TWI307262B - - Google Patents
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- Publication number
- TWI307262B TWI307262B TW95142029A TW95142029A TWI307262B TW I307262 B TWI307262 B TW I307262B TW 95142029 A TW95142029 A TW 95142029A TW 95142029 A TW95142029 A TW 95142029A TW I307262 B TWI307262 B TW I307262B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat transfer
- transfer structure
- particulate matter
- heat
- colloid
- Prior art date
Links
- 239000007788 liquid Substances 0.000 claims description 42
- 239000013618 particulate matter Substances 0.000 claims description 32
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 30
- 239000000084 colloidal system Substances 0.000 claims description 23
- 239000002904 solvent Substances 0.000 claims description 18
- 238000000576 coating method Methods 0.000 claims description 15
- 239000002245 particle Substances 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 14
- 239000003292 glue Substances 0.000 claims description 12
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical group CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 239000011236 particulate material Substances 0.000 claims description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229920006335 epoxy glue Polymers 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 239000003973 paint Substances 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 150000002118 epoxides Chemical class 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 230000001788 irregular Effects 0.000 claims description 2
- 150000002576 ketones Chemical class 0.000 claims description 2
- -1 mercaptoethyl group Chemical group 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 239000011148 porous material Substances 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims 1
- 239000012798 spherical particle Substances 0.000 claims 1
- 230000000694 effects Effects 0.000 description 7
- 230000017525 heat dissipation Effects 0.000 description 6
- 238000001802 infusion Methods 0.000 description 3
- 101150052863 THY1 gene Proteins 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000000499 gel Substances 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 108010068370 Glutens Proteins 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 235000021312 gluten Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95142029A TW200822850A (en) | 2006-11-14 | 2006-11-14 | Heat conduction structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW95142029A TW200822850A (en) | 2006-11-14 | 2006-11-14 | Heat conduction structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200822850A TW200822850A (en) | 2008-05-16 |
| TWI307262B true TWI307262B (enExample) | 2009-03-01 |
Family
ID=44770878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95142029A TW200822850A (en) | 2006-11-14 | 2006-11-14 | Heat conduction structure |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200822850A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110243216B (zh) * | 2018-03-09 | 2024-06-07 | 双鸿电子科技工业(昆山)有限公司 | 均温板及其制造方法 |
| CN112732047B (zh) * | 2020-12-22 | 2023-03-21 | 宝鸡文理学院 | 一种具有散热功能的计算机网络安全处理器 |
-
2006
- 2006-11-14 TW TW95142029A patent/TW200822850A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200822850A (en) | 2008-05-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |