TWI316301B - - Google Patents
Info
- Publication number
- TWI316301B TWI316301B TW095143210A TW95143210A TWI316301B TW I316301 B TWI316301 B TW I316301B TW 095143210 A TW095143210 A TW 095143210A TW 95143210 A TW95143210 A TW 95143210A TW I316301 B TWI316301 B TW I316301B
- Authority
- TW
- Taiwan
- Prior art keywords
- liquid
- led chip
- dissipating device
- led
- vapor heat
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/648—Heat extraction or cooling elements the elements comprising fluids, e.g. heat-pipes
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095143210A TW200824143A (en) | 2006-11-22 | 2006-11-22 | Light emitting diode and the assembly of liquid/vapor phase heat sink device |
JP2006351945A JP2008131026A (ja) | 2006-11-22 | 2006-12-27 | Led(発光ダイオード)と液相・気相放熱装置との結合構造 |
US11/703,167 US7538356B2 (en) | 2006-11-22 | 2007-02-07 | Combination assembly of LED and liquid-vapor thermally dissipating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW095143210A TW200824143A (en) | 2006-11-22 | 2006-11-22 | Light emitting diode and the assembly of liquid/vapor phase heat sink device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200824143A TW200824143A (en) | 2008-06-01 |
TWI316301B true TWI316301B (zh) | 2009-10-21 |
Family
ID=39416715
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095143210A TW200824143A (en) | 2006-11-22 | 2006-11-22 | Light emitting diode and the assembly of liquid/vapor phase heat sink device |
Country Status (3)
Country | Link |
---|---|
US (1) | US7538356B2 (zh) |
JP (1) | JP2008131026A (zh) |
TW (1) | TW200824143A (zh) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8764220B2 (en) | 2010-04-28 | 2014-07-01 | Cooper Technologies Company | Linear LED light module |
US8308320B2 (en) | 2009-11-12 | 2012-11-13 | Cooper Technologies Company | Light emitting diode modules with male/female features for end-to-end coupling |
CN101764190A (zh) * | 2010-01-01 | 2010-06-30 | 中山伟强科技有限公司 | 一种发光二极管的封装结构 |
EP2564112A4 (en) | 2010-04-27 | 2014-12-31 | Cooper Technologies Co | NETWORKABLE LINEAR LED SYSTEM |
TWM397030U (en) * | 2010-08-16 | 2011-01-21 | Liang Meng Plastic Share Co Ltd | LED packaging structure |
US8466486B2 (en) | 2010-08-27 | 2013-06-18 | Tsmc Solid State Lighting Ltd. | Thermal management system for multiple heat source devices |
CN201820758U (zh) * | 2010-09-15 | 2011-05-04 | 杨东佐 | 一种带有冷却装置的led集成结构 |
US20120186155A1 (en) * | 2011-01-25 | 2012-07-26 | Chin-Tai Tsai | Passive water supply system for plant pot |
CN102777811A (zh) * | 2011-05-10 | 2012-11-14 | 肇庆市立得电子有限公司 | 灯具及其散热装置 |
TW201248946A (en) * | 2011-05-18 | 2012-12-01 | Neobulb Technologies Inc | Semiconductor optoelectronic converting system and the fabricating method thereof |
US8759843B2 (en) | 2011-08-30 | 2014-06-24 | Abl Ip Holding Llc | Optical/electrical transducer using semiconductor nanowire wicking structure in a thermal conductivity and phase transition heat transfer mechanism |
US8723205B2 (en) | 2011-08-30 | 2014-05-13 | Abl Ip Holding Llc | Phosphor incorporated in a thermal conductivity and phase transition heat transfer mechanism |
US8710526B2 (en) | 2011-08-30 | 2014-04-29 | Abl Ip Holding Llc | Thermal conductivity and phase transition heat transfer mechanism including optical element to be cooled by heat transfer of the mechanism |
CN103996664B (zh) * | 2014-05-30 | 2016-08-24 | 佐志温控技术(上海)有限公司 | 一种防反二极管的液体强制冷却装置 |
CN113438868A (zh) * | 2021-06-29 | 2021-09-24 | 云南靖创液态金属热控技术研发有限公司 | 一种超薄散热装置及散热方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03121916U (zh) * | 1990-03-28 | 1991-12-12 | ||
US5173839A (en) * | 1990-12-10 | 1992-12-22 | Grumman Aerospace Corporation | Heat-dissipating method and device for led display |
TW295889U (en) | 1996-08-19 | 1997-01-11 | xian-da Chen | Structural improvement of lateral cover of abrasive wheel |
JPH11298048A (ja) * | 1998-04-15 | 1999-10-29 | Matsushita Electric Works Ltd | Led実装基板 |
AU2003265308A1 (en) * | 2002-07-25 | 2004-02-16 | Jonathan S. Dahm | Method and apparatus for using light emitting diodes for curing |
TWI257992B (en) * | 2004-09-13 | 2006-07-11 | Neobulb Technologies Inc | Lighting device with highly efficient heat dissipation structure |
JP2006128236A (ja) * | 2004-10-27 | 2006-05-18 | Mitsubishi Electric Corp | 光半導体モジュール |
-
2006
- 2006-11-22 TW TW095143210A patent/TW200824143A/zh not_active IP Right Cessation
- 2006-12-27 JP JP2006351945A patent/JP2008131026A/ja active Pending
-
2007
- 2007-02-07 US US11/703,167 patent/US7538356B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US7538356B2 (en) | 2009-05-26 |
US20080117601A1 (en) | 2008-05-22 |
JP2008131026A (ja) | 2008-06-05 |
TW200824143A (en) | 2008-06-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |