TWI315906B - Structure combined with an ic integrated substrate and a carrier, method of manufacturing the structure, and method of manufacturing an electrical device
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Structure combined with an ic integrated substrate and a carrier, method of manufacturing the structure, and method of manufacturing an electrical device
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Application filed by Princo CorpfiledCriticalPrinco Corp
Priority to TW95127670ApriorityCriticalpatent/TWI315906B/en
Priority to US11/533,762prioritypatent/US7545042B2/en
Priority to KR1020060099911Aprioritypatent/KR100785176B1/en
Priority to JP2006337851Aprioritypatent/JP2007173811A/en
Publication of TW200807660ApublicationCriticalpatent/TW200807660A/en
Priority to US12/267,374prioritypatent/US7993973B2/en
Application grantedgrantedCritical
Publication of TWI315906BpublicationCriticalpatent/TWI315906B/en
TW95127670A2005-12-222006-07-28Structure combined with an ic integrated substrate and a carrier, method of manufacturing the structure, and method of manufacturing an electrical device
TWI315906B
(en)
Structure combined with an ic integrated substrate and a carrier, method of manufacturing the structure, and method of manufacturing an electrical device
Structure combined with an ic integrated substrate and a carrier, method of manufacturing the structure, and method of manufacturing an electrical device
Structure combined with an ic integrated substrate and a carrier, method of manufacturing the structure, and method of manufacturing an electrical device
Substrate for electronic device, layered body for organic led element, method for manufacturing the same, organic led element, and method for manufacturing the same