TWI319891B - Polishing pad and method of manufacturing semiconductor devices - Google Patents
Polishing pad and method of manufacturing semiconductor devicesInfo
- Publication number
- TWI319891B TWI319891B TW093102620A TW93102620A TWI319891B TW I319891 B TWI319891 B TW I319891B TW 093102620 A TW093102620 A TW 093102620A TW 93102620 A TW93102620 A TW 93102620A TW I319891 B TWI319891 B TW I319891B
- Authority
- TW
- Taiwan
- Prior art keywords
- semiconductor devices
- polishing pad
- manufacturing semiconductor
- manufacturing
- polishing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60H—ARRANGEMENTS OF HEATING, COOLING, VENTILATING OR OTHER AIR-TREATING DEVICES SPECIALLY ADAPTED FOR PASSENGER OR GOODS SPACES OF VEHICLES
- B60H1/00—Heating, cooling or ventilating [HVAC] devices
- B60H1/32—Cooling devices
- B60H1/3204—Cooling devices using compression
- B60H1/3225—Cooling devices using compression characterised by safety arrangements, e.g. compressor anti-seizure means or by signalling devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003029560A JP3910921B2 (ja) | 2003-02-06 | 2003-02-06 | 研磨布および半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200428465A TW200428465A (en) | 2004-12-16 |
TWI319891B true TWI319891B (en) | 2010-01-21 |
Family
ID=32652996
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093102620A TWI319891B (en) | 2003-02-06 | 2004-02-05 | Polishing pad and method of manufacturing semiconductor devices |
Country Status (7)
Country | Link |
---|---|
US (1) | US20050227489A1 (zh) |
EP (1) | EP1445067B1 (zh) |
JP (1) | JP3910921B2 (zh) |
KR (1) | KR100693961B1 (zh) |
CN (1) | CN100570826C (zh) |
DE (1) | DE602004002120T2 (zh) |
TW (1) | TWI319891B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI816375B (zh) * | 2015-10-30 | 2023-09-21 | 美商應用材料股份有限公司 | 形成具有期望界達電位之拋光物件的設備與方法 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050266226A1 (en) * | 2000-11-29 | 2005-12-01 | Psiloquest | Chemical mechanical polishing pad and method for selective metal and barrier polishing |
JP2006114885A (ja) * | 2004-09-17 | 2006-04-27 | Jsr Corp | 化学機械研磨パッド及び化学機械研磨方法 |
JP5347524B2 (ja) * | 2008-01-24 | 2013-11-20 | Jsr株式会社 | 化学機械研磨パッドの研磨層形成用組成物、化学機械研磨パッドおよび化学機械研磨方法 |
US8177603B2 (en) * | 2008-04-29 | 2012-05-15 | Semiquest, Inc. | Polishing pad composition |
US20140370788A1 (en) * | 2013-06-13 | 2014-12-18 | Cabot Microelectronics Corporation | Low surface roughness polishing pad |
JP6434266B2 (ja) * | 2013-12-17 | 2018-12-05 | 富士紡ホールディングス株式会社 | ラッピング用樹脂定盤及びそれを用いたラッピング方法 |
WO2015153601A1 (en) | 2014-04-03 | 2015-10-08 | 3M Innovative Properties Company | Polishing pads and systems and methods of making and using the same |
CN105313033A (zh) * | 2014-08-05 | 2016-02-10 | 东莞金太阳研磨股份有限公司 | 一种弹性tpu抛光复合膜 |
CN109478507B (zh) * | 2016-07-29 | 2023-01-10 | 株式会社可乐丽 | 抛光垫及使用了该抛光垫的抛光方法 |
EP3571009A4 (en) * | 2017-01-20 | 2021-01-20 | Applied Materials, Inc. | THIN PLASTIC POLISHING ARTICLE FOR CMP APPLICATIONS |
KR102174958B1 (ko) * | 2019-03-27 | 2020-11-05 | 에스케이씨 주식회사 | 결함 발생을 최소화시키는 연마패드 및 이의 제조방법 |
CN111617305B (zh) * | 2020-04-23 | 2021-05-11 | 杭州千芝雅卫生用品有限公司 | 一种亲肤性吸液材料的制备方法 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US78632A (en) * | 1868-06-02 | Improved brick-machine | ||
MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
US5976000A (en) * | 1996-05-28 | 1999-11-02 | Micron Technology, Inc. | Polishing pad with incompressible, highly soluble particles for chemical-mechanical planarization of semiconductor wafers |
US5702977A (en) * | 1997-03-03 | 1997-12-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Shallow trench isolation method employing self-aligned and planarized trench fill dielectric layer |
WO1998047662A1 (en) * | 1997-04-18 | 1998-10-29 | Cabot Corporation | Polishing pad for a semiconductor substrate |
US6337280B1 (en) * | 1998-05-11 | 2002-01-08 | Kabushiki Kaisha Toshiba | Polishing cloth and method of manufacturing semiconductor device using the same |
KR100615691B1 (ko) * | 1998-12-18 | 2006-08-25 | 도소 가부시키가이샤 | 연마용 부재, 그것을 이용한 연마용 정반 및 연마방법 |
US6176763B1 (en) * | 1999-02-04 | 2001-01-23 | Micron Technology, Inc. | Method and apparatus for uniformly planarizing a microelectronic substrate |
JP2000349053A (ja) * | 1999-06-07 | 2000-12-15 | Asahi Chem Ind Co Ltd | 溝付研磨パッド |
WO2001045899A1 (fr) * | 1999-12-22 | 2001-06-28 | Toray Industries, Inc. | Tampon a polir, procede et appareil de polissage |
JP4615813B2 (ja) * | 2000-05-27 | 2011-01-19 | ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド | 化学機械平坦化用の研磨パッド |
JP3925041B2 (ja) * | 2000-05-31 | 2007-06-06 | Jsr株式会社 | 研磨パッド用組成物及びこれを用いた研磨パッド |
US6685537B1 (en) * | 2000-06-05 | 2004-02-03 | Speedfam-Ipec Corporation | Polishing pad window for a chemical mechanical polishing tool |
US6458013B1 (en) * | 2000-07-31 | 2002-10-01 | Asml Us, Inc. | Method of chemical mechanical polishing |
KR100738774B1 (ko) * | 2000-08-28 | 2007-07-12 | 제이에스알 가부시끼가이샤 | 화학 기계 연마 스토퍼막, 그의 제조 방법 및 화학 기계연마 방법 |
US6477926B1 (en) * | 2000-09-15 | 2002-11-12 | Ppg Industries Ohio, Inc. | Polishing pad |
JP3826702B2 (ja) * | 2000-10-24 | 2006-09-27 | Jsr株式会社 | 研磨パッド用組成物及びこれを用いた研磨パッド |
JP2002126998A (ja) * | 2000-10-26 | 2002-05-08 | Hitachi Ltd | 研磨方法および研磨装置 |
US20020098789A1 (en) * | 2001-01-19 | 2002-07-25 | Peter A. Burke | Polishing pad and methods for improved pad surface and pad interior characteristics |
US6667239B2 (en) * | 2001-01-23 | 2003-12-23 | Asml Us, Inc. | Chemical mechanical polishing of copper-oxide damascene structures |
US6663787B1 (en) * | 2001-02-06 | 2003-12-16 | Advanced Micro Devices, Inc. | Use of ta/tan for preventing copper contamination of low-k dielectric layers |
US6840843B2 (en) * | 2001-03-01 | 2005-01-11 | Cabot Microelectronics Corporation | Method for manufacturing a polishing pad having a compressed translucent region |
JP2002324772A (ja) * | 2001-04-25 | 2002-11-08 | Hitachi Ltd | 半導体装置の製造方法及び製造装置 |
JP3934388B2 (ja) * | 2001-10-18 | 2007-06-20 | 株式会社ルネサステクノロジ | 半導体装置の製造方法及び製造装置 |
KR100845481B1 (ko) * | 2001-11-13 | 2008-07-10 | 도요 고무 고교 가부시키가이샤 | 연마 패드 및 그 제조 방법 |
US6913517B2 (en) * | 2002-05-23 | 2005-07-05 | Cabot Microelectronics Corporation | Microporous polishing pads |
KR100584050B1 (ko) * | 2002-08-26 | 2006-05-29 | 제이에스알 가부시끼가이샤 | 연마 패드용 조성물 및 이를 사용한 연마 패드 |
AU2003272674A1 (en) * | 2002-09-25 | 2004-04-19 | Ppg Industries Ohio, Inc. | Polishing pad for planarization |
-
2003
- 2003-02-06 JP JP2003029560A patent/JP3910921B2/ja not_active Expired - Lifetime
-
2004
- 2004-01-22 DE DE602004002120T patent/DE602004002120T2/de not_active Expired - Lifetime
- 2004-01-22 EP EP04001342A patent/EP1445067B1/en not_active Expired - Fee Related
- 2004-02-04 US US10/771,060 patent/US20050227489A1/en not_active Abandoned
- 2004-02-05 TW TW093102620A patent/TWI319891B/zh active
- 2004-02-05 KR KR1020040007475A patent/KR100693961B1/ko active IP Right Grant
- 2004-02-06 CN CNB2004100031345A patent/CN100570826C/zh not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI816375B (zh) * | 2015-10-30 | 2023-09-21 | 美商應用材料股份有限公司 | 形成具有期望界達電位之拋光物件的設備與方法 |
US11964359B2 (en) | 2015-10-30 | 2024-04-23 | Applied Materials, Inc. | Apparatus and method of forming a polishing article that has a desired zeta potential |
Also Published As
Publication number | Publication date |
---|---|
JP2004241625A (ja) | 2004-08-26 |
DE602004002120D1 (de) | 2006-10-12 |
TW200428465A (en) | 2004-12-16 |
EP1445067A3 (en) | 2004-10-27 |
CN100570826C (zh) | 2009-12-16 |
KR100693961B1 (ko) | 2007-03-12 |
JP3910921B2 (ja) | 2007-04-25 |
CN1519894A (zh) | 2004-08-11 |
US20050227489A1 (en) | 2005-10-13 |
EP1445067B1 (en) | 2006-08-30 |
DE602004002120T2 (de) | 2007-02-22 |
KR20040071640A (ko) | 2004-08-12 |
EP1445067A2 (en) | 2004-08-11 |
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