TWI326452B - Method for detecting word line leakage in memory devices - Google Patents

Method for detecting word line leakage in memory devices Download PDF

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TWI326452B
TWI326452B TW96132334A TW96132334A TWI326452B TW I326452 B TWI326452 B TW I326452B TW 96132334 A TW96132334 A TW 96132334A TW 96132334 A TW96132334 A TW 96132334A TW I326452 B TWI326452 B TW I326452B
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Taiwan
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word line
memory
leakage
word
word lines
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TW96132334A
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Chinese (zh)
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TW200910361A (en
Inventor
Han Sung Chen
Su Chueh Lo
Chun Hsiung Hung
Nai Ping Kuo
Ming Chih Hsieh
Wen Pin Tsai
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Macronix Int Co Ltd
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Description

三達編號:TW369卯A 九、發明說明: 【發明所屬之技術領域】 本發明是有關於一 1C) ’且特別是有關於一 方法與裝置。 種積體電路(integrated circuit, # IC記憶體元件之漏電流測試之 【先前技術】 第_1圖疋-種傳統的記憶體元件的功能方塊圖。如第 1圖所不’心^體凡件1〇〇包括一字元線電源產生器⑼ 及數個zfell 11G、ill.....119,且字元線電源產生器 1〇1係分職接至各個記憶區。其中在記憶體操作時,字 元線電源產生H 101會提供字元線所需之電愿,例如是讀 取操作所需之讀取電壓位準。就一般所熟知地,記憶體元 件中往往會存在有漏電狀態,而其往往係藉由監測記憶體 元件耗電量,以判別此漏電狀態。然而,在傳統技術上仍 是有諸多限制與不便,所以目前實亟待一種記憶體漏電測 試之改良技術。 【發明内容】 本發明是有關於一種積體電路(integrated circuit, IC),且特別是有關於一種ic記憶體元件之漏電流測試之 方法與裝置。本發明僅透過實例而提出監測記憶體元件中 微電流(cell current)的技術,藉以偵測由製程缺陷所造成之 字元線漏電狀態。除此之外,本發明之應用範圍非常廣 1326452Sanda number: TW369卯A IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a 1C)' and particularly relates to a method and apparatus. Integral circuit (integrated circuit, # IC memory device leakage current test [prior art] Figure _1 - a functional block diagram of a traditional memory device. As shown in Figure 1, the heart is not The device 1 includes a word line power generator (9) and a plurality of zfell 11G, ill.....119, and the word line power generator 1〇1 is connected to each memory area. In operation, the word line power supply H 101 will provide the desired power of the word line, such as the read voltage level required for the read operation. As is well known, there is often leakage in the memory element. State, which often judges the leakage state by monitoring the power consumption of the memory component. However, there are still many limitations and inconveniences in the conventional technology, so an improved technique for memory leakage testing is currently required. SUMMARY OF THE INVENTION The present invention relates to an integrated circuit (IC), and more particularly to a method and apparatus for leakage current testing of an ic memory device. The present invention provides a monitoring memory component only by way of example.Current (cell current) technique, thereby detecting a state of the word-line leakage defects caused by the process. In addition, the scope of application of the present invention is extremely wide 1,326,452

三麵號:TW3699PA 記憶體元件中其他漏電狀態之 泛,其例如可以應用於 測試。 、本發月提出種相記憶體元件中字元線漏電的方 法本方法包括輕接記憶體元件中多條第一字元線至一電 壓源亚耦接錢體元件中多條第二字元線至一接地位準 雪,宜·中名^個繁一r、 八 —予元線係毗鄰於此些第一字元線其中 之一對應第一字元狳。丄 ^ 本方法包括等待一第一預定時間, 使此些第一字元線得Three-sided: TW3699PA The other leakage state in the memory component, which can be applied, for example, to testing. The method for extracting word line leakage in a phase memory component is provided by the present invention. The method comprises: connecting a plurality of first word lines in a memory component to a plurality of second word lines in a voltage source sub-coupled body component To the grounding level of quasi-snow, Yi · Zhongming ^ a complex r, eight - Yu Yuan line adjacent to the first character line one of which corresponds to the first character 狳.丄 ^ The method includes waiting for a first predetermined time to make the first character lines

听从達到預定電壓位準,此預定電壓位 準例如是記憶體讀取柽# 上 麵作所需之字元線電壓位準。並且, 在此些子元線達到預定電壓位準之後,將此些第一字元線 與電壓源分離。其次,經過一第二預定時間,使此些第一 字元線得以放電。此時,字元線電壓位準將會因本質漏電 (intrinsic leakage)或是夕卜部漏電(extrinsic leakage)而下 降,此本質漏電例如是接面漏電(junction leakage),而外 部漏電例如是製程缺陷(process defect)。之後,本方法包 括偵測對應此些第一字元線之記憶體元件電流,並將此電 流與一預定參考電流進行比較。此預定參考電流是用來鑑 別對應此些第一字元線之漏電狀態。本方法更包括判定此 字元線漏電狀態是否存在’舉例來說’若俄测到的電流係 低於預定參考電流,則判定此字元線漏電狀態存在。本實 施例之實例’即如第1〇-丨3圖所示。 此些第一字元線和此些第二字元線係選自於記憶體 元件之一記憶陣列’此記憶陣列例如是透過一陣列選擇開 關輕接至電壓源。如第2圖所示’各個第〜字元線及各個 叫¢)452The listener reaches a predetermined voltage level, such as the desired word line voltage level above the memory read 柽#. And, after the sub-element lines reach a predetermined voltage level, the first word lines are separated from the voltage source. Second, the first word line is discharged after a second predetermined time. At this time, the word line voltage level will decrease due to intrinsic leakage or extrinsic leakage, such as junction leakage, and external leakage is, for example, process defect ( Process defect). Thereafter, the method includes detecting a memory component current corresponding to the first word lines and comparing the current to a predetermined reference current. The predetermined reference current is used to identify the leakage state corresponding to the first word lines. The method further includes determining whether the word line leakage state exists. For example, if the current measured by the Russian system is lower than the predetermined reference current, it is determined that the word line leakage state exists. An example of this embodiment is shown in Figures 1 - 3 . The first word line and the second word line are selected from a memory array of a memory element. The memory array is, for example, lightly coupled to a voltage source via an array select switch. As shown in Fig. 2, 'each of the first word lines and each screaming number 452'

二達編號:TW3699PA ^二字元線皆包括一字元線驅動裝置,此字元線驅動裝置 •是係耦接至電壓源或接地位準電壓,其例如是使用習知技 、 術中已知之解碼電路(dec〇ding circuit)。如第1〇七圖所厂、 之實例中,此些第一字元線包括記憶體元件之多條偶數= 疋線,此些第二字元線包括記憶體元件之多條奇數字元子 ' 線。偵測電流之步驟包括執行一記憶體讀取操作,以測定 • 對應耦接此些第—字元線之記憶體元件電流。其中用於測 試之參數係使用在特定的測試狀況下,舉例來說,在選擇 其第二預定時間時,係依據對應此些第一字元線之電壓能 得以放電,予以能鑑別其字元線漏電狀態。根據漏電偵測 標準及字元線之電容’其第二預定時間係約為丨微秒(# s e c) 至200微秒。在選擇其預定參考電流時,係高於對應此些 第子元線之本貝漏電流(intrinsic leakage current),且 合乎於感測放大器之操作範圍。此預定參考電流例如約為 10微安培(# A)。 根據另一貫施例’本發明提出一種偵測記憶體元件中 字兀線漏電的方法,其中記憶體元件包括多條字元線。本 方法包括選擇s己憶體元件之多條字元線其中之一作為一 第一子元線,並且耦接記憶體元件之此第一字元線至電壓 源’並將記憶體凡件中其餘的字元線接地。本方法包括等 待-第-預定時間,使此第一字元線得以達到預定讀取電 壓位準。本方法包括將此第一字元線與電壓源分離,並輕 接此第一字το線至一浮接電壓端(fl〇ating v〇hage terminal),經過一第二預定時間’使此第一字元線得以放 8Erda number: TW3699PA ^The two-character line includes a word line driving device, which is coupled to a voltage source or a ground level voltage, which is known, for example, using conventional techniques and known in the art. Decoding circuit (dec〇ding circuit). In the example of the first, seventh figure, the first word line includes a plurality of even numbers of memory elements = 疋 lines, and the second word lines include a plurality of odd digital elements of the memory element. 'Line. The step of detecting current includes performing a memory read operation to determine a memory component current corresponding to the first word line. The parameters used for testing are used under specific test conditions. For example, when the second predetermined time is selected, the voltage corresponding to the first word lines can be discharged, and the characters can be identified. Line leakage state. According to the leakage detection standard and the capacitance of the word line, the second predetermined time is about 丨 microseconds (# s e c) to 200 microseconds. When the predetermined reference current is selected, it is higher than the intrinsic leakage current corresponding to the first sub-line and conforms to the operating range of the sense amplifier. This predetermined reference current is, for example, about 10 microamperes (# A). According to another embodiment, the present invention provides a method of detecting leakage of a word line in a memory device, wherein the memory element includes a plurality of word lines. The method includes selecting one of a plurality of word lines of the suffix element as a first sub-element, and coupling the first word line of the memory element to the voltage source 'and The remaining word lines are grounded. The method includes waiting for a -first predetermined time for the first word line to reach a predetermined read voltage level. The method includes separating the first word line from the voltage source, and lightly connecting the first word το line to a floating voltage terminal (f〇ating v〇hage terminal), and after a second predetermined time A word line can be placed 8

三麵號:TW3699PA 電。本方法包括偵測對應此第一字元線之記憶體元件電 流,並且將此電流與一預定參考電流進行比較,藉以驗明 一字元線漏電狀態,此預定參考電流是用來鑑別一字元線 漏電狀態。本方法更包括判定此字元線漏電狀態是否存 在。在此實施例中,此些字元線係透過一陣列選擇開關耦 接至電壓源。耦接第一字元線至電壓源之步驟包括導通一 字元線選擇開關。在此實施例中,耦接第一字元線至浮接 電壓端之步驟包括耦接第一字元線至一關閉狀態的金氧 半場效電晶體(MOSFET)之一端。再根據漏電偵測標準及 字元線之電容,其第二預定時間係約為1微秒(// sec)至200 微秒。其預定參考電流約為10微安培(//A)。本實施例之 實例,即如第14-17圖所示。 根據再一實施例,本發明提出一種偵測記憶體元件中 字元線漏電的方法。本方法包括耦接記憶體元件中一條或 多條字元線至一電壓源,並耦接前述一條或多條字元線所 毗鄰之至少一對應字元線至一接地電壓。本方法包括等待 一第一預定時間,使前述一條或多條字元線得以達到預定 讀取電壓位準之後,將前述一條或多條字元線與電壓源分 離。本方法包括等待一第二預定時間,使前述一條或多條 字元線得以放電。然後,將對應前述一條或多條字元線之 電壓與一參考電壓進行比較,其中此參考電壓是用來鑑別 對應前述一條或多條字元線之一字元線漏電狀態。本方法 更包括判定此字元線漏電狀態是否存在。如第5圖所示, 記憶體元件包括一開關元件及一比較器電路。此開關元件 1326452Three-face number: TW3699PA electricity. The method includes detecting a memory component current corresponding to the first word line, and comparing the current with a predetermined reference current to verify a word line leakage state, wherein the predetermined reference current is used to identify a word The leakage state of the yuan line. The method further includes determining whether the word line leakage state exists. In this embodiment, the word lines are coupled to the voltage source via an array select switch. The step of coupling the first word line to the voltage source includes turning on a word line select switch. In this embodiment, the step of coupling the first word line to the floating voltage terminal includes coupling one of the first word line to a closed state of a metal oxide half field effect transistor (MOSFET). According to the leakage detection standard and the capacitance of the word line, the second predetermined time is about 1 microsecond (//sec) to 200 microseconds. Its predetermined reference current is approximately 10 microamperes (//A). An example of this embodiment is shown in Figures 14-17. According to still another embodiment, the present invention provides a method of detecting leakage of word lines in a memory device. The method includes coupling one or more word lines in the memory element to a voltage source, and coupling at least one corresponding word line adjacent to the one or more word lines to a ground voltage. The method includes waiting for a first predetermined time to separate the one or more word lines from the voltage source after the one or more word lines have reached a predetermined read voltage level. The method includes waiting for a second predetermined time to cause the one or more of the word lines to be discharged. Then, the voltage corresponding to the one or more word lines is compared with a reference voltage, wherein the reference voltage is used to identify a leakage state of one of the one or more word lines. The method further includes determining whether the word line leakage state exists. As shown in FIG. 5, the memory component includes a switching component and a comparator circuit. This switching element 1326452

三達編號:TW3699PA 係回應一記憶體漏電測試指令訊號,以耦接記憶體元件之 一條或多條字元線至電壓源或比較器電路。此實施例中, 記憶體元件包括多個記憶陣列,更包括對應各個記憶陣列 之一開關元件及一比較器電路。各個開關元件係回應一記 憶體漏電測試指令訊號,以耦接對應記憶陣列之一條或多 條字元線至電壓源或比較器電路。本實施例之實例,即如 第4-9圖所示。 在與傳統技術相較之下,本發明具有諸多優點。舉例 來說,本發明技術之方法較傳統技術更便於使用,本發明 實施例之方法於傳統技術難以進行偵測的條件下,可進行 偵測記憶體之字元線漏電狀態。本發明之技術可以透過比 較記憶體讀取電流及預定參考電流,以偵測字元線漏電狀 態,並且可以偵測多條字元線或單一條字元線所對應之漏 電狀態。或者可以藉由監測字元線電壓位準,以測試字元 線漏電狀態。於此,關於上述本發明所具備之優點將詳細 說明於下文之說明書中,使本發明將更明顯易懂。 為讓本發明之上述内容能更明顯易懂,下文特舉一些 較佳實施例,並配合所附圖式,作詳細說明如下: 【實施方式】 本發明是有關於一種積體電路(integrated circuit, IC),且特別是有關於一種1C記憶體元件之漏電流測試之 方法與裝置。本發明僅透過實例而提出監測記憶體元件中 微電流(cell current)的技術,藉以债測由製程缺陷所造成之 10 1326452Sanda number: TW3699PA responds to a memory leakage test command signal to couple one or more word lines of a memory component to a voltage source or comparator circuit. In this embodiment, the memory component includes a plurality of memory arrays, and further includes a switching element corresponding to each of the memory arrays and a comparator circuit. Each of the switching elements is responsive to a memory leakage test command signal to couple one or more word lines of the corresponding memory array to the voltage source or comparator circuit. An example of this embodiment is shown in Figures 4-9. The present invention has many advantages over conventional techniques. For example, the method of the present invention is more convenient to use than the conventional technology. The method of the embodiment of the present invention can detect the leakage state of the word line of the memory under the condition that the conventional technology is difficult to detect. The technique of the present invention can detect the word line leakage state through the comparison memory read current and the predetermined reference current, and can detect the leakage state corresponding to the plurality of word lines or the single word line. Alternatively, the word line leakage state can be tested by monitoring the word line voltage level. Here, the advantages of the present invention will be described in detail in the following description, and the present invention will be more apparent. In order to make the above-mentioned contents of the present invention more comprehensible, the following detailed description of the preferred embodiments and the accompanying drawings will be described in detail as follows: [Embodiment] The present invention relates to an integrated circuit (integrated circuit) , IC), and in particular, a method and apparatus for leakage current testing of a 1C memory component. The present invention proposes, by way of example only, a technique for monitoring a cell current in a memory element, whereby the debt measurement is caused by a process defect 10 1326452

三達編號·- TW3699PA 字元線漏電狀態。除此之外,本發日月之應用範圍非常廣 .泛,其例如可以應用於IC記憶體元件中其他漏電狀態之 測試。 •'如前述所參考之第1圖中記憶體元件⑽,傳統上常 猎由監測其裝置之電源耗損量’ Μ測記憶體之漏電狀 • g。然而,根據本發明之實施例,記憶體元件往往會有本 _ f漏電之情況,其例如是由固有的雉面漏電流(junction leakage c_nt)所造成。而像是待機漏電流 零ieakawent)之類的某種程度的漏電流往往是可以接 受的。相對之下’由缺陷所造成之漏電狀態則有進行鑑別 之必要。其乃因於漏電路後存在有〜高阻抗的情況下,由 缺陷所造成之漏電流係會比本質漏電流大。於傳統的技術 上仍無法區分本質漏電狀態與缺陷所造成之漏電狀態。因 此’目前實亟待-種記憶體漏電㈣之改良技術。 第2圖及第3圖是依照本發明〜實施例之記憶體元件 之字元線漏電狀態的簡化圖。此中圖式僅用以舉例說明, 並非用以限定文中專射請範圍之範_,且此技術領域之 通常知識者應當瞭解其可作各種之更動與潤倚。並且,如 各圖式中有相似標號及元件應為本發明技術領域之通常 知識,係不再贅述其功能。請參照第2圖,其繪示依照本 發明一只%例之s己憶體元件的簡化示意圖。如第2圖所 示,§己fe'體元件200包括一個或多個記憶陣列,記憶陣列 例如是記憶區(Sector) 0、…、記憶區(Sect〇r) n,即為 210 ..... 290。舉例來說,記憶區210包括一字元線驅動 1326452Sanda number ·- TW3699PA Word line leakage state. In addition, the application range of this issue is very wide. For example, it can be applied to the test of other leakage states in IC memory components. • 'The memory component (10) in Figure 1 referenced above is traditionally hunted by monitoring the power loss of its device' to detect the leakage of the memory • g. However, according to an embodiment of the present invention, the memory element tends to have a leakage current, which is caused, for example, by an inherent junction leakage c_nt. A certain level of leakage current, such as standby leakage current (zero ieakawent), is often acceptable. In contrast, the leakage state caused by defects is necessary for identification. This is because when there is a high impedance after the leakage circuit, the leakage current caused by the defect is larger than the essential leakage current. In the conventional technology, it is still impossible to distinguish the leakage state caused by the essential leakage state and the defect. Therefore, there is an improved technology for memory leakage (4). Fig. 2 and Fig. 3 are simplified diagrams showing the leakage state of the word line of the memory element in accordance with the embodiment of the present invention. The drawings are for illustrative purposes only and are not intended to limit the scope of the scope of the application, and those of ordinary skill in the art should understand that they can make various changes and modifications. In addition, similar reference numerals and elements in the drawings should be the ordinary knowledge in the technical field of the present invention, and the functions thereof will not be described again. Referring to Figure 2, there is shown a simplified schematic diagram of a s-remember element of a % example in accordance with the present invention. As shown in FIG. 2, the ="fe' body element 200 includes one or more memory arrays, such as a memory area (Sector) 0, ..., a memory area (Sect〇r) n, ie 210 ... .. 290. For example, memory area 210 includes a word line driver 1326452

三達編號:TW3699PA 器211、字元線WL 0 (212)、字元線驅動器213及字元線 WLO (214)。字元線驅動器211耦接於字元線212,字元 . 線驅動器213耦接於字元線214。一陣列選擇開關222耦 .. 接至記憶區0.....記憶區N,陣列選擇開關222例如是 • 一金氧半場效電晶體(MOSFET)。在第2圖中,陣列選擇 - 開關222回應一指令訊號SECB時,而將記憶區〇..... . 記憶區N連接至一電壓源PWR(220)。 請參照第3圖,其繪示依照本發明一實施例之記憶體 鲁 元件300於漏電狀態的簡化示意圖。如第3圖所示,字元 線驅動器311耦接於字元線312,字元線驅動器313麵接 於予元線314。在第3圖中’其顯示字元線312所對應之 兩個漏電路徑,其中一個漏電路徑是存在於字元線312和 基板(substrate)之間,另一個漏電路徑是存在於字元線312 和與其毗鄰的字元線314之間。傳統技術於偵測漏電狀態 時,係透過一測試器(tester),以監測供應電壓至接地端的 籲 漏電流。然而,在某些情況下,此漏電流是不會超過字元 線驅動益之本質漏電,比如是字元線驅動器之接面漏電。 舉例來*兑,若有一向阻抗路徑存在於這些字元線之間時, 則此漏電流將是可比得上字元線之接面漏電。其次,以傳 統的測試方法偵測字元線漏電狀態是否存在是較為困難 的。因此,目前實亟待一種記憶體漏電測試之改良技術。 第4圖疋依照本發明一實施例之記憶體元件於漏電 測試的簡化示意圖。此中圖式僅用以舉例說明,並非用以 限定文中專利申請範圍之範轉,且此技術領域之通常知識 12 1326452Sanda number: TW3699PA 211, word line WL 0 (212), word line driver 213, and word line WLO (214). The word line driver 211 is coupled to the word line 212, and the line driver 213 is coupled to the word line 214. An array selection switch 222 is coupled to the memory area 0..... memory area N, and the array selection switch 222 is, for example, a gold oxide half field effect transistor (MOSFET). In Fig. 2, the array selection - switch 222 responds to a command signal SECB and connects the memory area 〇..... memory area N to a voltage source PWR (220). Referring to FIG. 3, a simplified schematic diagram of the memory device 300 in a leakage state in accordance with an embodiment of the present invention is shown. As shown in FIG. 3, the word line driver 311 is coupled to the word line 312, and the word line driver 313 is coupled to the pre-element 314. In FIG. 3, 'the two leakage paths corresponding to the word line 312 are displayed. One of the leakage paths exists between the word line 312 and the substrate, and the other leakage path exists in the word line 312. Between the word line 314 adjacent thereto. The conventional technology detects a leakage current through a tester to monitor the leakage current from the supply voltage to the ground. However, in some cases, this leakage current will not exceed the essential leakage of the word line driver benefit, such as the junction leakage of the word line driver. For example, if there is a path of impedance between the word lines, then the leakage current will be comparable to the junction leakage of the word line. Secondly, it is more difficult to detect the existence of the leakage state of the word line by the traditional test method. Therefore, there is an urgent need for an improved technique for memory leakage testing. Figure 4 is a simplified schematic diagram of a memory component in a leakage test in accordance with an embodiment of the present invention. The drawings are for illustrative purposes only and are not intended to limit the scope of the patent application, and the general knowledge of the technical field 12 1326452

三達編號:TW3699PA 者應當瞭解其可作各種之更動與潤飾。如第4圖所示,記 憶體元件400包括數個記憶區〇、…、記憶區n,即為 • 410 ..... 490。舉例來說,記憶區410包括一字元線驅動 •.器411、字元線412、字元線驅動器413及字元線414。字 . 元線驅動器411輕接於字元線412,字元線驅動器413搞 . 接於字元線414。一陣列選擇開關422耦接至記憶區 .0.....記憶區N,陣列選擇開關422例如是一 MOSFET。 在第4圖之實施例中,陣列選擇開關422是一 p型通道之 鲁 M0SFET裝置(PM0S),其閘極端連接至一接地電壓位準 (GND)。記憶體元件400亦包括一電源42〇、一比較器電 路430及一測試開關元件421。測試開關元件421係依照 一指令訊號(未繪示)將此些記憶區連接至電源42〇或比較 器電路430之一輸入端432。於此實施例中,本發明提出 一種測試記憶體400的方法。此方法包括利用測試開關元 件421將包含§己憶區〇、…、記憶區n之記憶陣列連接至 鲁 电源420於一預定時間,藉以使記憶陣列中之已選擇的字 元線得以充電至一電壓位準PWR,此電壓位準pWR例如 是一讀取電壓位準(Read level)。在測試狀態之下,這些毗 鄰的字元線係分別地施加偏壓於電源之電廢位準(pwR)或 接地位準(GND)。以第4圖舉例來說,字元線412連接於 電壓位準PWR,字元線414連接於接地位準GND。其次, 剛試開關元件421將記憶陣列連接至比較器電路43〇之輸 入端432。接著,於一特定時間使此些字元線之電壓得以 故電後’此些字元線之電壓位準係於輸入端432與一參考 13 1326452Sanda number: TW3699PA should understand that it can be used for various changes and retouching. As shown in Fig. 4, the memory element 400 includes a plurality of memory areas, ..., memory areas n, which are ... 410 ..... 490. For example, memory area 410 includes a word line driver 411, word line 412, word line driver 413, and word line 414. The word line driver 411 is lightly connected to the word line 412, and the word line driver 413 is connected to the word line 414. An array selection switch 422 is coupled to the memory area .0..... memory area N, and the array selection switch 422 is, for example, a MOSFET. In the embodiment of Figure 4, array select switch 422 is a p-channel MOSFET device (PM0S) whose gate terminal is connected to a ground voltage level (GND). The memory component 400 also includes a power supply 42A, a comparator circuit 430, and a test switching component 421. The test switching element 421 connects the memory areas to the power source 42 or one of the input terminals 432 of the comparator circuit 430 in accordance with a command signal (not shown). In this embodiment, the present invention provides a method of testing memory 400. The method includes connecting the memory array including the memory area n, ..., memory area n to the power source 420 for a predetermined time by using the test switching element 421, thereby charging the selected word line in the memory array to a The voltage level PWR, which is, for example, a read voltage level. In the test state, these adjacent word lines are respectively biased to the power waste level (pwR) or ground level (GND) of the power supply. For example, in Figure 4, word line 412 is coupled to voltage level PWR and word line 414 is coupled to ground level GND. Next, the just-tested switching element 421 connects the memory array to the input terminal 432 of the comparator circuit 43A. Then, after the voltages of the word lines are deactivated at a specific time, the voltage levels of the word lines are tied to the input terminal 432 and a reference 13 1326452.

三達編號:TW3699PA 電壓位準Vref(431)進行比較。於是,即可判別其漏電狀 態。此方法之細節將詳細說明於後。 第5圖是依照本發明另一實施例之記憶體元件於漏 電測試的示意圖。此中圖式僅用以舉例說明,並非用以限 定文中專利申請範圍之範疇,且此技術領域之通常知識者 應當瞭解其可作各種之更動與潤飾。如第5圖所示,記憶 體元件500係相似於記憶體元件400。在第5圖中,記憶 體元件500之各個記憶區皆包括一陣列選擇開關及一測試 開關元件。舉例來說,一陣列選擇開關522及一測試開關 元件521,一陣列選擇開關524及一測試開關元件523係 對應在記憶區N (即590),此些測試開關元件係分別將這 些記憶區連接至電源520或比較器電路530之輸入端 532。於此實例中,本發明提出一種測試記憶體500的方 法,其係相似於上述第4圖所說明之方法,其相似處不再 贅述。測試記憶體500的方法包括在這些記憶陣列充電至 一讀取電壓位準後,使其得以放電,並且與一參考電壓位 準Vref進行比較。由於,各記憶區均具有一陣列選擇開關 及一測試開關元件,所以各記憶區係可以各別地進行測 試。 第6圖是依照本發明一實施例之記憶體元件之字元 線漏電測試方法的示意圖。在第6圖中,記憶區510..... 590係已充電至一某程度讀取電壓位準,且連接至比較器 電路530之輸入端532。以下將搭配第7圖及第8圖詳細 說明其判別漏電狀態之方法。 14 1326452Sanda number: TW3699PA Voltage level Vref (431) for comparison. Thus, the leakage state can be discriminated. The details of this method will be described in detail later. Figure 5 is a schematic illustration of a memory component in a leakage test in accordance with another embodiment of the present invention. The drawings are for illustrative purposes only, and are not intended to limit the scope of the patent application, and those of ordinary skill in the art will recognize that the invention can be modified. As shown in Figure 5, memory component 500 is similar to memory component 400. In Figure 5, each memory region of memory component 500 includes an array select switch and a test switch component. For example, an array selection switch 522 and a test switching element 521, an array selection switch 524 and a test switching element 523 correspond to the memory area N (ie, 590), and the test switching elements respectively connect the memory areas. To power supply 520 or input 532 of comparator circuit 530. In this example, the present invention provides a method of testing memory 500 that is similar to the method illustrated in Figure 4 above, and similarities thereof are not described again. The method of testing memory 500 includes causing the memory arrays to be discharged after being charged to a read voltage level and compared to a reference voltage level Vref. Since each memory area has an array selection switch and a test switching element, each memory area can be individually tested. Figure 6 is a schematic diagram of a word line leakage test method for a memory device in accordance with an embodiment of the present invention. In Figure 6, memory areas 510..... 590 are charged to a certain level of read voltage level and are coupled to input 532 of comparator circuit 530. The method for discriminating the leakage state will be described in detail below with reference to Figs. 7 and 8. 14 1326452

三達編號:TW3699PA 第7圖是第5圖及第6圖之字元線漏電測試方法的示 意圖。如第7圖所示,電容740 (Ct()tal)代表字元線於測試 時所對應之總電容量。在第7圖中,其字元線係已充電至 一預定電壓位準而準備放電的時候,而圖中虛線I leakage 所 標註的部分係代表一潛在的漏電流路徑742。第8圖是第 5圖及第6圖之字元線漏電測試方法之電壓與時間的座標 圖,其係隨著電壓於放電時以電壓位準對時間做圖。以第 8圖舉例來說,實線803代表具有本質接面漏電之記憶陣 列於電壓隨時間放電時的曲線,虛線804代表同時具有字 元線漏電狀態與本質接面漏電之記憶陣列於電壓隨時間 放電時的曲線。最初的時候,實線803和虛線804皆位於 電壓801。於一預定時間805 (即第8圖之Detection time) 後,虛線804則降低至實線803之下,此象徵著字元線漏 電狀態的影響。於是,可以於一預定時間(Detecting time)805時,比較字元線電壓位準與參考電壓位準802, 以鑑別其漏電狀態。在本發明之實施例中,此參考電壓位 準802及預定時間805是可以隨欲監測之漏電狀態而擇定 變化的。 第9圖是依照本發明一實施例之記憶體元件之字元 線漏電測試方法的流程圖。此中圖式僅用以舉例說明,並 非用以限定文中專利申請範圍之範臂,且此技術領域之通 常知識者應當瞭解其可作各種之更動與潤飾。請參照第9 圖,其方法可以簡短地條列如下。 1.(步驟910)耦接字元線至電壓源; 15 1326452Sanda number: TW3699PA Figure 7 is a schematic diagram of the leakage test method for the character line in Figures 5 and 6. As shown in Figure 7, capacitor 740 (Ct()tal) represents the total capacitance of the word line corresponding to the test. In Fig. 7, when the word line is charged to a predetermined voltage level and ready to be discharged, the portion indicated by the broken line I leakage in the figure represents a potential leakage current path 742. Figure 8 is a graph showing the voltage versus time of the word line leakage test method of Figures 5 and 6, which plots the voltage level versus time as the voltage is discharged. For example, in FIG. 8, a solid line 803 represents a curve of a memory array having an essential junction leakage when the voltage is discharged with time, and a broken line 804 represents a memory array having a word line leakage state and an essential junction leakage at the same time. The curve when the time is discharged. Initially, the solid line 803 and the dashed line 804 are both at voltage 801. After a predetermined time 805 (i.e., the Detection time of Figure 8), the dashed line 804 is lowered below the solid line 803, which is indicative of the effect of the leakage state of the word line. Thus, the word line voltage level and the reference voltage level 802 can be compared at a predetermined time 805 to identify the leakage state. In an embodiment of the invention, the reference voltage level 802 and the predetermined time 805 are selectively variable with the leakage state to be monitored. Figure 9 is a flow chart showing a method of character line leakage test of a memory device in accordance with an embodiment of the present invention. The drawings are for illustrative purposes only and are not intended to limit the scope of the patent application, and those skilled in the art will recognize that the invention can be modified. Please refer to Figure 9, the method can be briefly listed as follows. 1. (Step 910) coupling the word line to the voltage source; 15 1326452

' 三達編號:TW3699PA - 2.(步驟920)等待字元線達至讀取電壓位準; 3.(步驟930)分離字元線與電壓源; • 4.(步驟940)等待字元線放電; * · 5.(步驟950)比較字元線電壓及參考電壓;以及 . 6.(步驟960)判別字元線漏電狀態。 以下將搭配第4-8圖詳細說明第9圖所示之方法。在 步驟910中,其方法包括耦接記憶體元件中之一條或多條 • 字元線至一電壓源。依第4-6圖之實施例中,此些字元線 % 係可以不同的方式來擇定。以第4圖之記憶體元件400舉 一例來說,欲從各記憶區裡選擇一字元線時,係利用開關 元件421將記憶區0之字元線412.....直至記憶區N之 字元線492均連接至電壓源420。以第5圖之記憶體元件 500舉另一例來說,欲從其中之一記憶區裡選擇一字元 線,以進行漏電流測試時,係利用開關元件521將記憶區 0之字元線512連接至電壓源520,以進行測試,並於其 後接連地測試至記憶區N之字元線592。然而,在第6圖 ® 所示之另一實例中,其可以同時選擇超過一個字元線,以 進行測試。這些已選擇的字元線例如係耦接至電壓源 PWR,此電壓源PWR即為第4圖之420及第5圖之520。 根據第4-6圖之實施例,其方法包括將已選擇的字元線所 赴鄰之某些字元線接地,藉以有效地測試字元線相互之間 的漏電狀態。在步驟920中,此步驟包括等待一第一預定 時間,使一條或多條字元線得以達到一預定讀取電壓位 進。此預定電壓位準例如是記憶體操作之讀取電壓位準 16 1326452'Sanda number: TW3699PA - 2. (Step 920) Wait for the word line to reach the read voltage level; 3. (Step 930) separate the word line and voltage source; • 4. (Step 940) Wait for the word line Discharge; * · 5. (Step 950) compare the word line voltage and the reference voltage; and 6. (Step 960) discriminate the word line leakage state. The method shown in Fig. 9 will be described in detail below with reference to Figs. 4-8. In step 910, the method includes coupling one or more of the memory elements to a voltage source. In the embodiment of Figures 4-6, such word line % can be selected in different ways. For example, in the memory device 400 of FIG. 4, when a word line is to be selected from each memory area, the word line 412..... of the memory area 0 is switched to the memory area N by the switching element 421. The word line 492 is connected to a voltage source 420. In another example, the memory element 500 of FIG. 5 is to select a word line from one of the memory areas for the leakage current test, and the word line 512 of the memory area 0 is used by the switching element 521. Connected to voltage source 520 for testing, and subsequently tested to word line 592 of memory region N in succession. However, in another example shown in Figure 6, it is possible to select more than one word line at the same time for testing. These selected word lines are, for example, coupled to a voltage source PWR, which is 420 of FIG. 4 and 520 of FIG. According to the embodiment of Figures 4-6, the method includes grounding certain word lines to which the selected word line is to be adjacent, thereby effectively testing the leakage state between the word lines. In step 920, the step includes waiting for a first predetermined time to cause the one or more word lines to reach a predetermined read voltage level. The predetermined voltage level is, for example, the read voltage level of the memory operation 16 1326452

• 號:TW3699PA (Read level)’其當然也可以是其它合適的㉞ 驟930中’其方法包括分離字元線與電麵。其次牛 驟940中,其方法包括於等待—第二預定時間:、使字元ς 得以放電。之後,在㈣95G巾,其方法“將對應字元• No.: TW3699PA (Read level)' It can of course be other suitable 34 steps 930' The method includes separating the word line and the electrical plane. Next, in step 940, the method includes waiting - a second predetermined time: to cause the character ς to be discharged. After that, in the (four) 95G towel, the method "will correspond to the character

線之-電巧:參考電麵行比較,此參考Μ是用來鑑 別已選擇的字7G線所對應之字元線漏電狀態。其中,比較 方法可以透過-比較H電路進行,此峨器電路例如是第 4圖之43G及第5圖之53〇。即為第8圖之參考電壓曲線 802,其可以用來鑑別漏電狀態。在步驟96〇中,其方法 係判別字π線漏電狀態是否存在。如第8圖所示,在時間 805之後,放電曲線804表示有一條或多條字元線於測試 時所對應之漏電流係大於參考字元線之曲線8〇3。 綜上所述,不同的測試參數是用在不同的測試狀況。 例如於測試時,用於使字元線得以充電之第—與第二預定 時間,或例如是根據實驗所測定之參考電壓位準與參考電 流位準。根據漏電偵測標準與字元線之電容,其第二預定 時間係約為1微秒(a sec)至200微秒。在選擇其預定參考 電流時,係南於對應那些第一字元線之本質漏電流,且合 乎於感測放大器之操作範圍。此預定參考電流約為1 〇微 安培(#A)。此中參數當然可作其他變動與修改。 根據本發明之一實施例,由上述步驟中提出一種债測 字元線漏電的方法。以其步驟總括而言,此方法包括使已 選擇的字元線充電、等待字元線放電、以及監測字元線之 電壓以判別其漏電狀態。對於其他變動與修改,如是增加 17 1326452Line-Calculation: Refer to the electrical line comparison. This reference is used to identify the leakage state of the word line corresponding to the selected 7G line. The comparison method can be performed by a comparison-H circuit, for example, 43G of Fig. 4 and 53A of Fig. 5. This is the reference voltage curve 802 of Figure 8, which can be used to identify the leakage state. In step 96, the method discriminates whether or not the word π line leakage state exists. As shown in Fig. 8, after time 805, the discharge curve 804 indicates that one or more of the word lines have a leakage current corresponding to the curve 8 〇 3 of the reference word line. In summary, different test parameters are used in different test situations. For example, during testing, the first predetermined time for charging the word line, or for example, the reference voltage level and the reference current level determined according to the experiment. According to the leakage detection standard and the capacitance of the word line, the second predetermined time is about 1 microsecond (a sec) to 200 microseconds. When selecting its predetermined reference current, it is south of the fundamental leakage current corresponding to those first word lines and is in accordance with the operating range of the sense amplifier. This predetermined reference current is approximately 1 〇 microamperes (#A). Of course, other parameters can be changed and modified. According to an embodiment of the present invention, a method of leakage of a debt test word line is proposed by the above steps. In summary, the method includes charging the selected word line, waiting for the word line to discharge, and monitoring the voltage of the word line to determine its leakage state. For other changes and modifications, if it is increased 17 1326452

' 三達編號·· TW3699PA ' 步驟、減少一個或多個步驟、以及變動一個或多個步驟之 次序,皆應視為文中專利申請範圍之範疇。本方法之詳細 • 說明係記載於說明書全文,為讓本方法能更明顯易懂,其 * - 詳細說明如下。 . 第10圖是依照本發明另一實施例之記憶體元件於漏 電測試的示意圖。此中圖式僅用以舉例說明,並非用以限 定文中專利申請範圍之範疇,且此技術領域之通常知識者 • 應當瞭解其可作各種之更動與潤飾。如第10圖所示,記 鲁 憶體元件1000包括一個或多個記憶陣列,記憶陣列例如 是第10圖之記憶區0 (即1010)。記憶區1010包括多條字 元線及多個字元線驅動器,其中各條字元線均耦接於一個 字元線驅動器。舉例來說,字元線驅動器1011耦接於字 元線1012,字元線驅動器1013耦接於字元線1014。一陣 列選擇開關1022耦接至記憶區1010及一電源1020,陣列 選擇開關1022例如是一 MOSFET。陣列選擇開關1022係 回應一指令訊號(即第10圖之SEC0B)時,而將記憶區1010 • 連接至一電源1020。在第10圖之實施例中,記憶體元件 可以包括多個記憶陣列,且記憶陣列區分為多個記憶區 (Sector)。於此實施例中,記憶區係可以連接至一特定的陣 列選擇開關。亦可以有兩個或兩個以上的記憶體陣列連接 至一個陣列選擇開關。 第11圖是依照本發明另一實施例之字元線漏電測試 方法的時間狀態圖。此中圖式僅用以舉例說明,並非用以 限定文中專利申請範圍之範疇,且此技術領域之通常知識 1326452The 'Sanda Number·· TW3699PA' step, the reduction of one or more steps, and the order in which one or more steps are changed shall be considered as the scope of the patent application in the text. Details of the method • The description is described in the full text of the specification, in order to make the method more obvious and easy to understand, its * - detailed description is as follows. Figure 10 is a schematic illustration of a memory component in a leakage test in accordance with another embodiment of the present invention. The illustrations are for illustrative purposes only and are not intended to limit the scope of the patent application, and the general knowledge of the technical field should be understood as a variety of changes and refinements. As shown in Fig. 10, the memory element 1000 includes one or more memory arrays, such as memory area 0 (i.e., 1010) of FIG. The memory area 1010 includes a plurality of word lines and a plurality of word line drivers, wherein each of the word lines is coupled to a word line driver. For example, the word line driver 1011 is coupled to the word line 1012, and the word line driver 1013 is coupled to the word line 1014. An array of select switches 1022 is coupled to the memory region 1010 and a power supply 1020. The array select switch 1022 is, for example, a MOSFET. The array select switch 1022 is coupled to a power supply 1020 in response to a command signal (ie, SEC0B in FIG. 10). In the embodiment of Fig. 10, the memory element may comprise a plurality of memory arrays, and the memory array is divided into a plurality of sectors. In this embodiment, the memory area can be connected to a particular array select switch. It is also possible to have two or more memory arrays connected to an array selection switch. Figure 11 is a timing diagram showing the word line leakage test method in accordance with another embodiment of the present invention. The drawings are for illustrative purposes only and are not intended to limit the scope of the scope of the patent application, and the general knowledge of the technical field 1326452

. 三編號:TW3699PA ' 者應當瞭解其可作各種之更動與潤飾。以下將搭配第1〇 圖之把憶裝置1000說明本方法。本方法包括啟動指令訊 •號SEC0B以連接記憶陣1010至電源1020於一預定時間, * * 使記憶陣列中已選擇的字元線得以充電達至一電壓位準 * PWR,此電壓位準PWR例如是一讀取電壓位準(Read Level)。在一較佳的測試狀況下,這些毗鄰的字元線係分 別地施加偏壓於電源之電壓位準(pWR)或接地位準 .(GND)。以第10圖舉例來說,將偶數字元線連接至pwR, • b匕如字元線WL 0 (即1012),將奇數字元線連接至GND, 比如1元線WL1 (即1014)。當已選擇的字元線(即偶數字 兀線)等待一時間Tdelayl而充電至預定電壓位準(如第n圖 之1^&(11^\^1)之後(如第11圖之£、£]^^^曲線),移除指 令訊號SEC0B(如第11圖於T1時移除SEC〇B),使陣列選 擇開關1022由’ΌΝ”切至”〇ff”,並等待一段時間使字元 線電壓放電,此段時間即為第π圖中虛線T1與虛線T2 之間標記的範圍。其次,以指令訊號READEN啟動一記 憶體讀取操作。本實施例之方法細節將詳情說明於後。 第12圖是依照本發明一實施例之字元線漏電測試方 法的IV曲線圖。此中圖式僅用以舉例說明,並非用以限 定文中專利申請範圍之範疇,且此技術頜域之通常知識者 應當瞭解其可作各種之更動與潤飾。如第12圖所示,其 係以記憶陣列之讀取電流與字元線電壓做圖。位置A代表 字το線電壓位於最大讀取電壓位準(即第12圖之Read Level)時之讀取電流。位置b代表字元線電壓因本質接面 19 1326452. Three number: TW3699PA ' should understand that it can be used for a variety of changes and retouching. The method will be described below with reference to the device 1000 of the first drawing. The method includes activating the command signal number SEC0B to connect the memory array 1010 to the power source 1020 for a predetermined time, ** enabling the selected word line in the memory array to be charged up to a voltage level * PWR, the voltage level PWR For example, a read voltage level (Read Level). Under a preferred test condition, these adjacent word lines are biased to the voltage level (pWR) or ground level (GND) of the power supply, respectively. For example, in Figure 10, the even digital line is connected to pwR, • b such as word line WL 0 (i.e., 1012), and the odd digital line is connected to GND, such as 1-ary line WL1 (i.e., 1014). When the selected word line (ie, even digital line) waits for a time Tdelayl and charges to a predetermined voltage level (such as 1^&(11^\^1) in Figure n (as shown in Figure 11) , £]^^^ curve), remove the command signal SEC0B (as shown in Figure 11 at T1 to remove SEC〇B), make the array selection switch 1022 cut from 'ΌΝ' to "〇ff", and wait for a while The word line voltage is discharged, and this period is the range marked between the broken line T1 and the broken line T2 in the πth figure. Secondly, a memory reading operation is started by the command signal READEN. The details of the method of this embodiment will be described in detail. Figure 12 is an IV graph of a character line leakage test method according to an embodiment of the present invention. The drawings are for illustrative purposes only and are not intended to limit the scope of the patent application scope herein. The general knowledge should understand that it can be used for various changes and retouching. As shown in Figure 12, it is based on the read current of the memory array and the word line voltage. Position A represents the word το line voltage is at the maximum reading. Read current at voltage level (ie, Read Level in Figure 12). Position b Table wordline voltage due to the nature of surface 191326452

三達編號:TW3099PA 漏電而些許降低時所對應之微電流(cell current) IB。位置C 代表字元線電壓因像是缺陷造成字元線漏電而大量降低 時所對應之微電流Ic。在此實施例中,參考電流位準Iref 是用來鑑別字元線漏電狀態,若讀取電流小於Iref時,則 可以鑑別其具字元線漏電之狀態。此中參數當然係可作其 他變動與修改。以下將搭配第10-13圖詳細說明其測試字 元線漏電狀態之方法。 第13圖是依照本發明另一實施例之記憶體元件之字 元線漏電測試方法的流程圖。此中圖式僅用以舉例說明, 並非用以限定文中專利申請範圍之範疇,且此技術領域之 通常知識者應當瞭解其可作各種之更動與潤飾。請參照第 13圖,其方法可以簡短地條列如下。 1. (步驟1310)連接已選擇的字元線至供應電壓; 2. (步驟1320)等待已選擇的字元線達至預定讀取電 壓位準; 3. (步驟1330)分離字元線與電壓源; 4. (步驟1340)等待字元線放電; 5. (步驟1350)偵測對應字元線之電流; 6. (步驟1360)比較偵測到的電流以及參考電流; 7. (步驟1370)判別字元線漏電狀態。 在步驟1310中,其方法包括耦接記憶體元件中之多 條第一字元線至一電壓源,並耦接記憶體元件中之多條第 二字元線至一接地位準電壓,其中各個第二字元線係毗鄰 於此些第一字元線其中之一對應第一字元線。根據本發明 {亡 20Sanda number: TW3099PA The cell current IB corresponding to the leakage and a slight decrease. The position C represents the microcurrent Ic corresponding to the word line voltage due to a large drop in the word line leakage caused by the defect. In this embodiment, the reference current level Iref is used to identify the word line leakage state. If the read current is less than Iref, the state of the word line leakage can be identified. Of course, the parameters are for other changes and modifications. The method for testing the leakage state of the word line will be described in detail below with reference to Figures 10-13. Figure 13 is a flow chart showing a method of character line leakage test of a memory element in accordance with another embodiment of the present invention. The drawings are for illustrative purposes only and are not intended to limit the scope of the scope of the patent application, and those of ordinary skill in the art will recognize that various modifications and changes can be made. Please refer to Figure 13, the method can be briefly listed as follows. 1. (Step 1310) connect the selected word line to the supply voltage; 2. (Step 1320) Wait for the selected word line to reach the predetermined read voltage level; 3. (Step 1330) Separate the word line and Voltage source; 4. (Step 1340) Wait for the word line to discharge; 5. (Step 1350) Detect the current of the corresponding word line; 6. (Step 1360) Compare the detected current with the reference current; 7. (Step 1370) Discriminate the word line leakage state. In step 1310, the method includes coupling a plurality of first word lines in the memory element to a voltage source, and coupling the plurality of second word lines in the memory element to a ground level voltage, wherein Each of the second character line lines adjacent to one of the first word lines corresponds to the first word line. According to the invention {20

達編號:TW3699PA 1〇 =例,此些字滅係可藉由不_方式來擇定。以第 體元舉例來說,記憶區中偶數字元線 ^接^制’記憶W奇財元_接於接地位準電 在第10財,已選擇的字元線係純至㈣源pwR ( P 02G)。—在㈣測中,其㈣包括等待—第一預定 (例如前述之Td邮),使第—字元線得以達到一預定 2電壓位準。此預定電壓位準例如可以是記憶體操作之 靖取電壓位準,即為第u圖之偶數字元線(evenwl)所 對應之讀取電壓位準(ReadLevel),《當然也可以是其它合 適的電壓㈣。在步驟⑽巾,其㈣包括分離字元線 與電廢源。其次’在步驟mG,其步驟包括於等待一第二 預定時間(如第11 ®之Τι至了2),使字元線得以放電。之 後’在步驟135G,其方法包㈣測已選擇的字元線所對應 之電"IL在步驟1360,其方法包括將偵測到的電流及參考 電流進行比較。此參考電流是用來鑑別對應第一字元線之 字=線漏電狀態。在步驟丨,,此方法係卿字元線漏電 狀態是否存在。舉例來說’如第12圖所示,如若偵測到 的電二低於參考電⑧Iref,則可鑑別其有—外部漏電狀態。 练上所述,不同的測試參數是用在不同的測試狀況。 例如於測試時,用於使字元線得以充電之第一與第二預定 時間,或例如是根據實驗所測定之參考電壓位準與參考電 流位準。在實例中,根據漏電偵測標準與字元線之電容, 其第一預疋陪間係約為}微秒(# sec)至微秒。選擇其 預定參考電流時,係高於對應那些第—字元線之本質漏電 21Number: TW3699PA 1〇 = For example, these words can be selected by not using the method. For example, in the case of the voxel, the even digital line in the memory area is connected to the memory of the memory. In the 10th fiscal year, the selected character line is pure to (4) the source pwR ( P 02G). - In (4), (4) includes waiting - the first predetermined (e.g., the aforementioned Td) to enable the first word line to reach a predetermined 2 voltage level. The predetermined voltage level may be, for example, the voltage level of the memory operation, that is, the read voltage level (ReadLevel) corresponding to the even digital line (evenwl) of the u-th image, "of course, it may be other suitable Voltage (four). In step (10), the (4) includes a separate word line and an electrical waste source. Next, at step mG, the steps include waiting for a second predetermined time (e.g., 11th to 11th) to cause the word line to be discharged. Thereafter, in step 135G, the method package (4) measures the power corresponding to the selected word line "IL in step 1360, the method comprising comparing the detected current with the reference current. This reference current is used to identify the word = line leakage state corresponding to the first word line. In step 丨, this method is the existence of the leakage state of the word line. For example, as shown in Fig. 12, if the detected electric 2 is lower than the reference electric 8Iref, it can be identified as having an external leakage state. As described above, different test parameters are used in different test situations. For example, during testing, the first and second predetermined times for charging the word line, or for example, the reference voltage level and the reference current level determined according to the experiment. In the example, according to the leakage detection standard and the capacitance of the word line, the first pre-emphasis is about [microseconds (#sec) to microseconds. When the predetermined reference current is selected, it is higher than the essential leakage of the corresponding first-character line.

三達編號:TW3699PA 流,且合乎於感測放大器之操 為10微安培(“)。此中參二:預定參考電流約 根據上述之實施例,由可作其他變動與修改。 4步驟中提出一種偵測字元 線漏電的方去。以其步驟總 J子凡 的字元線充電、等待字元線放電:=,已選擇 時所對應之電流以判別及侧子元線於測試 改,如是増加減;^對於其他變動與修 或多個步驟之次序,^視2=個步驟、以及變動一個 本方法之詳細說明專利中請範圍之範缚。 明顯易懂,其詳==明書全文,為讓本方法能更 1方;!51是依財發明再—實制之字元線漏電測 ⑽。此中圖式僅用以舉例說明,並非用以限 庫举睁解=2範圍之範4’且此技術領域之通常知識者 ^田瞭解其可作各種之更動與潤飾。帛14圖是依照本發 之《己It體元件於漏電測試的示意圖。記憶體元件刚〇 *了“有單獨測試字元線能力之外,其係與記憶體元件 夕000相似。如第14圖所示,記憶體元件14GG包括-個或 :個。己隐陣列’記憶陣列例如是記憶區0(即1410)。記憶 ^ 1410包括多條字元線及多個字元線驅動器,其中各條 子元線均耦接於一個字元線驅動器。舉例來說,字元線驅 動器ΗΠ耦接於字元線測試選擇裝置,此字元線測試選 擇裝置包括一 PMOS電晶體1412及一 NMOS電晶體 1413 ’藉以回應指令訊號WLSEL ’並包括一 NMOS電晶 體1414 ’藉以回應指令訊號WLFLOATB。一陣列選擇開 {' S > 22 1326452Sanda number: TW3699PA flow, and the operation of the sense amplifier is 10 microamperes ("). This reference 2: the predetermined reference current is about according to the above embodiment, and can be made other changes and modifications. A method for detecting the leakage of a word line is charged by the word line of the total J, and waiting for the word line to be discharged: =, the current corresponding to the selected current is determined by the discrimination and the side sub-line is tested. If it is 増 addition and subtraction; ^ for other changes and repairs or the order of multiple steps, ^ 2 = a step, and a change in the details of the method of the patent in the range of requirements. Obviously easy to understand, its details == Mingshu The full text, in order to make this method more one-way;! 51 is based on the invention of the invention - the actual word line leakage measurement (10). This figure is only used for illustration, not for limiting the library = 2 range Fan 4' and the general knowledge of this technical field ^ Tian understands that it can be used for various changes and retouching. Figure 14 is a schematic diagram of the leakage test of the body of the body according to the present invention. The memory component is just 〇* "With the ability to test character lines separately, the system and memory elements 000 similar evening. As shown in Fig. 14, the memory element 14GG includes - or one. The hidden array' memory array is, for example, memory area 0 (i.e., 1410). Memory ^ 1410 includes a plurality of word lines and a plurality of word line drivers, wherein each of the sub-line lines is coupled to a word line driver. For example, the word line driver ΗΠ is coupled to the word line test selection device, and the word line test selection device includes a PMOS transistor 1412 and an NMOS transistor 1413 ′ in response to the command signal WLSEL ′ and includes an NMOS battery. The crystal 1414' responds to the command signal WLFLOATB. An array of choices to open {' S > 22 1326452

' 三達編號:TW3699PA ' 關1422耦接至記憶區1410及一電源1420,陣列選擇開關 1422例如是一 MOSFET。陣列選擇開關1422於回應一指 • 令訊號(即第14圖之SEC0B)時,係將記憶區1410連接至 • · 一電源1420。根據此一實施例,本發明提出一種測試記憶 . 體元件1400之子元線漏電的方法,其詳述如下。 此方法包括使記憶陣列中已選擇的字元線充電,並將 其餘的字元線接地。其次’耦接已選擇的字元線至一浮接 ’ 電壓端並使其放電。經過一預定時間後,以一記憶體讀取 • 操作進行判別其漏電狀態。舉例來說,如第14圖所示, 係藉由導通PMOS M12及關閉NMOS 1413以選擇所要測 試之字元線WL0 (即1411)。然後,藉由關閉PMOS 1412、 導通NMOS 1413及關閉NMOS 1414,使字元線WL 0連 接至浮接電壓端。接著’將字元線WL0 (即1411)連接至 已關閉的NMOS 1414之汲極端。 第15圖是第14圖之記憶體元件1400之字元線漏電 測試方法的時間狀態圖。第16圖是第14圖之記憶體元件 鲁 1400之字元線漏電測試方法的IV曲線圖。以下將搭配第 14-17圖詳細說明其測試字元線漏電狀態的方法。 第17圖是依照本發明再一實施例之記憶體元件之字 元線漏電測試方法的流程圖。此圖式僅用以舉例說明,並 非用以限定文中專利申請範圍之範疇,且此技術領域之通 常知識者應當瞭解其可作各種之更動與潤飾。請參照第17 圖,其方法可以簡短地條列如下。 1.(步驟1710)選擇記憶體元件之多條字元線其中之 23 1326452'Sanda number: TW3699PA' The switch 1422 is coupled to the memory area 1410 and a power source 1420, and the array selection switch 1422 is, for example, a MOSFET. The array select switch 1422, when responding to a finger command signal (ie, SEC0B of Figure 14), connects the memory area 1410 to a power source 1420. According to this embodiment, the present invention provides a method of testing the memory of the sub-line leakage of the body element 1400, which is described in detail below. The method includes charging the selected word line in the memory array and grounding the remaining word lines. Next, 'coupled the selected word line to a floating' voltage terminal and discharges it. After a predetermined period of time, a memory reading operation is performed to determine the leakage state. For example, as shown in Fig. 14, the word line WL0 (i.e., 1411) to be tested is selected by turning on the PMOS M12 and turning off the NMOS 1413. Then, by turning off the PMOS 1412, turning on the NMOS 1413, and turning off the NMOS 1414, the word line WL 0 is connected to the floating voltage terminal. Next, word line WL0 (i.e., 1411) is coupled to the NMOS terminal of NMOS 1414 that is turned off. Fig. 15 is a timing chart showing the method of testing the word line leakage of the memory element 1400 of Fig. 14. Fig. 16 is a graph showing the IV curve of the memory element Lu 1400 word line leakage test method of Fig. 14. The method for testing the leakage state of the word line will be described in detail below with reference to Figure 14-17. Figure 17 is a flow chart showing a method of character line leakage test of a memory element in accordance with still another embodiment of the present invention. This illustration is for illustrative purposes only and is not intended to limit the scope of the scope of the patent application, and it is understood by those of ordinary skill in the art that various changes and modifications can be made. Please refer to Figure 17, the method can be briefly listed as follows. 1. (Step 1710) Selecting a plurality of word lines of the memory element 23 2326452

' 三達編號:TW3699PA • 一作為一第一字元線; 2.(步驟1720)耦接第一字元線至電壓源,並將其餘 • 的字元線接地; • - 3.(步驟1730)等待一第一預定時間,使第一字元線 . 達至預定讀取電壓位準; 4. (步驟1740)耦接第一字元線至一浮接電壓端; 5. (步驟1750)等待一第二預定時間,使第一字元線 • 放電; • 6.(步驟1760)偵測對應第一字元線之電流; 7. (步驟1770)比較偵測到電流及預定參考電流,此 預定參考電流係用來鑑別字元線漏電狀態;以及 8. (步驟1780)判別字元線漏電狀態是否存在。 在步驟1710中,其方法包括選擇記憶體元件之多條 字元線其中之一作為一第一字元線,例如在第14圖中, 係選擇字元線WL 0 (即1411)作測試。在步驟1720中,其 方法包括耦接第一字元線至電壓源(如第15之WLSEL之 • 操作),並使其餘的字元線接地。例如在第14圖中,當選 擇字元線WL 0 (即1411)作測試時,則將字元線WL 1至 字元線WL Μ連接至一接地電壓。在步驟1730中,其方 法包括等待一第一預定時間,使第一字元線(如第15圖之 WL0曲線)得以達到一預定讀取電壓位準(如第15圖之 Read Level)。在步驟1740中,其方法包括耦接第一字元 線至一浮接電壓端(如第15圖之WLFLOATB之操作)。在 步驟1750中,等待一第二預定時間,使第一字元線得以 24 1326452'Sanda number: TW3699PA • One as a first word line; 2. (Step 1720) Coupling the first word line to the voltage source and grounding the remaining • word lines; • - 3. (Step 1730) Waiting for a first predetermined time to bring the first word line to a predetermined read voltage level; 4. (Step 1740) coupling the first word line to a floating voltage terminal; 5. (Step 1750) Waiting for a second predetermined time to cause the first word line to be discharged; • 6. (Step 1760) detecting the current corresponding to the first word line; 7. (Step 1770) comparing the detected current with the predetermined reference current, The predetermined reference current is used to identify the word line leakage state; and 8. (Step 1780) to determine if the word line leakage state exists. In step 1710, the method includes selecting one of the plurality of word lines of the memory element as a first word line. For example, in Figure 14, the word line WL 0 (i.e., 1411) is selected for testing. In step 1720, the method includes coupling the first word line to the voltage source (e.g., the operation of the WLSEL of fifteenth) and grounding the remaining word lines. For example, in Fig. 14, when the word line WL 0 (i.e., 1411) is selected for testing, the word line WL 1 to the word line WL Μ are connected to a ground voltage. In step 1730, the method includes waiting for a first predetermined time to cause the first word line (e.g., the WL0 curve of Figure 15) to reach a predetermined read voltage level (e.g., Read Level of Figure 15). In step 1740, the method includes coupling the first word line to a floating voltage terminal (as in the operation of WLFLOATB in FIG. 15). In step 1750, a second predetermined time is waited for the first character line to be 24 1326452

' 三達編號:TW3699PA' Sanda number: TW3699PA

• 放電,此第二預定時間例如是第15圖之Tdelay2。在步驟 1760中,執行一記憶體讀取操作(如第15圖之READEN • 之操作),藉以偵測對應第一字元線之電流。在步驟1770 • · 中,其方法包括將偵測到電流與預定參考電流進行比較, . 此預定參考電流係用來鑑別其字元線漏電狀態。在步驟 1780中,其方法包括判別字元線漏電狀態是否存在。如第 16圖所示,其繪示字元線測試所對應之不同的電流,於此 • 與第12圖相似,係將其偵測之電流與參考電流Iref進行比 • 較,藉以判別其漏電狀態。 綜上所述,不同的測試參數是用在不同的測試狀況。 例如於測試時,用於使字元線得以充電之第一與第二預定 時間,或例如是根據實驗所測定之參考電壓位準與參考電 流位準。根據漏電偵測標準與字元線之電容,其第二預定 時間係約為1微秒(/z sec)至200微秒。在選擇其預定參考 電流時,係高於對應那些第一字元線之本質漏電流,且合 乎於感測放大器之操作範圍。此預定參考電流約為10微 ® 安培(# A)。此中參數當然可作其他變動與修改。 根據本發明之實施例,由上述步驟中提出一種偵測字 元線漏電的方法。以其步驟總括而言,此方法包括使已選 擇的字元線充電、等待字元線放電、以及監測字元線之電 壓以判別其漏電狀態。對於其他變動與修改,如是增加步 驟、減少一個或多個步驟、以及變動一個或多個步驟之次 序,皆應視為文中專利申請範圍之範疇。 綜上所述,雖然本發明已以一些較佳實施例揭露如 25 λ 1326452• Discharge, this second predetermined time is for example Tdelay2 in Figure 15. In step 1760, a memory read operation (such as the operation of the READEN of Figure 15) is performed to detect the current corresponding to the first word line. In step 1770, the method includes comparing the detected current to a predetermined reference current, the predetermined reference current being used to identify the word line leakage state. In step 1780, the method includes determining if a word line leakage state exists. As shown in Fig. 16, it shows the different currents corresponding to the word line test. Here, similar to the 12th figure, the detected current is compared with the reference current Iref to determine the leakage. status. In summary, different test parameters are used in different test situations. For example, during testing, the first and second predetermined times for charging the word line, or for example, the reference voltage level and the reference current level determined according to the experiment. According to the leakage detection standard and the capacitance of the word line, the second predetermined time is about 1 microsecond (/z sec) to 200 microseconds. When the predetermined reference current is selected, it is higher than the essential leakage current corresponding to those first word lines and is in accordance with the operating range of the sense amplifier. This predetermined reference current is approximately 10 micro ® amps (# A). Of course, other parameters can be changed and modified. According to an embodiment of the present invention, a method of detecting leakage of a word line is proposed by the above steps. In summary, the method includes charging the selected word line, waiting for the word line to discharge, and monitoring the voltage of the word line to determine its leakage state. For other changes and modifications, such as adding steps, reducing one or more steps, and changing the order of one or more steps should be considered as the scope of the patent application. In summary, although the invention has been disclosed in some preferred embodiments, such as 25 λ 1326452

三達編號:TW3699PA ' 上,然其並非用以限定本發明。本發明所屬技術領域中具 有通常知識者,在不脫離本發明之精神和範圍内,當可作 ' 各種之更動與潤飾。因此,本發明之保護範圍當視後附之 • · 申請專利範圍所界定者為準。 isiMyiSanda number: TW3699PA', but it is not intended to limit the invention. Those skilled in the art having the ordinary skill in the art can make various changes and refinements without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention is defined by the scope of the patent application. isiMyi

三達編號:TW36WpA 【圖式簡單說明】 . ^目種傳統的記憶體元件的功能方塊圖。 第2圖繪示依照本發明一實施例之記憶體元件的簡 .· 化示意圖。 . 第3圖繪示依照本發明一實施例之記憶體元件之漏 . 電狀態的簡化示意圖。 • 第4圖繪示依照本發明一實施例之記憶體元件於漏 % 電測試的簡化示意圖。 、第5圖繪示依照本發明另一實施例之記憶體元件於 漏電測試的簡化示意圖。 一第6圖繪示依照本發明一實施例之記憶體元件之字 兀線漏電測試方法的簡化示意圖。 ^第7圖繪示第5圖及第6圖之字元線漏電測試方法的 簡化示意圖。 第8圖繪示第5圖及第6圖之字元線漏電測試方法之 % 電壓與時間的座標圖。 _第9圖繪示依照本發明一實施例之記憶體元件之字 元線漏電測試方法的流程圖。 、 第1〇圖繪示依照本發明另一實施例之記憶體元件於 漏電測試的簡化示意圖。 第11圖繪示第10圖之記憶體元件之字元線漏電測試 方法的時間狀態圖。 第12圖繪示第10圖之記憶體元件之字元線漏電測試 方法的IV曲線圖。 27 1326452Sanda number: TW36WpA [Simple description of the diagram] . ^ The functional block diagram of the traditional memory component. FIG. 2 is a simplified diagram of a memory device in accordance with an embodiment of the invention. FIG. Figure 3 is a simplified schematic diagram of the leakage state of a memory device in accordance with an embodiment of the present invention. • Figure 4 is a simplified schematic diagram of a memory component in a leakage current test in accordance with an embodiment of the present invention. Figure 5 is a simplified schematic diagram of a memory component in a leakage test in accordance with another embodiment of the present invention. FIG. 6 is a simplified diagram showing a method of testing a word line leakage of a memory element in accordance with an embodiment of the invention. ^ Figure 7 is a simplified schematic diagram showing the leakage test method for the word line of Figures 5 and 6. Figure 8 is a graph showing the % voltage versus time of the word line leakage test method of Figures 5 and 6. FIG. 9 is a flow chart showing a method for testing a word line leakage of a memory element according to an embodiment of the invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a simplified schematic diagram of a memory device in accordance with another embodiment of the present invention. Fig. 11 is a timing chart showing the word line leakage test method of the memory element of Fig. 10. Fig. 12 is a graph showing the IV curve of the word line leakage test method for the memory element of Fig. 10. 27 1326452

&quot; 三達編號:TW3699PA ' 第13圖繪示第10圖之記憶體元件之字元線漏電測試 方法的流程圖。 ‘ 第14圖繪示依照本發明再一實施例之記憶體元件於 •· 漏電測試的簡化示意圖。 . 第15圖繪示第14圖之記憶體元件之字元線漏電測試 方法的時間狀態圖。 第16圖繪示第14圖之記憶體元件之字元線漏電測試 • 方法的IV曲線圖。 # 第17圖繪示第14圖之記憶體元件之字元線漏電測試 方法的流程圖。 【主要元件符號說明】 100、200、400、500、600、1000、1400 ··記憶體元 件; 101 :字元線電源產生器; 110 、 111 、 119 、 210 、 290 、 410 、 490 、 510 、 590 、 • 1010、1410、Sector :記憶區; 211、213 ' 311、313、411、413、491、493、511、 513、 591、593、1011、1013 :字元線驅動器; 212 ' 214、312 ' 314 ' 412 ' 414 ' 492 ' 494 ' 512 ' 514、 592、594、1012、1014、WL :字元線; 220、420、520、1020、1420 :電壓源; 222、422、522、524、1022、1422 :陣列選擇開關; 421、521、523 :測試開關元件; 28 1326452&quot; Sanda number: TW3699PA' Fig. 13 is a flow chart showing the method of character line leakage test of the memory element of Fig. 10. </ RTI> Figure 14 is a simplified schematic diagram of a memory element in accordance with a further embodiment of the present invention. Fig. 15 is a timing chart showing the word line leakage test method of the memory element of Fig. 14. Figure 16 is a diagram showing the word line leakage test of the memory element of Figure 14; #图17 is a flow chart showing a method of character line leakage test of the memory element of Fig. 14. [Description of main component symbols] 100, 200, 400, 500, 600, 1000, 1400 · Memory elements; 101: Word line power generators; 110, 111, 119, 210, 290, 410, 490, 510, 590, • 1010, 1410, Sector: memory area; 211, 213 '311, 313, 411, 413, 491, 493, 511, 513, 591, 593, 1011, 1013: word line driver; 212 '214, 312 ' 314 ' 412 ' 414 ' 492 ' 494 ' 512 ' 514, 592, 594, 1012, 1014, WL: word line; 220, 420, 520, 1020, 1420: voltage source; 222, 422, 522, 524, 1022, 1422: array selection switch; 421, 521, 523: test switching element; 28 1326452

三達編號:TW3699PA ' 430、530、730 :比較器電路; 431、531、731、802、Vref :參考電壓; • 432、532 :輸入端; -· 740 :電容; • 742 :漏電流路徑; 801、PWR :電壓源; 803、804 :曲線; 805、Tdelayl、Tdelay2、ΤΙ、T2 . B夺間; # 1412 : P通道金氧半場效電晶體; 1413、1414 : N通道金氧半場效電晶體;Sanda number: TW3699PA '430, 530, 730: comparator circuit; 431, 531, 731, 802, Vref: reference voltage; • 432, 532: input; - 740: capacitor; • 742: leakage current path; 801, PWR: voltage source; 803, 804: curve; 805, Tdelayl, Tdelay2, ΤΙ, T2. B Between; # 1412: P-channel MOS half-field effect transistor; 1413, 1414: N-channel MOS half-field effect Crystal

Gnd :接地電壓;Gnd : ground voltage;

Ileakage . 电沁11·,Ileakage . Electric 沁11·,

Icell、Ιβ、Ic :電流,Icell, Ιβ, Ic: current,

Iref :參考電流;Iref: reference current;

Real Level :讀取電塵; SECB、SEC0B、WLSEL、WLFLOATB、READEN : ®指令訊號。 29Real Level: Reads the electric dust; SECB, SEC0B, WLSEL, WLFLOATB, READEN: ® command signals. 29

Claims (1)

1326452 - 三達編號:TW369卯A 十、申請專利範圍: 1. 一種偵測記憶體元件中字元線漏電之方法,包括: • 耦接該記憶體元件之複數條第一字元線至一電壓 • · 源,並耦接該記憶體元件之複數條第二字元線至一接地位 . 準電壓,各該些第二字元線係毗鄰於該些第一字元線; 等待一第一預定時間,使該些第一字元線得以達到一 預定讀取電壓位準; ' 分離該些第一字元線與該電壓源; • 等待一第二預定時間,使該些第一字元線得以放電; 偵測對應該些第一字元線之一電流;以及 比較該電流與一預定參考電流,其中該預定參考電流 係用來鑑別對應該些第一字元線之一字元線漏電狀態。 2. 如申請專利範圍第1項所述之方法,其中該些第 一字元線與該些第二字元線係選自該記憶體元件中之一 記憶陣列,該記憶陣列係透過一陣列選擇開關而耦接至該 電壓源。 • 3.如申請專利範圍第2項所述之方法,其中各該些 第一字元線及各該些第二字元線皆包括一字元線驅動裝 置,該字元線驅動裝置係耦接至該電壓源或該接地位準電 壓。 4. 如申請專利範圍第2項所述之方法,其中該些第 一字元線包括該記憶體元件之複數條偶數字元線,該些第 二字元線包括該記憶體元件之複數條奇數字元線。 5. 如申請專利範圍第1項所述之方法,其中偵測該 30 1326452 三達編號:TW3699PA ' 電流之步驟係包括執行一記憶體讀取操作,以偵測對應耦 接該些第一字元線之一位元線之一電流。 ‘ 6.如申請專利範圍第1項所述之方法,其中該第二 -* 預定時間係用以將對應該些第一字元線之一電壓放電,以 . 鑑別該字元線漏電狀態。 7.如申請專利範圍第1項所述之方法,其中根據漏 電偵測標準及字元線之電容,該第二預定時間係約為1微 秒(/z sec)至200微秒。 • 8.如申請專利範圍第1項所述之方法,其中該預定 參考電流係高於對應該些第一字元線之一本質漏電流 (intrinsic leakage current)。 9. 如申請專利範圍第1項所述之方法,其中基於感 測放大器之操作範圍,該預定參考電流係約為10微安培 (/i A) ° 10. —種偵測記憶體元件中字元線漏電之方法,該記 憶體元件包括複數條字元線,該方法包括: ® 選擇該記憶體元件之該些字元線其中之一作為一第 一字元線,並將該些字元線中未被選擇的字元線指定為複 數條第二字元線; 耦接該記憶體元件之該第一字元線至一電壓源,並將 該記憶體元件之該些第二字元線接地; 等待一第一預定時間,使該第一字元線得以達到一預 定讀取電壓位準; 分離該第一字元絲與該電壓源; 31 1326452 三達編號:TW3699PA 耦接該第一字元線至一浮接(floating)電壓端; 等待一第二預定時間,使該第一字元線得以放電; 偵測對應該第一字元線之一電流;以及 比較該電流與一預定參考電流,其中該預定參考電流 係用來鑑別對應該些第一字元線之一字元線漏電狀態。 11. 如申請專利範圍第10項所述之方法,其中該些 字元線透過一陣列選擇開關而耦接至該電壓源。 12. 如申請專利範圍第10項所述之方法,其中耦接 該第一字元線至該電壓源之步驟係包括導通一字元線選 擇開關。 13. 如申請專利範圍第10項所述之方法,其中耦接 該第一字元線至該浮接電壓端之步驟係包括耦接該第一 字元線至一關閉狀態之金氧半場效電晶體(M0SFET)之一 端。 14. 如申請專利範圍第10項所述之方法,其中根據 漏電偵測標準及字元線之電容,該第二預定時間係約為1 微秒至200微秒。 15. 如申請專利範圍第10項所述之方法,其中基於 感測放大器之操作範圍,該預定參考電流係約為10微安 培。 16. —種偵測記憶體元件中字元線漏電之方法,包 括: 耦接該記憶體元件之一條或多條字元線至一電壓 源,並耦接至少一對應毗鄰之字元線至一接地電壓; f 亡 32 1326452 &quot; 三達編號:TW3699PA ' 等待一第一預定時間,使該條或該些條字元線得以達 到一預定讀取電壓位準; ' 將該條或該些條字元線與該電壓源分離; -· 等待一第二預定時間,使該條或該些條第一字元線得 . 以放電;以及 比較對應該條或該些條字元線之一電壓與一參考電 壓,其中該參考電壓係用來鑑別對應該條或該些條字元線 ' 之一字元線漏電狀態。 • 17.如申請專利範圍第16項所述之方法,其中該記 憶體元件包括一開關元件及一比較器電路,該開關元件係 回應一記憶體漏電測試指令訊號,以耦接該條或該些條字 元線至該電壓源或該比較器電路。 18.如申請專利範圍第16項所述之方法,其中該記 憶體元件包括複數個記憶陣列,該記憶體元件更包括對應 各該些記憶陣列之一開關元件及一比較器電路,各該些開 關元件係回應一記憶體漏電測試指令訊號,以耦接對應該 • 記憶陣列之該條或該些條字元線至該電壓源或該比較器 電路。 331326452 - Sanda number: TW369卯A X. Patent application scope: 1. A method for detecting leakage of a word line in a memory component, comprising: • coupling a plurality of first word lines of the memory component to a voltage • a source coupled to the plurality of second word lines of the memory component to a ground potential. The quasi-voltage, each of the second character lines is adjacent to the first word lines; waiting for a first a predetermined time for the first word lines to reach a predetermined read voltage level; 'separating the first word lines from the voltage source; and waiting for a second predetermined time to cause the first characters The line is discharged; detecting a current corresponding to one of the first word lines; and comparing the current with a predetermined reference current, wherein the predetermined reference current is used to identify one of the first word lines Leakage condition. 2. The method of claim 1, wherein the first word line and the second word line are selected from a memory array in the memory element, the memory array is transmitted through an array A selector switch is coupled to the voltage source. 3. The method of claim 2, wherein each of the first word lines and each of the second word lines comprises a word line driving device, the word line driving device is coupled Connect to the voltage source or the ground level voltage. 4. The method of claim 2, wherein the first word line comprises a plurality of even digital lines of the memory element, the second word lines comprising a plurality of the memory elements Odd digital line. 5. The method of claim 1, wherein detecting the 30 1326452 three-numbered: TW3699PA 'current step comprises performing a memory read operation to detect corresponding coupling of the first words One of the bit lines of one of the current lines. 6. The method of claim 1, wherein the second -* predetermined time is for discharging a voltage corresponding to one of the first word lines to identify the word line leakage state. 7. The method of claim 1, wherein the second predetermined time is about 1 microsecond (/z sec) to 200 microseconds based on the leakage detection standard and the capacitance of the word line. 8. The method of claim 1, wherein the predetermined reference current is higher than an intrinsic leakage current corresponding to one of the first word lines. 9. The method of claim 1, wherein the predetermined reference current is about 10 microamperes (/i A) based on the operating range of the sense amplifier. 10. detecting the characters in the memory component. In the method of line leakage, the memory component includes a plurality of word lines, the method comprising: selecting one of the word lines of the memory element as a first word line, and the word lines The unselected word line is designated as a plurality of second word lines; the first word line coupled to the memory element is coupled to a voltage source, and the second word lines of the memory element are Grounding; waiting for a first predetermined time to enable the first word line to reach a predetermined read voltage level; separating the first word line from the voltage source; 31 1326452 Sanda number: TW3699PA coupled to the first a word line to a floating voltage terminal; waiting for a second predetermined time to discharge the first word line; detecting a current corresponding to the first word line; and comparing the current with a predetermined Reference current, wherein the predetermined reference It should be based on those used to identify one of the first character line word-line leakage state. 11. The method of claim 10, wherein the word lines are coupled to the voltage source via an array selection switch. 12. The method of claim 10, wherein the step of coupling the first word line to the voltage source comprises turning on a word line select switch. 13. The method of claim 10, wherein the step of coupling the first word line to the floating voltage terminal comprises coupling a first word line to a closed state One end of a transistor (M0SFET). 14. The method of claim 10, wherein the second predetermined time is between about 1 microsecond and 200 microseconds, based on the leakage detection criteria and the capacitance of the word line. 15. The method of claim 10, wherein the predetermined reference current is about 10 microamps based on the operating range of the sense amplifier. 16. A method for detecting leakage of a word line in a memory device, comprising: coupling one or more word lines of the memory element to a voltage source, and coupling at least one corresponding adjacent word line to a Grounding voltage; f Death 32 1326452 &quot; Sanda number: TW3699PA ' Wait for a first predetermined time so that the strip or the word lines can reach a predetermined reading voltage level; 'The strip or the strips The word line is separated from the voltage source; -· waiting for a second predetermined time to cause the strip or the first word line of the strip to be discharged; and comparing the voltage of one of the corresponding strips or the strip of characters And a reference voltage, wherein the reference voltage is used to identify a leakage state of one of the corresponding word lines or one of the word lines. 17. The method of claim 16, wherein the memory component comprises a switching component and a comparator circuit, the switching component is responsive to a memory leakage test command signal to couple the strip or the A number of word lines are wired to the voltage source or the comparator circuit. 18. The method of claim 16, wherein the memory component comprises a plurality of memory arrays, the memory component further comprising a switching component corresponding to each of the memory arrays and a comparator circuit, each of the plurality of memory arrays The switching element is responsive to a memory leakage test command signal to couple the strip or the word line corresponding to the memory array to the voltage source or the comparator circuit. 33
TW96132334A 2007-08-30 2007-08-30 Method for detecting word line leakage in memory devices TWI326452B (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422844B (en) * 2011-07-06 2014-01-11 Etron Technology Inc Method for detecting connection defects of memory and memory capable of detecting connection defects
US11139017B2 (en) 2019-11-12 2021-10-05 Taiwan Semiconductor Manufacturing Company, Ltd. Self-activated bias generator
TWI783869B (en) * 2022-02-11 2022-11-11 華邦電子股份有限公司 Memory and reading method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422844B (en) * 2011-07-06 2014-01-11 Etron Technology Inc Method for detecting connection defects of memory and memory capable of detecting connection defects
US8773931B2 (en) 2011-07-06 2014-07-08 Etron Technology, Inc. Method of detecting connection defects of memory and memory capable of detecting connection defects thereof
US11139017B2 (en) 2019-11-12 2021-10-05 Taiwan Semiconductor Manufacturing Company, Ltd. Self-activated bias generator
TWI747407B (en) * 2019-11-12 2021-11-21 台灣積體電路製造股份有限公司 Integrated circuit device and method of operating thereof, and bias generator circuit
TWI783869B (en) * 2022-02-11 2022-11-11 華邦電子股份有限公司 Memory and reading method thereof

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