TWI324774B - Biasing and shielding circuit for source side sensing memory - Google Patents
Biasing and shielding circuit for source side sensing memory Download PDFInfo
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- TWI324774B TWI324774B TW96134582A TW96134582A TWI324774B TW I324774 B TWI324774 B TW I324774B TW 96134582 A TW96134582 A TW 96134582A TW 96134582 A TW96134582 A TW 96134582A TW I324774 B TWI324774 B TW I324774B
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- 三達編號:TW3728PA 九、發明說明: . 【發明所屬之技術領域】 本發明是有關於一種偏壓及遮蔽(Shielding)之電路, - 且特別是有關於一種應用於源極端感測記憶體(Source ·« Side Sensing Memory)之偏塵及遮蔽之電路。 【先前技術】 隨著科技的發展,非揮發性(Non-volatile)記憶體,例 $ 如是快閃記憶體(flash)係以廣泛地應用在各種電子產品 中。在開閃記憶體裝置中記錄資料之讀取操作中,係使用 感測電路來感測目標記憶胞(Cell)之記憶胞電流,以判請參 照第1圖,其繪示傳統快閃記憶體裝置之記憶胞矩陣的示 • 意圖。當記憶胞Ca係被存取,記憶胞Ca之記憶胞電流II . 應被感測,以決定記憶胞Ca儲存之資料數值。於感測操 作時,感測電路100係與記憶胞Ca耦接。由於記憶胞電 流II難以偵測及進行遮蔽,感測電流12係被利用在感測 ^ 操作中,以得知記憶胞Ca之記憶胞電流Π之大小。記憶 胞電流II及感測電流12滿足方程式: 11=12+13 13為經由記憶胞Cb分流之漏電流,其中記憶胞Cb係與記 憶胞Ca相鄰。漏電流13將影響感測電流II之精準度及影 響感測電路100感測到之資料數值的正確性。記憶胞電流 與感測電流間之差值越小,感測電路100執行之感測操作 越精確。在此,記憶胞電流及感測電流間之差值係定義為 1324774- Sanda number: TW3728PA IX. Description of the invention: 1. Field of the Invention The present invention relates to a circuit for biasing and shielding, and in particular to a source-sensing memory (Source · « Side Sensing Memory) The circuit of dust and shadow. [Prior Art] With the development of technology, non-volatile memory, such as flash memory, is widely used in various electronic products. In the reading operation of recording data in the flash memory device, the sensing circuit is used to sense the memory cell current of the target memory cell (Cell), so as to refer to FIG. 1, which shows the conventional flash memory. The intent of the memory cell matrix of the device. When the memory cell Ca is accessed, the memory cell current II of the memory cell Ca should be sensed to determine the data value of the memory cell Ca storage. During the sensing operation, the sensing circuit 100 is coupled to the memory cell Ca. Since the memory cell current II is difficult to detect and mask, the sensing current 12 is utilized in the sensing operation to know the size of the memory cell current 记忆 of the memory cell Ca. The memory cell current II and the sense current 12 satisfy the equation: 11 = 12 + 13 13 is the leakage current shunted through the memory cell Cb, wherein the memory cell Cb is adjacent to the memory cell Ca. The leakage current 13 will affect the accuracy of the sense current II and affect the correctness of the data values sensed by the sense circuit 100. The smaller the difference between the memory cell current and the sense current, the more accurate the sensing operation performed by the sensing circuit 100. Here, the difference between the memory cell current and the sense current is defined as 1324774
- 三達編號:TW3728PA 誤差電流。如此,如何設計出具有較小誤差電流及較精準 之資料數值感測結果的快閃記憶體電路為業界不斷致力 的方向之^ 一。 【發明内容】 本發明係有關於一種偏壓及遮蔽(Shidding)之電路, 其可有^地偏壓目標記憶胞(Cell)與相鄰記憶胞之源电極電 壓具有實質上相同的電壓位準。偏壓及遮蔽之電路可有私效 地避免目標記憶胞之記憶胞電流受到相鄰記憶胞曰> 體的源極雷户夕呈;;鄕 .,,. &曰曰 結果之正1:: 有效地提升資料數值偵測 確性及提升感測單元之感測速度。 之^據^發明提出—種偏壓(Biasing)與遮蔽(Shielding) 用=感測記憶體(S™心^ (Cell)輸出之 ,、f f極端感測記憶體之目標記憶胞 電流之影到第—相鄰記憶胞之源極(Source) 路包括預放電F 流至感測單元之感測節點。電 壓拉低單元及第—連Γ及第二篇壓單元、第-及第二電 訊號之位準夠 ^早二預放電裝置用以在第一控制 電壓位準。第—:=設定感測節點之電壓位準至負 來分別將目;㈣單元用以回應於第二偏壓位準 壓偏壓至第二I之源極電壓及相鄰記憶胞之源極電 流經第一及第二準。其中’感測電流及源極電流分別 第一及第二_ ,»—偏壓位準接近接地位準。 拉低早兀用以於第二控制訊號為低位準 X S- > 7 1324774- Sanda number: TW3728PA error current. In this way, how to design a flash memory circuit with a small error current and a relatively accurate data value sensing result is one of the directions that the industry is constantly striving for. SUMMARY OF THE INVENTION The present invention relates to a bias and shingling circuit that can bias a target memory cell (Cell) to have substantially the same voltage level as a source electrode voltage of an adjacent memory cell. quasi. The circuit of bias voltage and shielding can have a private effect to avoid the memory cell current of the target memory cell being subjected to the source of the adjacent memory cell; the source of the body is Lei Ren Xi;; 鄕.,,. & :: Effectively improve the accuracy of data values and improve the sensing speed of the sensing unit. According to the invention, a biasing (Biasing) and Shielding are used to sense the memory (STM heart ^ (Cell) output, ff extreme sensing memory target memory current The source path of the first adjacent memory cell includes a pre-discharge F flow to the sensing node of the sensing unit, the voltage pull-down unit and the first-connected and the second press unit, the first and second electrical signals The position of the pre-discharge device is used to be at the first control voltage level. The::== sets the voltage level of the sensing node to negative to respectively target; (4) the unit responds to the second bias position The quasi-voltage bias voltage to the source voltage of the second I and the source current of the adjacent memory cell pass through the first and second quasi-. wherein the 'sensing current and the source current are respectively the first and second _,»-bias The level is close to the ground level. The low level is used for the second control signal to be low level X S- > 7 1324774
三達編號:TW3728PA 列。Y多工器(Multiplexer)24用以回應於位址訊號來提供 汲極偏壓訊號DB至目標記憶胞之汲極或經由對應之位元 線提供DB至相鄰於目標記憶胞之記其他憶胞。列解碼器 14耦接至Μ條字元線(Word Line) WL1〜WLM,其係平行 地與記憶胞陣列16中之Μ列記憶胞排列。列解碼器14 用以回應於位址訊號來提供字元訊號w至記憶胞陣列Μ 中之Μ列記憶胞。回應於對應之汲極偏壓訊號DB及字元 訊號W ’目標記憶胞之電晶體叫)係被導通,幻原極: 流I⑽係被產生。感測單元22用以根據感測電流二 =斷記㈣之記憶資料數值’感測電流啊)係經= 接至目標記憶胞之電晶體Τω)之源極之位元線輪出輕 測電流IS⑽係接近源極電流I(iJ)。舉例 感 位元線BL4提供之汲極偏壓訊號D ^回應於由 供之字元訊號W產生之源極電流t(二:線WU提 T(1,3)。與源極電流叩,3)對應之感測電流晶體 元線BL3輸出。 L (,3)係經由位 遮蔽電路20用以避免减測雷 胞之電晶體Taj-D之源極電流I(〇 (1,ji受到相鄰之記憶 電流IS(i,j)至感測單元2〇。接下來」的影響’並提供感測 晶體T(U)之操作為例子對遮蔽電跟係遮蔽電路20對電 請參照第3圖及第4圖,第3回=之操作作說明。 電路20的詳細電路圖,第4圖繪厂圖'\不乃第2圖中遮蔽 20之相關訊號的波形圖。感9不乃第3圖中遮蔽電路 器。電壓偵測器用以判斷感測節:2:’例如是電壓偵測 之電壓位準為高於Sanda number: TW3728PA column. The multiplexer (Multiplexer) 24 is configured to provide the bungee bias signal DB to the drain of the target memory cell or provide the DB to the adjacent memory cell via the corresponding bit line in response to the address signal. Cell. The column decoder 14 is coupled to Word Lines WL1 WLW, which are arranged in parallel with the bank memory cells in the memory cell array 16. The column decoder 14 is responsive to the address signal to provide the word signal w to the bank memory cells in the memory cell array. In response to the corresponding bungee-bias signal DB and the character signal W', the cell of the target memory cell is turned on, and the imaginary pole: stream I(10) is generated. The sensing unit 22 is configured to perform a light measurement current according to the sensed current value of the sensed current (=4) of the memory data value of the sense memory (the sense current) connected to the source of the transistor ω) of the target memory cell. IS(10) is close to the source current I(iJ). For example, the drain bias signal D^ provided by the sense bit line BL4 is responsive to the source current t generated by the word signal W (two: the line WU is T (1, 3). With the source current 叩, 3 ) corresponding to the sense current crystal element line BL3 output. L (, 3) is used by the bit masking circuit 20 to avoid subtracting the source current I of the transistor Taj-D of the detonator (〇(1,ji is subjected to the adjacent memory current IS(i,j) to sensing) Unit 2 〇. The next "impact" and provide the operation of sensing the crystal T (U) as an example. For the shielding of the electrical tracking system 20, please refer to Figure 3 and Figure 4, the third operation Description: The detailed circuit diagram of the circuit 20, the fourth drawing of the factory diagram '\ is not the waveform diagram of the related signal of the mask 20 in the second figure. The sense 9 is not the shielding circuit in the third figure. The voltage detector is used to judge the sense Measure: 2: 'For example, the voltage level of voltage detection is higher than
Q HZ4//4Q HZ4//4
三達編號:TW3728PA 低於參考電壓位準或是為低於參考電壓位準,以決定目標 記憶胞中記憶資料的數值。 遮蔽電路20包括預放電(Pre-discharge)裝置202、偏 壓單το 204、206、電壓拉低單元2〇8、21〇及連接單元212。 預,%裝置202柄接至感測節點sn ’以控制感測節點之 電壓位準。預放電裝置202例如包括電晶體電晶體Sanda number: TW3728PA is lower than the reference voltage level or lower than the reference voltage level to determine the value of the memory data in the target memory cell. The masking circuit 20 includes a pre-discharge device 202, biasing singles 204, 206, voltage pull-down units 2〇8, 21〇, and a connection unit 212. Pre-% device 202 is connected to sense node sn' to control the voltage level of the sense node. The pre-discharge device 202 includes, for example, a transistor transistor
Ml 為 N 型金氧半(Metal Oxide Semiconductor,MOS)電晶 體’電晶體Ml包括閘極(Gate)、汲極(Drain)及源極 (Source),其分別接收控制訊號SCi、耦接至感測節點 及接收負電壓位準VLN。於期間τρι中,控制訊號奶 被致此,電晶體Ml係被導通並將感測節點SN之電壓位 準預先放電至負電堡位準VLN。而於期間τρ2中,控制訊 號SC2被非致能,電晶體M2係被關閉。 偏壓單7L 2〇4及2〇6係分別輕接至電晶體吼3)與 T(l,2)之源極’並分別用以對電晶雜 電壓進行偏壓,使電Β俨h t j之源極 电日日體TG,3)與T(l,2)之源極電壓均接 近一個偏壓電壓位準。偏懕 接 Α 偏蜃早兀204及206例如分別句括 電晶體M2及M3。t Β於Ώ ⑺匕括 斗二 也日日體M2及M3為Ρ型MOS電日驊, 其包括閘極、沒極遍、、择搞 日日體 ^广 與源極。電晶體M2與M3之閘極桩跄 、 極刀別耦接至電晶體T(l,3)與Τπ 之源極,沒極分別執接至恭 ,) 曰曰 兒壓拉低皁元208與210。雷 體M2與m3係回應於偏壓a、住Τ B曰 、於偏壓位準VLB2被導通,以 體M2與M3之源極電壓滿足方程式: 私Ml is an N-type Metal Oxide Semiconductor (MOS) transistor. The transistor M1 includes a gate, a drain, and a source, which respectively receive the control signal SCi and are coupled to the sense. Measure the node and receive the negative voltage level VLN. During the period τρι, the control signal milk is caused, the transistor M1 is turned on and the voltage level of the sensing node SN is pre-discharged to the negative electric gate level VLN. In the period τρ2, the control signal SC2 is disabled, and the transistor M2 is turned off. The bias voltages 7L 2〇4 and 2〇6 are respectively connected to the transistors 吼3) and the source of T(l,2) and are respectively used to bias the electric crystal voltage to make the electric Β俨htj The source of the source solar TG, 3) and the source voltage of T (l, 2) are close to a bias voltage level. Hemiplegia 蜃 蜃 蜃 兀 204 and 206, for example, respectively, include transistors M2 and M3. t Β于Ώ (7) 匕 斗 斗 二 二 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日 日The gates of the transistors M2 and M3 are connected to the source of the transistors T(l,3) and Τπ, and the poles are respectively connected to Christine.) 210. The ridges M2 and m3 are turned on in response to the bias voltage a, the Τ B 曰 , and the bias level VLB2 , and the source voltages of the bodies M2 and M3 satisfy the equation:
Ve _ M2 = VLB2 + Vth M2 1324774Ve _ M2 = VLB2 + Vth M2 1324774
- 三達編號:TW3728PA . Ve_M3 = VLB2 + Vth_M3- Sanda number: TW3728PA . Ve_M3 = VLB2 + Vth_M3
Ve_M2及Ve—M3分別為電晶體M2及M3之源極電壓位 準’而Vth_M2及Vth一M3分別為電晶體M2及M3之臨界 • 電壓。臨界電壓Vth_M2及Vth__3例如為實質上相等。如 - 此’電晶體丁(1,3)與T(l,2)之源極電壓位準為實質上相 等。偏壓位準VLB2例如為負電壓位準,電晶體M2與M3 之源極電壓位準均接近於接地位準VLG。感測電流IS( 1,3) 及IS(1,2)分別流經電晶體M2及]V13。 ^ 電壓拉低單元208及210分別耦接至電晶體M2及 M3之沒極’以分別拉低電晶體m2及M3之汲極電壓位 準。電壓拉低單元208及210例如分別包括電晶體M4及 M5,電晶體M4及M5例如為p型M〇s電晶體。電晶體 M4及M5之閘極例如接收控制訊號SC2,汲極接收接地位 準VLG ’源極分別耦接至電晶體m2及M3之汲極。 在期間τρι,控制訊號SC2被致能,且實質上為負電 壓位準。此時電晶體M4及M5例如被導通,以分別拉低 • 電晶體M2及M3之汲極電壓位準,使電晶體M2及M3 之汲極電壓位準接近接地位準VLG。如此,在期間τρι 中,電晶體M2及M3之源極電壓位準實質上接近接地位 準VLG,而電晶體T(1,3)及丁(1,2)之源極電壓位準亦接近 接地位準VLG。控制訊號SC2例如是控制訊號SC1之一 反相訊號。 連接單兀212耦接至電晶體M2之汲極及感測節點 SN ’以提供流經電晶體奶之感測電流is(i,3)至感測節點 11Ve_M2 and Ve-M3 are the source voltage levels of transistors M2 and M3, respectively, and Vth_M2 and Vth-M3 are the critical voltages of transistors M2 and M3, respectively. The threshold voltages Vth_M2 and Vth__3 are, for example, substantially equal. For example, the source voltage levels of the 'diodes D1 (1, 3) and T (l, 2) are substantially equal. The bias level VLB2 is, for example, a negative voltage level, and the source voltage levels of the transistors M2 and M3 are both close to the ground level VLG. The sense currents IS(1, 3) and IS(1, 2) flow through the transistors M2 and V13, respectively. The voltage pull-down units 208 and 210 are coupled to the gates of the transistors M2 and M3, respectively, to pull the drain voltage levels of the transistors m2 and M3, respectively. The voltage pull-down units 208 and 210 include, for example, transistors M4 and M5, respectively, and the transistors M4 and M5 are, for example, p-type M〇s transistors. The gates of the transistors M4 and M5 receive, for example, the control signal SC2, and the source of the drain receiving ground level VLG' is coupled to the drains of the transistors m2 and M3, respectively. During the period τρι, the control signal SC2 is enabled and is essentially a negative voltage level. At this time, the transistors M4 and M5 are turned on, for example, to pull down the drain voltage levels of the transistors M2 and M3, respectively, so that the drain voltage levels of the transistors M2 and M3 are close to the ground level VLG. Thus, during the period τρι, the source voltage levels of the transistors M2 and M3 are substantially close to the ground level VLG, and the source voltage levels of the transistors T(1, 3) and D (1, 2) are also close. The grounding level is VLG. The control signal SC2 is, for example, an inverted signal of the control signal SC1. The connection unit 212 is coupled to the drain of the transistor M2 and the sensing node SN' to provide a sensing current is(i, 3) flowing through the transistor milk to the sensing node 11
三達編號:TW3728PA SN,以對電容(^充電。連接單元 M6。電晶體_例如是n型M〇s略日列如包括電晶體 括閘極、没極及源極。電晶體M6 :曰曰體’電晶體M6包 SC2,源極耦接至感測節點SN,及^極接收控制简 没極。在期間爪巾,電晶體至電晶體地之 體M2之汲極與感測節點S]Si。如此晶 & ’感測電流IS(1 被提供至電容Cl,而感測節點SN 毛,L 1 可 〜兒壓將相關於感泪,丨齋 流IS(1,3)與充電時間的乘積,如此, 、]電 此,感測單元22可找屮 目標記憶胞中之資料數值, $ 毛楗位準為接近,使 電晶體T (15 2)之汲極與源極間之跨壓實f上很小。例如"· 電晶體M3與M2之源極電壓位準分別等於%微伏特 (Millivolt ’ mV)及214mV。由於電晶體τ(ι,2)之源極斑及 J 7 土 、’〜叩妳柽電流1(1,3)之編 流係非常小。如此,偏壓及遮蔽電路2〇可有效地降低 電流之大小,使得源極電流1(1,3)及感測電流IS(1,3)為 ^,使得感測電路22感測到之資料數值的正確率較高 極間之跨壓很小,源極電流1(1,2),即源極電流I(u)之漏 雷流係非當小。如此,偏壓及摭益啻狄m ~ 1 & 漏電 相近 由於在期間TP2中,電晶體M2之源極_汲極跨壓實質 上接近2.6伏特(〇-(-2.6)),而實質上大於電晶體m2之閘 極-源極跨壓與電3日體M2之£^界電壓之差’在期間TP] 中,電晶體M2實質上被偏壓在飽和區(Saturati〇n Region)。利用電晶體M2在期間TP2被偏壓在飽和區的特 點,在感測節點SN看到之等效電容實質上遠小於在傳統 源極端感測記憶體之感測節點SN看到之等效電容。如 12 .< S- 丄JZ4//4 二_號:TW3728Pa 而感測操 攻剛郎點SN之電壓的充雷、击& 作m 土 屯㈣兄包迷度可被提升 乍之細作速度可有效地被提升。 偏壓及遮蔽電路20更包括負雪 . P_P)222、位準移位及邏輯單元2 ^^泵陶咖…arge 用以提供負電壓位準VLN 216。負電荷泵222 節點张之電壓位準為負電壓二;^ 以設定感測 例如等一位準移位 負電龎仞Μντχτ、 早兀214及216用以根據Sanda number: TW3728PA SN, for the capacitor (^ charge. Connection unit M6. Transistor _ for example, n-type M〇s slightly daily, including the transistor including gate, immersion and source. Transistor M6: 曰The body 'transistor M6 package SC2, the source is coupled to the sensing node SN, and the ^ pole receiving control is simple. In the period of the claw towel, the transistor to the body of the transistor M2 and the sensing node S ]Si. Such crystal & 'sense current IS (1 is supplied to the capacitor Cl, while the sense node SN hair, L 1 can be related to the tears, 丨 流 stream IS (1, 3) and charging The product of time, so, ], the sensing unit 22 can find the data value in the target memory cell, and the value of the 楗 楗 is close, so that the drain of the transistor T (15 2) is between the source and the source. The cross-compacting f is small. For example, the source voltage levels of the transistors M3 and M2 are equal to % microvolts (Millivolt 'mV) and 214 mV, respectively, due to the source spot of the transistor τ(ι, 2). The circuit current of J 7 soil, '~叩妳柽 current 1 (1, 3) is very small. Thus, the bias voltage and shielding circuit 2〇 can effectively reduce the current, so that the source current is 1 (1, 3) and the sense current IS(1,3) is ^, so that the correct value of the data value sensed by the sensing circuit 22 is relatively high, and the source voltage is 1 (1, 2), that is, The leakage current of the source current I(u) is not small. Therefore, the bias voltage is similar to that of the leakage current due to the leakage of the source of the transistor M2 during the period TP2. Up to 2.6 volts (〇-(-2.6)), and substantially larger than the difference between the gate-source voltage across the transistor m2 and the voltage of the electric 3' body M2' during the period TP], the transistor M2 is substantially biased in the saturation region (Saturati〇n Region). Using the characteristics of transistor M2 during which TP2 is biased in the saturation region, the equivalent capacitance seen at the sensing node SN is substantially smaller than in the conventional source. The sensing capacitance of the extreme sensing memory SN sees the equivalent capacitance. For example, 12 .< S- 丄JZ4//4 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ & m m 屯 (4) brother package fan can be improved, the speed of fine work can be effectively improved. Bias and shielding circuit 20 also includes negative snow. P_P) 222, level shift and logic unit 2 ^ ^ pump Tao café...arge To provide a negative voltage level negative voltage VLN 216. The charge pump 222 bit nodes Zhang quasi two negative voltage; ^ other sense, for example to set a level shifting negatively charged Pang Ren Μντχτ, 214 and 216 for early Wu The
^ 7刀別提供控制訊號SCI及SC2。A _, 控制訊號SCU及SC2之高㈣㈣ ^ VLG,控制訊號SC1 、貝上4於接地位旱 愿你進ντχτ ^ 之低位準例如實質上等於負電 準VLN。偏壓及遮蔽電路2〇更包括調節器 f m)2:4 ’:周印器224回應於參考訊號Ref及電源訊 來產生日偏壓位準VLB2。電源訊號nv例如由負電 何泵222所提,其係具有負電壓位準。^ 7 knives provide control signals SCI and SC2. A _, control signal SCU and SC2 high (four) (four) ^ VLG, control signal SC1, Beishang 4 at the grounding position, you are allowed to enter the low level of ντχτ ^, for example, substantially equal to the negative VLN. The biasing and shielding circuit 2 further includes a regulator f m) 2: 4 ′: the peripheral 224 generates a daily bias level VLB2 in response to the reference signal Ref and the power signal. The power signal nv is, for example, referred to by the negative power pump 222, which has a negative voltage level.
凊參照第2圖,本實施例之快閃記憶體1〇更包括γ 多工器(触⑻叫18,其耦接至位元線犯〜則以接收 對應之N行記憶胞中之記憶胞產生之感測電流。γ多工器 18回應於選擇鮮旧流排ss上之訊號連接位元線 BL1〜BLN中兩條位元線至電晶體奶及M3之源極。舉例 來說,纽極端偏壓單元12及列解碼器14提供對應之沒 極偏壓訊號DB及字元訊號w以驅動電晶體τ(ι,3)時,γ 多工器18使位元線BL3及BL2分別輕接至電晶體禮及 M3之源極。如此’偏壓及遮蔽電路2()可將電晶體τ(ι,3) 及T(U)之源極電壓均偏壓至接近接地位準彻,並經由 13 1324774Referring to FIG. 2, the flash memory 1 of the present embodiment further includes a gamma multiplexer (touch (8) is called 18, which is coupled to the bit line to make a memory cell in the corresponding N-line memory cell. The sense current is generated. The γ multiplexer 18 responds to selecting two bit lines of the signal connection bit lines BL1 BLBLN on the fresh and old flow row ss to the source of the transistor milk and M3. For example, When the extreme bias unit 12 and the column decoder 14 provide the corresponding infinite bias signal DB and the word signal w to drive the transistor τ(ι, 3), the γ multiplexer 18 makes the bit lines BL3 and BL2 light, respectively. Connected to the transistor and the source of M3. Thus, the 'biasing and shielding circuit 2' can bias the source voltages of the transistors τ(1,3) and T(U) to near ground. And via 13 1324774
- 三達編號:TW3728PA . Y多工器18提供感測電流1(1,3)至感測單元22。 雖然在本實施例中僅以Y多工器18分別連接位元線 BL3及BL2至電晶體M2及M3之源極之操作為例作說 • 明,然,Y多工器18更可回應於選擇訊號匯流排SS上其 , 他數值之訊號來連接其他位元線至電晶體M2及M3之源 極。如此,感測單元22可偵測位於其他記憶胞行之記憶 胞之感測電流,而偏壓及遮蔽電路20可避免目標記憶胞 之感測電流受到與其相鄰之記憶胞之電晶體之源極電流 | 的影響。雖然在本實施例中僅以避免目標記憶胞之感測電 流IS( 1,3)受到源極電流I( 1,2)之影響的例子來對偏壓及遮 蔽電路20之操作做說明,然,避免其他目標記憶胞之感 測電流受到對應之源極電流影響之操作可根據前述例子 • 之操作類推得到。 在本實施例之偏壓及遮蔽電路20中,偏壓單元206 與電壓拉低單元210係形成一個之遮蔽裝置,用以避免目 標記憶胞之感測電流受到相鄰記憶胞之源極電流之影 ^ 響。雖然在本實施例僅以包括一個遮蔽裝置之偏壓及遮蔽 電路20為例作說明,然,本實施例之偏壓及遮蔽電路20 並不侷限於僅包括一個遮蔽裝置。舉例來說,請參照第5 圖,其繪示依照本實施例之偏壓及遮蔽電路20的第二電 路圖。在第5圖之偏壓及遮蔽電路20’中,另一個包含偏 壓單元206’及電壓拉低單元210’之遮蔽裝置係被加入第3 圖之偏壓及遮蔽電路20中。偏壓單元206’及電壓拉低單 元210’分別用以對電晶體T(l,l)之源極電壓進行偏壓及拉 14 1324774- Sanda number: TW3728PA. Y multiplexer 18 provides sense current 1 (1, 3) to sense unit 22. Although in the present embodiment, only the operation of connecting the bit lines BL3 and BL2 to the sources of the transistors M2 and M3 respectively by the Y multiplexer 18 is taken as an example, the Y multiplexer 18 is more responsive to Select the signal on the signal bus SS, and its value signal to connect the other bit lines to the sources of the transistors M2 and M3. In this way, the sensing unit 22 can detect the sensing current of the memory cells located in other memory cells, and the biasing and shielding circuit 20 can prevent the sensing current of the target memory cell from being the source of the transistor of the memory cell adjacent thereto. The effect of the pole current |. Although the operation of the bias voltage and shading circuit 20 is explained in the present embodiment only to avoid the case where the sensing current IS (1, 3) of the target memory cell is affected by the source current I (1, 2), The operation of avoiding the sensing current of other target memory cells being affected by the corresponding source current can be obtained by analogy with the operation of the foregoing example. In the biasing and shielding circuit 20 of the present embodiment, the biasing unit 206 and the voltage pulling unit 210 form a shielding device for preventing the sensing current of the target memory cell from being received by the source current of the adjacent memory cell. Shadow ^ sounds. Although the biasing and shielding circuit 20 including a shielding device is taken as an example in the present embodiment, the biasing and shielding circuit 20 of the present embodiment is not limited to including only one shielding device. For example, please refer to FIG. 5, which illustrates a second circuit diagram of the biasing and shielding circuit 20 in accordance with the present embodiment. In the biasing and shielding circuit 20' of Fig. 5, another shielding device including the biasing unit 206' and the voltage pulling unit 210' is incorporated in the biasing and shielding circuit 20 of Fig. 3. The biasing unit 206' and the voltage pulling unit 210' are respectively used to bias and pull the source voltage of the transistor T(1, l) 14 1324774
- 三達編號:TW3728PA 低電晶體τ(1,1)之電壓位準。無此’偏壓及遮蔽電路 可有效地對電晶體T(u)之源極電壓進行偏壓,以降低泰 晶體T(l,l)之源極電流〗(!,〗)。如此’偏壓及遮蔽電路 更可有效地避免感測電流IS(1,3)受到源極電流1(1 2)及 1(1,3)之干擾’並提升感測電流is( 1,3)之準確性。 在偏壓及遮蔽電路20中,電晶體M2、M4、η iVlb及電 容Cl形成一個感測裝置,用以提供目標記憶胞之感測電- Sanda number: TW3728PA Low voltage τ (1, 1) voltage level. Without this 'biasing and shielding circuit, the source voltage of the transistor T(u) can be effectively biased to lower the source current (!, 〗) of the Thai crystal T(l, l). Thus, the 'biasing and shielding circuit can effectively prevent the sensing current IS(1,3) from being interfered by the source currents 1(1 2) and 1(1,3)' and boost the sensing current is(1,3) ) accuracy. In the biasing and shielding circuit 20, the transistors M2, M4, η iVlb and the capacitor C1 form a sensing device for providing the sensing power of the target memory cell.
流至感測單元22。雖然在本實施例中以偏壓及遮^電路 20僅包括一個感測裝置的情形為例作說明,參, "、、 不貝施例 之偏壓及遮蔽電路20並不侷限於僅包括一個感測裝置。 舉例來說,請參照第6圖,其繪示依照本實施例之偏壓及 遮蔽電路20的第三電路圖。在第6圖之偏壓及遮蔽電 1路 20”中’另一個連接單元212,係被加入偏壓及遮蔽電^如, 之電路結構中。偏壓單元206、電壓拉低單元21〇及 單70 212’係形成另一感測裝置,以提供偵測電流IS(1 及iS(l,3)至感測節點SN。如此,偏壓及遮蔽電路2〇”可 效地提供感測電流IS(1,2)(即源極電流In 3〉由a 〇有 、于經由電晶辦 T(l,2)分流之漏電流)至感測節點SN。感測節點係接 感測電流IS(1,3)及IS(1,2)之和,而感測單元22,真正收 到之感測電流,相較於第3圖及第5圖中感測單/元咸則 測到之感測電流係更接近源極電流1(1,3) ^這樣一來之 壓及遮蔽電路20”可有效地提升感測單元22,残見", 測電流的精準度。 e 、·!之感 在前述例子中,偏壓及遮毅電路2〇、2〇,及2〇,,、、 15 1324774Flow to the sensing unit 22. Although in the present embodiment, the case where the bias voltage and the mask circuit 20 include only one sensing device is taken as an example, the biasing and shielding circuit 20 of the embodiment of the present invention is not limited to only including A sensing device. For example, please refer to FIG. 6, which illustrates a third circuit diagram of the biasing and shielding circuit 20 in accordance with the present embodiment. In the biasing and shielding power 1 way 20" of Fig. 6, the other connecting unit 212 is added to the circuit structure of the biasing and shielding circuit. The biasing unit 206, the voltage pulling unit 21 and The single 70 212' forms another sensing device to provide the detection current IS (1 and iS (1, 3) to the sensing node SN. Thus, the biasing and shielding circuit 2 可 effectively provides the sensing current IS(1,2) (ie, the source current In 3 > is a 漏, the leakage current shunted through the transistor T (1, 2)) to the sensing node SN. The sensing node is connected to the sensing current IS The sum of (1,3) and IS(1,2), and the sensing unit 22, the sensing current actually received, is measured compared to the sensing unit/yuan salt in Figures 3 and 5. The sensing current system is closer to the source current 1 (1, 3) ^ such that the voltage and shielding circuit 20" can effectively improve the sensing unit 22, and the accuracy of the current measurement. e, ·! In the foregoing examples, the bias and occlusion circuits 2〇, 2〇, and 2〇,,,, 15 1324774
- 三達編號:TW3728PA 有一個感測與一個遮蔽裝置、一個感測與兩個遮蔽裝置及 兩個感測裝置與一個遮蔽裝置。然而,包含在偏壓及遮蔽 電路中之感測裝置與遮蔽裝置之數目並不侷限於本實施 例中所揭露之配置。- Sanda number: TW3728PA has one sensing and one shielding device, one sensing and two shielding devices and two sensing devices and one shielding device. However, the number of sensing devices and shielding devices included in the biasing and shielding circuit is not limited to the configuration disclosed in the embodiment.
本實施例之偏壓及遮蔽電路對目標記憶胞與相鄰記 憶胞之電晶體之源極電壓進行偏壓至接近接地位準。如 此,可有效地避免目標記憶胞之感測電流受到相鄰記憶胞 之源極電流的影響。这樣一來’傳統源極端彳貞測快閃記憶 體偵測到之資料數值的精準度可有效地被提升。 在感測電流1(1,3)被提供至感測節點時,本實施例之 偏壓及遮敝電路中之電晶體M2貫質上被偏堡在飽和區。 如此,在感測節點SN看到之等效電容遠小於在傳統源極 端感測快閃記憶體之感測節點上看到之等效電容,而感測 節點SN上之電壓的充電速度及感測電路之感測操作速 度,相較於傳統作法可有效地被提升。 綜上所述,雖然本發明已以一較佳實施例揭露如上, 然其並非用以限定本發明。本發明所屬技術領域中具有通 常知識者,在不脫離本發明之精神和範圍内,當可作各種 之更動與潤飾。因此,本發明之保護範圍當視後附之申請 專利範圍所界定者為準。 16 1324774The biasing and shielding circuit of this embodiment biases the source voltage of the target memory cell and the transistor of the adjacent memory cell to a level close to the ground. Therefore, the sensing current of the target memory cell can be effectively prevented from being affected by the source current of the adjacent memory cell. In this way, the traditional source extremes can accurately improve the accuracy of the data values detected by the flash memory. When the sense current 1 (1, 3) is supplied to the sensing node, the transistor M2 in the bias and concealer circuit of this embodiment is qualitatively biased in the saturation region. Thus, the equivalent capacitance seen at the sensing node SN is much smaller than the equivalent capacitance seen on the sensing node of the conventional source terminal sensing flash memory, and the charging speed and sense of the voltage on the sensing node SN The sensing operation speed of the measuring circuit can be effectively improved compared to the conventional method. In view of the above, the present invention has been disclosed in a preferred embodiment, and is not intended to limit the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. 16 1324774
- 三達編號:TW3728PA T(i,j):電晶體 BL1〜BLN :位元線 WL1〜WLM :字元線 SS :選擇訊號接腳 SN :感測節點 202 :預放電裝置 204、206 :偏壓單元 208、210、210,、206’ :電壓拉低單元- Sanda number: TW3728PA T(i,j): transistor BL1~BLN: bit line WL1~WLM: word line SS: select signal pin SN: sense node 202: pre-discharge device 204, 206: partial Pressure unit 208, 210, 210, 206': voltage pull-down unit
212、212’ :連接單元 214、216 :位準移位及邏輯單元 222 :負電荷泵 224 :調節器212, 212': connection unit 214, 216: level shifting and logic unit 222: negative charge pump 224: regulator
Ml〜M6 :電晶體 C1 :電容Ml~M6: transistor C1: capacitor
1818
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TW96134582A TWI324774B (en) | 2007-09-14 | 2007-09-14 | Biasing and shielding circuit for source side sensing memory |
US12/420,678 US8077522B2 (en) | 2007-08-15 | 2009-04-08 | Memory and method operating the memory |
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TW96134582A TWI324774B (en) | 2007-09-14 | 2007-09-14 | Biasing and shielding circuit for source side sensing memory |
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TWI324774B true TWI324774B (en) | 2010-05-11 |
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