TWI320415B - Curable resin composition - Google Patents

Curable resin composition

Info

Publication number
TWI320415B
TWI320415B TW092118442A TW92118442A TWI320415B TW I320415 B TWI320415 B TW I320415B TW 092118442 A TW092118442 A TW 092118442A TW 92118442 A TW92118442 A TW 92118442A TW I320415 B TWI320415 B TW I320415B
Authority
TW
Taiwan
Prior art keywords
resin composition
curable resin
curable
composition
resin
Prior art date
Application number
TW092118442A
Other languages
Chinese (zh)
Other versions
TW200401788A (en
Inventor
Kawaguchi Yujiro
Toshiyuki Hasegawa
Yamamoto Satoshi
Original Assignee
Sumitomo Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Co filed Critical Sumitomo Chemical Co
Publication of TW200401788A publication Critical patent/TW200401788A/en
Application granted granted Critical
Publication of TWI320415B publication Critical patent/TWI320415B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C08L63/10—Epoxy resins modified by unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers
    • C08J2300/24—Thermosetting resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW092118442A 2002-07-12 2003-07-07 Curable resin composition TWI320415B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002203611 2002-07-12

Publications (2)

Publication Number Publication Date
TW200401788A TW200401788A (en) 2004-02-01
TWI320415B true TWI320415B (en) 2010-02-11

Family

ID=37317023

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092118442A TWI320415B (en) 2002-07-12 2003-07-07 Curable resin composition

Country Status (2)

Country Link
KR (1) KR100966247B1 (en)
TW (1) TWI320415B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI572886B (en) * 2015-09-02 2017-03-01 巴川製紙所股份有限公司 Protection film, film laminate and polarizing plate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4112687A1 (en) * 1991-04-18 1992-10-22 Hoechst Ag POWDERED COATING AGENTS
JPH08217958A (en) * 1994-12-13 1996-08-27 Sumitomo Chem Co Ltd Rubber composition
KR0172192B1 (en) * 1995-06-26 1999-03-20 사토 아키오 Powder paint composition
US6093774A (en) * 1997-09-26 2000-07-25 Reichhold Chemicals, Inc. Low gloss powder coating composition

Also Published As

Publication number Publication date
KR100966247B1 (en) 2010-06-28
TW200401788A (en) 2004-02-01
KR20040007280A (en) 2004-01-24

Similar Documents

Publication Publication Date Title
AU2003266675A8 (en) Liquid curable resin composition
EP1550701A4 (en) One-part curable composition
EP1556428A4 (en) Fast curing compositions
TWI348477B (en) Resin compositions
EP1602975A4 (en) Radiation-sensitive resin composition
HK1086582A1 (en) Curable resins and curable resin compositions containing the same
EP1652891A4 (en) Curable resin composition and cold-setting adhesive
EP1477848A4 (en) Radiation-sensitive resin composition
GB2407816B (en) Extrudable resin composition
EP1666536A4 (en) Curable composition
EP1621562A4 (en) Curing resin composition
AU2003292811A8 (en) Silicone resin composition
AU2002318602A1 (en) Curable resin composition
PL372704A1 (en) Curable composition
AU2003284676A1 (en) Curable urethane resin composition
EP1605005A4 (en) Curable resin composition
EP1672028A4 (en) Resin composition
AU2003215964A1 (en) Curable liquid resin composition
HK1079807A1 (en) Thermoplastic resin composition
EP1422263B8 (en) Resin composition
AU2003295257A1 (en) Radiation-curable resin composition
EP1642917A4 (en) Epoxy resin composition
TWI350427B (en) Radiation-sensitive resin composition
EP1526155A4 (en) Mold-releasable curable composition
EP1557718A4 (en) Radiation-sensitive resin composition

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees