TWI317764B - Buried heterostructure device fabricated by single step mocvd - Google Patents
Buried heterostructure device fabricated by single step mocvdInfo
- Publication number
- TWI317764B TWI317764B TW093127147A TW93127147A TWI317764B TW I317764 B TWI317764 B TW I317764B TW 093127147 A TW093127147 A TW 093127147A TW 93127147 A TW93127147 A TW 93127147A TW I317764 B TWI317764 B TW I317764B
- Authority
- TW
- Taiwan
- Prior art keywords
- single step
- device fabricated
- buried heterostructure
- heterostructure device
- step mocvd
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/131—Integrated optical circuits characterised by the manufacturing method by using epitaxial growth
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/227—Buried mesa structure ; Striped active layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34313—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser with a well layer having only As as V-compound, e.g. AlGaAs, InGaAs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2301/00—Functional characteristics
- H01S2301/17—Semiconductor lasers comprising special layers
- H01S2301/173—The laser chip comprising special buffer layers, e.g. dislocation prevention or reduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S2304/00—Special growth methods for semiconductor lasers
- H01S2304/04—MOCVD or MOVPE
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2004—Confining in the direction perpendicular to the layer structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2004—Confining in the direction perpendicular to the layer structure
- H01S5/2009—Confining in the direction perpendicular to the layer structure by using electron barrier layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2201—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure in a specific crystallographic orientation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/22—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure
- H01S5/2205—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers
- H01S5/2214—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers having a ridge or stripe structure comprising special burying or current confinement layers based on oxides or nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/3211—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures characterised by special cladding layers, e.g. details on band-discontinuities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/34346—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser characterised by the materials of the barrier layers
- H01S5/34366—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser characterised by the materials of the barrier layers based on InGa(Al)AS
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Geometry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biophysics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Semiconductor Lasers (AREA)
- Optical Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/787,349 US7184640B2 (en) | 2004-02-25 | 2004-02-25 | Buried heterostructure device fabricated by single step MOCVD |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200528576A TW200528576A (en) | 2005-09-01 |
TWI317764B true TWI317764B (en) | 2009-12-01 |
Family
ID=34861906
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093127147A TWI317764B (en) | 2004-02-25 | 2004-09-08 | Buried heterostructure device fabricated by single step mocvd |
Country Status (7)
Country | Link |
---|---|
US (1) | US7184640B2 (zh) |
EP (1) | EP1719003B1 (zh) |
JP (1) | JP5027647B2 (zh) |
CN (1) | CN100476472C (zh) |
DE (1) | DE202005021940U1 (zh) |
TW (1) | TWI317764B (zh) |
WO (1) | WO2005083480A1 (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7701991B2 (en) * | 2004-09-23 | 2010-04-20 | Seminex Corporation | High-power infrared semiconductor diode light emitting device |
US7565200B2 (en) * | 2004-11-12 | 2009-07-21 | Advanced Neuromodulation Systems, Inc. | Systems and methods for selecting stimulation sites and applying treatment, including treatment of symptoms of Parkinson's disease, other movement disorders, and/or drug side effects |
JP2007103581A (ja) * | 2005-10-03 | 2007-04-19 | Fujitsu Ltd | 埋込型半導体レーザ |
JP2009182249A (ja) * | 2008-01-31 | 2009-08-13 | Mitsubishi Electric Corp | 半導体光素子の製造方法 |
KR101803326B1 (ko) * | 2012-03-14 | 2017-12-04 | 한국전자통신연구원 | 광 스위치 소자 및 그 제조방법 |
CN104603653A (zh) | 2012-09-13 | 2015-05-06 | 惠普发展公司,有限责任合伙企业 | 控制光电路中的温度 |
US10193308B2 (en) * | 2017-06-19 | 2019-01-29 | Intel Corporation | Semiconductor laser with tensile strained InAlAs electron blocker for 1310 nanometer high temperature operation |
WO2021200408A1 (ja) * | 2020-03-31 | 2021-10-07 | 京セラ株式会社 | 光導波路モジュール及び光源モジュール |
WO2022073093A1 (en) * | 2020-10-05 | 2022-04-14 | National Research Council Of Canada | Corrugated buried heterostructure laser and method for fabricating the same |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5185289A (en) * | 1988-06-28 | 1993-02-09 | International Business Machines Corporation | Process for the selective growth of GaAs |
JP2831667B2 (ja) * | 1988-12-14 | 1998-12-02 | 株式会社東芝 | 半導体レーザ装置及びその製造方法 |
JPH0834336B2 (ja) * | 1990-01-31 | 1996-03-29 | シャープ株式会社 | 半導体レーザ素子及びその製造方法 |
JP3078004B2 (ja) * | 1990-08-31 | 2000-08-21 | 株式会社東芝 | 半導体レーザの製造方法 |
EP0516162B1 (en) | 1991-05-31 | 1995-12-27 | Shin-Etsu Handotai Company Limited | Semiconductor light emitting device |
JP2746065B2 (ja) * | 1993-07-29 | 1998-04-28 | 日本電気株式会社 | 光半導体素子の製造方法 |
JP2842292B2 (ja) * | 1994-09-16 | 1998-12-24 | 日本電気株式会社 | 半導体光集積装置および製造方法 |
DE19513848A1 (de) * | 1995-04-12 | 1996-10-17 | Basf Ag | Thermoplastische Formmassen auf der Basis von teilaromatischen Polyamiden und Polyetheramiden |
JP3728332B2 (ja) | 1995-04-24 | 2005-12-21 | シャープ株式会社 | 化合物半導体発光素子 |
US5952673A (en) * | 1996-12-11 | 1999-09-14 | Fujitsu Limited | Optical semiconductor device including a multiple quantum well structure of an AlGaInAs/InP system |
JPH10242577A (ja) * | 1997-02-26 | 1998-09-11 | Matsushita Electric Ind Co Ltd | 半導体レーザおよびその製造方法 |
JP3104789B2 (ja) * | 1997-05-02 | 2000-10-30 | 日本電気株式会社 | 半導体光素子およびその製造方法 |
JPH11238938A (ja) * | 1998-02-20 | 1999-08-31 | Matsushita Electric Ind Co Ltd | 半導体レーザ装置およびその製造方法ならびに光通信システム |
JP3336994B2 (ja) * | 1998-04-23 | 2002-10-21 | 日本電気株式会社 | 半導体光導波路アレイの製造方法及びアレイ構造半導体光素子 |
US6445723B1 (en) * | 1998-05-18 | 2002-09-03 | Jds Uniphase Corporation | Laser source with submicron aperture |
JP3116350B2 (ja) * | 1998-06-16 | 2000-12-11 | 日本電気株式会社 | 半導体レーザの製造方法 |
JP2000260714A (ja) * | 1999-03-08 | 2000-09-22 | Nec Corp | 有機金属気相成長による成膜方法及びこれを用いた半導体レーザの製造方法 |
JP3267582B2 (ja) * | 1999-06-17 | 2002-03-18 | 日本電気株式会社 | 半導体レーザの製造方法 |
US6967359B2 (en) * | 2001-09-13 | 2005-11-22 | Japan Science And Technology Agency | Nitride semiconductor substrate production method thereof and semiconductor optical device using the same |
-
2004
- 2004-02-25 US US10/787,349 patent/US7184640B2/en not_active Expired - Fee Related
- 2004-09-08 TW TW093127147A patent/TWI317764B/zh not_active IP Right Cessation
-
2005
- 2005-02-24 DE DE202005021940U patent/DE202005021940U1/de not_active Expired - Lifetime
- 2005-02-24 CN CNB2005800061023A patent/CN100476472C/zh not_active Expired - Fee Related
- 2005-02-24 EP EP05723631A patent/EP1719003B1/en not_active Expired - Fee Related
- 2005-02-24 JP JP2007500962A patent/JP5027647B2/ja not_active Expired - Fee Related
- 2005-02-24 WO PCT/US2005/005838 patent/WO2005083480A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
US7184640B2 (en) | 2007-02-27 |
EP1719003A4 (en) | 2008-01-09 |
JP2007533120A (ja) | 2007-11-15 |
EP1719003B1 (en) | 2011-08-24 |
CN100476472C (zh) | 2009-04-08 |
WO2005083480A1 (en) | 2005-09-09 |
US20050185909A1 (en) | 2005-08-25 |
JP5027647B2 (ja) | 2012-09-19 |
DE202005021940U1 (de) | 2011-10-12 |
TW200528576A (en) | 2005-09-01 |
EP1719003A1 (en) | 2006-11-08 |
CN1922518A (zh) | 2007-02-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |