1327705 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種穿引通孔之佈設技術，更詳而言 之铩有關於一種於差動對線進行換層佈設時對應佈設穿 引通孔之系統及方法。 【先前技術】 目前’電子工程師對於多騎刷電路板的線路佈局 (Lay〇ut)通常係藉由各類軟體程式（例如軟體）完 f其中’因差動訊號具有高速、低電壓擺幅以及低功率 f優點而受到越來越廣泛之應用，故於現有佈線設計中， 差動對線係一種較為常見之走線方式。 ^於印刷電路板之怖局過程中’某些差動對線會因 求而需於該印刷電路板執行換層佈設作業， ，經開設通孔以換層佈設時，其換 =㈣亦有可能會相應導舉例來講，= ^線自印刷電路板之頂層（TGp)轉換至第3層叫換Μ 二;:者的參考層均為第二層(叫 :而若該差㈣線自印刷電路板之頂層（〜)轉= 層⑽，相對於換層點之前走線部分之 :接地層(㈣)，換層點之後走線部分之；考層::層(二 弟7層（L7)之接地層（_)，參考層n 動 法提供一完整之回流路徑，影響訊號之傳輪品質動對線热 為解決上述因換層後參考層之改變而導致差動對線無 Π0193 5 1327705 法提供回流路徑的缺失—般於開設通孔時，還需考慮於 該通孔之周邊開設穿引通孔。f知作法—般係首先由佈線 工程師依據換層點之前後二走線部分的參考層及其參考層 屬性是否改變的情況來判斷是否f要於該差動料之換層 通孔周邊開設？引軌，且於確定需開設穿引通孔後，查 驗該換層通孔之周邊—錢圍内（例如為i(K)mii)之並他線 料設情況以確預設之最佳開設位置，以供於該預設 之最佳開設位置處開設穿引通孔。 惟，前述習知技術中’因是否需要開設穿引通孔之判 斷，以及確定預設之最佳開設位置等作業均係透過佈線工 程師以人王方式完成的’王作效率較低。另外，佈線工程 師會由於人為之疏忽可能忘記開設對應之穿引通孔，而導 致後續線路查核錯誤之因難，即使以例如設計規則查核 (Design Rule Check，DRC)報出錯誤，因轉換通孔周邊^密 佈完成其他之線路，導致無法確定預設之最佳之開設位 置’影響㈣設穿引通狀品質m操作流程繁 稷，過多人力資源所耗費時間及成本過高，對亟欲尋求生 產成本降低以增加產品競爭力的製造廠商而言，顯然是極 不合理的。 因此，如何克服上述習知技術之缺失，進而提供一種 可自動偵測差動對線於換層作業中參考層及其參考層屬性 之變化情況以據此判定是否需要開設穿引通孔，並於轉換 通孔周邊確定預設之最佳開設位置，避免習知技術中因人 為操作而造成的錯誤，簡化操作流程及節省作業時間，並 110193 61327705 IX. Description of the Invention: [Technical Field] The present invention relates to a laying-through hole laying technique, and more particularly to a corresponding routing when a differential pair is placed in a layer-by-layer arrangement System and method for through holes. [Prior Art] At present, the electronic engineer's circuit layout (Lay〇ut) for multiple rides of the circuit board is usually completed by various software programs (such as software), where the differential signal has high speed and low voltage swing. The advantages of low power f are more and more widely used. Therefore, in the existing wiring design, the differential pair is a relatively common way of routing. ^ In the process of the printed circuit board, 'some differential pairs will need to perform layer-by-layer layout on the printed circuit board. When the through hole is opened for layering, the change = (4) For example, the corresponding line of the = ^ line is switched from the top layer of the printed circuit board (TGp) to the third layer called the second layer; the reference layer of the person is the second layer (called: and if the difference (four) line is from The top layer of the printed circuit board (~) turns = layer (10), relative to the part of the trace before the layer change point: the ground plane ((4)), after the layer change point, the test layer:: layer (the second brother 7 layers ( L7) grounding layer (_), reference layer n dynamic method provides a complete return path, affecting the signal transmission quality of the signal to the line heat to solve the above-mentioned changes due to the change of the reference layer after the layer change, the differential line is flawless 0193 5 1327705 method provides the lack of return path - generally, when opening a through hole, it is also necessary to consider opening a through hole around the through hole. f knowing the law - the first is based on the wiring engineer before the second layer Whether part of the reference layer and its reference layer properties change to determine whether f is to be changed to the differential material The surrounding area is opened and the guide rail is opened. After it is determined that the through-hole is required to be opened, the periphery of the layer-through hole---in the Qianwei area (for example, i(K)mii) and the line material setting is confirmed. The best position for opening the through hole for the preset position. However, in the above-mentioned prior art, 'the judgment is made as to whether or not to open the through hole, and the best setting for the preset is established. The location and other operations are all done by the wiring engineer in the way of Wang Wang. In addition, the wiring engineer may forget to open the corresponding through-holes due to human negligence, which may cause difficulties in subsequent line check errors. Even if an error is reported by, for example, Design Rule Check (DRC), it is impossible to determine the optimal opening position of the preset by the conversion of the periphery of the through hole. (4) Setting the pass-through quality m The operation process is tedious, and too much human resources are time consuming and costly. It is obviously unreasonable for manufacturers who want to reduce production costs to increase product competitiveness. So, how? Overcoming the lack of the above-mentioned prior art, and further providing a method for automatically detecting the change of the reference layer and the reference layer property of the differential pair in the layer changing operation, thereby determining whether the through-via is required to be opened and converting The periphery of the hole determines the preset optimal position, avoiding the mistakes caused by human operation in the prior art, simplifying the operation process and saving the working time, and 110193 6
LDL / i\JJ 提巧工作之效率，實為目前亟待解決之問題。 【發明内容】 門磧 如馨於上述習知技術之缺失，本發明之主 種能於差動對線之換層佈設的過程中俾自動：，穿 引、孔以提供回流路徑予差 及方法。 & <牙引通孔之開設系統 即 法 —^ ^目的及其他’本發明提供—種穿引通孔之開 二…，4載至用以透過資料處理裝置製作印刷電路板 (崎d Clreuit Β術d，PCB)之佈線軟體中，用以提供回流 •路=予該佈線軟體所佈設之差動對線（DiffereniiaI㈣， •該牙^通孔之開設系統係包括：用以偵測透過該佈線軟體 所佈設之差動對線於該印刷電路板之轉換層數，以獲取於 ..籲線路轉換過程中5亥差動對線之參考層及其對應之參考層屬 _性的變化狀況之偵測模組；用以依據穿引通孔之開二条 件，對該偵測模組所偵測到該差動對線之參考層及其對應 之麥考層屬性之變化狀況進行分析，以判斷是否需要開設 與該差動對線對應之穿引通孔的分析模組；用以當透過該 分析模組分析得到該差動對線需開設穿引通孔時，於該差 動對線之轉換通孔周邊進行搜索以確定一預設之最佳開設 位置的位置搜索模組；以及用以於該位置搜索模組所確定 之該預設之最佳開設位置處開設所需之穿引通孔的開設模 7 110193 1327705 組。 於本發明之一種型態中，該佈線軟體係具有報告生成 模組，係周以於開設完成該穿引通孔後，對該開設結果進 行檢驗並生成一分析報告。 於本發明之一種型態中，該穿引通孔之開設條件係指 僅當該蒼考層改變以及其對應之參考層屬性不改變時，始 需要佈設與該差動對線對應之穿引通孔。且於一較佳實施 例中，該參考層屬性係例如電源層及接地層。而該穿引通 #孔復具有一與參考層屬性相對應之屬性。 本發明復提供一種穿引通孔之開設方法，該穿引通孔 之開设方法係包括：（1)偵測透過佈線軟體所佈設之差動 對線於該印刷電路板之轉換層數，以獲取於線路轉換過程 中该差動對線之參考層&其對應之參考詹屬十生的變化狀 況’（2)依據穿引通孔之開設條件，對該所偵測到該差動 對線之參考層及其對應之參考層屬性之變化狀況進行分析 鲁f判斷是否需要開設與該差動對線對應之穿引通孔，若 疋，則進至步驟（3 )，若否，則結束流程步驟；⑴於該 差動對線之轉換通孔周邊進行搜索以確定一預設之最佳^ :位置；以及（4)於該預設之最佳開設位置處開設所需之 穿引通孔，俾令該通孔提供回流路經予該差動對線 相較於習知之線路佈局技術，本發明之穿引通孔之開 5又系統及方法’係執行差動對線之換層作業B寺，預先偵測 於線路轉換過程中該差動對線之參考層及其對應之參考層 屬性是否改變，並對該變化狀況進行分析以確定是否需^ Π0193 8 1327705 開設穿51通孔’且於進行開設作 行搜:以確定-預設之最佳開設位置供= 〶以人工方式開設易耗費大量時間及效率^ 高工作效率並降低生產成本。 _之問碭，抚 * 【實施方式】 孰染此^ ^ ^ (的具財施㈣明本發明之實施方式， ·=Γ人士可由本說明書所揭示之内容輕易地瞭解 "之/、他優點及功效。本發明亦可藉由其他不同的且 3例加以施行或應用’本說明書中的各項細節亦可基 點與應用，在不㈣本發明之精神下進行各種 的二：第：圖，其係為本發明之穿引通孔之開設系統 “構方塊不意圖。該穿引通孔之開設系統“系搭載 ::透=人電腦、筆記型電腦、工作站等資料處理 》裝置執仃製作印刷電路板之佈線軟體2中，用以 路徑予該佈線軟體2所佈·^之差/、d机 H 又之差動對線。於本實施例中， =布線軟體2係可例如但;^限定為EDA、p刚等，节差 動對線係可例如但不限定為高速訊號線。 Λ 如圖所示，本發明之穿引通孔之開設系統！係包括： c〗。、分析模組12、位置搜索模組14以及開設模 該偵測模組1G係用㈣測透過佈線軟體2所佈設 對線於該印刷電路板之轉換層數，以獲取於線路轉換過 110193 9 1327705 私中該差動對線之參考層及其對應之參考層屬性的變化狀 ^於本實施例中’該差動對線係透過開設轉換通孔得以 ^換線路佈設層的。參考層係具體包括電源層及接地^。 該分析模組12係用以依據—穿引通孔之開設條件，對 該偵測额1G所_到該差動對線之參考層及宜對叙 層屬性之變化狀況進行分析以判斷是否需要開設與該 絲對線對應之穿引通孔。於本實施例中，該開設條㈣ ▲若該差動對線指轉換前後二走線部分之參考層未改變 ^不需要開設穿弓丨通孔；若該差動對線指轉換前後二走線 1之麥考層改變，且改變之二參考層之屬性亦改變，則 f需要開設穿引通孔；惟有該差動對線指轉換前後二走線 4分之荟考層改變，但改變之二參考層之參考層屬性未改 變時，始需要佈設與該差動對線對應之穿引通孔。、 川該位置搜索模組14❹以#透過該分析模㈣分析 7到該差動對線f開設穿引通孔時，於該差動對線之轉換 .通孔㈣周邊進行搜索以確定-預設之最佳開設位置。於 =_中，該預設之最佳開設位置係位於該轉換通孔周 ^ 一疋範圍内（例如為1GGmi1)、且與轉換通孔保持例如45 處。而於另一實施例中’倘若該轉換通孔周邊已 在其他之訊號走線，則可相應縮小搜索範圍（例如為 35mil)，且於後續進行適當之調整。 該開設模組16係用以於該位置搜索模組以之預# 之最佳開設位置處開設所需之穿料孔，俾令 : 提供回流路㈣該差動對線，藉㈣止該差動對線 130193 10 1327705 磁幹擾，避免於習知技術中需以人工方式開設易耗費大吾 時間及效率低下之問題，提高工作效率並降低生產成本了 此外’於本實施例之開設穿引通孔過程中，該開設模組】6 復包括提供所佈設之穿引通孔一與參考層屬性相對應的屬 性。 此外’該佈線軟體2係具有報告生成模組2〇，係用以 後續於透過該開設模組16開設完成該穿引通孔後，對該開 ，結果進行檢驗並生成一分析報告，俾供佈設工程師於後 _續作出調整。於本實施射，該檢驗係可例如為設計規則 查核（Design Rule Check，DRC)。 、透過本發明之穿引通孔之開設系統丨執行本發明之穿 引通孔之開設方法流程係如第2圖所示，本發明之穿引通 開叹方法k包括以下詳細實施步驟··於步驟，令 偵測模組10預先偵測透過佈線軟體2所佈設之差動對線於 該印刷電路板之轉換層數，以獲取於線路轉換過程中該差 鲁友之 > 考層及其對應之簽考層屬性的變化狀況。隨 後’進至步驟S202。 欠〜驟S2〇2，令該分析模組12依據-穿引通孔之開 =件’對該㈣㈣1G㈣測㈣差動對線之參考層及 之芬考層屬性之變化狀況進行分析以判斷是否需要 ^又/、該差動對線對應之穿引通孔。若是，則進至步驟 4，反之，若否，則進至步驟S綱。 鳇埴's 位置搜索杈組14於該差動對線之 轉換通孔周邊進行搜索 系以確疋—預設之最佳開設位置。隨 110193 11 後’進至步驟S206。 於步驟S206 ’令該開設模έ 所確定之子L 於該位置搜索模組14 赋B 置處開設所需之穿引通孔，並 設之穿引通孔可與參考層對應之屬性，俾提二 μ 2該差動對線’藉以防止該差動對線產生電磁幹擾。 業。於步驟通，透過佈線軟體2繼續執行其他之佈設作 鲁外復可令該該佈線軟體2之報告生成模組對 ♦_*結果進行檢驗並生成—分析報告 於後續作出調整。 m又工㈣ =續參閱第3圖，其係本發明之穿引通孔之開設方 請1 S200及S202之更詳細的步驟說明。於步驟 差動對莫組1〇預先崎過佈線軟體2所佈設之 ^ =線於該印刷電路板之轉換層數，並判斷於線路轉換 U王中該差動對線之參考層是否改變，若有改變，則進至 步驟S302;反之，若沒有改變，則進至步驟§3〇6，由分 析杈組12分析得出無需開設穿引通孔。 於v >驟S302 ’令該偵測模組1〇進—步判斷該改變之 爹考層所對應之參考層屬性是否未改變，若有改變，則轉 至步驟咖6,由分析模組12分析得出無需開設穿引通孔； 反之’若未改變’則進至步驟S3〇4。 *於/驟S304 ’令分析模組12依據上述參考層有改變 而參考層屬性未改變之變化狀況分析得到需開設穿引通 孔0 110193 12 1327705 請參閱第4圖’其係顯示本發明之穿引通孔之開設系 統及方法一應用實施例示意圖。如圖所示，差動對線4〇〇 透過佈線軟體2開設之轉換通孔41 〇而自印刷電路板3之 頂層（Top)轉換至第6層（L6)，其中，換層前之走線部分之 參考層421為第二層（L2)之接地層（GND)，而換層後之走 線部分之參考層422則轉換為第7層（L7)之接地層 (GND)，參考層改變但參考層屬性未改變。依據穿引通^ 之開δ又條件需開設穿引通孔，故於該轉換通孔"ο周邊確 鲁定預設之最佳開設位置43G以開設具有與接地層（gnd)對 應^屬性的穿引通孔44〇，俾令該穿引通孔44〇提供回流 路仏予5亥差動對線’藉以防止該差動對線4〇〇產生電磁幹 擾’提升訊號之傳輸品質。The efficiency of LDL / i\JJ's work is really an urgent problem to be solved. SUMMARY OF THE INVENTION The threshold is such that the above-mentioned prior art is absent, and the main species of the present invention can be automatically used in the process of layering the differential pair of wires: through the holes and the holes to provide the return path difference and method. . &<The opening system of the tooth through hole is the method of ^^^ and other 'the present invention provides a kind of opening through the opening of the through hole..., 4 is used to make a printed circuit board through the data processing device. Clreuit d d, PCB) wiring software for providing reflow • Road = differential wiring for the wiring software (Differeniia I (4), • The opening system of the tooth ^ through hole includes: for detecting through The differential layer disposed by the wiring software is converted to the number of layers of the printed circuit board to obtain a change in the reference layer of the 5 Hz differential pair and its corresponding reference layer _ property during the call line conversion process. The detection module of the condition is used for analyzing the change of the reference layer of the differential pair and the corresponding characteristics of the Macao layer detected by the detection module according to the condition of the opening and the opening of the through hole In order to determine whether it is necessary to open an analysis module corresponding to the through-hole corresponding to the differential pair line; when the differential pairing line needs to be opened through the analysis module, the differential hole is required to be opened. Search for the perimeter of the transition hole of the line to determine the best one. a position-searching module of the position; and a set of opening molds 71110193 1327705 for opening the required through-holes at the preset optimal opening position determined by the position searching module. In the type, the wiring soft system has a report generation module, and after the opening of the through hole is completed, the opening result is checked and an analysis report is generated. In one form of the invention, the wearing The opening condition of the through hole means that the through hole corresponding to the differential pair line needs to be disposed only when the Cang test layer is changed and the corresponding reference layer property is not changed. In a preferred embodiment, The reference layer attribute is, for example, a power layer and a ground layer, and the through hole has a property corresponding to the reference layer attribute. The present invention provides a method for opening a through hole, the through hole The method for opening the method includes: (1) detecting a number of conversion layers of the differential pair line disposed on the printed circuit board through the wiring software to obtain a reference layer of the differential pair in the line conversion process; Corresponding reference (2) According to the conditions for opening the through hole, the change of the reference layer of the differential pair and its corresponding reference layer property is analyzed. The differential pair corresponding to the through hole, if 疋, proceeds to step (3), if not, ends the process step; (1) searches the periphery of the differential through line of the differential pair to determine a preset The best ^: position; and (4) opening the required through-hole at the preset optimal opening position, so that the through-hole provides a return path to the differential pair compared to conventional The circuit layout technology, the opening and opening of the through hole 5 of the present invention and the method 'are performing the differential layering operation B temple, pre-detecting the reference layer of the differential pair in the line conversion process and Corresponding reference layer properties are changed, and the change status is analyzed to determine whether it is necessary to ^ 0193 8 1327705 to open through 51 through holes and to conduct a search: to determine the default location for the default = 〒 It is easy to spend a lot of time and efficiency by manual operation. Efficiency and reduce production costs. _ 砀 砀 抚 【 【 【 【 【 【 【 【 【 【 【 【 【 【 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ Advantages and Effects. The present invention may also be applied or applied by other different and 3 examples. The details of the present specification may also be applied to the basics and applications. In the spirit of the present invention, various kinds of two are performed: It is the opening system of the through-hole of the present invention. "The structure of the through-hole is not intended. The system for opening the through-hole" is equipped with:: through the data processing of human computers, notebook computers, workstations, etc. In the wiring soft body 2 for producing a printed circuit board, the path is applied to the difference between the wiring software 2 and the differential pair of the machine H. In the present embodiment, the wiring software 2 can be, for example, However, it is limited to EDA, p, etc., and the differential pairing system can be, for example, but not limited to, a high-speed signal line. Λ As shown in the figure, the opening system of the through-hole of the present invention includes: c. , the analysis module 12, the position search module 14 and the opening module of the detection module 1G (4) Measuring the number of conversion layers of the printed wiring board disposed on the printed circuit board by the transmission wiring software 2 to obtain a variation of the reference layer of the differential pair and its corresponding reference layer property in the line conversion 110193 9 1327705 In the embodiment, the differential pairing system is configured to change the wiring layer by opening the conversion via hole. The reference layer system specifically includes a power supply layer and a grounding layer. The analysis module 12 is used to: The condition is set, and the reference layer of the detection amount to the reference layer of the differential pair and the change of the attribute of the layer are analyzed to determine whether it is necessary to open the through hole corresponding to the pair of wires. In the embodiment, the opening strip (4) ▲ If the differential to the line finger refers to the reference layer of the two trace portions before and after the conversion is unchanged, the opening of the bow hole is not required; if the differential pair refers to the line 2 before and after the conversion The Mai Khao layer changes, and the property of the change reference layer also changes, then f needs to open through the through hole; only the differential to the line before and after the conversion of the second line 4 points of the test layer change, but the second reference When the reference layer property of the layer has not changed, it is necessary a through-hole corresponding to the differential pair is provided. The position search module 14 transmits the through-hole through the analysis mode (4) 7 to the differential pair f, and the differential pair Line conversion. The through hole (4) is searched to determine the preset optimal position. In =_, the preset optimal position is within the range of the conversion hole (for example, 1GGmi1) And maintaining, for example, 45 points with the conversion via hole. In another embodiment, 'if the periphery of the conversion via hole is already routed by other signals, the search range (for example, 35 mil) can be narrowed accordingly, and appropriate later. The opening module 16 is configured to open a required hole at the position of the position of the pre-# of the position search module, and provide: a return line (4) the differential pair line, by (4) The magnetic interference of the differential pair 130193 10 1327705 is avoided, which avoids the problem that the conventional technology needs to be manually operated and is inconvenient, and the efficiency is lowered, and the work efficiency is lowered and the production cost is reduced. In the process of the through hole, the opening module] 6 Included provides the properties of the through-holes that are routed to correspond to the properties of the reference layer. In addition, the wiring software 2 has a report generation module 2 for subsequently opening the through hole through the opening module 16, and then checking the result and generating an analysis report. The layout engineer will continue to make adjustments afterwards. For this implementation, the inspection may be, for example, a Design Rule Check (DRC). According to the opening system of the through-hole of the present invention, the flow of the method for opening the through-hole according to the present invention is as shown in FIG. 2, and the method for opening and staking the opening k of the present invention includes the following detailed implementation steps. In the step, the detection module 10 detects in advance the number of conversion layers of the differential alignment line disposed on the printed circuit board through the wiring software 2, to obtain the difference and the test layer of the difference Corresponding changes in the attributes of the signing layer. Then, the process proceeds to step S202.欠~骤S2〇2, the analysis module 12 analyzes the change of the reference layer of the differential pair and the property of the Fen test layer according to the opening of the through hole = '4' (4) 1G (four) test (4) It is required to pass the through hole corresponding to the differential pair. If yes, proceed to step 4, otherwise, if no, proceed to step S. The 鳇埴's position search group 14 searches for the periphery of the transition through hole of the differential pair to determine the best position for the preset. The process proceeds to step S206 with 110193 11 . In step S206, the sub-L determined by the opening module is opened at the position of the position search module 14 to establish a required through-hole, and the through-hole can be matched with the reference layer. Two μ 2 of the differential pair 'to prevent the differential from causing electromagnetic interference to the line. industry. In the step pass, the routing software 2 continues to perform other layouts. The report generation module of the routing software 2 can check and generate the analysis report for subsequent adjustments. m (4) = Continued to refer to Figure 3, which is the opening of the through-hole of the present invention. Please refer to the steps of S200 and S202 for more detailed steps. In the step of the differential pairing, the number of conversion layers of the circuit board disposed on the printed circuit board is determined, and it is determined whether the reference layer of the differential pair in the line switching U is changed. If there is a change, the process goes to step S302; otherwise, if there is no change, the process proceeds to step §3〇6, and it is analyzed by the analysis group 12 that it is not necessary to open the through hole. In the step S302, the detection module 1 is stepped forward to determine whether the reference layer attribute corresponding to the changed reference layer has not changed. If there is a change, the process proceeds to step 6, and the analysis module 12 analysis shows that there is no need to open the through hole; otherwise, if it has not changed, proceed to step S3〇4. * / / S304 'The analysis module 12 according to the change of the reference layer has been changed and the reference layer property has not changed, the analysis of the change of the reference layer is required to open the through hole 0 110193 12 1327705 Please refer to FIG. 4 A schematic diagram of an application embodiment of a through-hole opening system and method. As shown in the figure, the differential pair of wires 4〇〇 is switched from the top layer (Top) of the printed circuit board 3 to the sixth layer (L6) through the conversion via 41 opened by the wiring software 2, wherein the layer is moved before the layer is changed. The reference layer 421 of the line portion is the ground layer (GND) of the second layer (L2), and the reference layer 422 of the trace portion after the layer change is converted into the ground layer (GND) of the seventh layer (L7), the reference layer Changed but the reference layer properties have not changed. According to the opening and closing δ of the opening and closing, the through hole is required to be opened, so that the conversion through hole " ο surrounding the preset opening position 43G is opened to have the corresponding attribute to the ground layer (gnd) The through-via 44 穿 俾 俾 俾 俾 俾 俾 〇 〇 〇 〇 〇 〇 〇 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。
上述實施例僅為例示 不性說明本發明之原理及其功效， Π0193 13 :非用於_本_，料 變。因此，任何熟習此項技获之=事貝上仍可作其他改 之精神及範訂，對上述實_打2衫違f本發明 權利保護範圍，應如後1^改。因此本發明之 【圖式簡單說明】 h專利範圍所列。 第1圖係本發明之穿引通孔 ^/ 塊示意圖； 開仅糸統的基本架構方 圖；第2圖係本發明之穿引通孔之開設方法之流程示意 本發明之穿引通孔之開設方法之步驟議 及S202之更砰細的流程示意圖；以及 一弟4圖係、本發明之f引通孔之開設系統及方法之一廣 用實施例示意圖。 心 【主要元件符號說明】 10 \ 14 2 3 41〇 430 440 穿引通孔之開設系統 S300至S306 步驟 12 16 20 400 421 偵測模組 位置搜索模組 佈線軟體 印刷電路板 轉換通孔 預設之最佳開設位置 穿引通孔 分析模組 開設模組 報告生成模組 差動對線 422 參考層 S200至S208 步驟 110193 14The above embodiments are merely illustrative of the principles and effects of the present invention, Π 0193 13 : not used for the present invention. Therefore, any familiarity with this skill can still be used to make other changes to the spirit and scope of the book, and the scope of protection of the invention should be changed as follows. Therefore, the simple description of the present invention is listed in the scope of the patent. 1 is a schematic view of a through-hole/block of the present invention; a basic architectural diagram of a system; and FIG. 2 is a flow chart showing a method for opening a through-hole of the present invention. The steps of the method for opening the method and the more detailed flow chart of S202; and the schematic diagram of a widely used embodiment of the system and method for opening the through hole of the present invention. Heart [Main component symbol description] 10 \ 14 2 3 41〇430 440 Opening through hole opening system S300 to S306 Step 12 16 20 400 421 Detection module position search module wiring software printed circuit board conversion through hole preset The best location for the through-hole analysis module to open the module report generation module differential pair 422 reference layer S200 to S208 step 110193 14