TWM364254U - Bendable assembly structure of memory module packages - Google Patents

Bendable assembly structure of memory module packages Download PDF

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Publication number
TWM364254U
TWM364254U TW098204602U TW98204602U TWM364254U TW M364254 U TWM364254 U TW M364254U TW 098204602 U TW098204602 U TW 098204602U TW 98204602 U TW98204602 U TW 98204602U TW M364254 U TWM364254 U TW M364254U
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TW
Taiwan
Prior art keywords
memory module
module package
memory
outer casing
usb
Prior art date
Application number
TW098204602U
Other languages
Chinese (zh)
Inventor
Hong-Chi Yu
Tse-Ming Lin
Original Assignee
Walton Advanced Eng Inc
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Publication date
Application filed by Walton Advanced Eng Inc filed Critical Walton Advanced Eng Inc
Priority to TW098204602U priority Critical patent/TWM364254U/en
Publication of TWM364254U publication Critical patent/TWM364254U/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

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Abstract

A bendable assembly of memory module packages mainly includes a plurality of memory module packages and at least a connector. Each package has a plurality of USB fingers and a plurality of transfer fingers formed on two sides of an exposed surface respectively. The connector has a first socket, a second socket, and a bendable connective body connecting the first and the second sockets. The first socket has a plurality of first contact pins for electrically contacting the transfer fingers. The second socket has a plurality of second contact pins for electrically contacting the USB fingers. The connective body has a plurality of flexible wirings electrically connecting the first and the second contact pins. Thereby, the memory module packages plugged side-by-side will be electrically connected to extend memory capability and its application in decorative purposes.

Description

M364254 五、新型說明： 【新型所屬之枝術領域】 本創作係有關於一種記憶體模組封裝之可擴充應 裝置特別係有關於—種記憶體模組封裝之可撓性連 結構造。 * 【先前技術】 °己隐體模組封裴產品可應用於隨身碟等，並無 可擴充功尨，例如在一個usb插槽只能插接一隨身碟， 未裝户阜連接器時，無法由單- USB插槽同時讀 之資料。此外，目前隨身碟之尺寸將越 思身攜帶時易於掉落遺失。 【新型内容】 供一=憶之:題’本創作之主要目的係在於提 件之兩端各自^續I之可触連結構造，彻—連結 記憶體模組封$件 対幻午乂使兩相接之 於擴充讀存，更可J 連接，達到無限延伸，便 二=::=二術 撓性連二主依據本創作’-種記憶體模組封敦之可 至少-連二要—包含複數個記憶體模組封裳件以及 至少一则曰，，己憶體模組封裝件係包含-基板、 體4以及—封膠體，該基板係具有—内表 4 M364254M364254 V. New Description: [New Field of Branching] This creation is about a flexible device package for a memory module package, especially for a flexible connection structure of a memory module package. * [Prior Art] ° The hidden module packaging products can be applied to the flash drive, etc., and there is no extensible function. For example, when only one USB flash drive can be plugged in a usb slot, when the connector is not installed, The data cannot be read simultaneously by the single-USB slot. In addition, the size of the current flash drive will be easily lost when it is carried. [New Content] For a = Recall: The title of the main purpose of this creation is to connect the two ends of the piece to each other. Continued I can touch the connection structure, complete - connect the memory module to seal the piece of the piece, the magical afternoon makes two In addition to the expansion of the read and save, it is more J-connected, reaching infinite extension, and the second =::= two-flexibility is connected to the two masters based on the creation of the '----------------------------------- a plurality of memory module sealing parts and at least one 曰, the memory module package comprises a substrate, a body 4 and a sealing body, the substrate has an inner surface 4 M364254

面以及一外表面，其中該外表面之兩侧端係分別形成有 複數個USB接觸指與複數個轉接指，該連結件係具有 一第一外殼、一第二外殼以及一可撓曲連接該第一外殼 與該第二外殼之連接體，該第一外殼係設有複數個第一 連接端，該第二外殼係設有複數個第二連接端，該連接 體係具有複數個電性連接該些第一連接端與該些第二 連接端之芯線，其中該第一連接端係與其中一記憶體模 組封裝件之該些轉接指電性接觸，該些第二連接端係與 另一其中一記憶體模組封裝件之該些USB接觸指電性 接觸，藉以使得該兩相接之記憶體模組封裝件電性互 通。 本創作的目的暨解決其技術問題還可採用以下技 術措施進一步實現。And an outer surface, wherein the two sides of the outer surface are respectively formed with a plurality of USB contact fingers and a plurality of transfer fingers, the link member having a first outer casing, a second outer casing and a flexible connection a connecting body of the first outer casing and the second outer casing, wherein the first outer casing is provided with a plurality of first connecting ends, and the second outer casing is provided with a plurality of second connecting ends, the connecting system having a plurality of electrical connections The first connection end and the second connection end of the core wire, wherein the first connection end is in electrical contact with the transfer fingers of one of the memory module packages, and the second connection ends are The other USB contacts of one of the memory module packages are electrically contacted, so that the two connected memory module packages are electrically connected. The purpose of this creation and solving its technical problems can be further realized by the following technical measures.

在前述之記憶體模組封裝之可撓性連結構造中，該 連結件之數量係可與該些記憶體模組封裝件之數量相 等，以將該些記憶體模組封裝件串接於一飾環，具有裝 飾功效。 在前述之記憶體模組封裝之可撓性連結構造中，該 些記憶體模組封裝件係可為全套設以隱藏在該些連結 件之内部。 在前述之記憶體模組封裝之可撓性連結構造中，該 記憶體晶片係設於該基板之該内表面上並電性連接至 M364254 該些USB接觸指，該封膠體係形成於該基板之該内表 面上’以密封該記憶體晶片。 在則述之§己憶體模組封裝之可撓性連結構造中，該 連接體係為塑膠材質。 【實施方式】 * 請參閱第1A與1B圖所示，本創作之-種記憶體 ' 模組封裝之可撓㈣結構造W係包含複㈣記憶體模 _ 組封裝件100以及至少一連結件200。利用該連結件2〇〇 之第-外殼210肖第二外殼22〇各自分別套接—記憶體 - 模組封裝件ι〇0，以使兩相接之記憶體模組封裝件1〇〇 ' 能串接與電性連接，達到無限延伸。 凊參閱第2A與2B圖所示，每一記憶體模組封裝 件100係包含一基板110、至少一記憶體晶片12〇以及 一封膠體130，該基板11〇係具有一内表面lu以及一 _ 夕卜表面112。if常該基板110係為具有雙面電性導通之 P刷電路板。其中該外表面H2之兩侧端係分別形成有 複數個 USB 接觸指 113 (USB 為 Universal Serial Bus 之簡稱’中文為通用串列匯流排）與複數個轉接指114, 該些USB接觸指113係能以插接方式電性接觸一 USB 插槽之端子。該些轉接指114則為該些USB接觸指113 之擴充端子，為反序電性連接，用以電性接觸另一記憶 體模組封裳件1 〇〇之USB接觸指113。在形狀上，該些 6 M364254 轉接指114可與該些USB接觸指113相同。 而該記憶體晶片120係設於該基板110之該内表面 111上並電性接觸至該些USB接觸指113。在本實施例 中，該記憶禮晶片120係為快閃記憶體，即不會無電源 而失去儲存資料。並能以打線形成之銲線電性連接該記 憶體晶片120至該基板11 〇。在該基板之該内表面 111上可另設置有被動元件或控制器。 該封膠體130係形成於該基板110之該内表面111 上，以密封該記憶體晶片120。在本實施例中，該封膠 體130係為轉移成形(transfer molding)技術形成，可使 該記憶體模組封裝件100為超小型磚塊狀。 請參閱第3A、3B及3C圖所示，該連結件200係 具有一第一外殼210、一第二外殼220以及一可撓曲連 接該第一外殼210與該第二外殼220之連接體230。該 弟一外殼210係设有複數個第一連接端211，用以電性 接觸一記憶體模組封裝件1〇〇之轉接指114。該第二外 殼220係設有複數個第二連接端221，用以電性接觸一 記憶體模組封裝件100之USB接觸指113。該連接體 230係具有複數個電性連接該些第一連接端211與該些 第二連接端221之芯線231。其中’請參閱第iB圖所 示，該第一外殼210係用以套接於其中一記憶體模組封 裝件100之該些轉接指114上，並使該些第一連接端 M364254 211電性接觸該些轉接指114，第二外殼220係用以套 接於另一其中一記憶體模組封裝件1〇〇之該些USB接 觸指113上，並使該些第二連接端221電性接觸該些In the flexible connection structure of the memory module package, the number of the connectors may be equal to the number of the memory module packages, so that the memory module packages are connected in series Decorative ring for decorative effect. In the flexible connection structure of the memory module package described above, the memory module packages may be completely disposed to be hidden inside the connectors. In the flexible connection structure of the memory module package, the memory chip is disposed on the inner surface of the substrate and electrically connected to the M364254 USB contact fingers, and the encapsulation system is formed on the substrate. 'on the inner surface' to seal the memory wafer. In the flexible connection structure of the § memory module package described above, the connection system is made of plastic material. [Embodiment] * Please refer to FIGS. 1A and 1B, the flexible (four) structure of the memory module package of the present invention includes a complex (four) memory phantom package 100 and at least one link. 200. The second outer casing 22 of the second outer casing 22 of the connecting member 2 is respectively sleeved-memory-module package ι〇0 so that the two-connected memory module package 1' Can be connected in series and electrically connected to achieve unlimited extension. Referring to FIGS. 2A and 2B, each memory module package 100 includes a substrate 110, at least one memory chip 12A, and a gel 130 having an inner surface and a _ 夕 卜 surface 112. If the substrate 110 is a P-brush circuit board having a double-sided electrical conduction. The two ends of the outer surface H2 are respectively formed with a plurality of USB contact fingers 113 (USB is a universal serial bus short for 'Chinese is a universal serial bus bar) and a plurality of transfer fingers 114, the USB contact fingers 113 The terminal can be electrically connected to the terminal of a USB slot by plugging. The transfer fingers 114 are the extension terminals of the USB contact fingers 113, and are electrically connected in reverse order to electrically contact the USB contact fingers 113 of the other memory module. In terms of shape, the 6 M364254 adapter fingers 114 can be identical to the USB contact fingers 113. The memory chip 120 is disposed on the inner surface 111 of the substrate 110 and electrically contacts the USB contact fingers 113. In the present embodiment, the memory card 120 is a flash memory, that is, it does not lose power and loses stored data. The memory chip 120 can be electrically connected to the substrate 11 by a bonding wire formed by wire bonding. A passive component or controller may be additionally disposed on the inner surface 111 of the substrate. The encapsulant 130 is formed on the inner surface 111 of the substrate 110 to seal the memory wafer 120. In the present embodiment, the encapsulant 130 is formed by a transfer molding technique, and the memory module package 100 can be made into an ultra-small brick. As shown in FIGS. 3A, 3B, and 3C, the connecting member 200 has a first outer casing 210, a second outer casing 220, and a connecting body 230 that flexibly connects the first outer casing 210 and the second outer casing 220. . The outer casing 210 is provided with a plurality of first connecting ends 211 for electrically contacting the transfer fingers 114 of a memory module package. The second housing 220 is provided with a plurality of second connecting ends 221 for electrically contacting the USB contact fingers 113 of a memory module package 100. The connecting body 230 has a plurality of core wires 231 electrically connected to the first connecting ends 211 and the second connecting ends 221 . The first outer casing 210 is sleeved on the plurality of the connecting fingers 114 of one of the memory module packages 100, and the first connecting ends M364254 211 are electrically connected. The second connecting shell 220 is sleeved on the USB contact fingers 113 of the other memory module package 1 and the second connecting ends 221 are Electrical contact

UsB接觸指113，籍以使得該兩相接之記憶體模組封裝 件100電性互通。 & 崎π叫工，明令阅罘與5A圖所示，The UsB contact finger 113 is used to electrically interconnect the two connected memory module packages 100. & Saki 叫 叫 ,, Ming Ming reading and 5A picture,

可以增加連結件2GG之數量，以串接更多數量的記憶體 模組封裝件100，並且該些記憶體模組封骏件1㈧之門 為電性互通，達到無限延伸。僅需要將最前端的記憶體 楔組封裝件100之USB接觸指〗13插接至—電腦^機 或筆記型電腦之USB插槽，令該USB接觸指ii3電性 ，觸USB插槽之端子，便可使所有被串接的記憶體模 :封裝件議顯示在電腦主機或筆記型電腦之作料 圖上’以供資料傳輸之讀取與存入。請參閱第4B與 、所不’該些連結件2 〇 〇之連接體2 3 M系為塑 从任意-折，因此不會造成最/ 100承受過大重量。 、體槟組封裝件 -種记憶體模組封裝之可撓 件細之第-外殼21G與第二外㈣各t以-連結 :憶體模組封裝件100，可使得兩相：別套接一 ^件刚串接，達到無限延伸，並可串接成憶體模細封 兼具美觀裝飾作用。 *成一饰環則亦The number of the connecting members 2GG can be increased to connect a larger number of the memory module packages 100, and the gates of the memory module sealing members 1 (8) are electrically connected to each other to reach an infinite extension. It is only necessary to plug the USB contact finger 13 of the front-end memory wedge package 100 into the USB slot of the computer or the notebook computer, so that the USB contact refers to the ii3 electrical, and touches the terminal of the USB slot. All the memory modules that are connected in series can be displayed: the package is displayed on the drawing of the host computer or the notebook computer for reading and depositing data transmission. Please refer to Section 4B and No. 2, the connector 2 M 〇 of the connector 2 3 M is plastic from any fold, so it does not cause the most / 100 to withstand excessive weight. , the body of the betel group package - the flexible module of the memory module package - the outer casing 21G and the second outer (four) each t-link: the memory module package 100, can make two phases: different sets One piece is just connected in series to reach an infinite extension, and can be connected in series to form a memetic die and a beautiful decorative effect. *It’s also a ring

M364254M364254

在另一應用面上，請參閱第6圖所示，牛 200之數量係可與該些記憶體模組封裝件100之數量為 相等，以將該些記憶體模組封裝件100串接於一飾環， 如手環，易於攜帶使用與美觀裝飾。其中，該些記憶體 模組封裝件100之兩側係各自分別被套接兩個連結件 200之第一外殼210與第二外殼220。較佳地，該些記 憶體模組封裝件100係為全套設以隱藏在該些連結件 200之内部，以得到較佳的保護。In another application, as shown in FIG. 6, the number of cows 200 can be equal to the number of the memory module packages 100 to serially connect the memory module packages 100 to A decorative ring, such as a bracelet, is easy to carry and beautifully decorated. The two sides of the memory module package 100 are respectively sleeved with the first outer casing 210 and the second outer casing 220 of the two connecting members 200. Preferably, the memory module packages 100 are fully assembled to be hidden inside the connectors 200 for better protection.

以上所述，僅是本創作的較佳實施例而已，並非對 本創作作任何形式上的限制，雖然本創作已以較佳實施 例揭露如上，然而並非用以限定本創作，任何熟悉本專 業的技術人員，在不脫離本創作技術方案範圍内，當可 利用上述揭示的技術内容作出些許更動或修飾為等同 變化的等效實施例，但凡是未脫離本創作技術方案的内 容，依據本創作的技術實質對以上實施例所作的任何簡 單修改、等同變化與修飾，均仍屬於本創作技術方案的 範圍内。 【圖式簡單說明】 第1Α與1Β圖：依據本創作之一具體實施例，一種記憶 體模組封裝之可撓性連結構造於連接狀態之俯 視圖與截面圖。 第2Α與2Β圖：為本創作記憶體模組封裝件之俯視圖 9 M364254The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way. Although the present invention has been disclosed above in the preferred embodiment, it is not intended to limit the present invention, and any familiarity with the subject matter. A person skilled in the art can make some modifications or modifications to equivalent embodiments by using the technical content disclosed above, without departing from the technical scope of the present invention. Technical simplifications Any simple modifications, equivalent changes and modifications made to the above embodiments are still within the scope of the present technical solution. BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1A and 1B are diagrams showing a flexible connection structure of a memory module package in a connected state and a cross-sectional view, according to an embodiment of the present invention. 2nd and 2nd drawings: top view of the original memory module package 9 M364254

與截面示意圖。 第3A至3C圖：為本創作連結件之俯視圖、上截面圖及 側截面圖。 第4A至4B圖：為本創作記憶體模組封裝之可撓性連結 構造在可彎折電連接狀態之俯視圖。 第5A至5B圖：為本創作記憶體體模組封裝之可撓性 連結構造在可彎折電連接狀態之俯視圖。And a schematic view of the section. 3A to 3C are: a plan view, an upper cross-sectional view, and a side cross-sectional view of the creation link. 4A to 4B are plan views showing the flexible connection structure of the present memory module package in a bendable electrical connection state. Fig. 5A to Fig. 5B are plan views showing the flexible connection structure of the creation memory body module package in a bendable electrical connection state.

第6圖：為本創作記憶體模組封裝之可撓性連結構造在 環接成飾環之側視圖。Fig. 6 is a side view of the flexible connecting structure of the present memory module package in a looped ring.

【主要元件符號說明】 10 記憶體模組封裝之 130 封膠體 可撓性連結構造 200 連結件 100 記憶體模組封裝件 210 第一外殼 110 基板 211 第一連接端 111 内表面 220 第二外殼 112 外表面 221 第二連接端 113 USB接觸指 230 連接體 114 轉接指 231 芯線 120 晶片[Main component symbol description] 10 Memory module package 130 Sealant flexible connection structure 200 Connector 100 Memory module package 210 First housing 110 Substrate 211 First connection end 111 Inner surface 220 Second housing 112 Outer surface 221 second connection end 113 USB contact finger 230 connector 114 transfer finger 231 core wire 120 wafer

Claims (1)

M364254 六、申請專利範圍： 1、一種記憶體模組封裝之可撓性連結構造，其包含： 複數個記憶體模組封裝件，每一記憶體模組封裝件係 包含一基板、至少一記憶體晶片以及一封膠體， 該基板係具有一内表面以及一外表面，其中該外 表面之兩側端係分別形成有複數個USB接觸指 與複數個轉接指；以及M364254 VI. Patent Application Range: 1. A flexible connection structure for a memory module package, comprising: a plurality of memory module packages, each memory module package comprising a substrate, at least one memory a body wafer and a gel body, the substrate having an inner surface and an outer surface, wherein the two sides of the outer surface are respectively formed with a plurality of USB contact fingers and a plurality of transfer fingers; 至少一連結件，其係具有一第一外殼、一第二外殼以 及一可撓曲連接該第一外殼與該第二外殼之連接 體，該第一外殼設有複數個第一連接端，該第二 外殼設有複數個第二連接端，該連接體係設有複 數芯線並與該些第一連接端及該些第二連接端電 性連接，其中該些第一連接端係與其中一記憶體 模組封裝件之該些轉接指電性接觸，該些第二連 接端係與另一其中一記憶體模組封裝件之該些 USB接觸指電性接觸，使該兩相接之記憶體模組 封裝件電性互通。 2、 如申請專利範圍第1項所述之記憶體模組封裝之可撓 性連結構造，其中該連結件之數量係與該些記憶體模 組封裝件之數量為相等，以將該些記憶體模組封裝件 串接於一飾環。 3、 如申請專利範圍第1或2項所述之記憶體模組封裝之 11At least one connecting member having a first outer casing, a second outer casing and a connecting body flexibly connecting the first outer casing and the second outer casing, the first outer casing being provided with a plurality of first connecting ends, The second housing is provided with a plurality of second connecting ends, and the connecting system is provided with a plurality of core wires electrically connected to the first connecting ends and the second connecting ends, wherein the first connecting ends are associated with one of the memories The adapters of the body module package are electrically contacted, and the second terminals are in electrical contact with the USB contacts of the other one of the memory module packages, so that the two memories are connected. The body module package is electrically connected. 2. The flexible connecting structure of the memory module package according to claim 1, wherein the number of the connecting members is equal to the number of the memory module packages to memorize the memory. The body module package is connected in series to a trim ring. 3. The memory module package as described in claim 1 or 2 of the patent application 11 M364254 可撓性連結構造，其中該些記憶體模組封裝 套設以隱藏在該些連結件之内部。 4、如申請專利範圍第1項所述之記憶體模組封裝之可撓 性連結構造，其中該記憶體晶片係設於該基板之該内 '表面上並電性連接至該些USB接觸指，該封膠體係形 . 成於該基板之該内表面上，以密封該記憶體晶片。 . 5、如申請專利範圍第1項所述之記憶體模組封裝之可撓 i 性連結構造，其中該連接體係為塑膠材質。M364254 A flexible connection structure, wherein the memory module packages are sleeved to be hidden inside the connectors. 4. The flexible connection structure of the memory module package of claim 1, wherein the memory chip is mounted on the inner surface of the substrate and electrically connected to the USB contact fingers. The encapsulation system is formed on the inner surface of the substrate to seal the memory wafer. 5. The flexible i-linked structure of the memory module package according to claim 1, wherein the connection system is a plastic material. 1212
TW098204602U 2009-03-24 2009-03-24 Bendable assembly structure of memory module packages TWM364254U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI690027B (en) * 2018-07-18 2020-04-01 日商東芝記憶體股份有限公司 Semiconductor memory device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI690027B (en) * 2018-07-18 2020-04-01 日商東芝記憶體股份有限公司 Semiconductor memory device

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