicated by black) in the rotation of the rotating roller 18 and the gold bumps 46 is not parallel to the rotating roller 18 and the gold convex. The arrangement direction of the block 46 is parallel. As described above, pressing one gold block 46 requires about 1 N, and in the case of a large number of pressed gold bumps, a larger pressing force is required. That is, if the rotation spring 18 is parallel to the arrangement direction of the gold bumps 46, a large pressing force is required. Therefore, the stage 16 is rotated by the rotating machine 1335056, and the rotating roller 18 is changed to a direction in which the direction in which the gold bumps 46 are arranged intersects. Thereby, the force can be pressed with less force. Next, the rotating roller 18 is rotated, and the stage 16 is moved horizontally by the horizontal moving mechanism 26. Further, when turning back and forth during reciprocation, the stage 16 is raised by about 1/ζπ by sliding the slide 42 by a small distance. That is, the stage 16 is gradually moved horizontally by the distance between the small rotating roller 18 and the stage 16. Thereby, the head of the gold bump 46 can be gradually pressed. This is explained in more detail in Figure 5. In each case of reducing the distance _ distance, the rotating roller 18 presses the head of the gold bump 46. If the radius of the rotating roller 18 is R, the rising distance of the stage 16 is p, and the pressing width d at this time is 1) indicates. C number 1) d = ^J (2xpxR^JT) (1) Here, in the present embodiment, the radius of the rotation loss 18 is 25 mra, and d is about 220 ”. In a moment, the gold bump 46 is a rotating roller, and the pressing surface is 220 "£. At this time, if the same condition as above, the maximum number of the pressed gold nuggets 46 is about 350. The required pressing pressure is about 350 N. By pressing the two sides of the chrome without pressing the rod and pressing the line with the rotating roller 18, the squeezing can be performed with a small pressing force. Since the width of the stage 16 is small by the movement of the stage 16, the J family falls, so that the bumps of the entire area of the wafer 40 can be flattened for a short period of time. The rotation is light* and the straw horizontal moving mechanism 26 horizontally moves the stage 16. It is possible to flatten a large area of the bump with a small force, and the 隹-丄 。 。 。 。 。 令人 令人 。 。 令人 。 令人 令人 令人 令人 令人 令人 令人 令人 令人 令人 令人 令人 令人 令人 令人 令人 令人Move lym, however, it can also be a value other than 12 1335056. This rise distance p can also match the tight pressure or the area of the wafer 40, the number of gold bumps 46, or the flatness of the bumps. The speed is appropriately changed. Next, the rotation of the rotating roller 18 and the moving speed and direction of the stage 16 will be described. When the pressing is performed, the rotation of the rotating roller 18 and the movement of the stage 16 are performed at the lower end of the rotating roller 18. The portion is larger than the head of the gold bump 46: at a relatively stationary speed and direction. The rotating roller 18 rotates at a constant speed, and the gold bump 46 is horizontally moved at a constant speed by the horizontal movement of the stage 16. Since the rotating roller 18 is much larger than the gold bump 46', the movement of the lower end portion 18a can be regarded as substantially horizontally moving with respect to the gold bump 46. Therefore, if the moving speed of the stage 16 is substantially the same as the rotating speed of the rotating roller 18. And moving in the same direction, the lower end portion 18a of the rotating roller 18 and the head of the gold bump 46 are substantially relatively stationary. If the lower end portion 18a and the head of the gold bump 46 are so substantially relatively stationary, then The gold bumps 46 only apply a pressing force in the vertical direction. Therefore, the rotating roller 18 does not rub over the head of the gold bumps 46, and the crushed faces of the gold bumps are not destroyed. That is, in the gold bumps 46. Applying the force of the moving direction, such as As shown in Fig. 6(A), the gold bumps 46 are stretched in the moving direction. As shown in Fig. 6(B), the crushed surface is substantially elliptical. Also, as the case may be, it is also like the seventh (A). As shown in the figure, the gold bump 46 itself is dumped. However, by applying only the vertical pressing force to the gold bump 46, such a problem can be prevented. Further, the rotating roller 18 is gradually reduced by one side. The distance between the tables 16 is 1335056, and the horizontal movement is repeated, and the head of the gold bumps 46 can be gradually pressed to reduce the collapse of the gold bumps 46. That is, although by the rotating roller 18 as described above The stage 16 is relatively stationary, and only a vertical pressing force can be applied, but a slight speed difference actually occurs. At this time, if the amount of crushing p is large, the influence of the speed difference is increased. Therefore, the above problem occurs, the crushed surface becomes rounded or the gold bump is easy to fall. "In addition, in the case of a large amount of crushing p, that is, in the case of a large pressing force, the reaction force is applied much larger than the gold bump. Tight pressure. In this case, the pressing force does not spread over the entire gold bump, and only an increased pressing force is applied thereto. As a result, only the upper surface (crushed surface) forms a large unstable shape (Fig. 7(B)). If the distance between the rotating roller 18 and the stage 16 is gradually reduced as in the present embodiment, the horizontal movement is repeated, that is, This can be avoided. As described above, the distance '- surface between the rotating roller 丨 8 and the stage 逐渐 6 is gradually reduced to horizontally. Further, by repeating about one turn of the person, the gold bumps a having the shape shown in Fig. 3(A) are flattened as shown in Fig. 3(B). Further, when folding back and forth in the reciprocation, not only the vertical movement of the stage 16 but also the change of the angle of the entrance is performed. That is, at the time of folding back, the angle between the arrangement directions of the rotating "gold bumps 46" is changed. This can be changed by rotating the stage 16 by the rotating mechanism in the folding back. With the angle between the directions, it is more effective to prevent the shape of the crushed surface from becoming elliptical. As described above, it is true that the state of the first rotation 13 and the load 纟 16 are relatively static. 6 (A) The case where the head of the gold bump 拉伸 is stretched in the moving direction of the stage 16 14 1335056. This is particularly noticeable in the case of a large amount of crushing, that is, in the case where the vertical moving distance is large. The crushing surface of the bump 46 is often elliptical as shown in Fig. 6 (Β). To prevent this problem, 'the rotating roller 18' is changed when the rotating stage 16' is moved horizontally during reciprocating movement. The angle between the arrangement directions of the gold bumps 46 can be pressed against the gold bumps 46 from different directions, and can be prevented from being pressed into an elliptical shape. As described above, according to the embodiment, it can be easily placed on the wafer 4 A large number of gold bumps 46 are arranged in a large area to be well planarized. According to the present invention, a substrate having a plurality of gold bumps formed on a wafer can be planarly shaped well. [A Brief Description of the Drawings] (1) The first portion of the drawing is a convexity of an embodiment of the present invention. Block diagram of the block flattening device Fig. 2 is a perspective view of the device body of the bump flattening device. Fig. 3(A) and Fig. 3 are side views of the gold bump which is the object of flattening. Fig. 5 is a side view showing the flattening of the bumps. Fig. 6(A) is a side view showing the flattening of the bumps. Fig. 6(B) is a plan view of the gold bumps. 7(A) is a side view of a gold bump that has been dumped. Figure 7(B) is a side view of only the gold bump that is crushed above. 15 1335056 (2) Component symbol 10 12 16 18 18a 20 22 24 26 28 30 32 36 38 40 42 44 46 Bump flattening device device body stage rotating roller lower end moving unit up and down moving mechanism rotating mechanism horizontal moving mechanism position/angle detector speed detector roller drive mechanism main control unit drive control unit Wafer sliding member inclined member gold bump 16