九、發明說明： 【發明所屬之技術領域】 本發明係有關於-種「散鮮固定機構」，其主要涉及一 種應用於固定散熱器的機構，尤指設有接合端及定烟^且可 達到彈性定位功能的散熱器固定機構。 【先前技術】 請參閱第-圖，如騎示，傳統之散熱器_結構其主要 係於散熱n 12上裝設扣件n，並使該扣件u直接壓接於㈣ 座體Η上，其中該散熱|| 12上設有凹槽⑵·而該扣件η 係由抵壓部lu及設於抵壓部⑴兩側之第—扣接部⑴及第 二扣接部113所構成，其中該第一扣接部112及第二扣接部113 各設有第-接合孔112a及第二接合孔113a，__⑴ 係可與散絲12之凹槽121相接合；該cpu座體14上設有 第一卡接部141及第二卡接部142。 知同時參閱第-及二圖，如圖所示，於組裝時，先將cp (mputer Pr〇cessing Umt，中央處理器)裝設於哪座體！ a再將放熱器12接设於CPU 13上，繼而將扣件π之抵肩 p hi接合於散熱器12之凹槽121内，並使扣件η之第一士 接部112透過第一扣接部112之第一接合孔心卡接於⑽ 座體Η之第—卡接部141，再使扣件u之第二扣接部⑴这 °第4接4 113之第二接合孔ma而卡接於座體p 之第二卡接部142。 淮該S用之放熱器固定機構具有下列之缺點： ⑴該散熱器12上_設凹槽121始可供扣件旧且設， 進言之，此種散熱器12之外型與結構易受扣件η之 限制’同時紐散熱器12之散熱面積減縮。 ⑺該㈣之絲HiH定機構鋪由呈長方则體之抵 屋部ill卡制散熱器12之凹槽⑵，此種固定機構， 仍無法避免散熱器u產生滑動，據此，定位效果不 佳。 ⑶該·之散熱频定機構僅藉由呈長方形片體之抵 壓部ill及其兩侧之第-扣接部112及第二扣接部 113迫緊散熱器12 ’此種固定機構，仍無法有效使散 熱器12貼緊於CPU 13，職是，緊密接合於cpu 13 之效果不佳。 ⑷該習用之散熱器固定機構中之扣件1](结構易造成風 扇流阻。 緣是’有鑑於上述習用品所衍生的各項缺點，本案之發明 人遂竭其心智，潛心研究加以創新改良，終於成功研發完成本 件「散熱器固定機構」案，實為一具功效增進之發明。 【發明目的】 本發明之主要目的乃係在提供一種提升散熱器定位功效 之固定機構。 本心月之人要目的乃係在提供一種可緊密接合於匸四之 固定機構。 本毛月之3目的乃係在提供—種避免散熱器之散熱面 積受扣件之限制而減縮。 本發月之再目的乃係在提供一種穩固承接散熱器於 CPU上之固定機構。 本U之X目的乃係在提供—種可接設導熱管之散熱 器固定機構。 本U之X目的乃係在提供一種可減少風扇流阻之散 熱器固定機構。 【發明内容】 本發明係提供-種「散熱Hgj定機構」，其主要係於彈性 ，上設有-接合端及—以上之定位部，其中該接合端可與散熱 器相接設，而該定位部可與電路板相接設。 【實施方式】 本發明之上述目的及其結構與魏上的雜，將依據所附 圖式之較佳實施例予以說明。 /本發明係提供-種「散熱器固⑽構」，請參閱第三圖， 係為本發明之第-較佳實施例，如圖所示，其主要係於彈性體 1321982 21上設有接合端及一以上之定位部212，其中該接合端川 係設成凸部用以接設於設有嵌槽214a之散熱器22上，該散熱 /器22上設有-以上之凹槽2Ua，該凹槽2山可與導熱管幼 相接設，而該定位部212設有貫孔212a，該貫孔2i2a可供固 定元件21%組設’該固定元件勘(係可為螺鎖元件)可與電 路板25上所設之透孔251相接設。 請同時參閱第三、四及五圖，如圖所示，於組裝時，先將 mi23裝設於CPU座體μ上，再使散熱器a之嵌槽触^ 與彈性體21之接合端211相互接設，再使彈性體2ι之定位部 212透過固定元件212b組設定位部212之貫孔2i2a及電路板 25之透孔251而固設於電路板25上。 請參閱第六圖，係為本發明之第二較佳實施例，如圖所 示，其特徵在於：係關定元件212e固設彈性體2ι之定位部 212。與電路板25,其中該峡元件耻係包含有定位單元迎 及彈性單元212e;藉由該固定元件取之彈性單元砂，以# 使本發明可更緊密的接合於cpu 。 嗣’由上述之說明’而將本發明與先前技術作一比較，當 可知知本發明誠具有下浙述之伽及功效： ⑴本發明藉由彈性體21之接合端211與散熱器之嵌槽 214a相接設可使雜體21與散熱n22之間的粒效 果較省用放熱器固定機構為佳，且更為穩固。 8 (2) 本發明藉由彈性體2i之一以上之定位部212固設於 電路板25上’可使本發明緊密接合於cpu 23，俾達 快速散熱之目的。 (3) 由於本發明之彈性體21係組設於散熱器22下侧，故 不會阻擋氣流由風扇吹入散熱器22。 (4) 本發明之接合端211係與嵌槽214a相互組設，故可 使本發明之彈性效能更佳。 紅上所述，本發明所提供之一種「散熱器固定機構」，確 符合准予專利之要件’爰依法提出專利申請，祈請惠予專 利’貫為感禱。 惟以上所述者，㈣本發明之較佳可行之實施例而已，舉 凡利用本發明上述之方法、形狀、構造、裝置所為之變化，= 應包含於本案之權利範圍内0 白 【圖式簡單說明】 第一圖為習用散熱器固定機構之立體分解示意圖； 第一圖為習用散熱器固定機構之立體組合示意圖； 第二圖為本發明第一較佳實施例之立體分解示意圖； 第四圖為本發明第一較佳實施例之立體組合示意圖； 第五圖為本發明第一較佳實施例之側視組合示意圖； 第六圖為本發明第二較佳實施例之側視組合示意圓。 1321982IX. Description of the Invention: [Technical Field] The present invention relates to a "fresh-and-fresh fixing mechanism", which mainly relates to a mechanism for fixing a heat sink, in particular, a joint end and a fixed smoke ^ A heat sink fixing mechanism that achieves elastic positioning. [Prior Art] Please refer to the figure--, such as riding, the traditional radiator _ structure is mainly installed on the heat sink n 12 is equipped with a fastener n, and the fastener u is directly crimped to the (four) seat Η, The heat dissipation|| 12 is provided with a groove (2), and the fastener η is composed of a pressing portion lu and a first fastening portion (1) and a second fastening portion 113 provided on both sides of the pressing portion (1). The first fastening portion 112 and the second fastening portion 113 are respectively provided with a first engagement hole 112a and a second engagement hole 113a, and the __(1) can be engaged with the groove 121 of the loose wire 12; the cpu base 14 is The first engaging portion 141 and the second engaging portion 142 are provided. Please also refer to the first and second figures, as shown in the figure, in the assembly, first install cp (mputer Pr〇cessing Umt, central processing unit) in which body! a, the heat sink 12 is connected to the CPU 13, and then the π of the fastener π is engaged in the groove 121 of the heat sink 12, and the first contact 112 of the fastener η is transmitted through the first buckle The first engaging hole of the connecting portion 112 is engaged with the (10) first engaging portion 141 of the seat body, and the second fastening portion (1) of the fastening member u is connected to the second engaging hole ma of the fourth connection 4 113. The card is connected to the second latching portion 142 of the base body p. The radiator fixing mechanism used by the Huai S has the following disadvantages: (1) The recess 12 on the radiator 12 is provided for the fastener to be old and set. In other words, the shape and structure of the radiator 12 are easily buckled. The limit of the piece η 'the heat dissipation area of the new heat sink 12 is reduced. (7) The HiH fixed mechanism of the (4) wire is made of a groove (2) of the radiator 12 which is formed by the rectangular body of the rectangular body. The fixing mechanism can not prevent the radiator u from slipping, and accordingly, the positioning effect is not good. (3) The heat dissipation frequency fixing mechanism only presses the heat sink 12' such a fixing mechanism by the pressing portion ill of the rectangular sheet body and the first fastening portion 112 and the second fastening portion 113 on both sides thereof. The heat sink 12 cannot be effectively attached to the CPU 13, and the effect of tightly engaging the CPU 13 is poor. (4) The fasteners in the conventional radiator fixing mechanism 1] (The structure is easy to cause fan flow resistance. The edge is 'In view of the shortcomings derived from the above-mentioned articles, the inventor of the case exhausted his mind and devoted himself to research and innovation. Improvement, finally successfully developed the "heat sink fixing mechanism" case, which is an invention with improved efficacy. [Object of the Invention] The main object of the present invention is to provide a fixing mechanism for improving the positioning function of a heat sink. The purpose of the person is to provide a fixed mechanism that can be tightly joined to the fourth. The purpose of this month is to reduce the heat dissipation area of the radiator to be reduced by the fastener. The purpose is to provide a fixing mechanism for stably receiving the heat sink on the CPU. The purpose of this U is to provide a heat sink fixing mechanism capable of connecting a heat pipe. The purpose of this U is to provide a kind of The present invention provides a "heat dissipation Hgj fixing mechanism" which is mainly used for elasticity, and has a joint end and above a positioning portion, wherein the engaging end is connectable to the heat sink, and the positioning portion is connectable to the circuit board. [Embodiment] The above object and structure of the present invention and the structure of the present invention will be based on the drawing. The preferred embodiment of the present invention is described. / The present invention provides a "heat sink solid (10) structure", please refer to the third figure, which is a first preferred embodiment of the present invention, as shown in the figure, An engaging end and one or more positioning portions 212 are disposed on the elastic body 1321982 21, wherein the engaging end is configured as a convex portion for being attached to the heat sink 22 provided with the recessed groove 214a, and the heat sink 22 is disposed on the heat sink 22 a groove 2Ua is provided, and the groove 2 can be connected to the heat pipe, and the positioning portion 212 is provided with a through hole 212a for the fixing member 21% to be assembled. The survey (which may be a screw-locking component) can be connected to the through-hole 251 provided on the circuit board 25. Please also refer to the third, fourth and fifth diagrams, as shown in the figure, when assembling, first install the mi23 On the CPU base μ, the groove contact of the heat sink a and the joint end 211 of the elastic body 21 are connected to each other, and then the elastic body 2 is fixed. The portion 212 is fixed to the circuit board 25 through the through hole 2i2a of the fixed portion 212b and the through hole 251 of the circuit board 25. Referring to the sixth embodiment, it is a second preferred embodiment of the present invention. As shown in the figure, the locking member 212e fixes the positioning portion 212 of the elastic body 2i. The circuit board 25, wherein the isometric element includes a positioning unit to meet the elastic unit 212e; Taking the elastic unit sand, the invention can be more closely bonded to the cpu. 嗣 'Compared with the prior art by the above description, when the invention is known to have the following Efficacy: (1) The invention is provided by the joint end 211 of the elastic body 21 and the groove 214a of the heat sink, so that the grain effect between the hybrid body 21 and the heat sink n22 is better than that of the heat sink fixing mechanism, and more stable. 8 (2) The present invention is fixed to the circuit board 25 by the positioning portion 212 of one or more of the elastic bodies 2i. The present invention can be closely coupled to the CPU 23 for the purpose of rapid heat dissipation. (3) Since the elastic body 21 of the present invention is assembled on the lower side of the radiator 22, the airflow is not blocked from being blown into the radiator 22 by the fan. (4) The joint end 211 of the present invention is assembled with the fitting groove 214a, so that the elastic performance of the present invention can be made better. As described above, the "radiator fixing mechanism" provided by the present invention does meet the requirements for granting patents, "provisioning a patent application according to law, and praying for a patent". However, the above described, (4) preferred embodiments of the present invention, which are modified by the above-described methods, shapes, structures, and devices of the present invention, should be included in the scope of the present invention. The first figure is a three-dimensional exploded view of a conventional heat sink fixing mechanism; the first figure is a three-dimensional combination diagram of a conventional heat sink fixing mechanism; the second figure is a three-dimensional exploded view of the first preferred embodiment of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 5 is a schematic side view of a first preferred embodiment of the present invention; FIG. 6 is a schematic side view of a second preferred embodiment of the present invention; . 1321982
【主要元件符號說明】 11 . •.扣件 111 · ••抵壓部 112 · ••第一扣接部 112a · ••第一接合孔 113 · • •第二扣接部 113a · ••第二接合孔 12 . ••散熱器 121 · ..凹槽 13 · • · CPU 14 · • .CPU座體 141 · ••第一卡接部 142 · ••第二卡接部 21 · ••彈性體 211 · ••接合端 211a · ••凹槽 212 · ••定位部 212a · .·貫孔 212b · ••固定元件 212c · ••固定元件 212d · ••定位單元 212e · .•彈性單元 214a . •.彼槽 22 · ••散熱器 221 · ••導熱管 23 · .· CPU 24 · • .CPU座體 25 · ••電路板 251 · •.透孔[Description of main component symbols] 11. .. Fastener 111 • • • Pressing portion 112 • • • First fastening portion 112a • • • First engagement hole 113 • • • Second fastening portion 113a • • • Two engaging holes 12 ••• Heat sink 121 ·.. Groove 13 · • · CPU 14 · • .CPU base 141 ·••First snap 142 ·••Second snap 21 ·••Flexibility Body 211 · •• Jointed end 211a ·•• Groove 212 ·•• Positioning part 212a ·.·Through hole 212b ·••Fixed element 212c ·••Fixed element 212d ·••Positioning unit 212e ·.•Elastic unit 214a • The groove 22 · •• Heat sink 221 · •• Heat pipe 23 · .· CPU 24 · • .CPU base 25 · ••Circuit board 251 · •. Through hole