1330425 099年05月25日按正替換頁 發明說明： 【發明所屬之技術領域】 [0001] 本發明係關於一種訊號傳輸技術，尤指一種透過一條匯 流排傳輸高速訊號同時保持高速訊號完整性之高速訊號 傳輸架構。 【先前技術】 [0002] 在電場之作用下，兩個導體互相耦合，這種由電場引起 之耦合在電路模型中就用互容來表示，任何相鄰導體之 間都存在互容，導體間之間距越近，耦合就會越緊密。 同樣，在磁場之作用下，兩個導體互相耦合，這種由磁 場引起之耦合在電路模型中就用互感來表示。而互容和 互感係産生干擾之源頭。互容干擾表現爲互容將在被干 擾線（Victim Line)上之串擾點注入一定之電流，也 就係雜訊電流，他與干擾線（Aggressor Line)之電壓 變化斜率和互容之大小成正比。互感干擾表現爲互感將 在被干擾線上之串擾點注入一定之雜訊電壓，他與干擾 參 [0003] 線之電流變化斜率和互感之大小_成'正比。 ' '! * * 高速訊號之傳輸發生在訊號狀態改變之瞬間，即當驅動 電路從高輸出切換到低輸出或從低輸出切換到高輸出時 ，當訊號狀態切換過快時，訊號之上升緣和下降緣都非 常短，從而訊號電壓和訊號電流之變化斜率都很大，這 時高速訊號主傳輸線路中之串擾係不容忽視之。並且， 當高速訊號切換過快時，容易産生過沖（overshoot) 及下沖（undershoot)之問題，當電路在一個時鐘周期内 反復出現過沖及下沖時，即構成震盪，雖然大多數元件 095112490 表單編號A0101 第3頁/共14頁 0993182334-0 1330425 __ 099年05月25 &修正餐換頁 接收端有輸入保護二極體保護，但有時這些過沖電平會 遠遠超過元件電源電壓範圍，損壞元器件。 [0004] 另外，如果高速訊號主傳輸線路_之一根走線沒有被正 確匹配，那麽來自於驅動端之訊號脈衝在接收端被來回 反射，從而引起訊號輪廓失真，如果這種情況沒有被足 夠考慮，電路中之電磁干擾（EMI)將顯著增加，影響訊 號之傳輸品質。 [0005] 圖1揭示了習知一種高速訊號傳輸通道架構，其包括一驅 動電路塊10，一第一接收電路塊20及一第二接收電路塊 < 30，一主傳輸線40與該驅動電路塊10以及第一及第二接 收電路塊20和30相連接。其'中驅動電辂塊10.由一驅動電 路12以及一傳輸支線14組成:，該第一士收電路塊20由一 接收電路22、一傳輸支線24以及一終端匹配電阻26組成 ，該第二接收電路塊30由一接收電路32、一傳輸支線34 以及一終端匹配電阻36組成。 [0006] 圖2揭示了習知另一種高速訊號.傳輸通道架構，其與圖1 _ 不同之處在於一補償電容器'5 0連接於該驅動電路塊1 0與 第一及第二接收電路塊20和30之間，以濾除反射訊號， 從而用來解決架構中存在之訊號反射、過沖及下沖等問 題。 [0007] 在圖1中，該驅動端發出之訊號會由於傳輸線之多重反射 被逐漸衰減。在圖2中，由於加上了該補償電容器50，形 成一個低通濾波器，使這種衰減大大減少，濾除反射訊 號，提高訊號品質。 095112490 表單編號A0101 第4頁/共14頁 0993182334-0 1330425 [0008] 099年05月25日修正替換頁 然而，使用電容器以提高訊號品質之方法成本過高，且 工藝複雜，不適於生産製造之中大量使用，因此，實有 必要提供一種適用於生産製造，且成本低廉之高速訊號 傳輸架構。 【發明内容】 [0009] 有鑒於此，有必要提供一種適用於高速訊號傳輸同時保 持高速訊號完整性之高速訊號傳輸架構。 [0010] 一種高速訊號傳輸架構，其包括一驅動電路塊、至少一 φ 接收電路塊以及一連接該驅動電路塊及該接收電路塊之 主傳輸線，該高速訊號傳輸架構還包括一連接於該驅動 電路塊及該接收電路塊間之銅羯平板電容，該銅箔平板 電容可減小訊號之多重反射，提高訊號傳輸品質。 [0011] 上述高速訊號傳輸架構在電路中加入該銅箔平板電容以 替代等效電容器，從而降低訊號傳輸過程中出現之串擾 、上沖、下沖以及多重反射之問題，且該銅箔平板電容 工藝簡單，適於生產製造之中大量使用，成本低廉。 φ 【實施方式】 [0012] 請參閱圖3，本發明高速訊號傳輸架構包括一驅動電路塊 100，一第一接收電路塊200及一第二接收電路塊300， 一主傳輸線400與該驅動電路塊100、第一接收電路塊 200以及第二接收電路塊300相連接。其中該驅動電路塊 100包括一驅動電路120以及一傳輸支線140，該第一接 收電路塊200包括一接收電路220及一傳輸支線240，該 第二接收電路塊30 0包括一接收電路320及一傳輸支線 340，該傳輸支線140用以發送從該驅動電路120輸出之 095112490 表單編號A0101 第5頁/共14頁 0993182334-0 1330425 [0013] [0014] [0015] [0016] [0017] [0018] 095112490 099年05月25目按正替换頁 讯號至主傳輸線4〇〇，該等傳輸支線240和340用於接收 從該主傳輸線4〇〇輸入之訊號並分別對應發送到相應之接 收電路220和320，一銅箔平板電容600連接於驅動電路 塊100與主傳輸線400之間。 該獎動電路12〇爲北橋晶片，該等接收電路22〇及320爲 έ己憶體插槽。該銅箔平板電容6〇〇形狀爲長形，其特性如 同一電容器’該銅箔平板電容6〇〇係透過習知之蝕刻技術 ，在印刷電路板上钮刻出來，在印刷電路板佈線時即構 成該結構以代替電容器，達成與電容器相同之效果。 該銅箔平板電容6〇〇之等效電容量可用以下公式來計算1330425 According to the replacement page of the invention, the invention relates to: [0001] The present invention relates to a signal transmission technology, in particular to transmitting a high-speed signal through a busbar while maintaining high-speed signal integrity. High-speed signal transmission architecture. [Prior Art] [0002] Under the action of an electric field, two conductors are coupled to each other. This coupling caused by an electric field is represented by mutual capacitance in a circuit model, and mutual capacitance exists between any adjacent conductors. The closer the distance is, the closer the coupling will be. Similarly, under the action of a magnetic field, the two conductors are coupled to each other, and the coupling caused by the magnetic field is represented by mutual inductance in the circuit model. Mutual tolerance and mutual inductance are the source of interference. The mutual capacitance interference is characterized by mutual capacitance that will inject a certain current into the crosstalk point on the Victim Line, which is the noise current, and the slope of the voltage change and the mutual capacitance of the interference line (Aggressor Line) become Just proportional. The mutual inductance interference is manifested by the mutual inductance that will inject a certain noise voltage into the crosstalk point on the interfered line, and it is proportional to the magnitude of the current change slope and the mutual inductance of the interference parameter [0003]. ' '! * * The transmission of high-speed signals occurs at the moment when the signal state changes, that is, when the drive circuit switches from high output to low output or from low output to high output, when the signal state switches too fast, the rising edge of the signal Both the falling edge and the falling edge are very short, so that the slope of the change of the signal voltage and the signal current is large, and the crosstalk in the main transmission line of the high-speed signal cannot be ignored. Moreover, when the high-speed signal is switched too fast, it is easy to cause overshoot and undershoot. When the circuit repeatedly overshoots and undershoots in one clock cycle, it constitutes oscillation, although most components 095112490 Form No. A0101 Page 3 of 14 0993182334-0 1330425 __ 0599 May 25 & Corrected meal changer Receiver has input protection diode protection, but sometimes these overshoot levels will far exceed component power Voltage range, damage to components. [0004] In addition, if one of the high-speed signal main transmission lines _ is not correctly matched, the signal pulse from the driving end is reflected back and forth at the receiving end, causing signal contour distortion, if this situation is not enough It is considered that the electromagnetic interference (EMI) in the circuit will increase significantly, affecting the transmission quality of the signal. 1 shows a high-speed signal transmission channel architecture including a driving circuit block 10, a first receiving circuit block 20 and a second receiving circuit block < 30, a main transmission line 40 and the driving circuit. The block 10 and the first and second receiving circuit blocks 20 and 30 are connected. The 'driver block 10' is composed of a drive circuit 12 and a transmission branch 14: the first circuit block 20 is composed of a receiving circuit 22, a transmission branch 24 and a terminal matching resistor 26, the first The two receiving circuit block 30 is composed of a receiving circuit 32, a transmission branch line 34 and a terminal matching resistor 36. 2 illustrates another high-speed signal transmission channel architecture, which differs from FIG. 1 in that a compensation capacitor '50 is connected to the driving circuit block 10 and the first and second receiving circuit blocks. Between 20 and 30, the reflected signal is filtered to solve the problem of signal reflection, overshoot and undershoot in the architecture. [0007] In FIG. 1, the signal from the driver is gradually attenuated due to multiple reflections of the transmission line. In Fig. 2, since the compensation capacitor 50 is added, a low-pass filter is formed, which greatly reduces the attenuation, filters out the reflected signal, and improves the signal quality. 095112490 Form No. A0101 Page 4 of 14 0993182334-0 1330425 [0008] Corrected replacement page on May 25, 099 However, the method of using capacitors to improve signal quality is costly and complicated, and is not suitable for manufacturing. It is used in large quantities, so it is necessary to provide a high-speed signal transmission architecture that is suitable for manufacturing and low in cost. SUMMARY OF THE INVENTION [0009] In view of the above, it is necessary to provide a high-speed signal transmission architecture suitable for high-speed signal transmission while maintaining high-speed signal integrity. [0010] A high-speed signal transmission architecture includes a driving circuit block, at least one φ receiving circuit block, and a main transmission line connecting the driving circuit block and the receiving circuit block, the high-speed signal transmission architecture further comprising a connection to the driving The copper plate capacitor between the circuit block and the receiving circuit block, the copper foil plate capacitor can reduce multiple reflection of the signal and improve the signal transmission quality. [0011] The high-speed signal transmission architecture adds the copper foil plate capacitor to the circuit instead of the equivalent capacitor, thereby reducing crosstalk, overshoot, undershoot, and multiple reflection during signal transmission, and the copper foil plate capacitor The process is simple, and it is suitable for mass production in production and is low in cost. [0012] Referring to FIG. 3, the high-speed signal transmission architecture of the present invention includes a driving circuit block 100, a first receiving circuit block 200 and a second receiving circuit block 300, a main transmission line 400 and the driving circuit. The block 100, the first receiving circuit block 200, and the second receiving circuit block 300 are connected. The driving circuit block 100 includes a driving circuit 120 and a transmission branch 140. The first receiving circuit block 200 includes a receiving circuit 220 and a transmission branch 240. The second receiving circuit block 30 includes a receiving circuit 320 and a Transmission branch line 340 for transmitting 095112490 output from the drive circuit 120 Form No. A0101 Page 5 / Total 14 Pages 0993182334-0 1330425 [0014] [0016] [0017] [0018] ] 095112490 May 25, 2005, the target page is replaced by the main signal transmission line 240 and 340 for receiving the signal input from the main transmission line 4〇〇 and correspondingly sent to the corresponding receiving circuit. 220 and 320, a copper foil plate capacitor 600 is connected between the driving circuit block 100 and the main transmission line 400. The jack circuit 12 is a north bridge chip, and the receiving circuits 22 and 320 are sockets. The copper foil plate capacitor 6〇〇 has a long shape and has the same characteristics as the same capacitor. The copper foil plate capacitor 6 is printed on a printed circuit board by a conventional etching technique, and is printed on the printed circuit board. This structure is formed in place of the capacitor, achieving the same effect as the capacitor. The equivalent capacitance of the copper foil plate capacitor 6〇〇 can be calculated by the following formula
C 其中’ C表示銅箔平板電容6〇〇之等效電容量，f表示介 r. | ;； 電常數，S表示電路板上蝕刻該銅箔平板貪容6〇〇所占之 面積，k表示靜電常數，d表示印刷電路板介電質層之厚 度。 本較佳實施方式中，f = 4.20，钇=9.〇〇*l〇9N*m2/C2, d=l.(mi{r3in，所需之補償電容容量爲2〇pf。當該銅 箔平板電容600達成20pF左右電容量時，由公式：C where 'C represents the equivalent capacitance of the copper foil plate capacitor 6〇〇, f denotes the dielectric constant. S represents the area occupied by etching the copper foil plate on the circuit board, k Indicates the electrostatic constant and d represents the thickness of the dielectric layer of the printed circuit board. In the preferred embodiment, f = 4.20, 钇=9.〇〇*l〇9N*m2/C2, d=l. (mi{r3in, the required compensation capacitance is 2〇pf. When the copper foil When the plate capacitor 600 reaches a capacitance of about 20pF, the formula is:
AkTdC ε 表單編號A0101 第6頁/共14頁 0993182334-0AkTdC ε Form No. A0101 Page 6 of 14 0993182334-0
1330425 I 099年 〇5月 25^修正 [0019] [0020]1330425 I 099 〇 May 25 correction [0019] [0020]
可得其面積S大約爲6. 〇*l(T5m2即60mm2，本較佳實施方 式中該銅箔平板電容600爲長50ram、寬1. 2ram之長形。參 考圖4，爲避免傳輪線寬度之不連續變化，去除了該銅箔 平板電容600兩端之直角。 請參照圖5，其中曲線11〇代表採用2〇pF電容器傳輸電壓 爲IV脈衝訊號時之訊號波形，曲線13〇代表具有等效電容 量爲20pF之銅箔平板電容6〇〇傳輸電壓爲π脈衝訊號時 之訊號波形，由圖巾曲線11()和13G可見，制銅箱平板 電容600與採用電容器基本等效。 [0021] 請繼續參照圖6，曲線15G_動声路塊與第—及第二接 收電路塊之間未連接任何匹，配雜，即圖】中所示傳輸架 構之傳輸訊號波形圖；曲_〇爲該駆動電路塊與第一及 第二接收電路塊之間連接有補償電容器作爲匹配電路， 即圖2中所示傳輸架構之傳輪訊號波形圖；曲線18〇爲驅 動電路塊與第一及第二 電容600作爲匹配電路， 接收電·路塊之間連接有銅箔平板The radii of the copper foil plate capacitor 600 is 50 ram long and 1. 2 ram long. Referring to FIG. 4, in order to avoid the transmission line, the surface area S is approximately 6. 〇*1 (T5m2 is 60 mm2). The discontinuous change of the width removes the right angle between the two ends of the copper foil plate capacitor 600. Referring to FIG. 5, the curve 11 〇 represents the signal waveform when the voltage is 4 pulse signals transmitted by the 2 〇 pF capacitor, and the curve 13 〇 represents The signal waveform of the copper foil plate capacitor with an equivalent capacitance of 20pF is 6 〇〇 when the transmission voltage is π pulse signal. It can be seen from the curve 11() and 13G of the towel, and the copper plate capacitor 600 is basically equivalent to the capacitor. 0021] Please continue to refer to FIG. 6, the curve 15G_moving road block and the first and second receiving circuit blocks are not connected with any matching, which is the transmission signal waveform diagram of the transmission architecture shown in the figure;补偿 a compensation capacitor is connected between the swaying circuit block and the first and second receiving circuit blocks as a matching circuit, that is, a transmission signal waveform diagram of the transmission architecture shown in FIG. 2; a curve 18 〇 is a driving circuit block and the first And the second capacitor 600 as a matching circuit Connection between the copper foil flat-reception circuit block
即圖3中所示傳輸架構之傳輸訊 號波形圖。從以上高速訊及訊號波形圖 中可以看出，圖3所示高速訊號傳輸架構與圖冰示高速 訊號傳輸架構具有幾乎相同之訊號傳輪波形 ，均比圖1所 示傳輸架構之訊號衰減程核少，可有效祕訊號傳輸 過程中出現之串擾、上沖、下沖以及多重反射之問題， 且由於圖3所示傳輸架構在該等第—及第二接收電路塊 進_步減小了訊號傳輸 損耗。 [0022]上述高速訊號傳輸架構採用鋼箔平板電容6〇〇代替電容器 0993182334-0 095112490 表單編號Λ0101 第7頁/共14頁 1330425 _二 099年05月25 &梭正巷換百 達成與電容器相同之匹配效果，並且由於使用銅箔平板 電容600可有效減少訊號反射和衰減，不需要在接收端連 接終端匹配電阻，因而避免了電阻對訊號之損耗，使傳 輸訊號品質得到保障，且該銅箔平板電容工藝簡單，適 於生產製造之中大量使用，成本低廉。 [0023] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 | 【圖式簡單說明】 [0024] 圖1係習知一種高速訊號像輪架'構之方:框"圖。 [0025] 圖2係習知另一種高速訊號傳構ϋ框圖。 [0026] 圖3係本發明高速訊號傳輸架構較佳實施方式之方框圖。 [0027] 圖4係本發明高速訊號傳輸架構較佳實施方式中銅箔平板 電容之示意圖。 4 [0028] 圖5係採用銅箔平板電容與採用「電容器時傳輸訊號波形比 較圖。 [0029] 圖6係分別採用圖1、圖2及圖3中高速訊號傳輸架構時 傳輸訊號波形比較圖。 【主要元件符號說明】 [0030] [習知] [0031] 驅動電路塊：10 [0032] 驅動電路：1 2 095112490 表單編號Α0101 第.8頁/共14頁 0993182334-0 1330425 099年05月25日核正替換頁 [0033] 傳輸支線：14、24、34 [0034] 第一接收電路塊：20 [0035] 接收電路：22、32 [0036] 匹配電阻：26、36 [0037] 第二接收電路塊：30 [0038] 主傳輸線：40 [0039] • [0040] 補償電容器：50 [本發明] [0041] 驅動電路塊：100 ♦. [0042] 驅動電路：120 [0043] 傳輸支線：140、240、340 [0044] 第一接收電路塊：200 [0045] 接收電路：220、320 [0046] 第二接收電路塊：300 [0047] 主傳輸線：400 [0048] 銅箔平板電容：600 095112490 表單編號A0101 第9頁/共14頁 0993182334-0That is, the transmission signal waveform diagram of the transmission architecture shown in FIG. As can be seen from the above high-speed signal and signal waveform diagram, the high-speed signal transmission architecture shown in FIG. 3 has almost the same signal transmission waveform as the ice-high-speed signal transmission architecture, which is more than the signal attenuation process of the transmission architecture shown in FIG. The number of cores is small, which can effectively solve the problems of crosstalk, overshoot, undershoot and multiple reflections during the transmission of the secret signal, and since the transmission architecture shown in FIG. 3 is reduced in the first and second receiving circuit blocks. Signal transmission loss. [0022] The above high-speed signal transmission architecture uses a steel foil plate capacitor 6 〇〇 instead of a capacitor 0993182334-0 095112490 Form No. Λ 0101 Page 7 / Total 14 Page 1330425 _ 2 099 May 25 & Shuttle is Lane for the achievement and capacitor The same matching effect, and the use of the copper foil plate capacitor 600 can effectively reduce the signal reflection and attenuation, and does not need to connect the terminal matching resistor at the receiving end, thereby avoiding the loss of the resistor to the signal, so that the quality of the transmission signal is guaranteed, and the copper The foil plate capacitor has a simple process and is suitable for mass production in manufacturing, and has low cost. [0023] In summary, the present invention complies with the requirements of the invention patent, and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0024] FIG. 1 is a schematic diagram of a high-speed signal image wheel frame. [0025] FIG. 2 is a block diagram of another high speed signal transmission structure. 3 is a block diagram of a preferred embodiment of the high speed signal transmission architecture of the present invention. 4 is a schematic diagram of a copper foil plate capacitor in a preferred embodiment of the high speed signal transmission architecture of the present invention. [0028] FIG. 5 is a comparison diagram of a transmission signal waveform when a copper foil plate capacitor is used and a capacitor is used. [0029] FIG. 6 is a comparison diagram of transmission signal waveforms when the high-speed signal transmission architectures of FIGS. 1, 2, and 3 are respectively used. [Main component symbol description] [0030] [Practical] [0031] Drive circuit block: 10 [0032] Drive circuit: 1 2 095112490 Form number Α 0101 Page 8 / Total 14 page 0993182334-0 1330425 099 May 25th nuclear replacement page [0033] Transmission branch: 14, 24, 34 [0034] First receiving circuit block: 20 [0035] Receiving circuit: 22, 32 [0036] Matching resistance: 26, 36 [0037] Receiving circuit block: 30 [0038] Main transmission line: 40 [0039] • [0040] Compensation capacitor: 50 [Invention] [0041] Drive circuit block: 100 ♦. [0042] Drive circuit: 120 [0043] Transmission branch line: 140, 240, 340 [0044] First receiving circuit block: 200 [0045] Receiving circuit: 220, 320 [0046] Second receiving circuit block: 300 [0047] Main transmission line: 400 [0048] Copper foil plate capacitor: 600 095112490 Form No. A0101 Page 9 of 14 0993182334-0