TWI319901B - Support structures for semiconductor devices - Google Patents

Support structures for semiconductor devices

Info

Publication number
TWI319901B
TWI319901B TW095137456A TW95137456A TWI319901B TW I319901 B TWI319901 B TW I319901B TW 095137456 A TW095137456 A TW 095137456A TW 95137456 A TW95137456 A TW 95137456A TW I319901 B TWI319901 B TW I319901B
Authority
TW
Taiwan
Prior art keywords
semiconductor devices
support structures
structures
support
semiconductor
Prior art date
Application number
TW095137456A
Other languages
English (en)
Other versions
TW200721365A (en
Inventor
Goebel Thomas
Kaltalioglu Erdem
Kim Sun-Oo
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW200721365A publication Critical patent/TW200721365A/zh
Application granted granted Critical
Publication of TWI319901B publication Critical patent/TWI319901B/zh

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    • H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
    • H01L2224/486—Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/48638—Principal constituent of the connecting portion of the wire connector being Gold (Au) with a principal constituent of the bonding area being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L2924/30105—Capacitance

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW095137456A 2005-10-12 2006-10-11 Support structures for semiconductor devices TWI319901B (en)

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