1327607 九、發明說明： . 【發明所屬之技術領域】 . 本發明涉及一種電鑛件’尤其涉及一種防靜電之電 . 鍍件及其製造方法。 .【先前技術】 .如今微型超薄、輕巧美觀之攜帶式電子裝置越來越受 到人們之青睞，業界常通過縮小攜帶式電子裝置殼體内之 空間來滿足人們之需求。由於攜帶式電子裝置對靜電之敏 感程度和電路尺寸之大小有關，縮小攜帶式電子裝置殼體 内=空間，勢必造成電路尺寸之減小，損壞該電路上組件 所需之能量就減小。特別係人體經常帶上很高之靜電壓， 當人接觸或接近攜帶式電子裝置之金屬部件時，靜電感應 導致之瞬間放電係十分常見之。瞬間之感應電勢可達上萬 伏’直接造成攜帶式電子裝置之擊穿，燒毁。$了克服上 述缺點，一般於整機結構中採用ESD(electr〇staticstQfage 鲁巧ection }靜電茂放組件設計。所謂則靜電躲組件設 计係將重要之電子組件用靜電保護裝置隔離，該靜電保護 .裳置與撝帶式電子裝置内之接地點連接，當靜電感應引起 放電產生時將靜電電荷引入接地點洩放，從而保護重要之 -電子組件。然，為了提升攜帶式電子裝置之裝飾性，攜帶 式電子裝置外殼上出現了許多電鍍件，例如作裝飾用:電 鑛條、於攜帶式電子裝置外殼上直接鑛金屬膜或對攜帶式 電子裝置之顯示窗鏡片電鍍内金屬膜等。上述電鍍件之表 面都為金屬鍵層，如此，每個電鍍件均可能成為靜電感應 之。卩位，造成對電子裝置之電子組件毁壞之隱患。另，為 ^27607 了使上述電鍍件達到良好之防腐蝕、耐磨損及裝飾性等目 的，一般都利用鉻具有之硬度高、耐腐蝕、抗變色及表面 .易鈍化等優點，最後對該電鍍件進行鉻電鍍。而鉻鍍層之 :電阻值過大，不易導電，無法將所述電子裝置因靜電感應 .引起之靜電電荷迅速引入接地點$放，從而造成攜帶式電 •子裝置之毁壞。 因而，如何防止鉻電鍍電鍍件對攜帶式電子袭置之靜 電危害，已成為該類攜帶式電子裝置需要解決之問題。 【發明内容】 雲於上述内容’有必要提供一種防靜電、防腐姓、财 磨損及裝飾性之電鍍件。 另外，有必要提供一種所述電鍍件之製造方法。 -種電鑛件，其包括—基材、—導電層及—鉻層。該 導電層形成於該基材上，該鉻層形成於該導電層上，所述 導電層局部裸露於所述絡層。 種電錢件之製造方法，包括以下步驟： 選擇一塑膠基材； 將上述塑膠基材表面金屬化； 對上述塑膠基材電鍍銅，形成一電鍍銅層 對上述塑膠基材電鍍鎳，形成一電鑛錄層 對上述塑膠基材電麟，形成—電鍵絡^ 將上述鉻層局部去除而將該鎳層裸露。 相較習知技術，所述電錄件之絡層局部去除 裸露，而鎳和銅具有良好之導電 游、…曰 電子裝置之接地點連接，從而將靜電電荷引入接地 1327607 放’進而保護重要之電子組件。同時，由於電鑛件之 絡層僅局部去除而保留了大部分絡層，而絡且有硬产古 :::變色及表面易鈍化等優點，因而，該電二還 月b起到防腐钱、财磨損及裝飾性等目的。 【實施方式】 請參閱W及圖2,所示為本發明第一較佳實施方式 之’鍍件ίο,該電鍍件10包括一塑膠基材12、一導 IS:絡層16。該導電層U形成於該基材12上，該“ 16形成於該導電層14上。該導電層U包括金屬層142、 =144及錄層146。該金屬層142通過化學鐘鎳 鍍銅或真线料方法形成於該塑膠基材12 i。該銅層 144、錄層146及鉻㉟16依次電鍍於該塑膠基材η之金 =42上。該鉻層16將框線162以内之絡層局部去除而將 子應之鎳層面1462裸露，該裸露之鎳層面1462之面積_ 般為4平方毫米’因鎳和銅具有良好之導電性能，將該電 鐘件1〇裸露之錄層面1462與電子裝置之接地點連接（圖 未標不），從而將靜電電荷引入接地點浪放，進而 要之電子組件。 該塑膠基材12可以為聚氯乙烯、聚對苯二甲酸乙二醇 酉旨、丙烯睛-苯乙婦-丁二婦共聚合物、祕樹脂等 料。 可以理解’對於電鍍件1G，還可將祕層16和錄層 146 一起局部去除而將銅層144裸露或將該鉻層16和錄層 =6及銅層144 -起局部去除而將金屬層142裸露，將裸 路之銅層144或裸露之金屬層142與電子裝置之接地點連 1327607 接’從而將靜電電荷引人接地點沒放，進而保護重要之電 :組件。此外可以於上述裸露之鎳層面1462塗覆一層 電油墨’以提高上述裸露錦層面1462表面之对磨損性和 耐腐蝕性，該導電油墨可為酚醛樹脂、環氧樹脂等組成。 睛參閱圖3及圖4,所示為本發明第二較佳實施方式 之電鍍件20’該電鍍件20包括—金屬基材^、一導電層 24及一鉻層26。該金屬基材22可以為辞、鎮、锅、銘等。 該導電層24包括銅層242及錄層244。該銅層犯、錦層 244及鉻層26依次電鍍於該金屬基材“上。該鉻層加將 框線262以内之鉻層局部去除及該鎳層242將框線2422 以内之鎳層局部去除而將對應之鋼層面2442裸露，該裸露 之銅層面2442之面積一般為4平方毫米，因銅具有良好之 導電性能，將該電鍍件20裸露之銅層面2442與電子裝置 之接地點連接（圖未標示）’從而將靜電電荷引入接地點洩 放’進而保護重要之電子組件。 請參閱圖5所示，本發明電鍍件製造方法之較佳實施 例以製造電鍍件10為例加以說明，該製造方法包括以下步 首先選擇一塑膠基材。 提供濃度為15〜45克/升之除油藥水，該除油藥水可為 氮氧化鋼、碳酸鈉及磷酸三鈉溶液，於溫度為3〇〜5〇攝氏 度下’將上述塑膠基材浸泡6〜12分鐘對該塑膠基材進行 除油處理。. 利用軟水清洗經上述除油處理之塑膠基材，對該塑膠 基材進行水洗’將殘留於該塑膠基材之除油藥水清除。 1327607 提供濃度為180〜220毫升/升之硫酸溶液、400〜450克 /升之鉻酐溶液作為粗化劑，於溫度為60〜80攝氏度下，對 該塑膠基材進行2~10分鐘之粗化處理，將該塑膠基材表 面粗糙化，使表面具有預定之顆粒附著性。 ' 利用軟水清洗經上述粗化處理之塑膠基材，對該塑膠 •基材進行水洗，將殘留於該塑膝基材之粗化劑清除。 提供濃度為10〜20克/升之碱性藥劑，該碱性藥劑可為 氫氧化鈉，於溫度為40〜55攝氏度下，對該塑膠基材處理 馨3〜10分鐘，對該塑膠基材進行中和處理，將上述粗化處理 中所形成之酸性環境中和。 提供濃度為10〜20克/升之鈀錫合金溶液，於溫度為 40〜55攝氏度下，對該塑膠基材處理2~8分鐘，對該塑膠 基材進行活化處理，以便於經粗化處理之該塑膠基材表面 上形成一層把錫合金。 提供濃度為40〜50克/升之氫氧化鈉溶液，於溫度為 45〜55攝氏度下，對該塑膠基材浸泡2〜6分鐘進行去離子 ®處理，以便將上述活化處理中附著於該塑膠基材表面之鈀 錫合金中之錫去除，經該去離子處理後，鈀金屬以點狀分 •佈於該塑膠基材之表面上。 - 提供一化學鎳藥水，該化學鎳藥水包括20〜30克/升之 硫酸鎳、20〜30克/升之次磷酸鈉、10〜15克/升之氣化銨， 於溫度為35〜45攝氏度下，對該塑膠基材浸泡3〜8分鐘， 對該塑膠基材進行化學鍍鎳，以便將鎳金屬置於上述點狀 分佈之鈀金屬之間，使僅有鈀金屬點狀分佈之該塑膠基材 表面轉變成表面為面狀之，由鈀和鎳組成之金屬膜層。 1327607 利用軟水清洗上述塑膠基材，對該塑膠基材進行水 洗，將殘留於該塑膠基材之藥水清除，料去離子藥水、 化學鎳藥水。 . 冑該塑膠基材與钱陰極相接，將銅棒與電鑛陽極相 接，並將該塑膠基材與該銅棒浸泡於硫酸銅電解液中。接 .通該電鑛陰極和陽極電源，進行銅電鍍，於該塑膠基材上 形成-電鐘銅層。由於於銅電鑛過程中易產生銅粉，銅粉 進/入電鍍液後會引起朗層㈣，可將該銅棒用陽極布包 •住後再與電嫂陽極相接，防止銅粉進入硫酸銅電解液。 將上述銅棒換成鎳棒，並將該塑膠基材與該鎳棒浸泡 於硫酸鎳電解液中，進行錄電鑛，於上述電鏡銅詹上形成 一電鍍鎳層。 將上述鎳棒換成鉻棒，並將該塑膠基材與該鉻棒浸泡 於硫酸鉻電解液中，進行鉻電鑛，於上述電鍍鎳層上形成 一電錢鉻層。 φ 利用軟水清洗經上述電鍍處理之塑膠基材，對該塑膠 基材進行水洗，將殘留於該塑膠基材之電鍍液清除，並烘 乾該塑膠基材。 、 將上述塑膠基材之電鍍鉻層局部去除，去除之方法可 .以採用鐳射雕刻、化學蝕刻及電化學蝕刻中之一種。 從該塑膠基材進行粗化處理到該塑膠基材進行化學鍍 鎳處理，一般稱為塑膠基材表面金屬化，主要係因為塑膠 基材為非導艟，故於電鍍作業前需於塑膠基材表面形成一 層金屬層，從而將不導電之塑膠基材變為導電，最終實現 電鍍。 、 11 1327607 故可以理解’當選用金屬為電鍍件基材時，由於金屬 本身具有導電性，因而，可以省去上述塑膠基材表面金屬 化，直接對金屬基材進行鍍銅、鍍鎳及鍍鉻處理，於金屬 :基材表面依次形成電鍍銅層、電鍍鎳層及電鍍鉻層，並將 .該鉻層局部去除而將該鎳層裸露。 綜上所述，本發明符合發明專利要件，爰依法提出專 利申f。惟，以上所述者僅為本發明之較佳實施例，本發 明m不以上述實施例為限，舉凡熟習本案技藝之人 援依本發明之精神所作之等效修飾或變化，皆應涵蓋於 以下申請專利範圍内。 【圖式簡單說明】 圖1係本發明第一較佳實施方式之電鍛件之俯視圖； 圖2係圖1中所述之電鍍件沿A_A線之剖示圖； 圖3係本發明第二較佳實施方式之電錢件之俯視圖； 圖4係圖3中所述之電鍍件沿B_B線之剖示圖； • «5係製造本發明第一較佳實施方式之電鍍件之流程 【主要組件符號說明】 電鍍件 塑膠基材 導電層 金屬層 铜層 錄層 10、20 12 14、24 142 144 、 242 146、244. 12 1327607 鎮層面 1462 鉻層 16 ' 26 框線 162、2422、262 金屬基材 22 銅層面 24421327607 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to an electric ore member', and more particularly to an antistatic electric device, a plated member and a method of manufacturing the same. [Prior Art] Today's ultra-thin, lightweight and beautiful portable electronic devices are becoming more and more popular, and the industry often meets the needs of people by reducing the space inside the casing of portable electronic devices. Since the degree of sensitivity of the portable electronic device to static electricity is related to the size of the circuit, reducing the internal space of the portable electronic device will inevitably result in a reduction in the size of the circuit, and the energy required to damage the components on the circuit is reduced. In particular, the human body often carries a high static voltage. When a person touches or approaches a metal component of a portable electronic device, an instantaneous discharge caused by electrostatic induction is very common. The instantaneous induced potential can reach tens of thousands of volts, which directly causes the breakdown of the portable electronic device and burns. Overcoming the above shortcomings, ESD (electr〇staticstQfage) is used in the structure of the whole machine. The so-called electrostatic hiding component design isolates important electronic components with electrostatic protection devices. The skirt is connected to the grounding point in the strap-type electronic device, and when the electrostatic induction causes the discharge to be generated, the electrostatic charge is introduced into the grounding point to bleed, thereby protecting the important electronic component. However, in order to improve the decorativeness of the portable electronic device, A number of electroplated parts appear on the outer casing of the portable electronic device, for example, for decoration: an electric ore strip, a direct metal film on the outer casing of the portable electronic device, or a metal film for plating the display window lens of the portable electronic device. The surface of the parts is a metal bond layer, so that each of the plated parts may become electrostatically induced. The position is caused by the destruction of the electronic components of the electronic device. In addition, the plated parts are well protected against corrosion. For the purpose of wear resistance and decoration, chromium is generally used for high hardness, corrosion resistance, discoloration resistance and surface. The advantages of passivation, etc., finally chrome plating of the plated part. The chrome plating layer: the resistance value is too large, it is not easy to conduct electricity, and the electrostatic charge caused by the electrostatic induction of the electronic device cannot be quickly introduced into the grounding point, thereby causing portable electricity. • Destruction of sub-devices. Therefore, how to prevent the electrostatic hazard of chrome electroplating parts from portable electronic devices has become a problem that needs to be solved in such portable electronic devices. [Summary of the Invention] Anti-static, anti-corrosion surname, wealth wear and decorative plating parts. In addition, it is necessary to provide a manufacturing method of the electroplated parts. - An electro-chemical component comprising - a substrate, a conductive layer and a - chromium layer. a conductive layer is formed on the substrate, the chrome layer is formed on the conductive layer, and the conductive layer is partially exposed to the layer. The manufacturing method of the electric money piece comprises the following steps: selecting a plastic substrate; Metalizing the surface of the plastic substrate; electroplating copper on the plastic substrate to form an electroplated copper layer, electroplating nickel on the plastic substrate to form an electric recording layer The plastic substrate is formed by electro-bonding, and the above-mentioned chromium layer is partially removed to expose the nickel layer. Compared with the prior art, the layer of the electro-recording member is partially removed from the bare layer, and the nickel and copper have a good conductive tour. , ... the grounding point of the electronic device is connected, so that the electrostatic charge is introduced into the ground 1327607 to protect the important electronic components. At the same time, most of the layers are retained because the layer of the ore component is only partially removed, and there is Hard-produced ancient::: discoloration and easy surface passivation, etc., therefore, the electric second is also used for anti-corrosion money, wealth wear and decoration, etc. [Embodiment] Please refer to W and Figure 2, which shows In the first preferred embodiment of the present invention, the plating member 10 includes a plastic substrate 12 and a conductive IS layer 16. The conductive layer U is formed on the substrate 12, and the "16" is formed thereon. On the conductive layer 14. The conductive layer U includes a metal layer 142, = 144, and a recording layer 146. The metal layer 142 is formed on the plastic substrate 12 i by a chemical clock nickel plating or a true wire method. The copper layer 144, the recording layer 146 and the chromium 3516 are sequentially plated on the plastic substrate η gold = 42. The chrome layer 16 partially removes the layer within the frame line 162 to expose the nickel layer 1462 of the sub-portion, and the area of the exposed nickel layer 1462 is generally 4 mm 2 'because nickel and copper have good electrical conductivity, The electric clock unit 1 is connected to the grounding point of the electronic device (not shown), so that the electrostatic charge is introduced into the grounding point, and the electronic component is required. The plastic substrate 12 may be a polyvinyl chloride, a polyethylene terephthalate, a acrylonitrile-styrene-butanyl dimer, a secret resin or the like. It can be understood that for the plated part 1G, the secret layer 16 and the recording layer 146 may be partially removed together to expose the copper layer 144 or the chromium layer 16 and the recording layer = 6 and the copper layer 144 may be partially removed to remove the metal layer. The 142 is exposed, and the bare copper layer 144 or the exposed metal layer 142 is connected to the grounding point of the electronic device 1327607, thereby placing the electrostatic charge on the grounding point, thereby protecting the important electricity: components. In addition, a layer of electro-ink can be applied to the exposed nickel layer 1462 to improve the wear resistance and corrosion resistance of the surface of the bare metal layer 1462. The conductive ink can be composed of a phenol resin or an epoxy resin. Referring to Figures 3 and 4, there is shown a plated member 20' of a second preferred embodiment of the present invention. The plated member 20 comprises a metal substrate, a conductive layer 24 and a chrome layer 26. The metal substrate 22 can be a word, a town, a pot, a name, or the like. The conductive layer 24 includes a copper layer 242 and a recording layer 244. The copper layer, the brocade layer 244 and the chrome layer 26 are sequentially plated on the metal substrate. The chrome layer is partially removed from the chrome layer within the frame line 262 and the nickel layer 242 is partially exposed to the nickel layer within the frame line 2422. The corresponding steel layer 2442 is exposed, and the exposed copper layer 2442 is generally 4 square millimeters. Since the copper has good electrical conductivity, the bare copper layer 2442 of the plating member 20 is connected to the grounding point of the electronic device ( The figure is not shown) 'and thus electrostatic charge is introduced into the ground point to bleed out' to protect important electronic components. Referring to FIG. 5, a preferred embodiment of the method for manufacturing an electroplated part of the present invention is described by taking the electroplated part 10 as an example. The manufacturing method comprises the following steps: first selecting a plastic substrate. Providing a degreasing syrup having a concentration of 15 to 45 g/liter, the degreasing syrup may be a nitrogen oxide steel, a sodium carbonate or a trisodium phosphate solution at a temperature of 3 〇. ~5〇 degrees Celsius' soak the plastic substrate for 6~12 minutes to degrease the plastic substrate. Use soft water to clean the plastic substrate treated by the above degreasing treatment, and wash the plastic substrate' The degreasing solution is left on the plastic substrate. 1327607 A sulfuric acid solution having a concentration of 180 to 220 ml/liter and a chromic anhydride solution of 400 to 450 g/liter are provided as a roughening agent at a temperature of 60 to 80 degrees Celsius. The plastic substrate is subjected to a roughening treatment for 2 to 10 minutes, and the surface of the plastic substrate is roughened to have a predetermined particle adhesion. The plastic substrate subjected to the above roughening treatment is cleaned with soft water, and the plastic is applied to the plastic substrate. • The substrate is washed with water to remove the roughening agent remaining on the plastic knee substrate. The alkaline agent is provided at a concentration of 10 to 20 g/liter, and the alkaline agent can be sodium hydroxide at a temperature of 40 to 55. The plastic substrate is treated with Celsius for 3 to 10 minutes, and the plastic substrate is subjected to a neutralization treatment to neutralize the acidic environment formed in the above roughening treatment. Palladium having a concentration of 10 to 20 g/liter is provided. The tin alloy solution is treated at a temperature of 40 to 55 degrees Celsius for 2 to 8 minutes, and the plastic substrate is activated to form a layer of tin on the surface of the plastic substrate after roughening treatment. Alloy. Provides a concentration of 40~50 g / The sodium hydroxide solution is immersed in the plastic substrate at a temperature of 45 to 55 degrees Celsius for 2 to 6 minutes for deionization treatment to adhere the above-mentioned activation treatment to the palladium tin alloy on the surface of the plastic substrate. The tin is removed, and after the deionization treatment, the palladium metal is spotted on the surface of the plastic substrate. - A chemical nickel syrup is provided, and the chemical nickel syrup comprises 20 to 30 g/liter of nickel sulfate, 20 ~30 g / l of sodium hypophosphite, 10 ~ 15 g / l of vaporized ammonium, at a temperature of 35 ~ 45 ° C, soak the plastic substrate for 3 to 8 minutes, the plastic substrate is electroless nickel plating In order to place the nickel metal between the palladium metals of the above-mentioned point distribution, the surface of the plastic substrate having a palladium-like point distribution is converted into a metal film layer composed of palladium and nickel. 1327607 The plastic substrate is washed with soft water, and the plastic substrate is washed with water to remove the syrup remaining on the plastic substrate, and the deionized syrup and the chemical nickel syrup are prepared. The plastic substrate is connected to the cathode of the money, the copper rod is connected to the anode of the electric ore, and the plastic substrate and the copper rod are immersed in the copper sulfate electrolyte. The copper electroplating is performed on the cathode and anode power sources of the electric ore to form a copper layer on the plastic substrate. Since copper powder is easily generated during the copper electro ore process, the copper powder will enter the plating solution and cause a layer (4). The copper rod can be wrapped with an anode cloth and then connected to the electric anode to prevent copper powder from entering. Copper sulfate electrolyte. The copper rod is replaced with a nickel rod, and the plastic substrate and the nickel rod are immersed in a nickel sulfate electrolyte to conduct electric recording, and an electroplated nickel layer is formed on the electron microscope copper. The nickel rod is replaced with a chrome rod, and the plastic substrate and the chrome rod are immersed in a chromium sulphate electrolyte to perform chrome ore, and a chrome layer is formed on the electroplated nickel layer. φ The plastic substrate subjected to the above plating treatment is cleaned with soft water, the plastic substrate is washed with water, the plating solution remaining on the plastic substrate is removed, and the plastic substrate is dried. The method of partially removing the chromium plating layer of the plastic substrate may be performed by using one of laser engraving, chemical etching and electrochemical etching. The roughening treatment from the plastic substrate to the plastic substrate for electroless nickel plating is generally referred to as the surface metallization of the plastic substrate, mainly because the plastic substrate is non-conductive, so it is required to be in the plastic base before the plating operation. A metal layer is formed on the surface of the material to convert the non-conductive plastic substrate into electrical conductivity, and finally to achieve electroplating. 11 1327607 It can be understood that 'When metal is used as the substrate for electroplating, since the metal itself has electrical conductivity, the surface metallization of the above plastic substrate can be omitted, and the metal substrate can be directly plated with copper, nickel and chrome. The metal layer is sequentially formed on the surface of the substrate: an electroplated copper layer, an electroplated nickel layer, and an electroplated chromium layer, and the chromium layer is partially removed to expose the nickel layer. In summary, the present invention complies with the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and the present invention is not limited to the above-described embodiments, and equivalent modifications or variations made by those skilled in the art in light of the spirit of the present invention should be covered. It is within the scope of the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view of an electric forging member according to a first preferred embodiment of the present invention; FIG. 2 is a cross-sectional view of the electroplated member illustrated in FIG. 1 taken along line A_A; FIG. 4 is a cross-sectional view of the electroplated member illustrated in FIG. 3 along line B_B; • «5 is a process for manufacturing the electroplated member of the first preferred embodiment of the present invention [main components Explanation of Symbols] Plating Parts Plastic Substrate Conductive Layer Metal Layer Copper Layer Recording Layer 10, 20 12 14, 24 142 144, 242 146, 244. 12 1327607 Town Level 1462 Chromium Layer 16 ' 26 Frame Line 162, 2422, 262 Metal Base Material 22 copper layer 2442
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