TWI315906B - Structure combined with an ic integrated substrate and a carrier, method of manufacturing the structure, and method of manufacturing an electrical device - Google Patents

Structure combined with an ic integrated substrate and a carrier, method of manufacturing the structure, and method of manufacturing an electrical device

Info

Publication number
TWI315906B
TWI315906B TW95127670A TW95127670A TWI315906B TW I315906 B TWI315906 B TW I315906B TW 95127670 A TW95127670 A TW 95127670A TW 95127670 A TW95127670 A TW 95127670A TW I315906 B TWI315906 B TW I315906B
Authority
TW
Taiwan
Prior art keywords
manufacturing
carrier
electrical device
integrated substrate
combined
Prior art date
Application number
TW95127670A
Other languages
Chinese (zh)
Other versions
TW200807660A (en
Inventor
Chih Kuang Yang
Original Assignee
Princo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Princo Corp filed Critical Princo Corp
Priority to TW95127670A priority Critical patent/TWI315906B/en
Priority to US11/533,762 priority patent/US7545042B2/en
Priority to KR1020060099911A priority patent/KR100785176B1/en
Priority to JP2006337851A priority patent/JP2007173811A/en
Publication of TW200807660A publication Critical patent/TW200807660A/en
Priority to US12/267,374 priority patent/US7993973B2/en
Application granted granted Critical
Publication of TWI315906B publication Critical patent/TWI315906B/en

Links

TW95127670A 2005-12-22 2006-07-28 Structure combined with an ic integrated substrate and a carrier, method of manufacturing the structure, and method of manufacturing an electrical device TWI315906B (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW95127670A TWI315906B (en) 2006-07-28 2006-07-28 Structure combined with an ic integrated substrate and a carrier, method of manufacturing the structure, and method of manufacturing an electrical device
US11/533,762 US7545042B2 (en) 2005-12-22 2006-09-20 Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure
KR1020060099911A KR100785176B1 (en) 2005-12-22 2006-10-13 Structure combining an ic integrated and a carrier, and method of manufacturing such structure
JP2006337851A JP2007173811A (en) 2005-12-22 2006-12-15 Coupling structure of ic aligning substrate and carrier, manufacturing method of the same, and manufacturing method of electronic device
US12/267,374 US7993973B2 (en) 2005-12-22 2008-11-07 Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95127670A TWI315906B (en) 2006-07-28 2006-07-28 Structure combined with an ic integrated substrate and a carrier, method of manufacturing the structure, and method of manufacturing an electrical device

Publications (2)

Publication Number Publication Date
TW200807660A TW200807660A (en) 2008-02-01
TWI315906B true TWI315906B (en) 2009-10-11

Family

ID=44766706

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95127670A TWI315906B (en) 2005-12-22 2006-07-28 Structure combined with an ic integrated substrate and a carrier, method of manufacturing the structure, and method of manufacturing an electrical device

Country Status (1)

Country Link
TW (1) TWI315906B (en)

Also Published As

Publication number Publication date
TW200807660A (en) 2008-02-01

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