TWI324814B - Modular assembly of memory module packages - Google Patents

Modular assembly of memory module packages Download PDF

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Publication number
TWI324814B
TWI324814B TW096100100A TW96100100A TWI324814B TW I324814 B TWI324814 B TW I324814B TW 096100100 A TW096100100 A TW 096100100A TW 96100100 A TW96100100 A TW 96100100A TW I324814 B TWI324814 B TW I324814B
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TW
Taiwan
Prior art keywords
memory module
outer casing
memory
module package
packages
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Application number
TW096100100A
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Chinese (zh)
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TW200830477A (en
Inventor
Hong Chi Yu
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Walton Advanced Eng Inc
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Priority to TW096100100A priority Critical patent/TWI324814B/en
Publication of TW200830477A publication Critical patent/TW200830477A/en
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Publication of TWI324814B publication Critical patent/TWI324814B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71

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  • Semiconductor Memories (AREA)

Description

1324814 九、發明說明： 【發明所屬之技術領域】 本發明係有關於一種記憶體模組封裝之可擴充應用 裝置，特別係有關於一種記憶體模組封裝之模組連結構 造。 【先前技術】1324814 IX. Description of the Invention: [Technical Field] The present invention relates to an expandable application device for a memory module package, and more particularly to a module connection structure for a memory module package. [Prior Art]

按，記憶體模組封裝產品可應用於隨身碟等，並無 可擴充功能，例如在一個USB插槽只能插接一隨身碟， 在未加裝多埠連接器時，無法由單一 USB插槽同時讀 取到多顆隨身碟之資料。此外，目前隨身碟之尺寸將越 來越小，在隨身攜帶時易於掉落遺失。 【發明内容】 本發明目#係在於提供一帛記憶體模組封裝 之模組連結構造，利料撓曲之㈣連接件兩端各套接 -記憶體模組封裝件，以使兩相接之記憶逋模組封裝件 串接與電連接’達到無限延伸，便於擴充讀存更可串 接成一飾環，以便於攜帶。 本發明的目的及解決其枯你 具技術問題是採用以下技術方 案來實現的。依據本發明，一箱~ 種圮憶體模組封裝之模組 連結構造主要包含複數個 ^數個β己憶體模組封裝件以及至少 一塑膠連接件。每一記愧雜描 隐體模組封裝件係包含一基板、 至-^ 一 5己憶體晶片以及一封朦麻 对膠體，該基板係具有一内表 面以及一外表面，其中該外矣 表面之兩側係分別形成有複 數個USB接觸指與複數個轉 _锊接指，該記憶體晶片係設 6 132481.4 於該基板之該内表面上並電性連接至該些USB h ’該封膠髅係形成於該基板之該内表面上，以密封該 s己憶體晶片。該塑膠連接件係具有一第一外殼、一第二 外殼以及一可撓曲連接該第一外殼與該第二外殼之塑 膠彈性體，該第一外殼係設有複數個第一連接端，該第 二外殼係設有複數個第二連接端，該塑膠彈性體係具有 複數個電性連接該些第一連接端與該些第二連接端之 @ -外殼係用α套接纟中—記憶體模組封 裝件具有該些轉接指之—側，以使該些第__連接端電性 捿觸該些轉接指，第二外殼係用以套接另一其中一記憶 體模組封裝件具有該坻USB桩緬妒十 一 接觸指之一側，以使該些 第二連接端電性接觸該些USB接艏扣 .^ ^ 接觸指，藉以使得該兩 相接之記憶體模組封裝件電性互通。 本發明的目的及解沐I & ^ .. ^ _ 、、技術問題還可採用以下技術 措施進一步實現。 | π η 在前述之記憶體模組封裝之 膠連接件之數量係可與节此“ 逆，，》構造中，該塑 ^ ~ 一 5己’隐體模組封裝件之數量 相等，以將該些記憶體模組封裝件串接 在前达之記憶㈣㈣& H 記憶體模組封裝件係可 、連結構造中，該些 接件之内部》 "套§又从隱藏在該些塑膠連 【實施方式】 請參閱第1八與^圖所示， 組封裝之模組連結構造1〇 ' 明之一種記憶體模 '、匕含複數個記憶體模組錡 7 1324814 裝件丨〇〇以及至少一塑膠連接件200。利用該可撓曲之 塑膠連接件200兩端各套接一記憶艎模組封裝件1〇〇 ’ 以使兩相接之記憶趙模組封裝件1 〇 〇能串接與電性連 接’達到無限延伸。 請參閱第2A與2B圖所示，每一記憶體模組封裝件 I 〇〇係包含一基板11 〇、至少一記憶鱧晶片1 20以及一 封膠體130，該基板110係具有一内表面nl以及一外 表面112。通常該基板11〇係為具有雙面電性導通之印 刷電路板。其中該外表面i ! 2之兩側係分別形成有複數 個 USB 接觸指 113(USB 為 Universal Serial BUS 之簡 稱’中文為通用串列匯流排）與複數個轉接指114，該些 USB接觸指113係能以插接方式電性接觸一 uSB插槽 之端子。該些轉接指114則為該些USB接觸指113之 擴充端子，為反序電性連接，用以電性連接另一記憶體 模組封裝件100之USB接觸指113。在形狀上，該些轉 接指114可與該些USB接觸指113相同。 而該記憶體晶片120係設於該基板11〇之該内表面 II 1上並電性連接至該些USB接觸指11 3。在本實施例 中’該記憶體晶片1 2 0係為快問記憶體，即不會無電源 而失去儲存資料。並能以打線形成之銲線電性連接該記 憶體晶片120至該基板110»在該基板110之該内表面 111上可另設置有被動元件或控制器。 該封膠體130係形成於該基板110之該内表面U1 上’以密封該記憶體晶片120。在本實施例中，該封膠 1324814 體130係為轉移成形（transfer molding)技術形成，可使 該記憶體模組封裝件1 〇〇為超小型磚塊狀。According to the memory module package, it can be applied to the flash drive, etc. There is no expandable function. For example, only one USB flash drive can be plugged into a USB slot. When a multi-connector is not installed, it cannot be plugged by a single USB. The slot reads the data of multiple flash drives at the same time. In addition, the size of the current flash drive will become smaller and smaller, and it is easy to fall and lose when you carry it around. SUMMARY OF THE INVENTION The present invention is to provide a module connection structure of a memory module package, and to flex the four (4) socket-memory module packages at both ends of the connector to make two-phase connection The memory and module package are connected in series and electrically connected to an infinite extension, so that the expansion of the read memory can be connected in series to form a ring for easy carrying. The object of the present invention and the solution to its technical problems are achieved by the following technical solutions. According to the present invention, a module connection structure of a box-type memory module package mainly comprises a plurality of β-replica module packages and at least one plastic connector. Each of the doped description module includes a substrate, a wafer, and a ramie colloid having an inner surface and an outer surface, wherein the outer surface The two sides of the surface are respectively formed with a plurality of USB contact fingers and a plurality of switch fingers, and the memory chip is provided on the inner surface of the substrate and electrically connected to the USB h ' A capsule is formed on the inner surface of the substrate to seal the s-resonance wafer. The plastic connector has a first outer casing, a second outer casing, and a plastic elastic body that flexably connects the first outer casing and the second outer casing. The first outer casing is provided with a plurality of first connecting ends. The second outer casing is provided with a plurality of second connecting ends, and the plastic elastic system has a plurality of electrically connected first and second connecting ends of the first connecting end and the second connecting end. The module package has the side of the transfer fingers such that the first __ connection end electrically touches the transfer fingers, and the second outer case is used to sleeve another memory module package The device has one side of the USB pin and the eleven contact fingers, so that the second connecting ends electrically contact the USB contacts. ^ ^ contact fingers, so that the two connected memory modules The packages are electrically connected. The object of the present invention and the solution of the problem of I & ^ .. ^ _ , , can be further realized by the following technical measures. π η The number of adhesive connectors in the aforementioned memory module package can be equal to the number of the plastic module packages in the "reverse," configuration. The memory module packages are serially connected to the memory of the front (4) (four) & H memory module package, and the connection structure, the internal parts of the connectors are hidden from the plastics [Embodiment] Please refer to the 1st and 8th drawings, the module connection structure of the package is 1〇's memory type, the memory module 锜7 1324814, and at least a plastic connector 200. The memory module 200 is sleeved on both ends of the flexible plastic connector 200 so that the two-phase memory module package 1 can be connected in series The electrical connection is infinitely extended. Referring to FIGS. 2A and 2B, each memory module package I includes a substrate 11 , at least one memory wafer 1 20 , and a colloid 130 . The substrate 110 has an inner surface n1 and an outer surface 112. Typically, the substrate 1 1〇 is a printed circuit board having double-sided electrical conduction, wherein a plurality of USB contact fingers 113 are formed on both sides of the outer surface i! 2 (USB is a universal serial BUS short for 'Chinese is a universal serial confluence And a plurality of transfer fingers 114, the USB contact fingers 113 can be electrically connected to the terminals of a uSB slot by plugging, and the transfer fingers 114 are extension terminals of the USB contact fingers 113. For the reverse-sequential electrical connection, the USB contact fingers 113 are electrically connected to the other memory module package 100. In terms of shape, the transfer fingers 114 can be the same as the USB contact fingers 113. The body wafer 120 is disposed on the inner surface II 1 of the substrate 11 and electrically connected to the USB contact fingers 113. In the embodiment, the memory chip 120 is a fast memory. That is, the stored data is not lost without power supply, and the memory chip 120 can be electrically connected to the substrate 110 by a wire formed by wire bonding. On the inner surface 111 of the substrate 110, a passive component or controller may be additionally disposed. The encapsulant 130 is formed on the inner surface U1 of the substrate 110' Seal the memory chip 120. In the present embodiment, the sealant system is formed as a body 130 1324814 transfer molding (transfer molding), allow the memory module package 1 thousand and subminiature brick shape.

請參閱第3APlease refer to section 3A

係具有一第一外殼210、一第二外殼220以及一可撓曲 連接該第一外殼210與該第二外殼220之塑膠彈性體 230。該第一外殼210係設有複數個第一連接端211， 用以電性接觸一記憶體模組封裝件1 〇〇之轉接指丨丨4。 該第二外殼220係設有複數個第二連接端221，用以電 性接觸一記憶體模组封裝件1 〇〇之USB接觸指1 1 3。該 塑膠彈性體230係具有複數個電性連接該些第一連接 端211與該些第二連接端221之芯線231。其中，請參 閱第1B圖所示，該第一外殼21〇係用以套接其中一記 憶體模組封裝件100具有該些轉接指114之一側，以使 該些第一連接端2U電性接觸該些轉接指114，第二外 殼220係用以套接另一其中一記憶體模組封裝件100具 有該些麵接觸指113之一侧，以使該些第二連接端 221電性接觸該此USB接·細11。 ** _ UbB接觸指113,藉以使得該兩相接 之記憶體模組封裝件i 〇 〇電性互通。There is a first outer casing 210, a second outer casing 220, and a plastic elastomer 230 that flexibly connects the first outer casing 210 and the second outer casing 220. The first outer casing 210 is provided with a plurality of first connecting ends 211 for electrically contacting the transfer finger 4 of a memory module package 1 . The second housing 220 is provided with a plurality of second connecting ends 221 for electrically contacting a USB contact finger 1 1 3 of a memory module package 1 . The plastic elastomer 230 has a plurality of core wires 231 electrically connected to the first connecting ends 211 and the second connecting ends 221 . As shown in FIG. 1B , the first housing 21 is configured to be sleeved on one of the memory module packages 100 and has one side of the adapter fingers 114 such that the first connectors 2 U The second housing 220 is electrically connected to one of the other side of the memory module package 100 to have one side of the surface contact fingers 113 so that the second connection ends 221 Electrically contact this USB connection. ** _ UbB contact finger 113, whereby the two-phase connected memory module package i 〇 electrically exchanges.

因此’在一應用面上，請免朗隹/ A 麥閲第4A與5A圖所示， 可以增加塑膠連接件2〇〇>虹旦 . 按件200之數量，以串接更多數量的記Therefore, 'on the application side, please don't read it / A Mai reading 4A and 5A, you can add plastic connectors 2〇〇> Hongdan. According to the number of pieces 200, to connect a larger number Remember

憶體模組封裝件1〇〇，祐B 並且該些記憶體模組封裝件100 之間為電性互通。僅需要將 兩资將最則端的記憶體模組封裝件 100插接至一電盤；；j： 姑： 踢主機或筆記型電腦之USB插槽，令最 前端的δ己憶雜模组射担此 封裝# 100《刪接觸指113電性 9 1324814 接觸USB插槽之端子，便可使所有被串接的記憶趙模 組封裝件100顯示在電腦主機或筆記型電腦之作業系 統上’以供資料傳輪之讀取與存入。請參閱帛4B與5B 圖所示，由於該些塑膠連接件2〇〇之塑膠彈性體23〇, 可=該些被串接的記憶趙模組封裝件i⑽任意弯折不 會造成最前端的記憶體模組封裝件1〇〇承受過大重量。The memory module package 1 〇〇, B and the memory module packages 100 are electrically inter-connected. It is only necessary to insert the most end-of-life memory module package 100 into an electric disk; j: a: kick the host or the USB port of the notebook computer, so that the front end of the delta memory module is shot Carrying this package # 100 "Delete contact finger 113 electrical 9 1324814 Contact the USB slot terminal, so that all the serial memory module package 100 can be displayed on the computer host or notebook computer operating system' For the data transfer to read and deposit. Please refer to 帛4B and 5B. As these plastic connectors 2〇〇 plastic elastomer 23〇, can be arbitrarily bent by the serially connected memory module package i(10) without causing the front end The memory module package 1 is subjected to excessive weight.

一種記憶體模組封裝之模組連結構造，以塑膠連接 件2〇〇及可撓曲之塑膠彈性體23〇套接另—記憶體模組 封裝件1 00，以使得兩相接之記憶體模組封裝件丨串 接’達到無限延伸，便於攜帶，並可串接成一飾環。A module connection structure of a memory module package, in which a plastic connector 2 〇〇 and a flexible plastic elastic body 23 〇 are sleeved with another memory module package 100 to make two connected memories The module package 丨 series is 'infinitely extended, easy to carry, and can be connected in series to form a ring.

在另一應用面上，請參閱第6圖所示，該塑膠連接 件200之數量係可與該些記憶體模組封裝件之數量 為相等，以將該些記憶體模組封裝件1〇〇串接於一飾 環如手環，易於攜帶與偽裝。其中，該些記憶體模組 封裝件100之兩側係分別被套接兩個塑膠連接件2〇〇之 第外设210與第二外殼220。較佳地，該些記憶體模 組封裝件1 00係為全套設以隱藏在該些塑膠連接件2〇〇 之内部，以得到較佳的保護。 以上所述，僅是本發明的較佳實施例而已並非對 本發明作任何形式上的限制，雖然本發明已以較佳實施 例揭露如上，然而並非用以限定本發明，任何熟悉本專 業的技術人員’在不脫離本發明技術方案範圍内，當可 利用上述揭示的技術内容作出些許更動或修飾為等同 變化的等效實施例，但凡是未脫離本發明技術方案的内 10 1324814 容，依據本發明的技術實質 單修改、等同變化與修饰， 範圍内。 對以上實施例所作的任何簡 均仍屬於本發明技術方案的 【圖式簡單說明】 第1A與1B圖：依據本發明 ^ 具髋實施例，一種記 憶體模組封裝之掇纟B。 衣&模組連結構造於連接狀態之 俯視圖與截面圖。 第2A與2B圖··依據本發明之—具趙實施例該模組In another application, as shown in FIG. 6, the number of the plastic connectors 200 can be equal to the number of the memory module packages to replace the memory module packages. The 〇 is connected in series with a ring such as a bracelet, which is easy to carry and camouflage. The two sides of the memory module package 100 are respectively sleeved with the two outer peripheral parts 210 and the second outer casing 220. Preferably, the memory module packages 100 are fully assembled to be hidden inside the plastic connectors 2 for better protection. The above is only a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention A person skilled in the art can make some modifications or modifications to the equivalent embodiments by using the above-disclosed technical contents without departing from the technical scope of the present invention. The technical spirit of the invention is within the scope of single modification, equivalent variation and modification. Any simplification of the above embodiments still belongs to the technical solution of the present invention. Brief Description of the Drawings Figs. 1A and 1B: According to the present invention, a hip embodiment, a memory module package 掇纟B. The garment & module is constructed in a top view and a cross-sectional view of the connected state. 2A and 2B, according to the present invention, the module of the Zhao embodiment

連結構造之其中一記憶體模組封裝件之俯視 圖與截面示意圖。 第3A至3C圖：依據本發明之一具體實施例該模組 連結構造之其中一塑膠連接件之俯視圖、上截 面圖及側截面圖。 第4A至4B圖：依據本發明之一具體實施例，該記憶A top view and a cross-sectional view of one of the memory module packages of the connection structure. 3A to 3C are a plan view, an upper cross-sectional view and a side cross-sectional view of one of the plastic connectors of the module connection structure according to an embodiment of the present invention. 4A-4B: According to an embodiment of the present invention, the memory

體模組封裝之模組連結構造在可彎折電連接 狀態之俯視圖。 第5 A至5 B圖：依據本發明之一具體實施例，該記憶 體模組封裝之模組連結構造在可蠻折電連接 狀態之俯視圖。 第6圖：依據本發明之一具趙實施例，該記憶體模組封 裝之模組連結構造在環接成飾環之側視圖。 【主要元件符號說明】 10 記憶體模組封裝之模組連結構造 100記憶體模組封裝件The module connection structure of the body module package is a top view of the bendable electrical connection state. 5A to 5B: According to an embodiment of the present invention, the module connection structure of the memory module package is in a top view in a state in which the module connection can be made. Figure 6 is a side elevational view of the module assembly of the memory module package in a looped manner in accordance with an embodiment of the present invention. [Main component symbol description] 10 module connection structure of memory module package 100 memory module package

Claims (1)

Ι324,81.4 十、申請專利範团： 1、 一種記憶體模組封裝之模組連結構造，包含： 複數個記憶體模組封裝件，每一記憶體模組封裝件係包 含一基板、至少一記憶體晶片以及一封膠體，該基板係 具有一内表面以及一外表面，其中該外表面之兩側係分 別形成有複數個USB接觸指與複數個轉接指，該記憶 體晶片係設於該基板之該内表面上並電性連接至該些 USB接觸指，該封膠體係形成於該基板之該内表面上， • 以密封該記憶體晶片；以及 至少一塑膠連接件，其係具有一第一外殼、一第二外殼 以及一可撓曲連接該第一外殼與該第二外殼之塑膠彈 性體，該第一外殼係設有複數個第一連接端，該第二外 殼係設有複數個第二連接端，該塑膠彈性體係具有複數 個電性連接該些第一連接端與該些第二連接端之芯 線，其中該第一外殼係用以套接其中一記憶體模組封裝 件具有該些轉接指之一側，以使該些第一連接端電性接 觸該些轉接指’第二外殼係用以套接另一其中一記憶體 模組封裝件具有該些USB接觸指之一側，以使該些第 二連接端電性接觸該些USB接觸指，藉以使得該兩相 接之記憶趙模組封裝件電性互通。 2、 如申凊專利範圍第i項所述之記憶趙模組封裝之模組連 、-α構其中該塑膠連接件之數量係與該些記憶體模組 封裝件之數量為相等，以將該些記憶趙模組封裝件串接 於一飾環。 13 1-324.81.4 - 3、如申請專利範圍第1或2項所述之記憶體模組封裝之模 - 組連結構造，其中該些記憶體模組封裝件係為全套設以 隱藏在該些塑膠連接件之内部。Ι 324, 81.4 X. Patent application group: 1. A module connection structure of a memory module package, comprising: a plurality of memory module packages, each memory module package comprising a substrate, at least one a memory chip and a gel having an inner surface and an outer surface, wherein the outer surface is formed with a plurality of USB contact fingers and a plurality of transfer fingers respectively on the two sides of the outer surface, wherein the memory chip is The inner surface of the substrate is electrically connected to the USB contact fingers, the encapsulation system is formed on the inner surface of the substrate, to seal the memory chip, and at least one plastic connector has a first outer casing, a second outer casing and a plastic elastic body flexiblely connecting the first outer casing and the second outer casing, wherein the first outer casing is provided with a plurality of first connecting ends, and the second outer casing is provided with The plurality of second connecting ends, the plastic elastic system has a plurality of core wires electrically connected to the first connecting ends and the second connecting ends, wherein the first outer casing is used for socketing one of the memory modules The mounting member has one side of the transfer fingers, such that the first connecting ends electrically contact the transfer fingers. The second outer casing is used for socketing another one of the memory module packages. One side of the USB contact finger is such that the second connection ends electrically contact the USB contact fingers, so that the two connected memory module packages are electrically intercommunicated. 2. The module connection of the memory Zhao module package as described in item yi of the patent application scope, wherein the number of the plastic connector is equal to the number of the memory module packages, The memory module package is connected in series to a ring. 13 1-324.81.4 - 3. The module-to-group connection structure of the memory module package according to claim 1 or 2, wherein the memory module packages are completely set to be hidden in the The inside of some plastic connectors.
TW096100100A 2007-01-02 2007-01-02 Modular assembly of memory module packages TWI324814B (en)

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