TWI320693B - Circuit board having heat-dissipating structure and manufacturing method thereof - Google Patents
Circuit board having heat-dissipating structure and manufacturing method thereofInfo
- Publication number
- TWI320693B TWI320693B TW96115447A TW96115447A TWI320693B TW I320693 B TWI320693 B TW I320693B TW 96115447 A TW96115447 A TW 96115447A TW 96115447 A TW96115447 A TW 96115447A TW I320693 B TWI320693 B TW I320693B
- Authority
- TW
- Taiwan
- Prior art keywords
- manufacturing
- heat
- circuit board
- dissipating structure
- dissipating
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW96115447A TWI320693B (en) | 2007-05-01 | 2007-05-01 | Circuit board having heat-dissipating structure and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW96115447A TWI320693B (en) | 2007-05-01 | 2007-05-01 | Circuit board having heat-dissipating structure and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200845874A TW200845874A (en) | 2008-11-16 |
TWI320693B true TWI320693B (en) | 2010-02-11 |
Family
ID=44822964
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW96115447A TWI320693B (en) | 2007-05-01 | 2007-05-01 | Circuit board having heat-dissipating structure and manufacturing method thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI320693B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI400998B (en) * | 2010-08-20 | 2013-07-01 | Nan Ya Printed Circuit Board | Printed circuit board and method for fabricating the same |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI753468B (en) * | 2020-06-24 | 2022-01-21 | 欣興電子股份有限公司 | Substrate structure with heat dissipation structure and manufacturing method thereof |
CN114258183A (en) * | 2020-09-21 | 2022-03-29 | 鹏鼎控股(深圳)股份有限公司 | Circuit board with heat dissipation structure and manufacturing method thereof |
-
2007
- 2007-05-01 TW TW96115447A patent/TWI320693B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI400998B (en) * | 2010-08-20 | 2013-07-01 | Nan Ya Printed Circuit Board | Printed circuit board and method for fabricating the same |
Also Published As
Publication number | Publication date |
---|---|
TW200845874A (en) | 2008-11-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |