TWI334648B - Circuit substrate with embedded photo sensor and method of fabricating the same - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package structure of a photosensitive element, and more particularly to a circuit substrate having a buried photosensitive element and a method of fabricating the same. [Prior Art] In terms of electronic packaging technology, as semiconductor packaging technology has matured, more and more photosensitive wafers (or wafers) are sent to the wafer packaging factory for assembly operations, including crystals. Round cutting 'sticking, curing, wire bonding, sealing, balling and upper board, and finally finished product testing or functional testing to confirm the manufacturing yield of the product. Since the packaged photo-sensing wafer can be integrated with other control circuits, analog/digital converters, and digital signal processing circuits, the cost is significantly higher in today's demanding image processing market. It is much lighter, lighter, thinner, shorter, smaller, and does not occupy space. It meets the requirements of portable electronic devices that are convenient to carry. In general, photosensitive elements (or image sensing elements) fall into two broad categories: one is a charge coupled device (CCD) and the other is a metal oxide semiconductor (CMOS) device. Whether it is a CCD image sensing element or a CMOS image sensing element, both have a photodiode array in its illumination area, and the photodiode array can receive external image signals (or The light signal is converted to an electrical signal and transmitted to a circuit substrate for subsequent image processing. Please refer to Figure 1, Ganzi _ schematic. It is known that the photosensitive member 120 of the photosensitive type W package structure mainly includes the circuit substrates 110 and 140. The reduced transparent encapsulant 130 and a glass substrate CMOS image sensor are, for example, (10) landscape sensing elements or combined with the circuit substrate U. 2: 4: disposed on the circuit substrate U. On the surface, the upper portion of the member 120 is electrically connected. The glass substrate 140 is disposed on the photosensitive element to be contaminated by the impurity, and the photosensitive region 122 of the photosensitive layer 7^12G is contaminated. The transparent package 4 is filled in the sense element 12G and the glass substrate 140.壬 。. In general, 'protecting the photosensitive element 120 from the moon-permeable encapsulant 130 is epoxy-filled through the glass substrate 140 and the transparent capping array (not shown) The area 122' is transmitted from the optical circuit board 11 to the noisy and replaced by the social signal, and is processed by the photodiode image processing chip (not shown). The luminous flux represented by the mother-alkaline is The saturation of the color is caused by the loss of light when the light passes through the glass substrate 140. This will cause the photosensitive element 12 to be sensitive to light: in addition, the s is low by the strip, thereby affecting the correct optical element of the captured image. The transparent encapsulant (10) and the glass substrate 140 are disposed, so that m ^ 匕 'will make the whole package structure have a thicker V1 degree. [Abstract] 1334648 The object of the present invention is to provide a record of ===, Method 2 ==;: . The substrate is ordered, and the photosensitive area is reduced by the surface of the circuit substrate, and the photosensitive chip package structure of the conventional method is used to solve the problem of light loss due to the odor. Another object of the invention is to provide The circuit substrate is packaged in such a way that the core _: is changed to provide a better light transmittance, and the (four) base is measurable with a thin thickness. The photosensitive element is two or two: square (10) ease fihn ). Thereafter, the photoreceptor is disposed on the release film. The photosensitive member has a photosensitive area and a plurality of photosensitive contacts are facing the release film. Then the light region and these: and the dielectric layer, wherein the core: with the = layer "light 7L pieces. Then, after the transfer substrate and the core layer are combined to be confusing, the release film and the transfer substrate are removed. And the junctions of which are sensitized; == electro-sensing, into-laminated layers. Then, in the photosensitive region of the photosensitive element ^ ^ - protective layer. Money, on the lower side of the superimposed layer, is divided into two = J circuit layer: and one of the electrical connection with the second patterned line reed, J, a younger patterned circuit layer and the above-mentioned pads are electrically connected . θ, in an embodiment of the present invention, after the forming the second layer and the second patterned layer, the method further comprises removing the layer pattern, and in one embodiment of the invention, the pressure is The manner of transferring the substrate, the core layer and the dielectric layer includes a hot pressing process. In the embodiment of the present invention, the release film and the transfer substrate are removed, or the ultraviolet process or the ultraviolet light riding process is used to separate the release film and the transfer substrate from the laminate layer. And a fine towel, a towel-shaped wire n circuit layer p nS), a + additive method or a full additive method. The medium-rise implementation of the shooting method is also included in the superimposed layer. : a via hole through which the first patterned circuit layer is electrically connected to each other through the conductive vias. The brother-figure 彳 彳 彳 彳 彳 彳 彳 彳 驻 驻 驻 驻 驻 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在Thereafter, the transfer substrate, the core layer, the patterned wiring layer, and the dielectric layer are laminated. The electrical layer, in the embodiment of the present invention, after forming the first patterned line and the second patterned circuit layer, further comprises: forming a first layer on the first pattern and a second patterning layer a solder mask layer and a solder layer, wherein the first cap layer exposes at least a portion of the first germanium circuit layer, and the second solder mask layer exposes at least a portion of the first pattern pass: At least a portion of the exposed first, anti-oxidation layer on the road layer, and a second anti-oxidation layer 8 is formed on the second solder mask layer = at least part of the path / the slab-patterned wiring layer. In an embodiment of the present invention, the method for shaping the anti-oxygen layer includes: a first-patterned circuit layer and a second solder mask in the first-welding layer:: and the working layer: 2珞 to the second patterned circuit layer on the power-on-nickel/gold layer 1 ', at least part 2 of the road up to ^ or other purposes 'this hair (four) proposed - the first sense of the circuit board, The layer includes a core layer, a member, a -first patterned circuit layer, and a second layer has an opening. The dielectric layer is located at 711 pieces of core afterglow light with a sensed filament domain and a plurality of pads. The sense element is located in the opening of the core layer, and the photosensitive layer between the core layers of the dielectric household "These connections are caused by the storm in the core. The first-patterned circuit layer is disposed on the core layer of the above-mentioned core layer and dielectric layer of the @ν电通孔贝牙, in which the first pass line passes through the conductive vias and The second ugly circuit layer is the invention. In the embodiment, the wire plate having the (four) type photosensitive member further comprises a transparent protective layer disposed on the photosensitive region. The wire earth plate with the shimmering element further comprises a plurality of patterned circuit layers and a plurality of dielectric layers. The pattern=circuit layer is located between the dielectric layer and the second patterned circuit layer, and each W electrical layer is located in two phases. Between adjacent patterned circuit layers. In an embodiment of the invention, the line having the buried photosensitive element

The circuit board with the embedded photosensitive element is embedded in the circuit substrate, and the photosensitive area is exposed in the circuit substrate, so that the photosensitive area of the photosensitive S component can directly receive light. The entire package structure has a better light transmittance, and the entire circuit substrate has a thin thickness. Moreover, since the pads of the photosensitive element are directly electrically connected to the patterned circuit layer on the circuit substrate, it is not necessary to benefit

The wire is electrically connected to the circuit substrate, so that the process can be simplified to facilitate mass production of the product. The above and other objects, features and advantages of the present invention will become more <RTIgt; [Embodiment]

2A to 2D are cross-sectional views showing a flow of a method of fabricating a wiring substrate having a buried photosensitive member according to an embodiment of the present invention. First, please refer to FIG. 2A to provide a transfer substrate 21A, and a release film 220 disposed on the surface 210a of the transfer substrate 210, and a photosensitive element 230 disposed on the release film 220, the photosensitive element 230 having a photosensitive The region 232 and the plurality of pads 234' and the photosensitive regions 232 and pads 234 thereof face the release film 220. In one embodiment of the present invention, the transfer substrate 21 may be made of glass, metal, glass epoxy (FR-4, FR-5) or bis-maleic acid-Bismaleimide- Triazine, BT). In addition, the function of the release film 220 is mainly to allow the photosensitive member to be temporarily fixed on the transfer substrate 210. Therefore, a thermal release film (thermal release 11 1334648 film), an ultraviolet light release film (UV reiease fairy sentence or the like) can be used. A similar material is used to facilitate the stripping of the post-process. Then, referring to FIG. 2B, a core layer 242 and a dielectric layer 244 are sequentially disposed on the release film 22, and the core layer 242 has an opening η, μ. Gu Zhizhi shouted the 23Gm _ w-suit plastic substrate or the substrate with the circuit. In addition, the material of the dielectric layer 2 material can be epoxy resin containing glass particles (Ajinomoto Build_up Film,

, bis-succinic acid diamine-diamine _ triazabenzene 1 oxy resin (printed or polyimide (polyimide), etc. Next 'please phase π, Li Lai pressure or its financial compression = more Substrate 210, core layer 242, and dielectric layer 24

=== The core layer 242 and the photosensitive region 232 and the pads of the photoreceptor S component 23g say that the core layer 242 of the member 230 and the dielectric layer tear form a plump layer 240. Right κ system heating

When the film 220 is formed, if a heat release film is used as the release film as the release film 220, then the transfer substrate 210 and the external probe are sprayed, and then the test is performed. 22G is separated from the laminate layer 240. It is composed of the photosensitive region material of the photosensitive layer (10) which is formed by the protective layer. It may also be non-transparent or transparent to avoid damage during the continuous process. At least while the protective layer 250 is formed, the at least consistent hole TH may be formed in the laminated layer 240 as the circuit of the upper surface of the subsequent laminated layer 24 and the circuit of the lower surface. The conduit for the electrical connection between the two. Then, referring to FIG. 2F, a first patterned circuit layer 262 and a second patterned circuit layer 264 electrically connected thereto are formed on the upper and lower sides of the laminated layer 240, wherein the first patterned circuit layer 262 The second 230 is connected to the 234 electrical connection. In this step, the first patterned circuit layer 262 and the second patterning can be completed by patterning, semi-additive, full-addition, antimony ore, physical vapor deposition or chemical=2. Having the embedded photoreceptor 264 first; 'the patterned circuit layer 262 and the second patterned circuit layer form a conductive layer in a ,, such that the shape of the material ^, the first patterned circuit layer such as the second: its电 Electrically connected to each other through the conductive vias 266: a method of forming a first patterned circuit layer 262 and a patterned circuit layer 264 on the first and lower via layers 4 ^ ^ Formation in the hole TM - layer chemistry / On the layer of the layer and on the surface of the surface of the surface of the surface of the surface of the layer; the second layer is formed by the second layer of the metal layer; a conductive via 266 is formed in the surface of the surface electron microscope TM, and then the circuit layer and the through hole are etched together to remove the photoresist layer, and then the first patterned circuit layer 262 is formed. In addition, afterwards, it can be re-opened directly on the protective layer 25—the formation of the patterned circuit layer 264 The new protective layer, or 1,334,648 original first protective layer 250 is removed, then, a new protective layer is further formed on the photosensitive layer region 232, to achieve the purpose of protecting the photosensitive region 232. After the manufacturing process of the circuit substrate 2 having the embedded photosensitive element is completed, the solder mask layer and the anti-oxidation layer may be formed on the surfaces of the two sides of the circuit substrate 2 to protect the circuit substrate 2 by the following methods. The patterned lines in the raft are protected from damage and moisture. Please refer to FIG. 2G for the first patterned circuit layer 262 and the first

A first solder mask layer 272 and a second solder mask layer 274 are formed on the second patterned circuit layer 264, respectively. The first solder mask layer 272 exposes the photosensitive region 232 of the photosensitive element 23 and at least a portion of the first patterned wiring layer. In FIG. 2G, the 1-welding layer 272 exposes only the photosensitive region 232 of the photosensitive element 23). And the second solder mask layer 274 exposes at least a portion of the second patterned wiring layer 264. Thereafter, referring to FIG. 2H, an anti-oxidation layer (not shown) is formed on the first: patterned circuit layer exposed by the first solder mask layer 272, and the second layer is exposed by the second solder mask layer 274. Another oxidation resistant layer 280 is formed on the patterned wiring layer 264. In an embodiment of the invention, the anti-oxidation layer &lt;RTI ID=0.0&gt;&gt;&gt;&lt;/RTI&gt;&gt; can be electroplated-recorded/gold layer&apos; on the second pattern, 264 exposed by the second buffer layer 274 to form an oxidation resistant layer 28A. After the anti-oxidation layer is formed, the protective layer 250 can be removed, so that the photosensitive region 232 of the sensing 230 can directly receive light, and if the second layer 250 is a transparent material, it can be retained without moving. except. So far, the entire circuit board having the (four) type of sensing system is completed 1334648. In the above manufacturing process, the circuit board having the double-layer circuit layer is taken as an example for illustration. However, the user can also according to different usage requirements. In the step shown in FIG. 2B, a plurality of patterned wiring layers and a plurality of dielectric layers are disposed on the dielectric layer 244, wherein each dielectric layer is between two adjacent patterned wiring layers. Thereafter, the transfer substrate 21, the core layer 242, the dielectric layer 244, all of the patterned wiring layers, and the dielectric layer are further laminated to form a wiring substrate having a desired wiring layer. The present invention does not impose any limitation on the number of layers of the patterned wiring layer and the dielectric layer stacked on the transfer substrate 210. In summary, the manufacturing method of the circuit substrate having the embedded photosensitive element of the present invention firstly comprises disposing the photosensitive element, the core layer and the dielectric layer on a transfer substrate having a release film, wherein the photosensitive layer is formed. The component is placed in the opening of the core layer. Thereafter, the transfer substrate, the core layer, and the dielectric laminate are laminated together. Next, the release film and the transfer substrate are removed to form a laminated layer in which the photosensitive member is embedded. Finally, a desired patterned circuit layer is formed on the lower surface of the laminated layer, and one of the patterned circuit layers is electrically connected to the photosensitive element, thus completing the fabrication of the wiring substrate having the embedded photosensitive element. Since the photosensitive element is embedded in the circuit substrate and the photosensitive area is exposed by the circuit substrate, the entire circuit substrate has a thin thickness. In addition, since the photosensitive area of the photosensitive element can directly receive light, the entire package structure It has better light transmittance and can improve its performance. Furthermore, since the pads of the photosensitive element are directly electrically connected to the patterned circuit layer on the circuit substrate, the wire bonding method is not connected to the circuit substrate, so that the process can be simplified to facilitate the product. Although the present invention has been disclosed above in the preferred embodiment, it is produced. The invention is defined in the art, and is generally known in the art (for the invention (4) and the model _, when a slight change can be made and the process of the invention is not limited to the scope of the invention. Simple description of the schema]

= '·, 曰 is not known as a schematic diagram of a photosensitive wafer package structure. 2 to 2H are schematic cross-sectional views showing a method of fabricating a circuit substrate for a photosensitive Tt device according to one embodiment of the present invention. [Description of main components] 100 chip package structure 110 circuit substrate 120 photosensitive member 130 package colloid

140: glass substrate 2: circuit substrate 21 with embedded photosensitive element: transfer substrate 220: release film 230. photosensitive element 232 · photosensitive region 234 = pad 240 · rich layer 242: core layer 16 1334648 244: dielectric layer 250: protective layer 262: first patterned wiring layer 264: second patterned wiring layer 266: conductive via 272: first solder mask layer 274: second solder mask layer 280: anti-oxidation layer :Opening hole : Through hole

17

Claims (1)

X. Patent application scope: The manufacturing method of the circuit substrate of the component, the method of having the embedded photosensitive method includes the following steps: the shape is fine, the thinning is _, the upper configuration is - a photosensitive element, wherein the photosensitive element has a facing number Touching, and the sensing domain and the junctions are among the branches: two: the film is sequentially arranged - the core layer and the - dielectric layer, and the second layer has - an opening to accommodate the photosensitive element; The transfer substrate, the core layer and the dielectric layer; the core = the release film and the transfer substrate, forming a superposition of the photosensitive d-domain and the core layer and the dielectric layer :; welcoming the formation of the protective layer on the U-shaped area; and the layer and the seam electrical day, the car, the lower side respectively form a - the first patterned circuit m an ^ connected to the second patterned circuit layer Wherein the first patterned circuit layer is electrically connected to the plurality of contacts. &quot; The line of the inner circumference of the first aspect of the invention has a built-in photosensitive element and the present invention: the method of forming a first patterning line; after the formation of the circuit layer, the removal of the protection Floor. The circuit layer A# j has the embedded photosensitive element and the i-electric method described in Item 1, wherein the method of pressing the transfer substrate, the core layer and the H layer includes a hot pressing process. ^34648 4. As described in the scope of the patent application, a detachment 丄:: base =: = 卜 照 照 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作 制作The buried sensing element and the second patterned circuit layer patterned circuit layer are curcumized, semi-additive or fully additive. Patterned electroplating (the scale of the circuit has a built-in photosensitive element, an electrical via, such that the first layer of the pattern is electrically connected to each other through the conductive vias. And after the dielectric layer, further comprising a == core layered circuit layer and a plurality of dielectric layers, the pattern of which is adjacent to the pattern, the pq, the 'electric layer is located in the two-phase layer, and then pressed Transferring the substrate, the core electrical layer, the hybrid circuit layer, and the dielectric sounds. 8. The method for fabricating the two-way substrate as described in claim i is formed in the first case. &quot;Second patterned circuit layer further comprises: , ', 曰 and the first-patterned circuit layer and the =-------------------------------------------- And the second solder mask layer is exposed to the portion 1334648 to the second patterned circuit layer; and the path: the first: the oxygen mask layer is exposed to - the layer of the second solder mask layer The method includes an electron microscope-recording at least part of the second patterned circuit layer The circuit substrate of the buried photosensitive element comprises: a core layer having an opening; a dielectric layer located on one side of the core layer; the optical element 'having a photosensitive area and a plurality of contacts ???疋 is located in the opening of the core layer, and === between the component and the core layer, wherein the sensing pad is exposed by the core layer; the hard-working electric line is closed, and is disposed in the pure heart And on the layer, and the plurality of patterned circuit layers are disposed on the dielectric layer; and the second plurality of electrical vias are traversed as a layer contact, and the: the circuit layer passes through the conductive vias and the The second pattern = &amp; as described in claim 10 of the patent application, the base material having the cover material is provided with the base material ^^: $1°