1317609 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種分解電路板之膠渣的方法和裝置， 尤其是有關於一種利用水電漿分解電路板之膠渣的方法和 裝置。 【先前技術】 印刷電路板(Printed Circuit Board, PCB)是電性連接各 樣電子元件的一種基本電子裝置。通常而言，PCB合成的 材料包括有銅、聚醢亞胺（Polyimide, PI)以及環氧化合物 (Epoxy)等等。在電路板的製造過程中，一般是壓合已經蝕 刻好之各層線路板，接著使用樹脂(Epoxy-Resin)來黏合， 再將電路板鑽孔貫通，並用鍍銅的方法將各層線路板連接 在一起。然而，在鑽孔時無論是使用機械鑽孔或是雷射鑽 孔，皆會產生高溫而將樹脂硬化黏在所鑽之孔璧上，而蓋 住内層銅線路，而產生膠渣。這些膠渣如果未能處理，在 鍍銅時會無法將各層線路板導通連接，而造成斷路的現 象，所以鑽孔後必須去除膠渣。 一般除去膠渣的程序有兩個方式。一為化學方法，亦 即利用過錳酸鉀溶液加熱處理，以去除膠渣。此化學方式 係利用過錳酸鉀溶液之氧化鍵結來移除膠渣，其步驟繁 雜，需經過膠渣膨鬆、然後去膠渣以及中和等步驟。其中 高溫過程中，錳會解離出來而成氧化猛(Μη02)，因而膠渣 5 1317609 的移除率會降低直到不能移除，因此在去膠渣過程中必須 一直添加過錳酸鉀溶液。 其二是使用電漿處理，以去除膠渣。一般而言，電漿 之產生與維持需要附予氣體能量，這些外來的能量造成氣 體的離子化，進而產生電漿。電漿主要是將高分子的鍵結 打斷以移除膠渣，並且加入某些氣體如o2/cf4/n2，將有助 於其膠渣分解的效率。 近幾年，利用電漿來處理像膠渣這樣的高分子材料之 籲方法已被廣泛之研究與應用。電漿處理為一種具高能量及 可處理多種有毒高分子材料之作法，其在分解過程中會產 生大量之離子與活性粒子，特別是在處理環境中利用具有 如OH、Η及Ο等自由基之反應性電漿時，可藉這些自由 基來促進化學反應之進行。如果能夠有效地控制這些粒 子，可期待令其反應成為各種具有高附加價值之工業原料 並加以回收利用。電漿處理的好處是乾淨，不會造成環境 污染，其處理費用較低。目前已有許多廠商使用電漿處理， • 但一般使用有毒之曱烷(CF4)氣體。 然而電漿處理使用有毒氣體將會傷害操作人員之身體 健康。因此，實在有必要提供一種可去膠渣且有效而又不 傷害操作人員身體以及符合環保標準之方法及裝置，以改 進目前存在的問題。 【發明内容】 鑑於先前技術所存在的問題，本發明乃提供一種分解 6 1317609 電路板上膠渣之方法及裝置。 本發明之主要目的係在提供一種利用水電漿分解電路 板上膠渣之方法和裝置。 本發明首先提供一種分解電路板上膠渣之裝置。該裝 置具有”下幾個主要單元：___腔體、—上電極、—下電極、 一加熱器、一水蒸氣輪入端、一氮氣輸入端、一電力供應 器以及一幫浦。 1 在本發明之一實施例中，電力供應器係提供一 13.56MHz 之南週波射頻電漿（^^出〇 FreqUenCy piasmas， RF Plasma)放電。由於RF電漿放電較容易於較廣之氣壓範 圍内產生大容積之電毁。 在本發明之一實施例中，本發明之裝置可進一步包括 一回收槽’用以回收該電路板上膠渣分解後所產生之氣態 回收物質。因此’藉由本發明之裝置可有效地將電路板之 膠潰轉換成高附加價值之原料並加以回收利用，除可降低 丨生產成本’且有助於解決環保之問題，從節省資源之觀點 來看亦極為重要。 本發明提供一種分解電路板上膠渣之方法，其主要包 含以下步驟：1.提供電路板置於一腔體中；2.將腔體抽成真 空；3.提供一水蒸氣進入該腔體；4.調整該腔體内之各種變 數，5_提供一電漿與該水蒸氣反應而形成一水電漿放電， 致使電路板上膠渣被分解成為一氣態回收物質；6.回收氣 態回收物吳，7將腔體通入氡氣破真空，以將該電路板取 出；以及8·檢測該氣態回收物質之成份。 7 1317609 【實施方式】 為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂，下文特舉出較佳實施例，並配合所附圖式，作詳細 說明如下。 以下請一併參考圖1〜2關於本發明之分解電路板上膠 渣之裝置之結構示意圖以及分解電路板上膠渣之方法之步 驟流程圖。 請參考圖1關於依據本發明之分解電路板30上膠渣之 裝置之結構示意圖，其具有以下幾個主要單元：一腔體20、 一上電極21、一下電極22、一加熱器23、一水蒸氣輸入 端24、一氮氣輸入端25、一液態氮氣輸入端26、一電力 供應器40、一回收槽50以及一幫浦51。 如圖1所示，在本發明之實施例中，上電極21與下電 極22係為平行配置於該腔體20内部的一對上下電極，而 在該上電極21與該下電極22中間以一電力供應器40在腔 體20之外侧電性連接，且該下電極22内具有一加熱器23, 可將放置在其上之電路板30加熱。其中，本發明之電路板 30之材質不以軟板材質為限，還可包括硬板或其他型式之 電路板。 幫浦51係與腔體20連接，可將該腔體20抽高真空至 約30〇xl(T3托爾。水蒸氣輸入端24係設置於腔體20之外 側，並可輸入一水蒸氣從該輸入端24進入該腔體20之内 8 1317609 部。藉由該電力供應器40於腔體20内產生之電漿與水蒸 氣可形成一水電漿。在本發明之實施例中，電力供應器40 可提供高週波13.56MHz之放電電漿或2.45GHz之微波放 電電漿，但本發明並不以此為限。 位於腔體20内之水電漿與電路板30之膠渣反應後， 會使得膠渣被分解形成氣態回收物質。 氮氣輸入端25係設置於腔體20之上端，可從該氮氣 輸入端25灌入氮氣致使該腔體20破除真空，以便順利取 > 出經水電漿處理過，而已去除膠渣之電路板30。 另外，回收槽50係設置於腔體20之上端，並可由液 態氮氣輸入端26加入液態氮進入該回收槽50，以回收電 路板30上膠渣經水電漿分解後之氣態回收物質。 再者，本發明還包括可設置於腔體20外側之一光譜分 析儀45，用以檢測腔體20内之水電漿分解電路板30上膠 渣之情形。 > 此外，本發明除提供上述之分解電路板30上膠渣之裝 置外，尚提供一種分解電路板30上膠渣及回收該膠渣被水 電漿分解後所產生之氣態回收物質之方法。 以下請參考圖2關於本發明之步驟流程圖。此處需注 意的是，以下實施例將應用本發明之分解電路板30上膠渣 之裝置進行分解實驗，並以高週波13.56MHz之放電電漿 電源以及一含樹脂之軟板材料試片為例進行，但本發明並 不以此為限。同時，以下實施例所提出之材質、大小、溫 9 1317609 度、壓力或各樣變數等等皆為舉例說明，本發明並不以此 為限。 如圖2所示，本發明之方法包含以下步驟： 步驟101 :提供電路板置於一腔體中。首先，在進行 步驟101前，先預先準備一含樹脂之軟板材料試片，並裁 剪為大小5公分χ5公分之實驗試片，以作為圖1中的電路 板30。然後將該試片先放置一烤箱加熱烘烤，以160°C烘 烤一小時使其樹脂熟化，再將熟化之該試片放置於精密天 秤上，並量秤該試片之重量。 接著，利用丙酮將該腔體20内部擦拭清潔，此時因擦 拭清潔後的腔體20會殘留丙酮揮發之氣體，所以將腔體20 抽真空，使腔體20内部殘留氣體抽乾淨，再把該試片放入 如圖1所示，可當作試片台之下電極22上面。 步驟102 :將腔體抽成真空。此時，利用位於腔體20 上端之幫浦51(如圖1所示）將該腔體20抽高真空至30〇xl〇-3 托爾以下。 步驟103 :提供一水蒸氣進入該腔體。接著，再利用連 接於腔體20之水蒸氣輸入端24(如圖1所示）通入水蒸氣進 入該腔體20内侧。 步驟104 :調整該腔體内之各種變數。在步驟104中， 係將腔體20加溫至150°C，並設定該水蒸氣之流量為60毫升 /每分鐘，以及將高週波電漿功率調為250W之情況下進行 分解。 10 1317609 步驟10 5 :提供一電漿與該水蒸氣反應而形成一水電漿 放電，致使該試片上膠渣被分解成為一氣態回收物質。在 步驟105中，本發明係藉由電力供應器40所提供之一電漿與 腔體20内之水蒸氣反應形成水電漿，當水電漿放電可使該 試片之膠渣分解成為一氣態回收物質。 在進行步驟105前，可另外利用加熱器23將該試片先加 熱至150°C，以水電漿放電使該膠渣分解再做一次實驗，該 試片上膠渣被分解的效果與未加熱之試片，在溫度150°C以 下的實驗結果，其膠渣的移除率是一樣的，如圖4所示。 步驟106 :回收氣態回收物質。接著，將回收槽50加入 液態氮以回收該試片分解後之氣態回收物質，並做實驗後 之分析。此外，以上步驟105至步驟106，其反應時間可設 定為1、2、5、10以及15分鐘不等。 步驟107 :檢測水電漿反應情形。以上步驟103〜步驟 105,可同時使用一光譜分析儀45檢測腔體内之水電漿以及 水電漿分解該試片之情形。 步驟108 :腔體通入氮氣破真空，將該試片取出並觀 察。由氮氣輸入口 25灌入氮氣，使該腔體20破真空，取出 經水電漿反應過後之電路板30，再一次放置精密天秤，量 秤試片重量作比對，並觀察該試片表面的變化情形。 步驟109 :檢測該氣態回收物質之成份。由光譜分析儀 4 5所測得之基礎之光譜圖與分解時實際測得之光譜圖加以 比對，以確認分解與再合成反應之進行狀況。將回.收槽50 内之氣態回收物質，以一MS-GC儀器做檢測，檢測該氣態 11 1317609 回收物質之成分及含量。其中氣態回收物質包括丙酮、曱 醇、乙醇與乙醛等。 以下請一併參考圖3〜4關於本發明之實施例透過光譜 分析儀45、MS-GC儀器與精密天秤所檢測之結果。 請參考圖3係為通水蒸氣在腔體20内，但還未放進試 片情況下，所測得的基礎光譜，橫轴為電漿瓦數、縱軸為 光譜強度。如圖3所示，電漿將能量施於氣體使其受激電 0 離，可以發現氣體受電離而產生H、0帶電離子，而瓦數 越高可以發現所測得H、0帶電離子能量變化也跟著升高， 但除了 Η離子變化較大外，Ο離子則變化較小。 圖4係為依據本發明實施例之水電漿與膠渣反應後， 其電路板30在加熱與否的情形下，其膠渣分解的多寡在不 同時間的變化圖，橫轴為反應時間、縱轴為膠渣被移除的 量的大小。如圖4所示，在最初的階段有加熱之該試片的 膠渣移除率會稍微快一點，但到開始放電反應15分鐘後， φ 其膠渣移除率的量與試片未加熱的情況一樣。 本發明提出以一高週波電漿放電替代傳統方式，高週 波電漿放電較容易於較廣之氣壓範圍内產生大容積之電 漿，而其試片加熱與否，並沒有很大的影響，這可節省更 多經濟成本並解決分解電路板上膠渣之繁雜的步驟。此 外，此種方式只需小規模之裝置，投資容易，且未使用有 毒的氣體，而是以水來代替，兼具環保與經濟等優點，其 又可解決膠渣分解後之氣體回收處理問題，同時亦有節省 資源與再利用之效果，一舉數得，如能實用化對國家社會 1317609 之貢獻極大無疑。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何熟習此技藝者，在不脫離本發明之精神 和範圍内，當可作些許之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 【圖式簡單說明】 • 圖1為依據本發明之分解電路板上膠渣之裝置之結構 示意圖。 圖2為依據本發明之分解電路板上膠渣之方法之步驟 流程圖。 圖3係為依據本發明實施例之通水蒸氣在腔體内，但 還未放進含樹脂之軟板材料試片情況下，所測得的基礎光 譜。 圖4係為依據本發明實施例之水電漿與膠渣反應後， • 其電路板在加熱與否的情形下，其膠渣分解的多寡在不同 時間的變化圖。 【元件代表符號說明】 腔體20 上電極21 下電極22 13 1317609 加熱器23 水蒸氣端24 氮氣端25 液態氮氣端26 電路板30 電力供應器40 光譜分析儀45 回收槽50 幫浦51BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to a method and apparatus for decomposing a slag of a circuit board, and more particularly to a method and apparatus for decomposing a slag of a circuit board using a water plasma. [Prior Art] A Printed Circuit Board (PCB) is a basic electronic device that electrically connects various electronic components. In general, PCB synthesis materials include copper, polyimide (PI), and epoxy compounds (Epoxy). In the manufacturing process of the circuit board, generally, the circuit boards which have been etched are pressed, and then resin (Epoxy-Resin) is used for bonding, and then the circuit board is drilled through, and the circuit boards are connected by copper plating. together. However, in the case of drilling, whether using mechanical drilling or laser drilling, high temperature is generated to harden the resin to the drilled hole, and the inner copper line is covered to produce the slag. If these slags are not processed, it will not be possible to connect the various circuit boards during copper plating, which will cause the circuit to break, so the slag must be removed after drilling. There are two ways to remove the glue generally. One is a chemical method, that is, heat treatment with a potassium permanganate solution to remove the slag. This chemical method utilizes the oxidative bonding of the potassium permanganate solution to remove the slag. The steps are complicated and require the steps of bulking the slag, then removing the slag, and neutralizing. In the high temperature process, manganese will dissociate and become oxidized (Μη02), so the removal rate of the slag 5 1317609 will be reduced until it cannot be removed, so the potassium permanganate solution must be added during the desmear process. The second is to use plasma treatment to remove the glue. In general, the generation and maintenance of plasma requires the attachment of gas energy, which causes ionization of the gas, which in turn produces plasma. The plasma mainly breaks the bond of the polymer to remove the slag, and adding certain gases such as o2/cf4/n2 will help the efficiency of the slag decomposition. In recent years, the use of plasma to treat polymer materials such as slag has been widely studied and applied. Plasma treatment is a kind of high energy and can handle a variety of toxic polymer materials, which will generate a large amount of ions and active particles during the decomposition process, especially in the treatment environment, using free radicals such as OH, hydrazine and hydrazine. In the case of reactive plasma, these free radicals can be used to promote the progress of the chemical reaction. If these particles can be effectively controlled, it can be expected to be reacted and recycled as various industrial materials with high added value. The benefits of plasma treatment are clean, do not cause environmental pollution, and are less expensive to process. Many manufacturers currently use plasma treatment, but generally use toxic decane (CF4) gas. However, the use of toxic gases in plasma processing will harm the health of the operator. Therefore, it is indeed necessary to provide a method and apparatus that can be desmeared and effective without harming the operator's body and complying with environmental standards to improve existing problems. SUMMARY OF THE INVENTION In view of the problems of the prior art, the present invention provides a method and apparatus for decomposing a slag on a circuit board of 6 1317609. SUMMARY OF THE INVENTION A primary object of the present invention is to provide a method and apparatus for decomposing slag on a circuit board using a water plasma. The present invention first provides an apparatus for decomposing slag on a circuit board. The device has "the next few main units: ___ cavity, - upper electrode, - lower electrode, a heater, a water vapor wheel inlet, a nitrogen input, a power supply, and a pump. In one embodiment of the present invention, the power supply system provides a 13.56 MHz south-frequency RF plasma discharge (FreqUenCy piasmas, RF Plasma) discharge. Since the RF plasma discharge is easier to generate in a wider gas pressure range. In one embodiment of the present invention, the apparatus of the present invention may further comprise a recovery tank 'for recovering the gaseous recovered material produced by the decomposition of the slag on the circuit board. Thus, by the present invention The device can effectively convert and destroy the board's glue into high value-added raw materials, which can reduce the production cost of the product and help solve environmental problems. It is also very important from the viewpoint of saving resources. The invention provides a method for decomposing slag on a circuit board, which mainly comprises the following steps: 1. providing a circuit board in a cavity; 2. drawing a cavity into a vacuum; 3. providing a water vapor to enter a cavity; 4. adjusting various variables in the cavity, 5_ providing a plasma to react with the water vapor to form a water plasma discharge, causing the slag on the circuit board to be decomposed into a gaseous recovered substance; 6. recovering gaseous state Recycling material, 7, the chamber is introduced into the helium gas to break the vacuum to take out the circuit board; and 8. The composition of the gaseous recovered material is detected. 7 1317609 [Embodiment] The above and other objects and features of the present invention are made. The advantages and advantages can be more clearly understood. The preferred embodiments are described below, and are described in detail below with reference to the accompanying drawings. Please refer to FIG. 1 to 2 for the device for disassembling the slag on the circuit board of the present invention. FIG. 1 is a schematic view showing the structure of a device for decomposing a slag on a circuit board according to the present invention, which has the following main components: a cavity 20, an upper electrode 21, a lower electrode 22, a heater 23, a water vapor input terminal 24, a nitrogen input terminal 25, a liquid nitrogen input terminal 26, a power supply 40, a recovery tank 50, and a group of 51. In the embodiment of the present invention, the upper electrode 21 and the lower electrode 22 are a pair of upper and lower electrodes disposed in parallel with the cavity 20, and the upper electrode 21 and the lower electrode 22 are A power supply 40 is electrically connected to the outside of the cavity 20, and a heater 23 is disposed in the lower electrode 22 to heat the circuit board 30 placed thereon. The circuit board 30 of the present invention is The material is not limited to the soft board material, and may include a hard board or other type of circuit board. The pump 51 series is connected to the cavity 20, and the cavity 20 can be evacuated to a height of about 30 〇 xl (T3 Tor. The water vapor input end 24 is disposed on the outer side of the cavity 20, and a water vapor can be input from the input end 24 into the portion 8 1317609 of the cavity 20. The plasma generated by the power supply 40 in the cavity 20 and the water vapor can form a water plasma. In the embodiment of the present invention, the power supply 40 can provide a high-frequency 13.56 MHz discharge plasma or a 2.45 GHz microwave discharge plasma, but the invention is not limited thereto. The water plasma located in the cavity 20 reacts with the slag of the circuit board 30, causing the slag to be decomposed to form a gaseous recovered material. The nitrogen input end 25 is disposed at the upper end of the cavity 20, and the nitrogen gas can be injected from the nitrogen input end 25 to cause the cavity 20 to break the vacuum, so as to smoothly take out the circuit board which has been treated by the water plasma and has been removed. 30. In addition, the recovery tank 50 is disposed at the upper end of the cavity 20, and liquid nitrogen can be introduced into the recovery tank 50 from the liquid nitrogen input end 26 to recover the gaseous recovered material after the slag on the circuit board 30 is decomposed by the water plasma. Furthermore, the present invention further includes a spectral analyzer 45 that can be disposed outside the cavity 20 for detecting the situation in which the water plasma in the cavity 20 decomposes the slag on the circuit board 30. Further, in addition to the above-described apparatus for disassembling the slag on the circuit board 30, the present invention provides a method of decomposing the slag on the circuit board 30 and recovering the gaseous recovered material generated by the decomposition of the slag by the water plasma. Please refer to FIG. 2 for a flow chart of the steps of the present invention. It should be noted here that the following embodiment will perform the decomposition experiment using the apparatus for disintegrating the slag of the circuit board 30 of the present invention, and the high-frequency 13.56 MHz discharge plasma power supply and the resin-containing soft board material test piece are The examples are carried out, but the invention is not limited thereto. Meanwhile, the materials, the size, the temperature, the temperature, the pressure, the various variables, and the like proposed in the following embodiments are all illustrative, and the present invention is not limited thereto. As shown in FIG. 2, the method of the present invention comprises the following steps: Step 101: Providing a circuit board in a cavity. First, before performing the step 101, a test piece of a resin-containing soft board material was prepared in advance and cut into an experimental test piece having a size of 5 cm and 5 cm to serve as the circuit board 30 in Fig. 1. Then, the test piece was placed in an oven for heating and baking, baked at 160 ° C for one hour to cure the resin, and the matured test piece was placed on a precision scale, and the weight of the test piece was weighed. Then, the inside of the cavity 20 is wiped and cleaned with acetone. At this time, since the cavity 20 which is wiped and cleaned remains the vapor volatilized by the acetone, the cavity 20 is evacuated, and the residual gas inside the cavity 20 is cleaned. The test piece is placed as shown in Fig. 1, and can be used as the upper surface of the electrode 22 under the test piece. Step 102: The chamber is evacuated. At this time, the cavity 20 is evacuated to a temperature of 30 〇 xl 〇 -3 Torr by using a pump 51 (shown in FIG. 1) located at the upper end of the cavity 20. Step 103: Providing a water vapor into the chamber. Next, water vapor is introduced into the cavity 20 through the water vapor input end 24 (shown in Figure 1) connected to the cavity 20. Step 104: Adjust various variables in the cavity. In step 104, the chamber 20 is warmed to 150 ° C, the flow rate of the water vapor is set to 60 ml / min, and the high-cycle plasma power is adjusted to 250 W for decomposition. 10 1317609 Step 10 5: A plasma is provided to react with the water vapor to form a water plasma discharge, so that the slag on the test piece is decomposed into a gaseous recovered substance. In the step 105, the present invention forms a water plasma by reacting one of the plasmas provided by the power supply 40 with the water vapor in the cavity 20. When the water plasma discharges, the slag of the test piece is decomposed into a gaseous state. substance. Before performing step 105, the test piece may be additionally heated to 150 ° C by using the heater 23, and the slurry is decomposed by water plasma discharge to perform an experiment. The effect of the slag on the test piece is decomposed and unheated. The test piece, at the temperature of 150 ° C or less, the removal rate of the slag is the same, as shown in Figure 4. Step 106: recovering the gaseous recovered material. Next, the recovery tank 50 was charged with liquid nitrogen to recover the gaseous recovered matter after the decomposition of the test piece, and the analysis was performed after the experiment. Further, in the above steps 105 to 106, the reaction time may be set to 1, 2, 5, 10, and 15 minutes. Step 107: Detecting the situation of the water plasma reaction. In the above steps 103 to 105, a spectrum analyzer 45 can be used simultaneously to detect the water plasma in the cavity and the water plasma to decompose the test piece. Step 108: The chamber was evacuated by nitrogen gas, and the test piece was taken out and observed. Nitrogen gas is injected into the nitrogen inlet port 25 to break the vacuum of the cavity 20, and the circuit board 30 after the reaction of the water plasma is taken out, and the precision balance is placed again. The weight of the test piece is compared and the surface of the test piece is observed. Change situation. Step 109: Detect the components of the gaseous recovered material. The basic spectrum measured by the optical spectrum analyzer 45 is compared with the actually measured spectral image at the time of decomposition to confirm the progress of the decomposition and resynthesis reaction. The gaseous recovered material in the trough 50 is returned to the MS-GC instrument for detection of the composition and content of the gaseous 11 1317609 recovered material. Among them, gaseous recovered materials include acetone, decyl alcohol, ethanol and acetaldehyde. Hereinafter, the results of the transmission of the spectrum analyzer 45, the MS-GC apparatus, and the precision balance by the embodiment of the present invention will be described with reference to Figs. Please refer to Fig. 3 for the measured basic spectrum when the water vapor is in the cavity 20 but has not been placed in the test piece. The horizontal axis is the plasma wattage and the vertical axis is the spectral intensity. As shown in Fig. 3, the plasma applies energy to the gas to cause it to be excited. It can be found that the gas is ionized to generate H and 0 charged ions, and the higher the wattage, the measured H, 0 charged ion energy. The change also increased, but in addition to the larger change in strontium ions, the strontium ions changed less. FIG. 4 is a diagram showing changes in the amount of slag decomposition of the circuit board 30 in the case of heating or not after the reaction of the water plasma with the slag according to the embodiment of the present invention, and the horizontal axis is the reaction time and the longitudinal direction. The shaft is the amount of the amount by which the slag is removed. As shown in Fig. 4, the slag removal rate of the test piece heated at the initial stage is slightly faster, but after 15 minutes from the start of the discharge reaction, the amount of slag removal rate of φ and the test piece are not heated. The same is true. The invention proposes to replace the conventional method with a high-frequency plasma discharge, and the high-frequency plasma discharge is easier to generate a large-volume plasma in a wider gas pressure range, and the test piece heating or not has no great influence. This saves more economic costs and solves the cumbersome steps of disassembling the slag on the board. In addition, this method requires only a small-scale device, easy investment, and does not use toxic gas, but is replaced by water, which has the advantages of environmental protection and economy, and can solve the problem of gas recovery and treatment after decomposition of the slag. At the same time, it also has the effect of saving resources and reusing. In one fell swoop, if it can be practical, the contribution to the national society 1317609 is enormous. While the present invention has been described in its preferred embodiments, the present invention is not intended to limit the invention, and the present invention may be modified and modified without departing from the spirit and scope of the invention. The scope of protection is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the structure of a device for disassembling a slag on a circuit board according to the present invention. Figure 2 is a flow chart showing the steps of a method of disassembling a slag on a circuit board in accordance with the present invention. Fig. 3 is a diagram showing the measured basic spectrum of water vapor in a cavity according to an embodiment of the present invention, but without being placed in a test piece of a soft material containing resin. Fig. 4 is a graph showing changes in the amount of slag decomposition of the circuit board in the case of heating or not after the reaction of the water plasma with the slag according to the embodiment of the present invention. [Description of component symbols] Cavity 20 Upper electrode 21 Lower electrode 22 13 1317609 Heater 23 Water vapor terminal 24 Nitrogen gas terminal 25 Liquid nitrogen gas terminal 26 Circuit board 30 Power supply 40 Spectrum analyzer 45 Recovery tank 50 Pump 51