94724 19588twf.d〇c/e 九、發明說明： 【發明所屬之技術領域】 =發明是有關於—種接合方法―一 偏)、顯示 2( _y aPPa咖s)以及顯示器和·)，且特別 種用於K麵示裝置的接合方法、製作成本較 低的顯示|置以及製作成本較低的顯示器。 【先前技術】94724 19588twf.d〇c/e IX. Description of the invention: [Technical field to which the invention belongs] = invention is related to a kind of bonding method - a partial display), display 2 ( _y aPPa coffee s), display and ·), and special A bonding method for a K-face display device, a display device with a low production cost, and a display with a low manufacturing cost. [Prior Art]
為了配合現代之生活模式，視訊或影像裝置之體積曰 漸趨於㈣。雖然傳統之陰極射線管㈣h*叩tube, CRT)In order to cope with the modern lifestyle, the volume of video or video devices has gradually become (4). Although the traditional cathode ray tube (four) h*叩tube, CRT)
“不為仍有其優點’但是由於其内部電子腔的結構，使得 陰極射線管顯示器之體積顯得I大而且佔㈣，並且在陰 極射線管顯示器輪出影像的同時會產生輻射線，造成眼睛 fe告等問題。因此，配合光電技術與半導體製造技術所發 展之平面型顯示器（flat panel diSplay，FpD)，例如液晶顯 示裝置(liquid crystal display apparatus)，已逐漸成為顯示器 產品之主流。 在液晶顯示裝置的製造過程中，驅動晶片與液晶顯示 面板之間的接合方式大致分為晶粒-電路板接合(chip on board ’ COB)、晶粒-玻璃接合(chip on glass，COG)或捲帶 自動接合(tape automatic bonding，TAB)(即晶粒-薄膜接合 (chip on film，C〇F))等的方式。 圖1A至圖IF繪示習知一種驅動晶片與液晶顯示面板 之接合方法的流程圖，其繪示之接合方法係利用捲帶自動 接合方式進行。請先參照圖1A，接合方法是先將一異方向 5 94724 19588twf.doc/e 性導電膠22貼附於液晶_ _ 後，如圖1B所示，在星面板1〇的間極接墊12上。然 性電路板32。盆中向性導電勝22上配置多個可挽 極驅動晶片瓜。在配性電路板32上連接有一閘 豚人制γ 配置夕個可撓性電路板32之後，進行 接。 撓^路板32與閘減墊12電性連 =著1參照圖1C，將—異方向性導電膠24貼附於 = Ϊ 1〇的源極接塾14上。之後，如圖1D所示， 在異方向性導電膠24 V to sa々 卜 / 24上配置多個可撓性電路板34。其中， 母〆二二笔路板34上連接有一源極驅動晶片34a，並且 進行堊σ衣私，以使可撓性電路板34與源極接墊14電 性連接。 月二’、、、圖1Ε，在一閘極印刷電路板42上貼附一異方 向)·生導電.26 ’並進行—壓合製程，以使可撓性電路板％ 與閘極印刷電路板42電性連接。 。月'圖1F，然後，在一源極印刷電路板44上貼附 異方向)生導電膠28，並進行一壓合製程，使可挽性電路 板34與源極印刷電路板44電性連接。 在凡成上述步驟之後，一液晶顯示裝置5〇便可被完 成1此液^顯示裝置5〇若與一背光模組(未繪示）組裝即可 成為、2日曰顯示态。然而，由於可撓性電路板32、34為捲 帶承載态封裝(taPe carrier package，TCP)結構，其價格較 高。因此^以此種接合方法製作的液晶顯示裝置％的製造 成本权向，不利於市場競爭。 1333398 94724 19588twf.doc/e 為解決上述的問題，習知技術中還有另一種接合方 法。圖2A至圖2H繪示習知另一種驅動晶片與液晶顯示面 板之接合方法的流程圖，其繪示之接合方法係利用晶粒- 玻璃接合方式以及捲帶自動接合方式進行。請參照圖2A， 此接合方法是先將一異方向性導電膠22貼附於液晶顯示 面板10的閘極接塾12上。然後，如圖2B所示，在異方 向性導電膠22上配置多個閘極驅動晶片32a，並且進行一 φ 壓合製程，以使閘極驅動晶片32a與閘極接墊12電性連接。 接著’請參照圖2C，將一異方向性導電膠24貼附於 液晶顯示面板1〇·的源極接墊14上。之後，如圖2D所示， • 在異方向性導電膠24上配置多個可撓性電路板34。其中， . 母一可撓性電路板34上連接有一源極驅動晶片34a，並且 進行一壓合製程，以使可撓性電路板34與源極接墊14電 性連接。 滑芩照圖2E，在閘極接墊 电膠22’。之後，如圖2F所示，在異方向性導電膠η =置多個可繞性電路板36 ’其中可撓性電路板％尚未 接任何的晶片。進行-壓合製程 與間極接墊12電性連接。 灸叮U兒路板 。月參A?、圖2G，在一閘極印刷| 向性導電膠26,並進行一壓合製 與閑極印刷電路板42電輯接。 ° %路板 月ΐ Α?、圖2Η，然後，在一源極印 —異方向性> f7刷电路板44上貼 導_ 28亚進饤—壓合製程，使可繞性電 7 94724 19588twf.doc/e 板34與源極印刷電路板44電性連接。 如此，液晶顯示裝置5f), 置50,的閘極側是利用晶接二成。而液晶顯示裝 與間極驅動晶片32a電性遠拉门方式私間極接墊]2 顯示裘置％，液轉示於上述之液晶 然而，為進-步減作成本降低許多。 一牛尨田雔、真曰』 作成本，目前的習知技術更進 源^皆二接合方式進行。也就是在祕侧與 出二5= 因此在此不再贅述，僅以圖3緣示 4置5〇 ’’更有進一步將開極印刷電路板42 量印刷電路板44整合成單—電路板以減少電路板數 性電::戶ΐΪί所有壓合製程中’由於驅動晶片與可撓 次進行屣：二:5，因此驅動晶片與可撓性電路板必須分 成接合製程。更詳細而言，壓合機台的 板。舉例而：Ά動晶片後第二次再行壓合可撓性電路 程序方能完:所;:=顯=須=6次的壓合 裝置於壓合源極驅動曰:不0 3之液晶顯示 所示，單曰曰片或源極接塾的示意圖。如圖4中 相同。土 與各源極驅動晶片34a之間的距離皆為 裝置然顯繼％，，峨成本較顯示 與源極侧必需預留^低二然而、’顯示裝置5〇”的閘極側 、Λ大的空間，以便供可撓性電路板36、 8 1333398 94724 19588twf.doc/e 38接合之用。因此以雙邊晶粒-玻璃接合方式製作出的液 晶顯示裝置50”之尺寸較大。 【發明内容】 有鑑於上述，本發明之目的是提供一種可降低顯示器 製造成本之接合方法。 本發明之另一目的是提供一種製造成本較低且尺寸 較小的顯示裝置。 本發明的又一目的是提供一種製造成本較低的顯示 器。 為達上述或是其他目的，本發明提出一種接合方法， 適於接^—顯示面板與多個晶片。顯示面板具有一顯示 區、一第一周邊電路區以及一第二周邊電路區。第一周邊 電路區内配置有多個第一接墊，第二周邊電路區内配置有 多個第二接墊。而接合方法包括下列步驟。首先，在這些 第一接墊上貼附一第一異方向性導電膠。在第一異方向性 導電膠上配置多個第一晶片。進行一第一壓合製程，以使 這些第一晶片與這些第一接墊電性相連。在這些第二接墊 上貼附一第二異方向性導電膠。在第二異方向性導電膠上 配置多個第二晶片以及至少一可撓性電路板。進行一第二 壓合製程，以使這些第二晶片以及可撓性電路板之一端藉 由第二異方向性導電膠電性接於這些第二接墊。 依照本發明一實施例所述之接合方法’其中第一晶片 為閘極驅動晶片，第二晶片為源極驅動晶片。 依照本發明一實施例所述之接合方法，其中第一晶片 9 1333398 94724 19588twf.doc/e 為源極驅動晶片’弟二晶片為閘極驅動晶片。 依照本發明一實施例所述之接合方法，其中第二接墊 分為多組區塊，可撓性電路板電性連接於其中一區塊的第 二接墊。 依照本發明一實施例所述之接合方法，其中可撓性電 路板上具有一第三晶片。 依照本發明一實施例所述之接合方法，更包括在進行 第二壓合製程之後，於一印刷電路板上配置一第三異方向 導電膠，且在配置第三異方向性導電膠之後進行一第三壓 合製程，以使可撓性電路板之另一端與印刷電路板電性連 接。 依照本發明一實施例所述之接合方法，第二晶片與可 撓性電路板之該端成一直線排列。 本發明另提出一種顯示裝置，此顯示裝置包括一顯示 面板、多個第一晶片、多個第二晶片以及至少一可撓性電 路板。顯示面板具有一顯示區、一第一周邊電路區以及一 第二周邊電路區。第一周邊電路區内配置有多個第一接 墊，第二周邊電路區内配置有多個第二接墊。第一晶片配 置於第一周邊電路區上，且分別與第一接墊電性連接。第 二晶片配置於第二周邊電路區上，且分別電性連接於部份 第二接墊。可撓性電路板之一端電性連接於部份第二接 墊。其中，可撓性電路板具有多條連續線路、多條不連續 線路以及一第三晶片，連續線路與部份第二晶片以及部分 第二接墊電性相連，而不連續線路經由第三晶片與部份第 1333398 94724 19588twf.doc/e 二接墊電性連接。 :實?例所述之顯示裝置，其中第二晶片 ”⑷生电路板之1成-直線排列。 依照本發明—實施 片則 為閉極驅動晶片，第二曰丄”’、貝不衣置，其中弟一曰曰片 為源極驅動晶片。 《㊈動日日片。弟 f施例所述之顯示裝置，其中第一晶片 第一曰θ片為閘極驅動晶片。第三晶片則 依照本發明 為源極驅動晶片 為閘極驅動晶片 依照本發明—實施例 接塾分為多組區塊，可撓性帝衣置’其中d弟;; 墊電性連接。 $板^、其中一區塊的第一接 依照本發明—實施例 链勺 括多條連接線路，從第一用、㈣；f不衣置，顯不面板更包 區，且與爾邊電路區延伸至第二周邊電路 墊错由連接祕電性連接部分第連接之。卩刀弟一接 依照本發明—實施例所述 括多條連接線路，從第―周邊顯不面板更包 區，且θ U兩 延伸至弟二周邊電路 ，、4弟一日日片笔性連接之部 路電性連接部分第-接塾。 ，一接動曰由連接線 依照本發明—實施例所述之顯示裝置，顯示裝 Ρ刷電職，其電性連接於可撓性電路板之另—端。 1 =明—實施例所述之顯示裝置，其中顯示面板可以 疋-水顯示面板(Plasma Display Panel，PDp)、有機電 1333398 94724 丨 9588twf.doc/e 光顯示面板（Organic Electro-Luminescence DiSpiay panej OELD)或液晶顯示面板。 本發明又提出一種顯示器，此顯示器包括一背光源以 及一顯示裝置。其中，顯示裝置配置於背光源之上，且包 括一顯示面板、多個第一晶片、多個第二晶片以及至少一 可撓性電路板。顯示面板具有一顯示區、一第一周邊電路 區以及一第二周邊電路區。第一周邊電路區内配置有多個 φ 第一接墊，第二周邊電路區内配置有多個第二接墊。第一 晶片配置於第一周邊電路區上，且分別與第一接墊電性連 接。第二晶片配置於第二周邊電路區上，且分別電性連接 - 於部份第二接墊。可撓性電路板之一端電性連接於部份第 ' 一接墊。其中，可撓性電路板具有多條連續線路、多條不 連縯線路以及一第三晶片。連續線路與部份第二晶片以及 部份第二接墊電性相連，而不連續線路經由第三晶片與部 份第二接墊電性連接。 依照本發明一實施例所述之顯示器，其中第二晶片與 可撓性電路板之一端成一直線排列。 依照本發明一實施例所述之顯示器，其中背光源包括 冷陰極螢光燈管背光模組(co]d cath〇de幻職⑽獄】amp back light module)、冷陰極螢光平面燈（c〇M cathode fluorescence flat lamp)、發光二極體背光模組⑴幼t⑽油叩 diode back light module)、場發射背光模組(fidd emming back l】ght module)或其它適當的背光源。 依照本發明一實施例所述之顯示器，其中第一晶片為 12 1333398 94724 19588twf.doc/e 閘極驅動晶片’弟二晶片為源極驅動晶片。弟二晶片則為 源極驅動晶片。 依照本發明一實施例所述之顯示器，其中第一晶片為 源極驅動晶片’弟二晶片為間極驅動晶片。弟二晶片則為 閘極驅動晶片。 依照本發明一實施例所述之顯示器，其中第二接墊分 為多組區塊，可撓性電路板電性接於其中一區塊的第二接 墊。 依照本發明一實施例所述之顯示器，顯示面板更包括 多條連接線路，從第一周邊電路區延伸至第二周邊電路 區，且與可撓性電路板之連續線路電性連接之部分第二接 墊藉由連接線路電性連接部分第一接墊。 依照本發明一實施例所述之顯示器，顯示面板更包括 多條連接線路，從第一周邊電路區延伸至第二周邊電路 區，且與第二晶片電性連接之部分第二接墊藉由連接線路 電性連接部分第一接墊。 依照本發明一實施例所述之顯示器，顯示裝置更包括 一印刷電路板，其電性連接於可撓性電路板之另一端。 依照本發明一實施例所述之顯示器’其中顯示面板可 以是電聚顯示面板、有機電激發光顯不面板或液晶顯不面 板。 本發明又提出一種顯示裝置，此顯示裝置包括一顯示 面板、多個第一晶片、多個第二晶片以及至少一可撓性電 路板。顯示面板具有一顯示區、一第一周邊電路區以及一 13 1333398 94724 19588twf.doc/e 第二周邊電路區。第一周邊電路區内配置有多個第一接 墊，第二周邊電路區内配置有多個第二接墊。第一晶片配 置於第一周邊電路區上，且分別與第一接墊電性連接。第 二晶片配置於第二周邊電路區上，且分別電性連接於部份 第二接墊。可撓性電路板之一端電性連接於部份第二接 墊，且此端與第二晶片成一直線排列。 依照本發明一實施例所述之顯示裝置，可撓性電路板 φ 具有多條連續線路、多條不連續線路以及一第三晶片，連 續線路與部份第二晶片以及部分第二接墊電性相連，而不 連續線路經由第三晶片與部份第二接墊電性連接。 - 依照本發明一實施例所述之顯示裝置，顯示面板更包 - 括多條連接線路，從第一周邊電路區延伸至第二周邊電路 區，且與可撓性電路板之連續線路電性連接之部分第二接 墊藉由連接線路電性連接部分第一接墊。 依照本發明一實施例所述之顯示裝置，顯示面板更包 括多條連接線路，從第一周邊電路區延伸至第二周邊電路 B 區，且與該第二晶片電性連接之部分第二接墊藉由連接線 路電性連接部分第一接墊。 依照本發明一實施例所述之顯示裝置，其中第一晶片 為間極驅動晶片’弟^晶片為源極驅動晶片。 依照本發明一實施例所述之顯示裝置，其中第三晶片 為源極驅動晶片。 依照本發明一實施例所述之顯示裝置，其中第一晶片 為源極驅動晶片，第二晶片為閘極驅動晶片。 14 1333398 94724 i9588twf.doc/e 依照本發明一實施例所述之顯示裝置，其中第三晶片 為閘極驅動晶片。 依照本發明一實施例所述之顯示裝置，其中第二揍墊 分為多組區塊，可撓性電路板與其中一區塊的第二接墊電 性連接。 依照本發明一實施例所述之顯示裝置，顯示裝置更包 括一印刷電路板，其電性連接於可撓性電路板之另一端。 依照本發明一實施例所述之顯示裝置，其中顯示面板 可以是電聚顯示面板、有機電激發光顯示面板或液晶顯示 面板。 本發明又提出一種顯示器，此顯示器包括一背光源以 及一顯示裝置。其中，顯示裝置配置於背光源之上，且包 括一顯示面板、多個第一晶片、多個第二晶片以及至少一 可挽性電路板。顯示面板具有一顯示區、一第一周邊電路 區以及一第二周邊電路區。第一周邊電路區内配置有多個 第一接墊，第二周邊電路區内配置有多個第二接墊。第一 晶片配置於第一周邊電路區上，且分別與第一接墊電性連 接。第二晶片配置於第二周邊電路區上’且分別電性連接 於部份第二接墊。可撓性電路板之一端電性連接於部份第 二接墊，且此端與第二晶片成一直線排列。 依照本發明一實施例所述之顯示器，其中可撓性電路 板具有多條連續線路、多條不連續線路以及一第三晶片。 連續線路與部份第二晶片以及部份第二接墊電性相連，而 不連續線路經由第三晶片與部份第二接墊電性連接。 15 1333398 94724 19588twf.doc/e 依照本發明一實施例所述之顯示器，顯示面板更包括 多條連接線路，從第一周邊電路區延伸至第二周邊電路 區，且與可撓性電路板之連續線路電性連接之部分第二接 墊藉由連接線路電性連接部分第一接墊。 依照本發明一實施例所述之顯示器，顯示面板更包括 多條連接線路，從第一周邊電路區延伸至第二周邊電路 區，且與第二晶片電性連接之部分第二接墊藉由連接線路 Φ 電性連接部分第一接墊。 依照本發明一實施例所述之顯示器，其中第一晶片為 閘極驅動晶片’弟二晶片為源極驅動晶片。 - 依照本發明一實施例所述之顯示器，其中第三晶片則 - 為源極驅動晶片。 依照本發明一實施例所述之顯示器，其中第一晶片為 源極驅動晶片，第二晶片為閘極驅動晶片。 依照本發明一實施例所述之顯示器，其中第三晶片則 為閘極驅動晶片。 ® 依照本發明一實施例所述之顯示器，其中第二接墊分 為多組區塊，可撓性電路板電性接於其中一區塊的第二接 墊。 依照本發明一實施例所述之顯示器，顯示裝置更包括 一印刷電路板，其電性連接於可撓性電路板之另一端。 依照本發明一實施例所述之顯示器，其中顯示面板可 以是電漿顯示面板、有機電激發光顯示面板或液晶顯示面 板。 16 1333398 94724 19588twf.doc/e 本發明所提出的接合方法利用較少的步驟接合多個 晶片與顯示面板，因此可降低顯示裝置的生產成本，而利 用本發明提出之接合方法製作出的顯示裝置之尺寸也較 小。此顯示裝置更可與一背光源組裝成一製造成本較低的 顯示器。此外，由於本發明採用獨立壓頭以及一次同時壓 合多個第二晶片以及至少一可撓性電路板，因此第二晶片 以及可撓性電路板皆只藉由一第二異方向性導電膠與第二 φ 接墊電性連接，不僅節省異方向性導電膠使用量，亦可減 少第二周邊電路區域面積，進一步縮小面板尺寸。再者， 相較於習知壓合製程為採用單一壓頭分別壓合驅動晶片以 - 及可撓性電路板，本發明的第二壓合製程有別於習知壓合 - 技術採用獨立壓頭方式，每一驅動晶片與可撓性電路板分 別對應獨立壓頭，可同時壓合第二晶片與可撓性電路板， 節省壓合次數。 為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂，下文特舉較佳實施例，並配合所附圖式，作詳細說 •明如下。 【實施方式】 圖5繪示本發明一實施例之顯示裝置的俯視圖。請參 照圖5，顯示裝置100包括一顯示面板110、多個第一晶片 120、多個第二晶片130、至少一可撓性電路板140以及一 印刷電路板150。顯示面板110具有一顯示區Π2、一第一 周邊電路區114以及一第二周邊電路區116。第一周邊電 路區114與第二周邊電路區116皆鄰接顯示區1]2。然而’ 17 1333398 94724 l9588twf.doc/e 在另一實施例中，第一周邊電路區114與第二周邊電路區 116也可以不鄰接於顯示區Π2。此外，第一周邊電路區 114内配置有多個第一接墊114a，第二周邊電路區116内 配置有多個第二接墊116a。第一晶片12〇配置於第一周邊 • 電路區上，且分別與第一接墊114a電性連接。第二晶 片130配置於第一^周邊電路區116上，且分別電性連接於 、 部份第二接墊116a。可撓性電路板]4〇之—端電性連接於 • 部份第二接墊U6a’且此端與第二晶片130約略排列成一 直線。在本實施例中，可撓性電路板14〇具有多條連續線 路142、多條不連續線路144以及一第三晶片146。連續線 - 路142與部份第二晶片130以及部份第二接墊116a電性相 ' 連，而不連續線路144經由第三晶片146與部份其餘第二 接墊116a電性連接。然而，本實施例並不限定可撓性電路 板140的型態。舉例而言，在另一實施例中，可撓性電路 板140也可以不具有第三晶片146。另外，印刷電路板丨％ φ 電性連接於可撓性電路板140之另一端。詳細而言，顯示 面板110例如可為液晶顯示面板、電漿顯示面板、有機電 激發光顯示面板或其它適當之顯示面板。在本實施例中， 此，示面板110為一液晶顯示面板，而此液晶顯示面板例 如芽透式液晶顯示面板或半穿透半反射液晶顯示面板。此 外’顯示裝置1〇〇包括兩個可撓性電路板丨。其中，第 - 二接墊116a分為多組區塊s，每一可橈性電路板14〇與其 中一區塊s的第二接墊116a電性連接。 承上述，第一接墊n4a為閘極接墊，第二接墊]】6& 18 1333398 94724 19588twf.doc/e =、極接塾，且第—晶片UQ為閘極驅動晶片，第二 3〇為源極驅動晶片。第三晶片146則為 _曰曰 另外’顯示面板110 f、畜拉Μ 力曰曰月 條連接線路·’其中這些二、二多 周邊電路區114延伸5筮-田A U8b攸弟— _刚之連續線路;==二撓性"It is not for its advantages" but due to the structure of its internal electron cavity, the volume of the cathode ray tube display appears to be large and accounts for (4), and radiation is generated while the cathode ray tube display is rotated, causing the eye fe Therefore, the flat panel diSplay (FpD) developed by optoelectronic technology and semiconductor manufacturing technology, such as liquid crystal display apparatus, has gradually become the mainstream of display products. In the manufacturing process, the bonding between the driving chip and the liquid crystal display panel is roughly classified into a chip-on-board (COB), a chip-on-glass (COG) or a tape-and-tape automatic bonding. (tape automatic bonding, TAB) (ie, chip-on-chip (C〇F)), etc. Figure 1A to Figure IF show a flow chart of a method of bonding a driving wafer and a liquid crystal display panel. The joining method is shown by the automatic tape joining method. Please refer to FIG. 1A first, the joining method is to firstly give a different direction 5 94724 19588 The twf.doc/e conductive adhesive 22 is attached to the liquid crystal _ _, as shown in Fig. 1B, on the inter-pole pad 12 of the star panel 1 . The circuit board 32. The directional conductivity in the basin is 22 A plurality of pullable drive chip melons are disposed. After the connection circuit board 32 is connected with a bristles γ configuration 个 可 flexible circuit board 32, the connection is performed. The flexible circuit board 32 and the brake pad 12 are electrically connected. Referring to FIG. 1C, the opposite-direction conductive paste 24 is attached to the source contact 14 of = Ϊ 1〇. Thereafter, as shown in FIG. 1D, the conductive paste of the opposite direction is 24 V to sa々. A plurality of flexible circuit boards 34 are disposed on the board 24, wherein a source driving chip 34a is connected to the mother board 22 board, and the flexible circuit board 34 and the source are provided. The electrode pad 14 is electrically connected. On the second floor of the second printed circuit board 42, a different direction is applied to the gate printed circuit board 42. The conductive layer is formed and the process is pressed to make the flexibility. The board % is electrically connected to the gate printed circuit board 42. Month 'Fig. 1F, then, a different direction of the conductive paste 28 is attached to a source printed circuit board 44, and a press-fit is performed. The liquid crystal display device 5 can be electrically connected to the liquid crystal display device 5. After the above steps, the liquid crystal display device 5 can be completed. The assembly (not shown) can be displayed in a two-day display state. However, since the flexible circuit boards 32 and 34 are taped carrier package (TCP) structures, the price is high. Therefore, the manufacturing cost of the liquid crystal display device manufactured by such a bonding method is not favorable to market competition. 1333398 94724 19588twf.doc/e To solve the above problems, there is another joining method in the prior art. 2A to 2H are flow charts showing a conventional bonding method of a driving wafer and a liquid crystal display panel, which are illustrated by a die-glass bonding method and a tape automated bonding method. Referring to FIG. 2A, the bonding method is to first attach an anisotropic conductive paste 22 to the gate pad 12 of the liquid crystal display panel 10. Then, as shown in Fig. 2B, a plurality of gate driving wafers 32a are disposed on the anisotropic conductive paste 22, and a φ pressing process is performed to electrically connect the gate driving wafers 32a and the gate pads 12. Next, referring to Fig. 2C, an anisotropic conductive paste 24 is attached to the source pads 14 of the liquid crystal display panel 1·. Thereafter, as shown in FIG. 2D, a plurality of flexible circuit boards 34 are disposed on the anisotropic conductive paste 24. A source driving chip 34a is connected to the mother-flexible circuit board 34, and a pressing process is performed to electrically connect the flexible circuit board 34 to the source pad 14. Slide 2A, in the gate pad epoxy 22'. Thereafter, as shown in Fig. 2F, the isotropic conductive paste η = a plurality of flexible circuit boards 36' in which the flexible circuit board % has not been connected to any of the wafers. The performing-pressing process is electrically connected to the interpole pad 12. Moxibustion 叮U children's road board. The ginseng A?, Fig. 2G, prints the directional conductive paste 26 at a gate, and performs a press-fit system to electrically connect to the idle printed circuit board 42. ° %路板月ΐ 、?, Figure 2Η, and then, on a source-printing-dissimilarity> f7 brush circuit board 44, the _ 28 sub-adhesive-pressing process is applied to make the recyclable electricity 7 94724 19588twf The .doc/e board 34 is electrically coupled to the source printed circuit board 44. As described above, in the liquid crystal display device 5f), the gate side of the device 50 is made of two. The liquid crystal display device and the interpole driving chip 32a are electrically connected to each other. The display device has a % of the device, and the liquid transfer is shown in the above liquid crystal. However, the cost of the step-by-step reduction is much lower. The cost of a cow is 尨田雔,真曰』, and the current conventional technology is more advanced. That is to say, on the secret side and out of the second 5= Therefore, it will not be described here any more, and only the 4th 5'' of the edge of FIG. 3 is further integrated into the single-circuit board of the printed circuit board 44 of the open-circuit printed circuit board 42. In order to reduce the number of boards of the circuit:: ΐΪ 所有 All the splicing process 'Because the driver wafer and the flexible 屣: 2:5, so the driver chip and the flexible circuit board must be divided into bonding process. In more detail, press the plate of the machine table. For example: after the wafer is tilted, the flexible circuit program can be pressed for the second time: :========================================================================= Shown is a schematic diagram of a single cymbal or source connection. Same as in Figure 4. The distance between the soil and each of the source driving wafers 34a is the % of the device, and the cost is lower than that of the display and the source side. However, the gate side of the 'display device 5〇' is large. The space is provided for bonding the flexible circuit board 36, 8 1333398 94724 19588 twf.doc/e 38. Therefore, the liquid crystal display device 50" fabricated by the bilateral die-glass bonding method is large in size. SUMMARY OF THE INVENTION In view of the above, it is an object of the present invention to provide a bonding method that can reduce the manufacturing cost of a display. Another object of the present invention is to provide a display device which is low in manufacturing cost and small in size. It is still another object of the present invention to provide a display which is less expensive to manufacture. To achieve the above or other objects, the present invention provides a bonding method suitable for connecting a display panel to a plurality of wafers. The display panel has a display area, a first peripheral circuit area, and a second peripheral circuit area. A plurality of first pads are disposed in the first peripheral circuit region, and a plurality of second pads are disposed in the second peripheral circuit region. The joining method includes the following steps. First, a first anisotropic conductive paste is attached to the first pads. A plurality of first wafers are disposed on the first anisotropic conductive paste. A first pressing process is performed to electrically connect the first wafers to the first pads. A second anisotropic conductive paste is attached to the second pads. A plurality of second wafers and at least one flexible circuit board are disposed on the second anisotropic conductive paste. A second bonding process is performed to electrically connect one of the second wafers and one of the flexible circuit boards to the second pads by the second anisotropic conductive paste. A bonding method in accordance with an embodiment of the present invention wherein the first wafer is a gate driving wafer and the second wafer is a source driving wafer. A bonding method according to an embodiment of the invention, wherein the first wafer 9 1333398 94724 19588 twf.doc/e is a source driving wafer, and the second wafer is a gate driving wafer. According to an embodiment of the present invention, the second pad is divided into a plurality of blocks, and the flexible circuit board is electrically connected to the second pad of one of the blocks. A bonding method according to an embodiment of the invention, wherein the flexible circuit board has a third wafer. The bonding method according to an embodiment of the invention further includes: after performing the second pressing process, disposing a third opposite-direction conductive paste on a printed circuit board, and performing the third anisotropic conductive paste after the third isotropic conductive paste is disposed; A third pressing process is used to electrically connect the other end of the flexible circuit board to the printed circuit board. According to the bonding method of one embodiment of the present invention, the second wafer is aligned with the end of the flexible circuit board. The present invention further provides a display device including a display panel, a plurality of first wafers, a plurality of second wafers, and at least one flexible circuit board. The display panel has a display area, a first peripheral circuit area, and a second peripheral circuit area. A plurality of first pads are disposed in the first peripheral circuit region, and a plurality of second pads are disposed in the second peripheral circuit region. The first wafer is disposed on the first peripheral circuit region and electrically connected to the first pads, respectively. The second chip is disposed on the second peripheral circuit region and electrically connected to the second portion of the second pads. One end of the flexible circuit board is electrically connected to a part of the second pad. The flexible circuit board has a plurality of continuous lines, a plurality of discontinuous lines, and a third chip. The continuous line is electrically connected to a portion of the second wafer and a portion of the second pads, and the discontinuous lines are via the third chip. It is electrically connected to part of the 1333398 94724 19588twf.doc/e two pads. The display device according to the embodiment, wherein the second wafer "(4) is formed in a linear arrangement of the circuit board. According to the invention, the implementation sheet is a closed-end drive wafer, and the second" is not placed. One of the brothers is a source driver chip. "Nine-day Japanese film. The display device of the embodiment, wherein the first wafer first 曰 θ sheet is a gate driving wafer. The third wafer is a gate-driven wafer for the source-driven wafer in accordance with the present invention. According to the present invention, the interface is divided into a plurality of blocks, and the flexible device is placed therein; $板^, the first connection of one of the blocks according to the invention - the embodiment chain spoon includes a plurality of connecting lines, from the first use, (four); f is not put on the display, the panel is not covered, and the circuit is The extension of the region to the second peripheral circuit is connected by the connection of the electrical connection portion. According to the invention, the plurality of connecting lines are arranged in accordance with the present invention, and the panel is not covered by the first periphery, and the θ U extends to the peripheral circuit of the second brother. Connect the part of the electrical connection part of the connection. A display device according to the present invention is a display device that is electrically connected to the other end of the flexible circuit board. 1 = 明—The display device according to the embodiment, wherein the display panel can be a plasma display panel (PDp), an organic electric 1333398 94724 丨 9588 twf. doc / e light display panel (Organic Electro-Luminescence DiSpiay panej OELD ) or LCD panel. The invention further provides a display comprising a backlight and a display device. The display device is disposed on the backlight and includes a display panel, a plurality of first wafers, a plurality of second wafers, and at least one flexible circuit board. The display panel has a display area, a first peripheral circuit area, and a second peripheral circuit area. A plurality of φ first pads are disposed in the first peripheral circuit region, and a plurality of second pads are disposed in the second peripheral circuit region. The first wafer is disposed on the first peripheral circuit region and electrically connected to the first pads, respectively. The second chip is disposed on the second peripheral circuit region and electrically connected to the second portion of the second pad. One end of the flexible circuit board is electrically connected to a part of the first pad. The flexible circuit board has a plurality of continuous lines, a plurality of non-continuous lines, and a third wafer. The continuous line is electrically connected to a portion of the second wafer and a portion of the second pads, and the discontinuous lines are electrically connected to the second portion of the second via the third wafer. A display according to an embodiment of the invention, wherein the second wafer is aligned with one end of the flexible circuit board. A display according to an embodiment of the invention, wherein the backlight comprises a cold cathode fluorescent tube backlight module (co]d cath〇de (10) prison amp back light module), and a cold cathode fluorescent flat lamp (c) 〇M cathode fluorescence flat lamp), LED backlight module (1) young t (10) oil diode back light module), field emission backlight module (fidd emming back l ght module) or other suitable backlight. A display according to an embodiment of the invention, wherein the first wafer is a 12 1333398 94724 19588 twf.doc/e gate drive wafer, and the second wafer is a source drive wafer. The second wafer is a source driver chip. A display according to an embodiment of the invention, wherein the first wafer is a source driving wafer, and the second wafer is an inter-polar driving wafer. The second wafer is a gate drive wafer. According to an embodiment of the invention, the second pad is divided into a plurality of blocks, and the flexible circuit board is electrically connected to the second pad of one of the blocks. According to the display of the embodiment of the present invention, the display panel further includes a plurality of connecting lines extending from the first peripheral circuit area to the second peripheral circuit area and electrically connected to the continuous line of the flexible circuit board. The two pads are electrically connected to the first pads by connecting the wires. According to an embodiment of the present invention, the display panel further includes a plurality of connection lines extending from the first peripheral circuit region to the second peripheral circuit region, and a portion of the second pads electrically connected to the second chip is The connecting line is electrically connected to the first pad. According to the display of the embodiment of the invention, the display device further includes a printed circuit board electrically connected to the other end of the flexible circuit board. According to an embodiment of the present invention, the display panel may be an electropolymer display panel, an organic electroluminescence display panel or a liquid crystal display panel. The present invention further provides a display device including a display panel, a plurality of first wafers, a plurality of second wafers, and at least one flexible circuit board. The display panel has a display area, a first peripheral circuit area, and a second peripheral circuit area of 13 1333398 94724 19588 twf.doc/e. A plurality of first pads are disposed in the first peripheral circuit region, and a plurality of second pads are disposed in the second peripheral circuit region. The first wafer is disposed on the first peripheral circuit region and electrically connected to the first pads, respectively. The second chip is disposed on the second peripheral circuit region and electrically connected to the second portion of the second pads. One end of the flexible circuit board is electrically connected to a portion of the second pad, and the end is aligned with the second wafer. According to the display device of the embodiment of the invention, the flexible circuit board φ has a plurality of continuous lines, a plurality of discontinuous lines, and a third chip, and the continuous line and the part of the second chip and the part of the second pad The connection is not connected, and the discontinuous line is electrically connected to a part of the second pads via the third chip. In a display device according to an embodiment of the invention, the display panel further includes a plurality of connection lines extending from the first peripheral circuit region to the second peripheral circuit region, and the continuous line electrical property with the flexible circuit board A part of the second pad connected is electrically connected to the first pad by a connecting line. According to the display device of the embodiment of the present invention, the display panel further includes a plurality of connecting lines extending from the first peripheral circuit region to the second peripheral circuit B region, and the second portion electrically connected to the second chip is connected. The pad is electrically connected to the first pad by a connecting line. A display device according to an embodiment of the invention, wherein the first wafer is an inter-polar drive wafer, and the wafer is a source-driven wafer. A display device according to an embodiment of the invention, wherein the third wafer is a source drive wafer. A display device according to an embodiment of the invention, wherein the first wafer is a source driving wafer and the second wafer is a gate driving wafer. A display device according to an embodiment of the invention, wherein the third wafer is a gate drive wafer. A display device according to an embodiment of the invention, wherein the second pad is divided into a plurality of blocks, and the flexible circuit board is electrically connected to the second pad of one of the blocks. According to the display device of the embodiment of the invention, the display device further includes a printed circuit board electrically connected to the other end of the flexible circuit board. A display device according to an embodiment of the invention, wherein the display panel may be an electro-polymer display panel, an organic electro-optic display panel or a liquid crystal display panel. The invention further provides a display comprising a backlight and a display device. The display device is disposed on the backlight and includes a display panel, a plurality of first wafers, a plurality of second wafers, and at least one switchable circuit board. The display panel has a display area, a first peripheral circuit area, and a second peripheral circuit area. A plurality of first pads are disposed in the first peripheral circuit region, and a plurality of second pads are disposed in the second peripheral circuit region. The first wafer is disposed on the first peripheral circuit region and electrically connected to the first pads, respectively. The second wafer is disposed on the second peripheral circuit region ′ and electrically connected to a portion of the second pads. One end of the flexible circuit board is electrically connected to a portion of the second pad, and the end is aligned with the second wafer. A display according to an embodiment of the invention, wherein the flexible circuit board has a plurality of continuous lines, a plurality of discontinuous lines, and a third wafer. The continuous line is electrically connected to a part of the second chip and a part of the second pads, and the discontinuous line is electrically connected to the part of the second pads via the third chip. In a display according to an embodiment of the invention, the display panel further includes a plurality of connecting lines extending from the first peripheral circuit area to the second peripheral circuit area, and the flexible circuit board A part of the second pads electrically connected to the continuous lines is electrically connected to the first pads by the connecting lines. According to an embodiment of the present invention, the display panel further includes a plurality of connection lines extending from the first peripheral circuit region to the second peripheral circuit region, and a portion of the second pads electrically connected to the second chip is Connecting line Φ Electrically connect part of the first pad. A display according to an embodiment of the invention, wherein the first wafer is a gate drive wafer and the second wafer is a source drive wafer. A display according to an embodiment of the invention, wherein the third wafer is - a source drive wafer. A display according to an embodiment of the invention, wherein the first wafer is a source driving wafer and the second wafer is a gate driving wafer. A display according to an embodiment of the invention, wherein the third wafer is a gate drive wafer. A display according to an embodiment of the invention, wherein the second pads are divided into a plurality of blocks, and the flexible circuit board is electrically connected to the second pads of one of the blocks. According to the display of the embodiment of the invention, the display device further includes a printed circuit board electrically connected to the other end of the flexible circuit board. A display according to an embodiment of the invention, wherein the display panel can be a plasma display panel, an organic electroluminescent display panel or a liquid crystal display panel. 16 1333398 94724 19588twf.doc/e The bonding method proposed by the present invention utilizes fewer steps to join a plurality of wafers and a display panel, thereby reducing the production cost of the display device, and the display device produced by the bonding method proposed by the present invention The size is also small. The display device can be assembled with a backlight to form a display that is less expensive to manufacture. In addition, since the present invention employs a separate indenter and simultaneously presses a plurality of second wafers and at least one flexible circuit board at a time, the second wafer and the flexible circuit board are only supported by a second anisotropic conductive paste. The electrical connection with the second φ pad not only saves the amount of the directional conductive paste, but also reduces the area of the second peripheral circuit area and further reduces the panel size. Furthermore, the second press-bonding process of the present invention is different from the conventional press-bonding technique in that the press-bonding process is performed by separately pressing the driving wafer with a single indenter - and the flexible circuit board. In the head mode, each of the driving chip and the flexible circuit board respectively correspond to a separate indenter, and the second chip and the flexible circuit board can be simultaneously pressed to save the number of presses. The above and other objects, features and advantages of the present invention will become more <RTIgt; Embodiments FIG. 5 is a plan view showing a display device according to an embodiment of the present invention. Referring to FIG. 5, the display device 100 includes a display panel 110, a plurality of first wafers 120, a plurality of second wafers 130, at least one flexible circuit board 140, and a printed circuit board 150. The display panel 110 has a display area 2, a first peripheral circuit area 114, and a second peripheral circuit area 116. The first peripheral circuit region 114 and the second peripheral circuit region 116 are both adjacent to the display region 1]2. However, in another embodiment, the first peripheral circuit region 114 and the second peripheral circuit region 116 may not be adjacent to the display region Π2. In addition, a plurality of first pads 114a are disposed in the first peripheral circuit region 114, and a plurality of second pads 116a are disposed in the second peripheral circuit region 116. The first wafer 12 is disposed on the first peripheral circuit area and electrically connected to the first pads 114a. The second wafer 130 is disposed on the first peripheral circuit region 116 and electrically connected to the second spacers 116a. The flexible circuit board is electrically connected to a portion of the second pads U6a' and is disposed approximately in line with the second wafer 130. In the present embodiment, the flexible circuit board 14 has a plurality of continuous lines 142, a plurality of discontinuous lines 144, and a third wafer 146. The continuous line-way 142 is electrically connected to a portion of the second wafer 130 and a portion of the second pads 116a. The discontinuous line 144 is electrically coupled to a portion of the remaining second pads 116a via the third wafer 146. However, this embodiment does not limit the type of the flexible circuit board 140. For example, in another embodiment, the flexible circuit board 140 may also have no third wafer 146. In addition, the printed circuit board 丨% φ is electrically connected to the other end of the flexible circuit board 140. In detail, the display panel 110 may be, for example, a liquid crystal display panel, a plasma display panel, an organic electroluminescent display panel, or other suitable display panel. In this embodiment, the display panel 110 is a liquid crystal display panel, and the liquid crystal display panel is, for example, a permeable liquid crystal display panel or a transflective liquid crystal display panel. Further, the display device 1 includes two flexible circuit boards. The second pad 116a is divided into a plurality of blocks s, and each of the flexible circuit boards 14 is electrically connected to the second pads 116a of one of the blocks s. In the above, the first pad n4a is a gate pad, the second pad]]6& 18 1333398 94724 19588twf.doc/e =, the pole is connected, and the first wafer UQ is a gate driving chip, the second 3 〇 is the source drive chip. The third wafer 146 is _ 曰曰 another 'display panel 110 f, the Μ Μ 曰曰 连接 连接 连接 连接 · · 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中 其中Continuous line; == two flexible
:連接線路118a電性連接部分第一接：u:，使;二a 二Ϊ路SI50所產生之訊號可依序經由連續線路〗42、部 仏床H ’印刷電路板150所產生之訊號也可 又序左由弟—晶片13〇與連接線路η孙傳送至第一晶片 120以下將介紹製作顯示裝置100的接合方法。 圖6Α至圖紐緣示本發明一實施例之接合方法的流程 θ。此接合方法適於接合上狀顯示面板UG與多個晶 .片。請先參照圖6Α ’首先，在第-接塾114a上貼附一第 一異方向性導電膠21〇。 ΛΛ後，如圖6B所示，在第一異方向性導電膠.21 〇上 配置多個第-晶片12G，並且進行—第—壓合製程，以使 這二第Ba片丨2〇與這些第一接墊1】4a電性相連。 ^ 接著，如圖6C所示，在這些第二接墊]16a上貼附一 第一異方向性導電朦220。 然後’如圖6D所示’第二異方向性導電膠22〇上配 置多個第二晶片130以及兩可撓性電路板140，並且進行 一第二壓合製程，以使第二晶月〗30以及每一可撓性電路 \9 1333398 94724 19588twf.doc/e 板140之一端電性接於第二接墊U6a。其中，第一 分為多組區塊s，可撓性電路板140電性 墊]】知 塊S的第二接墊116a。 雜&其中-區 然後，在進行完上述的步驟後，如圖6 印刷電路板150上配置一第三異方向導電 不’於一 置第三異方向性導電膠23〇之後進行―第^人制財土配 使可撓性電路板之另-端與印刷電路板15〇^=，以 此，顯示裝置100即可被完成。 逑接。如 圖7緣示本上述接合方法中墨合 _曰 電路板至第二接塾的示意圖。由於第二日曰:^及可撓性 同於可撓性電路板14〇之厚度 ==度不 的接合設計，且這_P，與第二二 路板M0之間的距離是可調整 撓性電 晶片以及可撓性電路板，以減少度不一的 值得注意的是，在本實施例之接合方= 裝置100的第一周邊電路區n4(咖。是利用二:曰曰：： 接合方式將第-接墊"4a(及閉極接墊)與第—晶：：： ，驅動晶片)電性連接。液晶顯示裝日： 路區1]獅側)是利用晶粒-玻璃接合方式=周2 ma(及源極接墊)與第二晶片13〇(即源極、乐一接墊 撓性電路板mo電性連接。相較 曰曰一片)以及可 -，本實施例之接合方式的步驟較:知 少。因此，若以本實施例之接合方法製作液 = 50，則不但製作時間較短，製作成本也較低。…、置 20 1333398 此外，顯不裝置丨〇〇的第一周邊電路區ΐι4盥第二周 邊電路區116分別皆只貼附一第一異方向性導膠 一第二異方向性導電膠220’而第二晶片130“ 路板之接腳成一直線且皆藉由—第二異方向^册: 22:與第，接墊116a電性連接。因此，相較於習知液：顯 示衮置50的閘極侧與源極側須預留空間，再貼附異方向 性導電膠與壓合可撓性電路板。本實施例之顯 ⑻ φ 的尺寸較小。 乂 而上述之顯示裝置100更可用於與一背光源3⑻組裝 成一顯不器400，如圖8繪示之結構。其中，背光源3〇〇 • 例如為:陰極螢光燈管背光模組、冷陰極螢光平面燈、發 光一極版月光模組、場發射背光模組或其它適當的背光源。 壯由灰顯不器400是以製作成本較低且尺寸較小的顯示 裝置100組裝而成，因此顯示器4〇〇的製作成本也較低’ 尺寸也會較小。: The first connection of the electrical connection portion of the connection line 118a: u:, the signal generated by the SI2 of the second a second circuit can be sequentially transmitted via the continuous line 42 and the signal generated by the printed circuit board 150. The method of fabricating the display device 100 will be described below in order to transfer the wafer 13 〇 and the connection line η to the first wafer 120. Fig. 6A to Fig. show the flow θ of the joining method of an embodiment of the present invention. This bonding method is suitable for bonding the upper display panel UG to a plurality of crystal sheets. Referring first to Fig. 6A', first, a first anisotropic conductive paste 21 is attached to the first contact 114a. After that, as shown in FIG. 6B, a plurality of first wafers 12G are disposed on the first anisotropic conductive paste. 21 ,, and a -first pressure bonding process is performed to make the two second wafers 〇 2 〇 The first pads 1 4a are electrically connected. Next, as shown in Fig. 6C, a first anisotropic conductive crucible 220 is attached to the second pads 16a. Then, as shown in FIG. 6D, a plurality of second wafers 130 and two flexible circuit boards 140 are disposed on the second anisotropic conductive paste 22, and a second pressing process is performed to make the second crystal moon 30 and each flexible circuit \9 1333398 94724 19588twf.doc / e one end of the board 140 is electrically connected to the second pad U6a. The first segment is divided into a plurality of blocks s, and the flexible circuit board 140 is electrically padded]] the second pad 116a of the block S. Then, after the above steps are performed, as shown in FIG. 6, a third different direction of conduction is disposed on the printed circuit board 150, and then the third isotropic conductive paste 23 is disposed. The human environment is configured to match the other end of the flexible circuit board with the printed circuit board 15 , so that the display device 100 can be completed. Connected. Fig. 7 is a schematic view showing the ink-jet board to the second port in the above bonding method. Since the second day 曰: ^ and the flexibility is the same as the thickness of the flexible circuit board 14 = == the joint design, and the distance between the _P and the second two-way board M0 is adjustable It is worth noting that the electrical chip and the flexible circuit board are reduced in degree, in the joint side of the embodiment = the first peripheral circuit area n4 of the device 100 (the coffee is using two: 曰曰:: bonding) The method is to electrically connect the first pad "4a (and the closed pad) to the first crystal:::, drive the wafer). LCD display day: Road area 1] lion side) is using die-glass bonding method = week 2 ma (and source pad) and second chip 13 〇 (ie source, Le one pad flexible circuit board The electrical connection of the mo is relatively simple and can be - the steps of the bonding mode of the embodiment are less: less. Therefore, when the liquid is 50 in the joining method of the present embodiment, the production time is short and the production cost is low. ..., 20 1333398 In addition, the first peripheral circuit area ΐι4 and the second peripheral circuit area 116 of the display device are respectively attached with only a first dissimilar conductive adhesive and a second dissimilar conductive adhesive 220'. The second wafer 130 "the pins of the circuit board are in a straight line and are all connected by the second direction: 22: electrically connected to the pad 116a. Therefore, compared with the conventional liquid: the display device 50 The gate side and the source side have space reserved, and the directional conductive paste and the press-fit flexible circuit board are attached. The size of the display (8) φ in this embodiment is small. It can be used to assemble a display device 3 (8) into a display device 400, as shown in Fig. 8. The backlight 3 is, for example, a cathode fluorescent tube backlight module, a cold cathode fluorescent flat lamp, and a light emitting device. One-pole version of the moonlight module, field emission backlight module or other suitable backlight source. The strong gray display device 400 is assembled by the display device 100 with lower manufacturing cost and smaller size, so the display is 4 Production costs are also lower' size will be smaller.
上所述’本f务明所提出之接合方法、顯示裝置以及 而;主忍的是，本實施例雖以可撓性電路板連接於 示面板Πο的源極側(也就是連接於第二周邊電路區】 為例’以進行制。但可撓性f路板⑽也可^速接於 己義馮源極側，第 接墊l]4a為源極 匕，第一晶片】2〇 1333398 94724 19588twf.doc/e 顯示器至少具有下列優點： 一、 在發明所提出之接合方法是利用晶粒-玻璃接合方 式將第一晶片、第二晶片以及連接有第三晶片的可撓性電 路板電性連接於顯示面板。較於習知技術，本實施例之接 合方式的步驟較少，且所需的材料也較少。因此，若以本 實施例之接合方法製作液晶顯示裝置，則不但製作時間較 短，製作成本也較低。 二、 本發明所提出之顯示裝置的第一周邊電路區與第 二周邊電路區分別皆只貼附一第一異方向性導電膠與一第 二異方向性導電膠。相較於習知技術，本實施例之顯示裝 置的尺寸較小。 三、 本發明所提出之顯示器是以製作成本較低且尺寸 較小的顯示裝置組裝而成，因此顯示器的製作成本也較 低，尺寸也會較小。 四、 本發明所提出之接合方法、顯示裝置以及顯示器 的製作與現有廠内的製程相容，不需添購額外製程設備。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何熟習此技藝者，在不脫離本發明之精神 和範圍内，當可作些許之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1A至圖1F繪示習知一種驅動晶片與液晶顯示面板 之接合方法的流程圖。 圖2A至圖2H繪示習知另一種驅動晶片與液晶顯示 22 1333398 94724 19588twf.doc/e 面板之接合方法的流程圖。 圖3繪示以雙邊晶片-玻璃接合方式製作之的顯示裝 置的俯視圖。 圖4繪示圖3之液晶顯示裝置於壓合閘極驅動晶片與 閘極接墊的示意圖。 圖5繪示本發明一實施例之顯示裝置的俯視圖。 圖6A至圖6E繪示本發明一實施例之接合方法的流程 圖。 圖7繪示本發明一實施例之接合方法中壓合第二晶片 以及可撓性電路板至第二接墊的示意圖。 圖8繪示本發明一實施例之顯示器的結構示意圖。 【主要元件符號說明】 10 .液晶顯不'面板 12 :閘極接墊 14 :源極接墊 22、22’、24、24’、26、28 :異方向性導電膠 32、34、36、38、140 :可撓性電路板 3 2 a .閘極驅動晶片 3 4 a .源極驅動晶片 42 :閘極印刷電路板 44 :源極印刷電路板 50、50’、50” ：液晶顯示裝置 100 :顯示裝置 1 ] 0 :顯示面板 23 1333398 94724 19588tw「.doc/e 112 :顯示區 114 :第一周邊電路區 114a :第一接墊 116 :第二周邊電路區 l]6a :第二接墊 ‘ 118a、118b :連接線路120 :第一晶片 * 130 第二晶片 • 142 連續線路 144 不連續線路 146 第三晶片 150 - 210 220 230 印刷電路板 第一異方向性導電膠 第二異方向性導電膠 第三異方向性導電膠 300 :背光源 400 :顯示器 P、P，：壓頭 S :區塊 24In the above description, the bonding method and the display device proposed by the present invention are the same; the main endurance is that the present embodiment is connected to the source side of the display panel Πo by a flexible circuit board (that is, connected to the second The peripheral circuit area is taken as an example. However, the flexible f-board (10) can also be connected to the source side of the Fengyi source. The first pad is the source 匕, the first chip] 2〇1333398 94724 19588twf.doc/e The display has at least the following advantages: 1. The bonding method proposed in the invention is to electrically charge the first wafer, the second wafer, and the flexible circuit board to which the third wafer is connected by means of die-glass bonding. It is connected to the display panel. Compared with the prior art, the bonding method of the embodiment has fewer steps and less material is required. Therefore, if the liquid crystal display device is fabricated by the bonding method of the embodiment, not only the fabrication is performed. The time is short and the manufacturing cost is also low. 2. The first peripheral circuit area and the second peripheral circuit area of the display device of the present invention are respectively attached with a first anisotropic conductive adhesive and a second different direction. Conductive adhesive. Compared to conventional The display device of the present embodiment has a small size. 3. The display device of the present invention is assembled by a display device having a low manufacturing cost and a small size, so that the display device has a low manufacturing cost and a small size. 4. The bonding method, the display device and the display provided by the present invention are compatible with the existing in-plant process, and no additional process equipment is required. Although the present invention has been disclosed above in the preferred embodiment, It is not intended to limit the invention, and those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the invention, and the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A to FIG. 1F are flowcharts showing a conventional method of bonding a driving wafer and a liquid crystal display panel. FIGS. 2A to 2H illustrate another conventional driving wafer and liquid crystal display 22 1333398. 94724 19588twf.doc/e Flowchart of the bonding method of the panel. Fig. 3 is a plan view of the display device fabricated by the bilateral wafer-glass bonding method. 3 is a top view of a display device according to an embodiment of the invention. FIG. 6A to FIG. 6E are diagrams showing an embodiment of the present invention. Figure 7 is a schematic view showing a method of bonding a second wafer and a flexible circuit board to a second pad in a bonding method according to an embodiment of the present invention. Figure 8 is a diagram showing a display of an embodiment of the present invention. Schematic diagram of the structure. [Main component symbol description] 10. LCD display is not 'panel 12: gate pad 14: source pad 22, 22', 24, 24', 26, 28: isotropic conductive paste 32, 34 , 36, 38, 140: flexible circuit board 3 2 a. gate drive wafer 3 4 a. source drive wafer 42: gate printed circuit board 44: source printed circuit board 50, 50', 50": Liquid crystal display device 100: display device 1] 0: display panel 23 1333398 94724 19588tw ".doc/e 112: display area 114: first peripheral circuit area 114a: first pad 116: second peripheral circuit area l] 6a: Second pad '118a, 118b: connection line 120: first wafer * 130 second wafer • 142 Continued line 144 Discontinuous line 146 Third wafer 150 - 210 220 230 Printed circuit board First isotropic conductive paste Second isotropic conductive paste Third isotropic conductive paste 300: Backlight 400: Display P, P, : Indenter S: Block 24