TWI319901B - Support structures for semiconductor devices - Google Patents
Support structures for semiconductor devicesInfo
- Publication number
- TWI319901B TWI319901B TW095137456A TW95137456A TWI319901B TW I319901 B TWI319901 B TW I319901B TW 095137456 A TW095137456 A TW 095137456A TW 95137456 A TW95137456 A TW 95137456A TW I319901 B TWI319901 B TW I319901B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor devices
- support structures
- structures
- support
- semiconductor
- Prior art date
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- H01L2224/48655—Nickel (Ni) as principal constituent
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
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- H01L2924/11—Device type
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H01L2924/207—Diameter ranges
- H01L2924/20754—Diameter ranges larger or equal to 40 microns less than 50 microns
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- H01L2924/30105—Capacitance
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- Engineering & Computer Science (AREA)
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- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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US11/248,554 US7626268B2 (en) | 2005-10-12 | 2005-10-12 | Support structures for semiconductor devices |
Publications (2)
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TW200721365A TW200721365A (en) | 2007-06-01 |
TWI319901B true TWI319901B (en) | 2010-01-21 |
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EP (1) | EP1783834B1 (zh) |
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CN100413066C (zh) * | 2005-11-30 | 2008-08-20 | 中芯国际集成电路制造(上海)有限公司 | 低k介电材料的接合焊盘和用于制造半导体器件的方法 |
US20070187828A1 (en) * | 2006-02-14 | 2007-08-16 | International Business Machines Corporation | Ild layer with intermediate dielectric constant material immediately below silicon dioxide based ild layer |
US20070210453A1 (en) * | 2006-03-13 | 2007-09-13 | Texas Instruments Inc. | Dummy-fill-structure placement for improved device feature location and access for integrated circuit failure analysis |
JP4072697B2 (ja) | 2006-05-02 | 2008-04-09 | セイコーエプソン株式会社 | 半導体装置 |
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US7861204B2 (en) * | 2007-12-20 | 2010-12-28 | International Business Machines Corporation | Structures including integrated circuits for reducing electromigration effect |
US8258629B2 (en) * | 2008-04-02 | 2012-09-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Curing low-k dielectrics for improving mechanical strength |
JP5334459B2 (ja) * | 2008-05-30 | 2013-11-06 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
US9161448B2 (en) | 2010-03-29 | 2015-10-13 | Semprius, Inc. | Laser assisted transfer welding process |
CN102171821B (zh) * | 2011-04-19 | 2013-02-27 | 华为技术有限公司 | 焊盘的防水结构、防水焊盘和形成该防水结构的方法 |
US9412727B2 (en) | 2011-09-20 | 2016-08-09 | Semprius, Inc. | Printing transferable components using microstructured elastomeric surfaces with pressure modulated reversible adhesion |
US9245083B2 (en) | 2011-10-13 | 2016-01-26 | Globalfoundries Inc. | Method, structures and method of designing reduced delamination integrated circuits |
US8756546B2 (en) | 2012-07-25 | 2014-06-17 | International Business Machines Corporation | Elastic modulus mapping of a chip carrier in a flip chip package |
US8650512B1 (en) * | 2012-11-15 | 2014-02-11 | International Business Machines Corporation | Elastic modulus mapping of an integrated circuit chip in a chip/device package |
US10068834B2 (en) | 2013-03-04 | 2018-09-04 | Cree, Inc. | Floating bond pad for power semiconductor devices |
CN110265344B (zh) | 2014-07-20 | 2023-09-12 | 艾克斯展示公司技术有限公司 | 用于微转贴印刷的设备及方法 |
US9704821B2 (en) | 2015-08-11 | 2017-07-11 | X-Celeprint Limited | Stamp with structured posts |
US10468363B2 (en) | 2015-08-10 | 2019-11-05 | X-Celeprint Limited | Chiplets with connection posts |
KR102494710B1 (ko) * | 2015-09-04 | 2023-02-02 | 한국전기연구원 | 스마트 인슐레이션을 구비하는 고온 초전도 코일, 그에 사용되는 고온 초전도 선재 및 그 제조방법 |
US10103069B2 (en) | 2016-04-01 | 2018-10-16 | X-Celeprint Limited | Pressure-activated electrical interconnection by micro-transfer printing |
US10222698B2 (en) | 2016-07-28 | 2019-03-05 | X-Celeprint Limited | Chiplets with wicking posts |
US11064609B2 (en) | 2016-08-04 | 2021-07-13 | X Display Company Technology Limited | Printable 3D electronic structure |
US10891366B1 (en) | 2017-08-18 | 2021-01-12 | Jonetix Corporation | Secure hardware signature and related methods and applications |
US10410934B2 (en) * | 2017-12-07 | 2019-09-10 | Micron Technology, Inc. | Apparatuses having an interconnect extending from an upper conductive structure, through a hole in another conductive structure, and to an underlying structure |
US10748793B1 (en) | 2019-02-13 | 2020-08-18 | X Display Company Technology Limited | Printing component arrays with different orientations |
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JPH08293523A (ja) * | 1995-02-21 | 1996-11-05 | Seiko Epson Corp | 半導体装置およびその製造方法 |
US5767575A (en) * | 1995-10-17 | 1998-06-16 | Prolinx Labs Corporation | Ball grid array structure and method for packaging an integrated circuit chip |
KR100231276B1 (ko) * | 1996-06-21 | 1999-11-15 | 황인길 | 반도체패키지의 구조 및 제조방법 |
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US6428641B1 (en) * | 1998-08-31 | 2002-08-06 | Amkor Technology, Inc. | Method for laminating circuit pattern tape on semiconductor wafer |
US6037668A (en) * | 1998-11-13 | 2000-03-14 | Motorola, Inc. | Integrated circuit having a support structure |
US6444295B1 (en) * | 1998-12-29 | 2002-09-03 | Industrial Technology Research Institute | Method for improving integrated circuits bonding firmness |
US6258715B1 (en) * | 1999-01-11 | 2001-07-10 | Taiwan Semiconductor Manufacturing Company | Process for low-k dielectric with dummy plugs |
US20020043727A1 (en) * | 2000-10-13 | 2002-04-18 | Hsiao-Che Wu | Bonding pad structure |
FR2824954A1 (fr) | 2001-05-18 | 2002-11-22 | St Microelectronics Sa | Plot de connexion d'un circuit integre |
US6908841B2 (en) | 2002-09-20 | 2005-06-21 | Infineon Technologies Ag | Support structures for wirebond regions of contact pads over low modulus materials |
DE10333465B4 (de) * | 2003-07-22 | 2008-07-24 | Infineon Technologies Ag | Elektronisches Bauteil mit Halbleiterchip, Verfahren zur Herstellung desselben sowie Verfahren zur Herstellung eines Halbleiterwafers mit Kontaktflecken |
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US7524731B2 (en) * | 2006-09-29 | 2009-04-28 | Freescale Semiconductor, Inc. | Process of forming an electronic device including an inductor |
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EP1783834A3 (en) | 2011-09-07 |
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