TWI306053B - Chuck with integrated wafer support - Google Patents

Description

1306053

V. INSTRUCTIONS OF THE INVENTION (1) Field of the Invention The present invention relates to an improved chuck and an improved probe station. For the prior art, see the first borrowing of a small number of jacks (about 1 / 1 detail. Using the probe square 18, its components. The collet chuck assembly uses the horizontal to move along the counters 1 2 using the jacks 16. ,, ... less than 1 ή part of the icon), 143'141), 14〇, 14 (1 support platform 12' jack can be 〇吋) relative to the base upright selective lifting platform, the base of the station is also 10 Supports motorized positioner 丨6, with a long ΐ 2 ί head assembly 2〇, “Support wafer or other tear 1 assembly 20 freely through the large through hole 22 on the platform 12 'The odson locator 16 is platform independent, Along the χ, γ, ζ coordinate movement, vertical coordinates X and Υ, and upright along the 2 coordinates. Similarly, when the flat top 14 is upright, it is also independent of the collet assembly 2〇 and the fixed top is mounted on the top of the platform 12 ( Only one of them is shown in the figure, and each probe is supported by 3〇 to test the component. The probe is used to adjust the position of the probe holder 28 to the position of the head assembly 28 of the chuck assembly 28 Non-linear 'probe tips and crystals are included in the "approaching coordinates" can be adjusted to tilt the probe 2 〇 supported wafer or other parts Is a plurality of individual probe locators, each of which has an extension member 26' mounted with a probe holder 28, a 1 mounted wafer mounted on the top of the collet assembly 2, and a positioner 24 with a centimeter card adjuster 34, 36, 38, and the probe 30 are placed along the X, γ, and ζ coordinates, respectively. The Ζ coordinates are referred to herein as, for example, the probe holder 2 § and the near coordinate, although the approaching direction is neither upright nor round or other test elements are in contact with each other, as is the meaning of the word. Another PCT card adjuster 4 (needle holder 2 8'' to adjust the flatness of the probe relative to the collet assembly test element. Platform 〗 2 on the collet 1306053 V. Description of the invention (2) - Assembly 20 Up to 丨2 individual probe locators 24 can be arranged around, each supporting another J-probe to radially converge on the squeezing head assembly as a round. For this configuration, each individual locator 24 can be in X The Z, Z directions respectively adjust their probes, and the jacks 14 can be actuated to lift the platform 12 so that all of the locators 24 and their individual probes can be stepped.

— The ring-shaped brother control container is composed of an upper case portion 42 firmly attached to the stage 12, and a lower case portion 44 firmly attached to the base portion 10. Both parts are made of steel or other suitable electrically conductive material to provide EMI shielding. When the jack 14 is actuated to lower the platform 1 2, in order to accommodate the small upright movement between the two box portions 4 2, 4 4 , a conductive elastic foaming pad such as carbon, preferably silver or saturated carbon monoxide, is interposed. The sheet 4 6 is at the periphery of the joint meeting point, between the front of the container, and between the lower box portion 4 4 and the platform 12, so that although the two box portions 42 and 44 can be relatively upright, the whole is maintained, and the EMI is substantially airtight. And light. Although the upper box portion 42 is securely attached to the platform 12, it is preferred to interpose the same 47' between the upper box portion 42 and the top of the platform to achieve maximum sealing. Referring to the fifth and fifth figures, the top surface of the upper box portion 42 includes an octagonal steel box 48, and the extension members 26 of the probe locators 24 such as 49a and 49b'

Μ ς η runs through it. Each panel comprises a hollow casing, and each elastic foaming sheet is placed therein, similar to the gasket material described above. The erect portion of the foam body is cut and slits aligning with the long holes 54 formed in the outer and outer faces of the panel casings, and the extension members 26 of the respective sixteen positioners 24 are movable. This has a slit foaming effect. The extension member 26 of each probe positioner moves in the X, Y, and Z directions, and the Iff container provides a substantially airtight and light secret. In the four panels, the range of motion in the ', ', and Y directions is larger, and the foamed sheet 50 is sandwiched by the long hole.

Page 5 1306053 V. Description of the invention (3) ---- 54 pairs of steel plates 55 'This plate can be traversed in the panel cover, the movement of the large and narrow holes 56 inside and outside the shell garden. Through the panel cover The top of the octagonal steel box 48 is provided with a circular viewing hole 58 with a recessed ... sealing window 60. The carriage 6 2 holds a sliding shutter with a through hole. The circular shape allows or blocks light from passing through the window. The body y4l connected to the CRT monitor: selective capacity can be placed on the window to provide wafers or other test components and ^ not large display 'when set or operated, suitable probes can be placed The window 60 can be removed from the 'microscopic convex lens one surrounded by the foaming gasket', which can be inserted through the viewing hole 58 to provide EMI airtightness to the foam and the upper casing portion 42 of the container can also contain the hinged steel Door 68, the axis is tilted outwardly as shown in Figure 2A. The hinges open the door downwardly toward each other to form a close 'overlapping, sliding edge 68' with the top of the upper box portion. When the door is open, the collet assembly 20 is moved under the door opening by the positioner. As shown in Figure 2A, the collet assembly is accessible for loading or unloading. Referring to Figures 3 and 4, the seal integrity of the container is also maintained by the motorized positioner 16 throughout the positioning movement due to the provision of a series of four sealing plates 72, 74, 76, 78' The size of the plate gradually increases from top to bottom, as is the central through holes 723, 74 £1, 76a, 78a formed on the plates 72, 74, 76, 78, and the through holes 79β formed in the bottom portion 44a of the lower case portion 44. The central through hole 72a of the top plate 72 is closely fitted around the bearing housing 18a of the upright movable plunger 18. The secondary plate that progresses downward, i.e., the plate 74, has an upwardly projecting peripheral edge 74b that limits the plate 72. It can slide over the top of the board 74. The central through hole 74a in the plate 74 is sized to allow the locator 16 to move the plunger 18 and its bearing housing 18' across the X and gamma coordinates up to the edge 74b of the edge of the top plate 72. However, the through hole 1306053 V. invention description (4) is too large to be exposed by the top plate 72 when it is engaged, so the plate is kept sealed regardless of the movement of the plunger 18 and its bearing housing along the χ*γ axis. The plunger 18 and the bearing housing move further in the direction of engagement of the plate 72. The edge 74b causes the plate 74 to slide toward the peripheral edge 7 of the next lower plate 76. Also i ί 2ft ί through hole? 6a is large enough to engage the plate 74 with the edge 76b, and the second hole 76a is squeezed, thus maintaining the movement between the plates 74 and 76 and the bearing housing in the same direction, which will cause the lower surface to slide to the lower layer. The connecting edges (4) b and ^. will expose the through holes 783 and 79a. The sliding plate and the gradual increase of this plug 18 are separated by a seal along the X and γ coordinates. This is all in the movement of the squat, still keeping the container in the dense horse: 4;; sealed, even if the electric reverse milk of the positioner 16 ..., the cause is located below the sliding plate. The picture is made with 'clamp 5 assembly 2° is - the type of module structure is respectively supported at π π π ^ I plunger 18 supports the adjustment plate 79, thus the ground = chuck _ &: f line The needle is getting farther and farther away from the first, second, or; ί 83 Ϊ = 0, 81, 83. The element 83 is a conductive rectangular step having a flat and mounted rounded "conductive element 8" and 8]. Upright through hole 84 of the component. This round; support surface 82 of the circle, with an array of chambers connected separately to the Ϊ = communicating with the chambers separated by the ring 88, opening the control vacuum valve (\, empty line 90a' 90b, 90c (Fig. 6 ), through the sub-chamber and its through-hole selective speed is not old) and the vacuum source. Each vacuum line isolates each via from a vacuum source, a null source to hold the wafer, or otherwise release the wafer' as is conventional. Each room and

1306053 V. INSTRUCTIONS (5): The corresponding through hole is open, so that the chuck can hold crystal circles of different diameters. ^ Outside the circular elements 80 and 81, the screws are used in the corners of the element 83 (the auxiliary chucks are mounted freely on the picture, like 92 and 94, and the elements 80 β # π 立立, for the purpose of supporting the contact substrate and correction The substrate, while the wafer is supported by the component 80. The parallel relationship of the auxiliary chucks 92, 94. The vacuum through holes 1〇4 are traversed from the respective chuck bodies and protrude through the surfaces 100 and 102. The chamber is thus separated by a separate two g-line and a separate single-acting vacuum valve (not shown), communicating with the vacuum source. Each valve selectively connects or isolates each set of through-holes 04, independent of the component 80. Through hole 8 4 'to be independent of the wafer or other test element' = selectively holding or releasing the contact substrate or the correction substrate on each surface 1〇〇 and 1〇2. The plate 1〇6, from the edge of the element 83, surrounds the other elements 81 and the auxiliary chucks 92, 94. & 头 t head assembly elements 8〇, 81, 83, and the additional chuck assembly elements ji ί ϊ Ϊ The gas is absolutely the same as the edge, even if it is composed of a conductive metal, and it is said that the gold-like dielectric connection is shown in Figures 3 and 3A. In fact, in addition to the elastic stitching circle 88, there are also a dielectric spacer 85 and a dielectric washer 86, which can be added with the fact that the screw 96 is penetrated by the screws and the two have a large size. The hole prevents the nail stem and the underlying element from passing through only the contact to provide the required insulation. As can be seen from Fig. 3, the dielectric spacer 85 ^ τ 2 is connected to a small portion of the opposite surface area of the collet assembly component. Leaving the air gap between the opposite surfaces of most of the area. So air

Page 8 1306053 V. INSTRUCTIONS (6) The gap minimizes the dielectric constants in the space between the components of each collet assembly, thus correspondingly reducing the capacitance between them and the ability of current to leak from one component to another. Preferably, the spacer 85 and the gasket 86 are each constructed of a material having the lowest dielectric constant that is consistent with the dimensional stability and the volumetric resistance of the height.

to make. A suitable material for the spacers and gaskets is glass epoxy, or a shrinkage. DuPont manufactures and sells the Delrin trademark. Fine aldehyde I, see Figures 6 and 7 'The collet assembly 20 also includes a pair of detachable electrical connector assemblies 108 and 110' each having at least two electrically conductive connecting elements 108a, 108b and 11a, respectively The il〇b 'electrically insulated' connector elements ^1〇8b and n〇b are preferably coaxially surrounding the connector elements 1083 and 108b for protection. If desired, the connector assemblies 108 and 110 can be three-coordinated to enclose the outer shield 108 c, ll 〇 c around each connector element 1 〇 81) and u 〇 b, as indicated by =. The outer shields 10 8c and 110c can be connected to the cool head assembly element two phases 2 through the shutter support (10) frame 113 if necessary: the power can be connected at random, especially in view of the enclosed EMI shielding container 42, 44' .下 Next 4丨's connector elements 1〇8^11〇a are connected and connected to the connector J. The detachment is connected to the curved edge of the collet assembly member 80. / The second unloading connection to the component 8 is free of the connector element ΎΠ: the shaped opening 112a, and the box 112 is also insulated from the rectangular shape of the component 83. A fixing screw such as 11 8 connector elements is used, and is connected to each of the connector boards m and 116. The parts are detachable and freely fixed, regardless of the coaxial axis or the three-axis lanyards 118 and 12 () as shown, forming a detachable

1306053 V. INSTRUCTIONS (7) In addition to the electrical connector assemblies 108 and 1丨〇, as with their three-axis detachable connectors 122 and 124, the lower portion 44 of the container is controlled through the environment, so the three-axis connector 122, 124 outside the shield is connected to the container. Alternatively, the triaxial cables 122a, 124a may be detachably coupled to the connectors 122 and 124 by suitable testing equipment such as a Hewlett-Packard 4142B modular DC source/monitor or an HP 4284A precision LCR instrument, depending on the application. If the cables 118 and 120 are only coaxial cables or other types of cables having only two conductors, a conductor connects the (signal) connector elements of each connector 122 or 124 to the respective connector elements 10a or 11a. Connecting 'and another conductor connects the intermediate (protective) connector elements of each connector 122 or 124 to each connector element 1〇8b, n〇b

U.S. Patent No. 5,5,32,609 discloses probe stations and collets, which are incorporated herein by reference. There is a corresponding collet assembly member having a corresponding spacer 20, which can be provided on the upper surface of the first and second collet assemblies 20 by the three 88 and the surrounding metal screw two and the third collet. The power between the components will be tired during the test. 8 5 thinner clips are available for wafer inspection.

The upright through hole 8 4 and the collet which separates the chamber by the ring 8 8 selectively generate a vacuum in different zones. A dielectric spacer 85 comprising three ring driving pins 96 secures the adjacent first, driving elements 80, 81, 83 together. The concentric ring 8 head assembly is extruded to help distribute the force across the surface to maintain a flat surface. However, the ring and the dielectric constant are larger than the ambient air caused by the leakage. In addition, the additional material between ^0, 8 1 and 8 3 reduces the adjacent chuck capacity. Furthermore, the dielectric charge of the dielectric material of the ring and the dielectric spacer 85 increases the absorption of the medium. The ring and dielectric spacers provide mechanical stability to prevent warpage of the collet, 颂 assembly elements 80, 81, 83. When the first, second, |

1306053 V. INSTRUCTIONS (8) When the three collet assembly members 80, 81, 83 are fixed together, the heights of the different rings and the dielectric spacer 85 have a slightly different tendency, causing unevenness of the upper surface. The present inventors have considered the existing roll-out chuck step' and determined that when the chuck step extends at least partially outside, it is easier to position the wafer on the roll-out chuck, plus crystal The round is relative to the desired zero guide of the collet. Unfortunately, the collet is heated or cold, such as up to 300. (: or far below the ambient temperature, placing the wafer at ambient temperature on the chuck has a tendency to damage the components on the wafer or cause cracking of the wafer itself. In either case, the wafer is easy Damaged. In some cases, the user can hold the wafer on the wafer holder near the chuck. The straight wafer is fully heated' but the user is too difficult to complete at the same time. In addition, it is difficult to achieve the use of crystal like this temperature. The round seat 'because of the insulation effect of the wafer holder and the distance between the wafer and the surface of the chuck. The user's tendency to accidentally touch the surface of the chuck' causes pain or burns to the hand. In addition, even around In the case of a temperature chuck, the wafer is typically placed on the upper surface of the chuck using a motion that is at an acute angle to the upper surface of the chuck. Therefore, the wafer has a tendency to slide over the surface of the chuck and is placed in an unnecessary place. If you leave it on the collet, see Figure 8. The roll-out consists of a step that moves relative to the chamber. The step is preferably present at least in the chamber while the x, y, and z positioners remain indoors. The inventor implemented A set of movable pins 200 are added to the roll-out collet 210, which is generally referred to as a lift pin'. (1) The wafer is placed on the lift pin 200 to simplify the positioning of the wafer on the chuck, and (2) The user's hand accidentally touches the chuck surface 212 and is easily injured' (3) enables the wafer to remain in the clip

Page 11 1306053 V. INSTRUCTIONS (9) Above the head position, the temperature of the wafer can be adjusted closer to the temperature of the chuck surface, and/or (4) the wafer is easily slipped out of position. The lifting pin 2 〇 〇 设 内 210 210 210 210 ’ 可 可 可 可 可 可 可 可 210 210 210 210 210 210 210 210 210 210 210 210 210 210 210 In addition, the lifting pin can remain stationary while the head surface can be raised and lowered. In any event, the upper surface 2 1 2 of the lift lock 200 and the lost head 21〇 includes an upright movement relative to each other, and the maximum distance between the lift pin top and the upper jaw of the collet is approximately. .25 is better. One technique for combining lift pins between the upper surfaces of the head is to use a motor, such as a stepper motor, to lift the pins. The stepper motor can be controlled by software or otherwise indicated by the user that the lift pin needs to be lifted and lowered. Another option in conjunction with the lift pin is to use the pneumatic system 'with software control' or by the user to indicate that the lift pin needs to be lifted. Another technique for providing more strategic feedback to the user is to use a mechanically coupled system controlled by the user. Referring to Fig. 9, the mechanical coupling system includes a handle 250 connected to the lever 2 52, rotated about the pivot point 254 (rotational twist), two 1 (four) (degree U diagram (rotation 12 degrees) and 12 (rotation) The lifting pin 2〇0 extends completely above the upper surface of the chuck. On the 200: Figure 12 shows that the wafer is properly positioned on the upper surface of the lifting pin nw. The surface is not at ambient temperature. It is not easy to use: Ϊ 2 ί, i again, Since the wafer is separated from the upper surface of the lost head, it can be slowly or coldly cooled, and the components on the wafer can be easily damaged or damaged, or the wafer itself can be "all": When the crucible is fully extended or not fully retracted, the chuck 21〇 And related = Τ can shrink or move to the appropriate detection position. When the lift pin falls to substantially equal to the upper surface of the chuck

1306053 V. INSTRUCTIONS (10) _______ The lifting pin has been fully contracted. In the case where the wafer rises to a contraction of the lift pin, when the lift pin is extended, or when the lift pin is not fully extended, it is obtained. When the lifting pin is not fully contracted and the step is contracted indoors, the 曰i I step is contracted indoors, and the handle of the lifting mechanism can be accidentally touched from the first 12th. At 12 degrees, the 30-degree movement around the 25 point 25 is shown in Figure 11 (see Fig. 2). Upon full contraction, the vacuum from the vacuum switch 210 in the upper surface 212 of the head 210 is supplied to the result, and the plate 256 is partially inserted into the display). Is the lever M2 turned into a vacuum to the true surface of the chuck? 2 6 This 0 Γ see /; 1 picture), when the time, lift the lock 20. It should be partially contracted. Open two. , this extra-sales sales =, 〇rn ^ ^ Tian Ran's part of the sales of 200 to make the film so that the wafer is lowered to the upper surface of the cool head, " to the true "reduction of the handle 250 ΐ ΐ lever handle 250 to 6 When the lifting pin 2 0 0 continues to contract, =,, no, causing the roll-out interlock 258 (locking mechanism) to be disengaged. This is the whole surface of the chuck, such as when moving indoors, it is not easy to punch ^ Detecting, when the lifting pin is fully contracted or the wafer is supported by the upper surface of the chuck, the locking can also be released. Also, the locking mechanism is released, and when the lifting of the wafer is maintained above the upper surface of the chuck, the chuck is allowed to be received indoors. The wafer and the upper surface of the chuck can substantially reach the desired operating temperature. When the handle of the rotation_lift mechanism reaches 0 degrees to continue the contraction of the lift pin, as shown in Fig. 9, the wafer is supported by the upper surface of the chuck. The lift pin is typically slightly 'slightly recessed below the upper surface of the chuck' or substantially opposite the upper surface of the chuck

Page 13 1306053

level. The wafer has not arrived with the class i source. Before, or at the same time, the combination of the vacuum on the top surface of the TIII, combined with the vacuum T / war, the Japanese yen is easy to slip, and the upper surface of the chuck is presented on the upper surface for subsequent detection. When the handle is locked, it cannot move. Reduce the handle to move inadvertently, or empty to the upper surface of the chuck. Otherwise, the drive pin can be shrunk indoors through the wafer chuck. The wafer chuck shrinks indoors or does not fully extend the handle and lift pin mechanism. Therefore, the lift pin will press the wafer, and the real user has The handle itself may be inadvertently moved, thus damaging part of the wafer. When the collet is fully contracted or not fully extended, such as indoors,

The locking of the lifting system is combined, and when the collet is fully extended or at a certain point where it is not fully recovered for detection, the lifting pin mechanism is disengaged. When Ϊ 升 upsells the wafer. Also, when the collet is completely shrunk = the wafer is easily lifted off the upper surface of the chuck to enter the probe, and the movement is reduced, and the wafer is supported by the lifting pin, so that the lifting pin is caused to slide indoors during the movement of the clip. Take off. π When the collet is fully extended or moved from its detection position, the lifting mechanism is disengaged. Referring back to Figure 9, the handle 25〇 can be moved to the lift 200 lift. When the handle 250 is moved, the motion locking mechanism 258 is moved to lock the position in steps, as shown in Fig. 10.

Full rotation of the handle 250 and lever 252 will cause the plate 256 to contract from the vacuum switch 260, closing the vacuum to the upper surface of the collet, as shown in FIG. The handle 250 and the lever 252 disengage the mechanical movement of the vacuum switch 260, $

1306053 V. INSTRUCTIONS (12) Facilitate wafer lifting from the upper surface of the chuck. At, a + facilitates the lifting of the pin 20. Lifting the wafer when the B-ring fixing mechanism is released 'More handles ί t i t: The upper surface is detached. Between the upper surface of the chuck and the wafer: ‘Impair the wafer lift. In order to release the remaining vacuum suction, it is ensured that a limited amount of air is provided to the lower surface of the Japanese yen to provide additional air pressure to the collet via the line' but can be provided via different openings. Air pressure can be provided using a vacuum source. Preferably, the air used by the cylinder 272 used to lift the lift pin through line 264 provides air pressure which is caused by the movement of the lever 2 52. In this manner, the movement of the handle 25 and the lever 252 can be air pressure to help release the wafer from the upper surface of the collet. Therefore, the 'air pressure will be supplied to the upper surface of the chuck in a timely manner, regardless of the speed at which the user moves the lever 252. One or more of the locking features, as well as the vacuum characteristics, can be omitted or in a different order. As previously described, the handle 2 50 motion causes the vacuum pressure to the wafer to be closed before the lift pin 2〇0 rises above the upper surface of the chuck. As shown in Fig. 9_12, when the lever 252 is moved, the pin 270 is moved inward, causing the air cylinder 272 to move outside. Referring to Fig. 13 (lever in twist), movement of cylinder 272 causes a reduction in the area between piston 278 and the end of cylinder 272. Referring to Figure 14, the piston 278 has a tendency to move the drive plate 280 outward due to the increase in air pressure within the cylinder. The drive plate 280 is coupled to the lift plate 282 using a resilient mechanism, i.e., a spring 284. When the drive plate 280 is moved, the lift plate 282 is also moved by the force applied by the spring 284. As a result of the movement of the lift plate 282, the bearing 286 of the lift pin assembly 284 is raised and moved up the ramp 288. It can be seen that if the wafer is sucked by the residual vacuum onto the upper surface of the chuck, the lift pin assembly 284

Page 15 1306053 V. Description of the invention (13) will reduce its movement, otherwise it will be inhibited by the elastic movement of the spring 284. It should be noted that during movement of cylinder 272, air is routed through air line 264 to the upper surface of the collet to reduce residual vacuum. This coupling system adds several advantages. One is that the lift pin assembly 284 is not directly coupled to the lever 252, so the force applied does not cause the lift pin 200 to break the wafer. Another advantage is the provision of an elastic mechanism to inhibit the ability of the lift pin 2 to break the wafer. Yet another advantage is that the lifting pin assembly 284 is inhibited from being lifted by the lift pins due to the action of the spring 284. Therefore, the rise speed of the lift pin is not directly related to the speed of movement of the lever 252. Referring to Fig. 15, the residual vacuum, once transmitted between the wafer and the upper surface of the chuck, exerts a tendency to push the lift plate assembly 282 upward, thereby raising the wafer onto the lift pin 200. As the lever 252 is fully rotated, the drive plate 280 is static and the piston 278 moves within the cylinder 272, i.e., draws in air. When the piston moves inward, the collet valve assembly allows air to pass from the cylinder through the vacuum valve, and when the piston is pulled out, the supplemental air is supplied through the needle valve. Once the suction between the wafer and the collet breaks, the lifting plate of the pin can be controlled until its stop against the drive plate. The spring pulls the visible chuck to best extend the portion that supports the wafer, while the step that provides the χ, y, z motion does not extend. In one embodiment, a set of one or more outer pins, other members, may be from a portion of the upper surface of the upper surface of the collet, up = two to above the upper surface of the head. The external pin resists the wafer and does not accidentally slide out of the clip. When it is extended, the outer pin extends to the height of the lift pin 2〇〇. "In addition, the outer pin preferably rises before the lift pin rises and is lifted 2 pin: Z t ί Τ:. t & 'External pin suppresses the possibility of the wafer slipping off the lift pin or slipping off the upper surface of the chuck. π

Page 16 1306053 ---- V. Description of the invention (14) ---- The potential is in the same potential or floating electric f liter f with the 'lifting pin can be connected to the upper surface of the head, can be connected to the shielding potential, protection potential , the earth, so the wafer Ϊ: Ϊ ί 升 升 can also contain holes 8, selective vacuum supply, can provide sales. Any function of the lift pin assembly is 2*2 clamp temperature, which is at approximately -65 °C and 300. . Change between ice crystals. For f? cold f 2 'when the test wafer may form air to contact f soil hail 9, to (1) maintain indoor air dew point to avoid below the production temperature; (2) cause low-speed air to cross the probe ^ send a small amount Heat, so as not to cause significant temperature changes (; 3 = only the surface of the chuck is supplied to the chamber to avoid uneven temperature changes; the head is sent to the air in a uniform manner to facilitate the transition from different temperatures at different temperatures. Time; and / or (6) in the rapid transfer of a small amount of volume between the micro-chamber wall, the outside of the micro-outdoor side "sweat", and avoid the heat situation to avoid cold disaster. The chamber contains one or more air inlets, such as and/or D, and contains a top cover and/or an inlet to one or more air boundary pages. Typically, the chamber contains a series of ' For example, the air flows out. The system preferably contains 75%, more preferably 9%, by defining the outlet = leak diameter. Thus, the air passing through the chamber is controlled by the air. Therefore, different probe stations A slight amount of inter-structure can be more punctual 5 'About the resulting space 1306053 V. Description of the invention (15) Above the chuck itself, such as in the top cover, there is a mouth close to each of the upper chambers. The main designated air outlet is preferably in the center of the side wall of the chamber. District, size about 1. 5 pay X 4. 5 pairs.

Referring to Figure 16, the air input above the collet is specifically designated for low velocity, substantially laminar flow, and radial split speed to introduce air through the plate insert. The insert may contain a pair of plates and a baffle plate that substantially distributes the air evenly over the plate insert. For example, air can enter through three, four, five, six, or more openings. The purpose is to provide air smoothly through the opening in the plate to the chuck, where the radial direction is smoothly distributed on the chuck. Another function of introducing air is the cover that involves air leakage through the detection station. Under cold operating conditions, the chuck should produce a slight pumping effect from the heavier cold air flowing out of the edge of the collet. This air flow creates a slight vacuum in the center of the collet, which tends to draw air through the top cover. Guided air above the collet helps ensure that the pressure inside the cap is always positive relative to the outside pressure. It has been determined that the air flow at 8-12 cfm (0.13-0.2 cfm) is sufficient to reduce leakage from the top cover and provide radial flow across the collet, with a connection rate of several millimeters per second at the outer edge.

Although only one opening can be provided between indoors and outdoors, such openings are second to best when producing low flow and low noise measurements. Referring to Figure 17, the more suitable port to the chamber contains a diffuser containing a plate of porous sintered stainless steel (such as a 5 micron aperture) sandwiched within the frame. The air pressure is preferably connected to the base (shown on the right) and passed into the plenum behind the porous plate before being substantially evenly distributed through the porous sheet. The air outlet of the chamber may contain an exhaust port. The vents contain a plurality of uniform spiral air passages that overlap each other. The purpose of the air passage is to provide low

Page 18 1306053 V. INSTRUCTIONS (16) The pressure drop laminar flow path reduces the passage of light and low frequency electromagnetic waves. This means that there is no straight road, passing through the air outlet from indoors to outdoors. The visible chamber contains air introduced into the wafer above the chamber, with a substantially sealed chamber plus a controlled drain. However, when the collet is generally centered under the plate opening, the air introduced from the top cover onto the wafer works well. However, when the collet is fully moved to the side with respect to the opening for the top cover, the air flow will be sufficiently uneven, because some of the air will not impact the collet, but will go straight down (or slightly). indoor. Referring to Fig. 18, when the collet is moved laterally relative to the inner opening of the top cover, in order to make the air flow evenly across the collet, at least a portion of the collet may contain a baffle member, preferably in the collet. Along the majority of the week, 7 5 %, 95 % or 100%. The baffle member has a tendency to act as a collet extension, preferably with a sufficient width, so that the baffle remains underneath all of the openings provided by the plate when the collet is probed at any particular edge. For example, the width of the baffle plate can be the same as the opening of the plate. In addition, there may be openings around most of the collets between the collet and the baffle to provide electrical insulation and openings for air to flow through the edges of the collet.

Page 19 1306053 I-Simple Description __ Figure 1 is a front view of a wafer according to the present invention; a portion of a specific example of the station is shown in Figure 2; Figure 2A is a top view of the wafer probe station; The i-th wafer is opened; the 〃patch diagram, the closed gate half 3 is the part of the wafer probing station in Fig. 1 , the _ surface and the part of the front safari 3A is the 3rd picture along the 3A_3A Line enlargement Figure 4 is a top view of the seal assembly, wherein the figure; extends through the bottom of the seal;

J = is the enlarged top view of the first line · Fig. 1 is an enlarged plan sectional view of the first line of the 56_5 line; • Fig. 3 is a detailed plan view of the chuck assembly along line 6 - 6; Figure 7 is a partial cross-sectional front view of the collet assembly of Figure 6; Figure 8 shows the probing station's collet containing steps, with lifting pins, without X, y, z positioners, can be moved; The figure shows that the lifting pin handle of the collet is at 0 degrees; the figure 10 shows that the lifting pin handle of the collet is at 6 degrees; the eleventh figure shows that the lifting pin handle of the collet is at 12 degrees;

Figure 12 shows the lift pin handle of the collet at 3 degrees; Figure 13 shows the side view of the chuck when the lift pin is retracted; Figure 14 shows the side view of the clamp before the lift pin is lifted; Figure 15 shows the lift Side view of the chuck when the pin is raised;

Page 20 1306053

Page 21

Claims (1)

Office"月i师(3⁄4雄) 1306053 Case No. 92136941 VI. Patent Application Range 1. A detection station, including: the assembly is contained; the surface 'is suitable for supporting the wafer chuck assembly on the circumference of the π 丄忐 3 1 , suitable for 匕 relative In the upright movement, the chuck holding the wafer is not moved by the position of the upper surface of the lost head in the room. The detection station 'where the chamber is substantially (a) the chamber at least partially holds the collet (b) the collet assembly has the above table (c) a plurality of lift pins located at the support wafer; (d) the lift pin And the upper surface is such that the lifting pin protrudes from the upper surface and the wafer is supported; (e) the chuck assembly can be completely at least partially in the outdoor surface 2 as in claim 1 Airtight. 3. The probe station of claim 3, wherein the collet comprises a thermal unit that raises the temperature of the upper surface to above ambient temperature. m 4 . The probe station of claim 1, wherein the lost head comprises a thermal unit that reduces the temperature of the upper surface to below the ambient temperature. 5. A probe station as claimed in claim 1 wherein the upper surface is substantially flat. 6. The probe station of claim 1, wherein the plurality of lift pins are substantially evenly spaced around the collet. 7. For the detection station of claim 1 of the patent scope, the plurality of lifting pins are selectively lifted. 8 · If you are applying for the probe station in item 1 of the patent scope, the plural number is raised. 2008.12.11. 022 13〇6〇53 丄___SS__92136941____^ VI. The patent application scope lock can be maintained at the height above the upper surface. 9. If the probe station of the patent application scope 1 can respond to the user Move the handle and move. 10. A lost head assembly comprising: (a) the collet assembly circle; (b) a plurality of lifting pins, wherein the plurality of lifting has an upper surface, and the supporting crystal is located on the periphery of the collet assembly Suitable for supporting the wafer; hunting c) the lifting pin and the upper surface can be moved upright relative to each other, wherein the lifting pin protrudes from the upper surface of the chuck supporting the wafer thereon, the wafer does not need At the same time, the upper surface of the collet is supported; (d) when the plurality of lift pins are fully extended, the collet assembly is restrained 'no side movement. 11. The collet assembly of claim 3, wherein the side movement is unrepressed when the plurality of lift pins are fully retracted. 1 2. The collet assembly of claim 1, wherein the side movement is not inhibited when the plurality of lift pins are not fully extended. 1 3. The collet assembly of claim 1, wherein the vacuum is supplied to the upper surface of the collet when the lift pin contracts. 1 . The chuck assembly of claim 1 , wherein when the lift pin does not protrude above the upper surface of the chuck, a vacuum is supplied to the upper surface of the chuck and the lift pin is used by the user. As a result of the lifting, the vacuum is lowered before the lifting pin extends above the upper surface of the collet. Page 23 2008.12.11. 023 1306053 __Case No. 9213694] VI. Patent Application 1 5. A type of chuck assembly, comprising: (a) The chuck assembly having an upper surface suitable for supporting thereon a wafer (b) a plurality of lift pins located at a periphery of the chuck assembly for supporting the wafer; (c) the lift pin and the upper surface are movable upright relative to each other by the lift pin from above The upper surface of the chuck supporting the wafer protrudes, the wafer need not be supported by the upper surface of the chuck at the same time; (d) reducing the result of the extension of the plurality of lifting pins, increasing the vacuum supplied to the upper surface, and the plurality of lifting The pin is not substantially flush with the upper surface. 16. The collet assembly of claim 5, wherein the reduction is from the full extension of the plurality of lift pins to the point where the plurality of lift pins are substantially flush with the upper surface. 1 7. The collet assembly of claim 5, wherein when the plurality of lift pins are fully extended, no vacuum is provided. 1 8. A collet assembly comprising: (a) the collet assembly having an upper surface adapted to support a wafer thereon; (b) a plurality of lift locks located at a periphery of the collet assembly adapted to Supporting the wafer, (c) the lift pin and the upper surface are movable upright relative to each other in a manner that the lift pin supports the wafer from above Page 24 2008.12.11.024 1306053 Case No. 92136941 牟α修jE·_ ------------- --------i---------- _ Six The surface of the patent application is extended. The wafer does not need to be supported by the upper surface of the chuck at the same time; (d) when the plurality of lifting pins are at the first height above the upper surface, the chuck assembly is inhibited. It is not possible to move sideways, and is not inhibited when the plurality of lift pins are at a first degree above the upper surface, wherein the first height is higher than the second height. 1 9. A collet assembly comprising: (a) the collet assembly having an upper surface adapted to support a wafer thereon; (b) a plurality of lift pins 'located around the collet assembly for supporting The wafer, (c) the lift pin and the upper surface are movable upright relative to each other in such a manner that the lift pin protrudes from the upper surface of the chuck supporting the wafer thereon, and the wafer does not need to be simultaneously The upper surface of the head is supported; (d) when the collet assembly is in a position suitable for detecting the wafer, the collet is inhibited such that the lift pin does not move relative to the position above the upper surface. Page 25 2008.12.11,025