1326412 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種主機板基本輸入輸出系統 (Basic Input Output System，以下簡稱 BIOS)修復裝置，尤 指一種通過辅助BIOS晶片啓動電腦之主機板BIOS修復裝 置。 【先前技術】 現今之電腦系統中，主機板上之BIOS晶片爲電腦提供 最基本、最直接之硬體控制。它主要用於存放自診斷測試程 式、系統自舉裝入程式、系統設置程式和主要I/O (輸入/輸 出）設備之I/O驅動程式及中斷服務程式。BIOS係於每次開 機或重啓動時自動運行。當電腦接通電源後，系統主機板産 生一個復位信號，系統從BIOS之起始位址開始讀取並運行 BIOS。因此，一旦BIOS晶片出現問題，電腦一開機便無法 執行如記憶體、硬碟、中央處理器等之測試，電腦便無法順 利開機。 當BIOS晶片之電路結構隨著時間而産生退化或受不可 預測之操作之影響，其内容可能會流失或産生錯誤，導致電 腦開機執行BIOS時産生錯誤，因而導致電腦無法開機。主 機板量產時爲節約成本，一般把BIOS晶片直接焊接在主機 板上，要修復這種BIOS晶片，習知之方法係用熱風槍等設 備把晶片從主機板上脫焊，用編程器等設備把晶片寫好後， 再把晶片焊在主機板上，惟，該方法操作麻煩，晶片周圍需 要兼顧之元件、電路太多，一旦控制不好，會把主機板弄壞。 【發明内容】 本發明之目的在於提供一種主機板基本輸入輸出系統 修復裝置，可直接連接在待修復BIOS晶片上以對其進行修 復。 爲實現本發明之目的，本發明提供之主機板基本輸入輸 6 1326412 出系統修復裝置包括一開關控制單元、一對接管座、一輔助 修復BIOS晶片和複數絕緣軟線，該絕緣軟線連接開關控制 單元和對接管座，該對接管座具有一上管座、一下管座和一 印刷電路板，該上管座和下管座對接在印刷電路板的两面， 該辅助修復BIOS晶片插入上管座中，該下管座用來插入待 修復BIOS晶片。該辅助修復BI〇s晶片和待修復BI〇s晶片 具有一特定引腳，上管座和下管座除對應該特定引腳之管腳 外，其他管腳均 對接在印刷電路板上。通過切換該開關 控制單元來選擇特定引腳之電平狀態，從而允許主機板從輔 助修復BIOS晶片或待修復BIOS晶片啓動。 本發明之功效在於，採用上述修復裝置，無需將待修復 BIOS aB片從主機板上脫焊，也不會破壞主機板線路，使操 作變得簡易。 【實施方式】 請參閱第一圖，係本發明主機板基本輸入輸出系統修復 裝置之第一貫施例，該實施例採用開關切換BI〇s修復裝 置’包括一按鈕開關100 ’絕緣軟線1〇1、1〇2、1〇3，一輔 助修復BIOS晶片（圖未示）及—對接管座106。 明參閱第一圖、第二圖，對接管座包括一上管座5〇、 下笞座51及一印刷電路板52。其中上管座50及下管座 51 均爲貼片式 PLCC(Plastic Leaded Chip Carrier，即塑膠有 引線晶片載體）封裝管座，兩杳對接在印刷電路板52的两 面。上官座50及下管座51之對接方式爲，除管腳12外， 上管座50之管腳對應電氣特性相同之下管座51之管腳均一 一焊接在一起，相互並聯，且上管座5〇之管腳32、管腳8 焊接在一起，下管座51管腳32、管腳8焊接在一起。下管 座51用來插入主機板上之待修復BI〇s晶片（圖未示），上 管座50用來插入輔助修復BI〇s晶片。該印刷電路板52係 用以方便上管座50與下管座51管腳之焊接，並且提高其使 1326412 用之壽命，製作者亦可直接將上管座50與下管座51之管腳 焊接在一起。 下面結合第一圖、第二圖說明開關切換BIOS修復裝置 之工作過程。首先將製作好之引導BIOS晶片作爲辅助修復 BIOS晶片插入對接管座1〇6之上管座50中，並將下管座51 插入主機板上之待修復BIOS晶片。這樣，使待修復BIOS 晶片和輔助修復BIOS晶片之引腳相互並聯（引腳12除外）。 絕緣軟線1〇1 ' 102、1〇3之一端分別連至按鈕開關100之節 點2、節點3、節點1，另一端分別與下管座51之管腳32、 管腳12，上管座50之管腳12相連。此時在主機板之電氣連 接中’待修復BIOS晶片之引腳12 (圖未示）由於懸空而處 於低電平，也只有引腳12爲低電平時，待修復BIOS晶片才 能夠被選通而工作。另外，3.3V電源連接待修復BIOS晶片 之引腳32，以供給其工作電壓。引腳8係防寫控制端（低電 平有效）。首先把按鈕開關1〇〇置於處於初始狀態，即節點2連通節 點3,則下管座51之管腳12與下管座51之管腳32連通，上 管座50之管腳12懸空，由於對接管座1〇6之電信號傳遞作 用’待修復BIOS晶片之引腳12與連接3.3V電源之引腳32 連通，其電位從低電平轉爲高電平，輔助修復BIOS晶片之 引腳12由於懸空而爲低電平，此時主機板從輔助修復BIOS 晶片啓動。同時待修復BIOS晶片與輔助修復BIOS晶片之 引腳8和引腳32連通爲高電平，允許資料寫入。手動控制 引導進入DOS(Disk Operation System，即磁片作業系統）模 式’從網上或使用含自動執行程式之軟盤機啓動盤，將相應 主機板之BIOS燒錄工具軟體和標準燒錄文件拷貝至DOS系 統（部分BIOS燒錄只支援在DOS下執行，而部分BIOS燒錄 可在非DOS下執行），然後按下按鈕開關100，讓節點2連通節點 1’則上管座50之管腳12與下管座之管腳32連通，下管座 51之管腳12懸空，這時對接管座1〇6之電信號傳遞作用使 8 1326412 輔助修復BIOS晶片之引腳12與待修復BIOS晶片之引腳32 連通，其電位從低電平轉爲高電平，待修復BIOS晶片之引 腳12懸空，其電位從高電平轉爲低電平，輔助修復BIOS晶 片不工作，待修復BIOS晶片工作，此時可以執行Bi〇s燒 錄工具軟體和標準燒錄文件對待修復BIOS晶片進行重新燒 錄。燒錄完成後，切斷主機板之電源，取出修復裝置，至此， 主機板BIOS修復完成。 請參閱第三圖、第四圖，係本發明主機板基本輸入輸出 系統修復裝置之第二實施例，該實施例採用並行口控制BIOS 修復裝置，包括一並行口控制器200，絕緣軟線101、1〇2、 103，一輔助修復BIOS晶片及一對接管座1〇6。並行口控制 器200包括一並行口 201、一上拉電阻202及一光電藕合器 203。並行口 201與主機板並行口（圖未示）相連。絕緣軟線 102之一端與並行口 201之引腳D0相連，並和絕緣軟線ιοί 之一端焊在上拉電阻202之兩端。光電藕合器203之引腳a、 引腳b分別與並行口 201之引腳D1、引腳D2相連，光電藕 合器203之引腳c、引腳d分別與絕緣軟線1〇3、101之一端 相連。絕緣軟線101、102、103之另一端分別與下管座51 之管腳32、管腳12，上管座50之管腳12相連。 請繼續參閱第三圖、第四圖，並行口控制BIOS修復裝 置工作過程係首先將製作好之引導BIOS晶片作爲輔助修復 BIOS晶片插入對接管座1〇6之上管座50中，並將下管座51 插入待修復BIOS晶片中》給主機板上電，此時並行口之資 料寄存器預設值爲0XFFh(十六進位表示），光電藕合器203 不工作，下管座51之管腳12在上拉電阻202之作用下保持 高電平’上管座50之管腳12由於懸空而處於低電平，在對 接管座106之電信號傳遞作用下，輔助修復BIOS晶片之引 腳12爲低電平’待修復BIOS晶片之引腳12爲高電平，此 時主機板從輔助修復BIOS晶片啓動。同時待修復BIOS晶片 9 1326412 與輔助修復BIOS晶片之引腳8與引腳32連通爲高電平，允 許資料寫入。手動控制引導進入DOS系統，將並行口之資料 寄存器值從OXFFh修改爲OXFAh， 下管座51之管腳12從 高電平轉爲低電平，同時光電藕合器203工作，上管座50 之管腳12連通下管座51之管腳32,在對接管座106之電信 號傳遞作用下，待修復BIOS晶片之引腳12從高電平轉爲低 電平，輔助修復BIOS晶片之引腳12與待修復BIOS晶片之 引腳32連通，其電位轉爲高電平，故辅助修復BIOS晶片不 工作，待修復BIOS晶片工作，此時可以執行BIOS燒錄工具 軟體和標準燒錄文件對待修復BIOS晶片進行重新燒錄。 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡熟悉 本案技藝之人士，在爰依本發明精神所作之等效修飾或變 化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 第一圖係本發明主機板基本輸入輸出系統修復裝置之第 一實施例之立體圖。 第二圖係本發明主機板基本輸入輸出系統修復裝置之第 一實施例之電路圖。 第三圖係本發明主機板基本輸入輸出系統修復裝置之第 二實施例之立體圖。 第四圖係本發明主機板基本輸入輸出系統修復裝置之第 二實施例之電路圖。 【主要元件符號說明】 按紐開關 100 絕緣軟線 101、 102、 103 對接管座 106 上管座 50. 下管座 51 印刷電路板 52 並行口控制器 200 並行口 201 上拉電阻 202 光電藕合器 203 10[Technical Field] The present invention relates to a basic input/output system (Basic Input Output System, BIOS for short) repair device, and more particularly to a BIOS repair of a motherboard by booting a BIOS chip. Device. [Prior Art] In today's computer systems, the BIOS chip on the motherboard provides the most basic and direct hardware control for the computer. It is mainly used to store I/O drivers and interrupt service programs for self-diagnostic test programs, system bootloaders, system setup programs, and main I/O (input/output) devices. The BIOS runs automatically each time it is turned on or restarted. When the computer is powered on, the system board generates a reset signal, and the system reads and runs the BIOS from the start address of the BIOS. Therefore, once there is a problem with the BIOS chip, the computer cannot be tested, such as a memory, a hard disk, or a central processing unit, and the computer cannot be turned on smoothly. When the circuit structure of the BIOS chip degrades over time or is affected by unpredictable operations, its contents may be lost or cause errors, causing errors when the computer is booted to execute the BIOS, thus causing the computer to fail to boot. In order to save cost when the main board is mass-produced, the BIOS chip is usually soldered directly on the motherboard. To repair the BIOS chip, the conventional method uses a heat gun and the like to remove the wafer from the motherboard, using a programmer or the like. After the wafer is written, the wafer is soldered to the motherboard. However, the method is troublesome, and the components and circuits that need to be taken care of around the wafer are too much. Once the control is not good, the motherboard will be broken. SUMMARY OF THE INVENTION It is an object of the present invention to provide a motherboard basic input/output system repair device that can be directly attached to a BIOS chip to be repaired for repair. For the purpose of the present invention, the basic input and output of the motherboard provided by the present invention is 6 1326412. The system repairing device comprises a switch control unit, a pair of sockets, an auxiliary repair BIOS chip and a plurality of insulated flexible wires, and the insulated flexible wire connection switch control unit And a docking socket having an upper header, a lower header and a printed circuit board, the upper header and the lower header being butted on both sides of the printed circuit board, the auxiliary repairing BIOS chip being inserted into the upper header The lower header is used to insert a BIOS chip to be repaired. The auxiliary repair BI〇s wafer and the BI〇s wafer to be repaired have a specific pin, and the upper and lower headers are connected to the printed circuit board except for the pins corresponding to the specific pins. The level of a particular pin is selected by switching the switch control unit to allow the motherboard to boot from the secondary repair BIOS chip or the BIOS chip to be repaired. The effect of the present invention is that the above-mentioned repairing device eliminates the need to remove the solder aB piece to be repaired from the motherboard, and does not damage the motherboard circuit, thereby making the operation simple. [Embodiment] Please refer to the first figure, which is the first embodiment of the basic input/output system repairing device of the motherboard of the present invention. The embodiment uses a switch to switch the BI〇s repairing device to include a push button switch 100' insulated flexible cord 1〇 1, 1 〇 2, 1 〇 3, an auxiliary repair BIOS chip (not shown) and a docking socket 106. Referring to the first and second figures, the docking socket includes an upper header 5, a lower jaw 51 and a printed circuit board 52. The upper header 50 and the lower header 51 are both packaged PLCC (Plastic Leaded Chip Carrier) packaged sockets, and the two sides are butted on both sides of the printed circuit board 52. The connection between the upper seat 50 and the lower base 51 is such that, except for the pin 12, the pins of the upper base 50 correspond to the electrical characteristics of the same, and the pins of the base 51 are welded together one by one, in parallel with each other, and The pin 32 and the pin 8 of the socket 5 are welded together, and the pin 32 and the pin 8 of the lower stem 51 are welded together. The lower header 51 is used to insert a BI?s wafer (not shown) to be repaired on the motherboard, and the upper header 50 is used to insert an auxiliary repair BI?s wafer. The printed circuit board 52 is used to facilitate the soldering of the upper header 50 and the lower header 51, and to improve the life of the 1326412. The manufacturer can also directly connect the upper header 50 to the lower header 51. Soldered together. The working process of the switch switching BIOS repairing device will be described below with reference to the first figure and the second figure. First, the prepared boot BIOS chip is inserted into the socket 50 of the docking socket 1〇6 as an auxiliary repair BIOS chip, and the lower header 51 is inserted into the BIOS chip to be repaired on the motherboard. In this way, the pins of the BIOS chip to be repaired and the auxiliary repair BIOS chip are connected in parallel with each other (except pin 12). One end of the insulated cord 1〇1 '102, 1〇3 is connected to the node 2, the node 3, and the node 1 of the push button switch 100, and the other end is respectively connected to the pin 32, the pin 12, and the upper header 50 of the lower header 51. The pins 12 are connected. At this time, in the electrical connection of the motherboard, the pin 12 of the BIOS chip to be repaired (not shown) is at a low level due to floating, and only when the pin 12 is low, the BIOS chip to be repaired can be strobed. And work. In addition, a 3.3V power supply connects the pins 32 of the BIOS chip to be repaired to supply its operating voltage. Pin 8 is a write-protected control terminal (low level active). First, the button switch 1〇〇 is placed in the initial state, that is, the node 2 is connected to the node 3, and the pin 12 of the lower header 51 communicates with the pin 32 of the lower header 51, and the pin 12 of the upper header 50 is suspended. Due to the electrical signal transmission function of the docking socket 1〇6, the pin 12 of the BIOS chip to be repaired is connected to the pin 32 connected to the 3.3V power supply, and its potential is changed from a low level to a high level, and the auxiliary chip is repaired. Pin 12 is low due to dangling, at which point the motherboard boots from the auxiliary repair BIOS chip. At the same time, the BIOS chip to be repaired and the pin 8 and pin 32 of the auxiliary repair BIOS chip are connected to a high level to allow data to be written. Manually control the boot into the DOS (Disk Operation System) mode. From the Internet or use the floppy disk drive containing the automatic execution program, copy the BIOS and standard burning files of the corresponding motherboard to DOS system (some BIOS burning only supports execution under DOS, and some BIOS burning can be performed under non-DOS), then press button switch 100 to let node 2 connect node 1' to pin 12 of upper socket 50 Connected to the pin 32 of the lower header, the pin 12 of the lower header 51 is suspended, and the electrical signal transmission effect of the docking socket 1〇6 enables the 8 1326412 auxiliary repair BIOS chip pin 12 and the BIOS chip to be repaired. The pin 32 is connected, and its potential changes from low level to high level. The pin 12 of the BIOS chip to be repaired is suspended, its potential is changed from high level to low level, and the auxiliary repair BIOS chip does not work. The BIOS chip is to be repaired. At this time, you can execute the Bi〇s burning tool software and the standard burning file to re-burn the BIOS chip. After the burning is completed, the power of the motherboard is cut off, and the repairing device is taken out. At this point, the BIOS repair of the motherboard is completed. Please refer to the third embodiment and the fourth figure, which is a second embodiment of the basic input/output system repairing device of the motherboard of the present invention. The embodiment adopts a parallel port control BIOS repair device, including a parallel port controller 200, an insulated cord 101, 1〇2, 103, an auxiliary repair BIOS chip and a pair of sockets 1〇6. The parallel port controller 200 includes a parallel port 201, a pull-up resistor 202, and a photocoupler 203. The parallel port 201 is connected to a parallel port (not shown) of the motherboard. One end of the insulated flexible wire 102 is connected to the pin D0 of the parallel port 201, and is soldered to one end of the pull-up resistor 202 at one end of the insulated flexible wire ιοί. The pin a and the pin b of the photocoupler 203 are respectively connected to the pin D1 and the pin D2 of the parallel port 201, and the pin c and the pin d of the photocoupler 203 are respectively insulated with the insulated cord 1〇3, 101. One end is connected. The other ends of the insulated flexible wires 101, 102, 103 are respectively connected to the pins 32 of the lower header 51, the pins 12, and the pins 12 of the upper header 50. Please continue to refer to the third and fourth figures. The parallel port control BIOS repair device works first by inserting the prepared boot BIOS chip as an auxiliary repair BIOS chip into the socket 50 of the docking socket 1〇6, and will The socket 51 is inserted into the BIOS chip to be repaired to power on the motherboard. At this time, the data register of the parallel port has a preset value of 0XFFh (indicated by hexadecimal), the photocoupler 203 does not work, and the pin of the lower header 51 12 is maintained at a high level by the pull-up resistor 202. The pin 12 of the upper header 50 is at a low level due to floating, and the pin 12 of the BIOS chip is repaired under the electrical signal transmission of the docking socket 106. For the low level, the pin 12 of the BIOS chip to be repaired is high, and the motherboard is booted from the auxiliary repair BIOS chip. At the same time, the BIOS chip 9 1326412 and the auxiliary repair BIOS chip pins 8 and 32 are connected to a high level, allowing data to be written. Manually control the boot into the DOS system, change the data register value of the parallel port from OXFFh to OXFAh, the pin 12 of the lower header 51 from the high level to the low level, and the photocoupler 203 works, the upper header 50 The pin 12 is connected to the pin 32 of the lower header 51. Under the electrical signal transmission of the docking socket 106, the pin 12 of the BIOS chip to be repaired is changed from a high level to a low level, and the auxiliary chip is repaired. The pin 12 is connected to the pin 32 of the BIOS chip to be repaired, and its potential is turned to a high level, so the auxiliary repair BIOS chip does not work, and the BIOS chip is to be repaired. At this time, the BIOS burning tool software and the standard burning file can be executed. Repair the BIOS chip for re-burning. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a perspective view of a first embodiment of a basic input/output system repairing apparatus for a motherboard of the present invention. The second drawing is a circuit diagram of a first embodiment of the basic input/output system repairing apparatus of the motherboard of the present invention. Fig. 3 is a perspective view showing a second embodiment of the basic input/output system repairing apparatus of the motherboard of the present invention. The fourth drawing is a circuit diagram of a second embodiment of the basic input/output system repairing apparatus of the motherboard of the present invention. [Main component symbol description] Button switch 100 Insulated cord 101, 102, 103 Butt socket 106 Upper socket 50. Lower header 51 Printed circuit board 52 Parallel port controller 200 Parallel port 201 Pull-up resistor 202 Photoelectric coupler 203 10