TWI320681B - A novel via structure for improving signal integrity - Google Patents
A novel via structure for improving signal integrityInfo
- Publication number
- TWI320681B TWI320681B TW96101026A TW96101026A TWI320681B TW I320681 B TWI320681 B TW I320681B TW 96101026 A TW96101026 A TW 96101026A TW 96101026 A TW96101026 A TW 96101026A TW I320681 B TWI320681 B TW I320681B
- Authority
- TW
- Taiwan
- Prior art keywords
- via structure
- signal integrity
- improving signal
- novel via
- novel
- Prior art date
Links
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW96101026A TWI320681B (en) | 2007-01-11 | 2007-01-11 | A novel via structure for improving signal integrity |
US11/986,323 US8153906B2 (en) | 2007-01-10 | 2007-11-20 | Interconnection structure for improving signal integrity |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW96101026A TWI320681B (en) | 2007-01-11 | 2007-01-11 | A novel via structure for improving signal integrity |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200830967A TW200830967A (en) | 2008-07-16 |
TWI320681B true TWI320681B (en) | 2010-02-11 |
Family
ID=44818416
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW96101026A TWI320681B (en) | 2007-01-10 | 2007-01-11 | A novel via structure for improving signal integrity |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI320681B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8487195B2 (en) * | 2010-03-04 | 2013-07-16 | Broadcom Corporation | Via structure for multi-gigahertz signaling |
US8723052B1 (en) | 2013-02-27 | 2014-05-13 | Boulder Wind Power, Inc. | Methods and apparatus for optimizing electrical interconnects on laminated composite assemblies |
US8785784B1 (en) | 2013-03-13 | 2014-07-22 | Boulder Wind Power, Inc. | Methods and apparatus for optimizing structural layout of multi-circuit laminated composite assembly |
US9793775B2 (en) | 2013-12-31 | 2017-10-17 | Boulder Wind Power, Inc. | Methods and apparatus for reducing machine winding circulating current losses |
WO2017111834A1 (en) * | 2015-12-26 | 2017-06-29 | Intel Corporation | Ground plane vertical isolation of, ground line coaxial isolation of, and impedance tuning of horizontal data signal transmission lines routed through package devices |
CN113079634B (en) * | 2020-05-29 | 2022-11-18 | 新华三技术有限公司合肥分公司 | Circuit board and preparation process thereof |
-
2007
- 2007-01-11 TW TW96101026A patent/TWI320681B/en active
Also Published As
Publication number | Publication date |
---|---|
TW200830967A (en) | 2008-07-16 |
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