TWI305658B - Semiconductor wafer cleaning system - Google Patents

Description

1305658 IX. Description of the Invention: [Technical Field] The present invention relates to a semiconductor wafer cleaning system. More specifically, the present invention relates to a semiconductor wafer cleaning system in which a wafer having a polished surface is individually cleaned and rinsed in each independently disposed cleaning station. The waiting time for round feeds to each cleaning station is minimized 'and thus' improves overall wafer productivity by addressing the resolution of a delay in the wafer process. [Prior Art] In general, a semiconductor wafer process consists of two steps: one is to polish the surface of a wafer by using, for example, a chemical mechanical polishing machine (CMP machine); and the other is to clean the wafer. The purpose is to remove particles generated when polishing the surface of the wafer. The application's wafer cleaning steps of various semiconductor cleaning systems known in the art are performed in a variety of ways. Typically, a wafer cleaning step includes: at a cleaning station, cleaning a particular chemical onto the surface of the wafer. Reusing pure water (ie, deionized, rain) to rinse the wafer surface. 'After the transfer station is cleaned, the wafer is repeatedly sprayed off 'washing and rinsing ^ dry times; finally, after the wafer is inserted into the p drying station' the wafer is dried. That is to say, in the 纟_ workstation, the washing step is performed with chemicals and the rinsing step with deionized water, respectively. Therefore, due to the fact that in the conventional semiconductor wafer cleaning system, the monthly washing and rinsing procedures are carried out in the same-cleaning system, and the single workstation performs such a procedure very (four) m, this washing and rushing 6 1305658 must be repeated several times in subsequent workstations, which adds more time to the cost while causing a delay in time, so the polished wafer on the polishing module platform must wait before entering the cleaning system, thus causing The backwardness of the entire process, due to the inability to keep the overall process flowing smoothly, has caused a decline in wafer productivity. That is to say, when two or more chemicals are used in a cleaning station for the monthly washing process, in order to avoid the pH shock caused by the difference in chemical composition between the respective cleaning procedures due to the type of the chemical, Neutralized rushing_washing #王序疋 necessary. For this purpose, a pair of cleaning brushes made of a wet sponge are used, and each cleaning brush is separately disposed on both sides of the wafer to brush the wafer in a twisting manner. Because, through each brush shaft, the chemicals used for cleaning and the deionized water used for rinsing are alternately and repeatedly provided, in the initial stage of the change of the cleaning procedure in which different chemicals are supplied, 3 Deionized water in one of the brushes does not properly maintain the concentration of different chemicals for a specific period of time, so the effect of cleaning is reduced by one. Therefore, a longer cleaning time is required in order to perform a normal cleaning procedure, which will result in reduced productivity. Moreover, in the cleaning system of the prior art, a specific preliminary cleaning procedure is not performed, and the highly contaminated wafer caused by the polishing procedure is immediately sent directly to the cleaning station, passes through the above brush, and is immediately cleaned, so The degree of contamination of the brush is increased and the cleaning ability is reduced. In addition, the brushes are shortened during their use and, therefore, need to be replaced frequently, which causes inconvenience in the maintenance of a CMP machine and increases the operating cost. 〃 7 1305658 In addition, after several cleaning and rinsing procedures are completed via separate cleaning stations, 'by high-speed rotation, the wafer is dried in a drying station, and the gripping structure for gripping and rotating the wafer is four At the same time, it consists of a radially operated gripping finger. When a flat wafer is inserted into a cleaning station with the flat position of the wafer not fully aligned, the gripping conditions of the respective gripping fingers are unevenly uniform, so that the high-speed rotation is performed. The wafer is very susceptible to damage and downtime. Therefore, the wafer alignment procedure is necessary, but the time required for alignment will cause delays in the overall process, which in turn will additionally reduce wafer productivity. However, the semiconductor cleaning system of the prior art has a magical structure in which the respective cleaning, rinsing, and drying stations are arranged in a column, so that a large space is required to set and apply the cleaning of the prior art. system. SUMMARY OF THE INVENTION The purpose of the present invention is to solve the problems caused by the prior art, and to provide a semiconductor wafer cleaning system that does not have the overall process delay phenomenon of the wafer and has the advantages of improved wafer fabrication. The waiting time for wafers to enter each cleaning station is minimized by performing separate cleaning and brushing procedures on the wafer. Another object of the present invention is to provide a semiconductor wafer cleaning system with improved wafer productivity by separating the chemical and deionized water supply structures to improve cleaning and shortening the need for cleaning. Another object of the present invention is to provide a semi-conductive 1305658 wafer cleaning system with a maximum cleaning power and a minimum brush loss by brushing the polished highly contaminated wafer to a certain level of main cleaning procedure. Nine degrees, at the same time, due to the extension of the brush life, there is a cost-effectiveness of the overall process. Another object of the present invention is to provide a semiconductor wafer cleaning system with a wafer, which on the one hand can improve the grip structure of a drying station for spinning a wafer. Regardless of the wafer wheeling side =: ::: holding the uniform grip state even when the wafer is rotating at a high speed, in the interest of knowing the knowledge, the realization of a stable straightening..., raw HU circle The type of stable structure, which is used to produce the individual alignment of the wafers, and shorten the time required for the overall process. Another object of the present invention is to provide a kind of squeezing, "simplification and reduction of the structural configuration for cleaning, m-female mother-station workstation, and And the ancient ra coffee cleaning system. The dry conductor Japanese yen cleans the above purpose, according to the invention, the semiconductor wafer main: square, day 0, pre-clear most of the particles on the wafer; a first two stations 2 for cleaning the remaining particles, the first washing station by frictionally rotating a pair of brushes configured to be in contact with the front surface of the wafer: the rear surface and the chemical sprayer independently disposed via _ It is used to spray the cleaning liquid on the surface of the Japanese yen on the first day of the first light to perform the rinsing process, and the structure and method of the same The chemical was sprayed on a separate set of chemical sigma squirts at 9 1305658

The first flushing station has been rinsed with the surface of the wafer by the first-oil method, the main, the soil-A-man, so that the second cleaning remains on the surface of the wafer $# main 1 ^ Μ ± 圚a particle on the surface; a second rinsing station for spraying the cleaning liquid _ _ _ 隹 隹 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一The rinsing program, and, a drying station, which rotates the wafer which has been washed at the first, the, and the soil, is used to rotate the residual cleaning liquid by the centrifugal force generated. Here, 'the county where the car is good. ・ Poor 0. The first washing station further includes a steering and conveying device, which is used to compare the wafers that have been cleaned for the first time by 兮 笛 笛 + Α In the direction of entering the first flushing station, the change of the temperature of the acne T 90 is changed, and the wafer that has been cleaned for the first time is changed to the direction of the next course, and the direction of the movement of the person is the first time. The cleaned wafer is fed into the next program. Moreover, preferably, if the steering and conveying device comprises: a lifting and lowering plate, which is vertically disposed, and is raised by a specific linear motion 4 and the lower yak's plurality of roller carriers, They are vertically fixed to a side wall of the ascending and descending plates in a manner that the fixed gaps are parallel to each other, and are installed between the conveyor belts for opening and uninterrupted between the roller carriage and the conveyor belt. In the case of the previous procedure, the 哕S, 1 search for the 亥 日 ®, and the plurality of steering buckle transfer rollers are supported in a manner that is supported by the one-piece type, that is, the steering and the transfer The knife's ground & is placed on the inside of the roller carriage' to make the steering and transport rollers: Both ends can roll on one side of the rise and fall plates and roll ^. In addition, it is preferred that if the preliminary cleaning station comprises:

Grip and rotating device; and, - deionized water spray m | f, which is set above ^ 'main role is to remove large particles by - K ] 0 1305658 = sprinkle when feeding high pressure deionized water Wherein, the wafer grip includes a support plate in which an upper and a lower guide track are along with one force and a force, and a rising and falling flat and a rising and falling guide are performed. Guide. In order to be guided by the ascending and descending v-guide track; a pressure cylinder, the 〃 〃 芏 芏 和 和 和 和 和 和 , δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ δ And, a plurality of guide rollers, which are equal in circle, and when the slave is loaded or released, the guide rollers will lower the plate and rise and knee/extension. The wheel raises and lowers and lowers the leader so as not to interfere with the wafer. In addition, it is preferred that if a lifetime includes: a pair of brushes; and a "the second washing station and the second cleaning station pair of brushes, which are washed by the wafer and the wafer, the stupid brushworker The contact between the two sides of the clothes is clear, and the system relies on the material of the wet sponge made by the wet sponge. The flow is supplied with deionized water when the brush is not actuated. - The water is called the two sides of the wafer. When the side surface is sprayed, the sprinkler is on the mouth of the sapphire chemical. ° The sputum is passed and the other is '##, w ^ Also, if the drying station includes the ^ ^ axis, the axial extension, 匕栝.—The center rotates and is rotated by the center of the rotating shaft of the driving device that is rotated by the power transmitted by the mAh. The gj, . The top m of the central rotating shaft is specific to the radial direction. The 卩, 刼, rod, ^, at the same distance and can be cut along the slit μ ~ through five incisions; the way the finger Μ * is set ' #备由〃 '# 'It's equal to vertical, t gold key Le 'mother one finger-shaped county style with each operating rod ~ With a rotatable u 吏 when each lever moves 1,305,658 second:: cantilever can be combined with each lever; grasping fingers The finger has a groove that can be sleeved - the edge of the wafer ^ is connected between a top two fingers of the finger (four) wire; and, - in the connecting element Central pin, tow station, connecting plate for supporting the crystal® and acting as a movement. 'To perform an opposite pendulum between the finger cantilever and the gripping finger 1 The advantageous effect of the invention is in accordance with the invention The semiconductor wafer cleaning system has the following advantages: by separating and arranging the ... the surface throwing circle U and the rinsing process in the washing station and the rinsing station, so that the wafers enter each The waiting time of the cleaning station is reduced, thereby solving the delay of the overall process of wafer manufacturing, and significantly improving the productivity of the wafer. Another advantage of the present invention is that by chemical and deionization Separation of the water supply structure, so that cleaning benefits are improved ^ by each The shortening of the cleaning time of the station has improved the productivity of the wafer. That is to say, the supply of chemicals and the separation of the U.S. water to the U λ z_l tjj. Two separate program structures for the supply of deionized water by the brush, so that when the cleaning station uses more than two chemical cleaning procedures, there is no longer any chemical impact caused by different components between different chemicals. By maintaining the precise concentration of the chemical, it is possible to optimize the cleaning action, so that the productivity of the wafer is improved by the shortening of the cleaning time. 0 22 1305658 The semiconductor wafer cleaning system according to the present invention can simultaneously By the table, the cleaning procedure performed by the brush is in the following state: before the brush performs a main cleaning procedure, a preliminary method capable of performing the preliminary/monthly washing procedure, and the first step, the month/first station is provided. The main circle with high pollution after the completion of the polishing process: the degree of the second set, by minimizing the degree of contamination of the brush, "b will be enlarged, due to staying in the semiconductor crystal Among washing system time is prolonged, because this Lang 4 μ # □ ABC, deep system maintenance advantages. In addition, according to the present invention, the wafer gripping structure is improved into a five-claw type 蟪, which can complete the stabilizing structure, and does not: the yen = the direction of the person, can be maintained - fixed The grip state, when #圆,ππ% turns, there is no longer any damage phenomenon, at the same time, no: why the round shape is 'example' "flat area type or incision type, all month "Complete to - stable structure, because & no longer need to perform - individual wafer alignment actions, shortening the time required by the overall process, so that the productivity of the wafer is improved. According to the present invention' By washing, rinsing, and drying the stations, the m-direction and the transfer device 'by cleaning, rinsing, and drying the stations - improving to an L-shaped configuration', the present invention is minimized due to the minimization of the supply space The maximum space utilization benefit of the overall unit is achieved. [Embodiment] Hereinafter, several preferred embodiments of the semiconductor wafer cleaning system according to the present invention will be described in detail by reference to the accompanying drawings.

The drawings C1 through 11 are for illustrating a legend of semiconductor wafer cleaning in accordance with the present invention. More specifically, FIG. 1 is related to the configuration of the respective parts of the semiconductor wafer cleaning system c, which are connected to the same plane, for example, in accordance with the present invention. A schematic view of the module P and the wafer receiving module F. Figure 2 is a perspective view of the main structure of a preliminary, raw ice #, λ month wash station 10, which is applied to the deionized water curtain sprayer 1 applied to the system of the moon according to the present invention. 8, to remove the scorpion. Figure 3 is a cross-sectional view of the ΙΙΙ-ΙΠ section line shown in Figure 2, and the ^ ^ ' °J surface view. Figure 4 is a perspective view of the main structure of the first cleaning station 2〇 and the second cleaning station 40 which are applied to the wet scrubbing brush 丄, 十 2 依据 依据 according to the present invention. . Fig. 5 is a vertical sectional view showing the flow structure of deionized water applied to the brush 21 of the first > month washing station 20 and the second washing station 4; Figure 6 #一一, you sigh between the first cleaning station 20 and the second cleaning station 40 for the rinsing procedure after the cleaning procedure of the vanadium vanadium cleaning station 20 and for changing the wafer 1 , ,, a perspective view of the main structure of the first washing station 3 in the direction of the Ai yen. Fig. 7 through Fig. 9 are schematic top and side views, respectively, illustrating the principle of steering and transfer performed by the first cleaning station 30 on the wafer cassette. Fig. 1 is a perspective view showing the main structure of a rinsing station 50 of the _J-th washing station which is followed by a rinsing process by the first cleaning station 40. Fig. 1 is a perspective view showing the main structure of a drying station 60 which is applied to the centrifugal force of the moon. Typically, as shown in Figure 1, one, raw, soil, ±

The monthly washing system (washer module) C is disposed between a polishing module p and a wafer rounding receiving wedge group (device front end module) F for fine polishing of more than 1 m wafers. The CMP machine is set in the polished chess set P, and the wafer technology is used to stack the majority of the wafers 1 and receive them. More than one loading device 3, 14 305658 square, placed in the polishing module P, will transfer (load) the wafer to be polished to each CMp machine = flat 2 or will be polished The wafer cassette is transferred (unloaded) from the platform 2 to the subsequent cleaning system C. - the robot arm 5 is arranged in relation to the loading device 3, the::arm 5 is used to transfer the round 1 to the cleaning system c after the picking of the crystals from the loading device 3 - the preliminary cleaning station (7), or transfer the wafer 1 to the loading device 3 after the wafer 1 is grabbed from the upper stage 4 of the wafer receiving mold F by another mechanical arm (not shown).

The semiconductor wafer cleaning system C according to the present invention comprises: - a preliminary cleaning station 1G, which pre-clears: larger particles on the wafer 1 by deionizing water (four) on the wafer 1; Station 20, which first uses the use of thick rubbing 'rotation - oblique blood am 1 t, the surface of the Japanese yen 1 and the back surface contact: brush 21 ' and then sprays chemicals on the wafer 1 to Cleaning Remaining = Particles... No. - Flushing station 3G, which is used to spray the cleaning liquid on the surface of the wafer that has been cleaned by the first person to perform the operation. The second cleaning station 40, eight uses The same as the first cleaning station, the δ 士 knows the ancient fighting, μ 』, ··. And the method of finely spraying the chemicals on the surface of the surface after the second cleaning of the crystal Ki; a second washing station 50' which sprays the cleaning liquid on the wafer 1 which is first cleaned for a long time. On the surface, 'to perform rinsing; and, 妒 4 4 ^ , , ^ Β 知 知 60, which rotates the wafer 1 that has been washed at a high speed, and the user can produce i% 、, +, raw centrifugal force, dry The remaining cleaning solution. The crystal between the respective workstations according to the present invention by the arrangement of the respective conveyor belts (the wheels of the wheel rim 7 shown in Figures 6 and 10) passing through the partition walls between the respective work sites A circular transfer is performed. As shown in FIG. 2 and FIG. 3, the device capable of: using four guides, the preliminary cleaning station 10 has a work roller 16 for grasping and rotating the wafer 1, and the 15.1305658 for setting the wafer 1 The sputum produced by the 18-year-old water curtain high-pressure deducer (Ear) 18! Benli removes the particles and removes the preliminary cleaning procedure by deionized water. Stubborn... move the larger particles on the deionized water sprinkler (the side of the initial cleaning of the knife) (under the door) "on the side of the soil. For the deionization supplied from the outside 7 i, The hole 1 8a is formed on the side surface away from the high-pressure deionized water from the ...: when the deionized ion water supply hole 18a is supplied, the k-hole is also etched through the long hole-shaped spray hole. Water H /... Money, silk pushed to the wafer 1 , , , , ' 纟, straw with high-pressure water curtain spray, get a great effect of removing particles. In several other embodiments, After the spray is applied to the mouth, 'use the deionized water nozzle _ 丄 8 to perform a rinsing year. Before the preliminary cleaning procedure using deionized water, the reaction is performed 0 by the edge of the wafer 1 The intimate state of the head held in the groove of the guide roller 16 'each guide roller 16 is designed to rotate the crystal ^ ^. When the wafer 2 is fed or sent out of the preliminary cleaning station 1 , the guide roller " Can move up and down with a small width' so that wafer 1 does not interfere with the individual guide rollers 16 It is said that the supporting plate 1 1 having a penetrating hole at an appropriate position is vertically and fixedly disposed on the side of the preliminary cleaning #1〇. In the vertical direction of the Shanghai, a rising and falling guiding rail (1) is integrally formed at: An outer side of the flat 11 ... the rising and falling flat plate 13 is combined with the ascending and descending 3 obstruction m ' along the rising and falling guiding track "a, the rising and falling flat plate 13 can be used for ascending and descending movements. The cylinder 12 is fixed vertically on the bottom of the slab 11 of the slab 11 and the lower end of the raised and lowered slab 13 is integrally connected to the piston rod 12a of the embossing 12 In the pressure cylinder 12, the rising and lowering plate i3 can be fixed to the ascending and descending body through a perforation end by the end of the roller shaft i6a for arranging the respective guide rollers 16 : Plate 13' By this, the rollers 16 have the function of ascending and descending the plate η :: ascending and descending. Here, a top having an opening work is combined for maintenance. The roller axes W are The driven wheel]. Each of the two π is rotatably supported. Rolling correction...above, and designed to be joined by the belt 15b. - The horse is fixed on the rising side and the wide side of the wheel 'the driving sliding surface formed at one end of the shaft of the motor 14 and among the guiding rollers 16 - When the roller-μ grinding l4a of the roller 16 rotates, each of the guide rollers 16 also rotates at the same time. Falling = if the invention is constructed such that when the cylinder 12 is operated, the upper and lower plates 13' of the casing 17 are each The guide roller Μ and the motor 14 rise and fall together. The month includes the 'the first cleaning station 2' is a device, which - the guide roller 23 that rotates the side edge of one of the wafers 1 to the brush 21, will The wafer chemical sprayer 26, by frictionally rotating the brush 21 disposed through the independent, two-contact, and spraying the chemical by one time, the main product, the sprayer 26 is used for First, the main cleaning procedure for washing the remaining particles in the month. Brother 17 '1305658 As shown in Figure 4 and the round ς from the - gp circle, the brush 21 is made of a moist sponge, and also P 'in the porous PVA outside the u, hb mouth r recording surface, forming numerous fine contacts Protrusion 21a. The physical role of the rotating movement of the surface of the B1 ten surface of the day is the brushing effect of the medium-sized particles and the small particles. In addition, the movement is two: the rotation in the fixed direction, so that the wafer 1 has the guide roller 23 , ^ 'and the structure of the Langzi 21 is designed such that the gap between the brushes 1 can be adjusted. In addition, the brush 21 has a hollow cylinder shape, while passing through the _ " middle work part, a brush shaft 22 can be inserted into the brush 21. Although the two sides of the brush surface * are rotatably mounted on the two side walls of the initial cleaning station 10; I, the main channel 22a of the deionized water is formed; the brush shaft At the same time, at the same time, the plurality of holes 22b for the mouth to spray the deionized water are formed by the radial direction of the inner wall of the brush shaft 22, ώ.. έ0 ^ gate is formed, so the deionized water can pass through the bu_ channel 2 2 a The virgin η is sprayed toward the brush 21 and through the hole 22b. Here, when the brush 21 is inactive, the supply of the deionized water of the recording brush 21 can be regarded as being used to place the brush 2 1 in the 邮a post field, the ground The mechanism of the wet state, such as the guidance of the preliminary cleaning station, and the recognition, As shown in the structure of the roller 16 (see Fig. 3), each/guide roller 23 has a pull-and-pull connection, wherein the roller shaft 23a that is sleeved in the casing 25 will be Pivot 24 gentleman is slightly combined 24 to drive the roller by one. Each guide b uses the & &" belt (not shown, the blocker supports the wafer 丨徭 "work, edge 'According to the forward movement of the wafer 1 caused by the brush 21 wire clock. - Mechanism · ιτΒ Bu In addition, the pivot for driving the roller 24.n The agricultural wheel 23 is rotated at a fixed angle (戋 lateral) so as not to For the wafer crucible (the movement of the secondary side circle 1 interferes with 0. In addition, the chemical squirting has a hollow cylindrical shape, and a 38 1305658 is used to supply the chemical flow path 26a. The sprinkler nozzle is formed inside the spray 1||26 2 . The plurality of sprinklers 20 are symmetric on the surface of a @ λ. The chemical is applied to both sides of the rounded surface, as shown by the ® 6 °H. The first washing station 30 at the first time, by sprinkling the cleaning solution on the mouth of the round ^ μ surface (example *, deionized water, etc.: in the upper circle and s Haidi one Wash station 30 is at the same time a wafer i dogwood w_ belt 70 toward the moving direction of the white is set to - 1 comprising: (iv) + for main feed direction W of the reading wheel 70 and the conveyor belt - on

Washing liquid sprayer 3 7. T

The conveyor belt 70 includes: conveyor belt pulleys 71, 7u, which are arranged in parallel with a preset gap on both sides of the basin; a conveyor belt belt Μ connected between the two belt pulleys 71, 71a; A belt holder 73, which is used to support the belt pulleys 71, 71a. Here, the belt pulley is structurally slightly different from the other belt pulley 71. However, the difference between them is only a simple design change: that is, the belt pulley 7la has two separate short section structures in order to prevent interference caused by steering or mutual interference with the device which will be described in detail later. . Structurally, the cleaning liquid sprayer 37 is not different from the chemical sprayer 26 of the first cleaning station 2 described above. That is, the cleaning liquid sprayer 37 has a hollow cylindrical shape, and a flow path 37a for supplying the cleaning liquid is formed in the hollow portion, and on the other hand, a plurality of spray nozzles 37b are formed on the outer surface. Further, in addition to the structure of the first rinsing station 30, the present invention additionally includes a steering and transporting roller device (RAT: right angle conversion), after the wafer is input into the first rinsing station 30 and subjected to a rinsing process, when the wafer 1 into 19 1305658 槿At β 'First #王序¥ 'The structure of the steering and transfer roller device (RAT) can change the reciprocal motion direction of the wafer by 90 degrees. With this device, the conventional technology head: the parallel configuration of the workstation is changed to the L-shaped configuration, and the monthly ti is, for example, the τ ^ type throwing module 晶圆 and the wafer receiving module F, etc. Each of the stations can be connected to the peripheral device. The roller device can provide a compact structure and make the overall unit occupancy μ larger. That is to say, the steering and transport roller device (RAT) is a structure in which: for a certain line correction; $ ^ * (for example, ascending and descending devices in the preliminary cleaning station 10, etc.) The opening and lowering of the Φ ancient AA + _L-b drop plate 33 is set to be mutually flat ^ 2 ^ a plurality of roller brackets 32 are fixed on the fixed gap phase · ^ / vertically fixed to one side wall of the ascending and descending plate 33 That is, two steering and conveying rollers 31 are arranged in a manner of: the temple turning and conveying rollers 31 are separately mounted to the roller bracket 32, so that both ends of the steering and conveying rollers 31 are raised and The lowering of the two side walls and the end of the roller bracket 32 are rotatable. Each of the two specials: and the transfer roller 3" is between the conveyor belt pulley 7U without any interference.隹h Therefore, in the production of any disturbance with the rise and fall of Zhuo & ut μ +, only the lower wire lift and the lower movement do not send the well; the month / lower 'steer and the transfer roller 31 in the conveyor belt 7 使用 use Han >^ Drop in the following, by reference to the drawings in the order, 1 more use of steering and transmission of the assembly; fish s explain. The principle of the steering and transmission of the next day will be firstly as shown in the plane of Figure 7 _ _ see the picture, at the first cleaning station 20 complete the wafer of the 20.1305658 cleaning program into the first Conveyor belt 7. Conveyor belt 2 at the time the wafer is still placed in the sprayer, B goes off the top, then the bad cleaning solution sprays j deionized water to perform the flushing procedure' then, as shown in Figure 8 side view ^, when the rise and fall flat When the % rises, the steering and conveying roller 31 placed under the belt belt 72 of the conveyor belt rises between the belts % to a position slightly higher than the belt belt 72 of the belt, and therefore, the crystal placed on the W π belt 72 circle! Was lifted up. In this situation, as shown in Figure 9.

As shown in the plan view, when the steering and conveying rollers 31 are rotated in a forward conveying direction, the moving direction of the wafer cassette placed on the steering and conveying rollers 3 is changed to 9 G degrees and then the wafer 1 is inserted. The person second cleaning station 40. At the same time, the second cleaning station 4 () is used to transfer the front surface and the back of the wafer 1 by a second spraying which may be the same as or different from the chemical used in the first cleaning station. The device for cleaning the remaining particles on the surface. The second cleaning station 40 has the same structure and method as the first cleaning station 20 (refer to Figs. 4 and 5), so the detailed description thereof is omitted here, and The same elements of the first cleaning station and the second cleaning station 2, 40 will be provided with the same component symbols. Further, as shown in Fig. 1, the second rinsing station 50 performs the final rinsing by spraying the cleaning liquid (e.g., deionized water or the like) on the second cleaning wafer 1. The second processing station 5 is a device comprising: a conveyor belt 7 for conveying the wafer 1; and a cleaning liquid sprayer 5 1 disposed above the wafer 1 for spraying the deionized water To the surface of wafer 1. Reference numeral 5 1 b indicates a spray nozzle, and at the same time, an ultrasonic device (million speed of sound) can be selectively installed on the second flushing station 50, so that the 21 1305658 S mysterious ultrasonic operation can be the same The final cleaning benefit/cleaning procedure 'by this, more significantly enhances the independent and sufficient rinsing of the wafer 1 by the second, φ, 杰, μ h + ^ ΒΒ ΛΑ ^, so the rinsing process of the present invention benefits In the present invention, the more efficient execution of the rinsing program of the technique is simultaneously performed in the rinsing process at the subsequent drying station 60 M u more significant benefits can be expected to shorten the program time of the drying station, planting holes, delaying phenomenon The main factor of the sequence time is currently causing the entire cleaning process first? Day 1 'As shown in Figure 11, the drying station (SRD: Rotary Flush Drying) is hurricane wr wr 最后 final cleaning solution, for example: washing...' and drying it by centrifugal force Grab wafer 2: Drying station 60 is a device. The finger 1 is gripped by a finger that rotates at two speeds. The gripping device is a device that grips the wafer 1 at an equal distance and rotates at a south speed. Among the finger gripping devices, one of the: the condensing shaft 65 is extended upward, and the power of the 1~, Η special transmission is rotated. The drive unit 66 at the bottom of the ... is the five incisions of the outer circumference of the shaft. The throwing rods are respectively protruded outward through the five incisions in the radial direction, and the door can be inscribed on the upper and lower sides of the five incisions. 4t" "The same distance and the cantilever 62 can be placed in a vertical manner. The member cantilever 62 is connected every m when the money key pin (4) is moved, so that when each of the operating levers 64 moves the cantilever 62 to be combined with each of the operating levers 64. On the buckle] page #'grip finger The members 61 are individually formed with a finger suspension 22 I3 〇 5658 - body, each of the grip fingers 6 i having a groove capable of staking the edge of the wafer. A connecting member is disposed on the chain pin 64a And the grip finger makeup Du 々 々 „ '62 叙 叙 I grip & In the connecting element, a middle and a shaft pin 63 are connected to the 'seat plate for pushing the wafer 1 when loading, and function as a pivot to execute the finger county arm 62 $ t 4 pieces The relative swing between 6! The element "62" and the gripping finger finger Μ have a structure similar to that of the human finger, and the := member can be grasped by the human finger after grasping the edge of the circular plate. ^ = 4 The structure of the finger gripping device described above, I is carried in the rounded corner of the seat plate! It can be firmly gripped by the five gripping fingers 61, because in the 'central shaft' When 65 is rotated, they can rotate at the same time. When unloading, the 'operating rod 64 is pulled toward the center shaft 65 by a mechanical control. The bottom of the finger cantilever 62, thereby pulling the bottom of the finger cantilever 62, so the grip finger 6 The top of the crucible is wound around the central axis pin of the pivot point for radial expansion, and the wafer! is released. When the wafer i is gripped, it is executed against the above-mentioned operation. The detailed description is omitted here. Furthermore, the five gripping fingers 61 are arranged equidistantly along an outer configuration, so the distance between the gripping fingers 61 is maintained at 72 degrees. - Flat area type wafer i does not require any alignment operation (4), but exceeds 216 degrees of (10) degrees, making at least four effective (Iv) # 61 grip grip circumference of the wafer 1, thereby keeping - stable grip stars. " The stability of this embodiment is significantly better than the instability of the prior art. In the prior art, four gripping fingers are used, so 23 1305658 will have a flat area type without any alignment operation. When the wafer is input, there are only at least three effective grip fingers to cover the circumference of the wafer i in a range of 180 degrees. Kaogang training, like, ', mouth Fu with the five horses to grasp the finger shape heart 6〗 The direction of the wafer 1 is not in the direction of the wafer, when the wafer is rotated at high speed, will not cause wafer damage guarantee In the following, the stabilizing structure embodied by the present invention can maintain a fixed grip state. Those skilled in the art should readily appreciate that the number of grip fingers 61 can be designed in accordance with a flat area wafer or a slit type wafer. That is to say, for the fan-flat area type wafer, the 5-Hail grip finger type is away from i, 斟-cut... The grip finger 61 structure 'or the needle is not the heart-shaped wafer' can be one or three Or four fingers ^ structure. Autumn: 2: Wafer] The type of the above two types of pick-ups: the additional alignment operation of the wafer center alignment and the use of the five-grip finger structure is preferred. Operation day round 1' Another: 'Depending on the condition, including one for drying in the drying station and one for the other, and spraying the deionized water (or nitrogen) The pores and the rinsing process of the sputum are in the deionized water and nitrogen sparger in this embodiment. In J Tianzhong, while spraying deionization, the wy-washing procedure is carried out with a low-speed rotating finger gripping device, and the finger gripping device is rotated at a high speed, and then the mouth is smashed with nitrogen gas, and at the same time, by (10) (4) oxygen (four) Improve the dry surface for anti-oxidation treatment. The reaction of ruthenium can be applied to the wafer 1 of 24.1305658. Although the invention is described with reference to the specific embodiments shown in the drawings, it should be construed as a description rather than as a limitation. . Therefore, it is apparent to those skilled in the art that various modifications and equivalent embodiments can be conceived without departing from the scope of the invention. Thus, the breadth and scope of the invention may be defined by the scope of the appended claims. & Industrial Applications The wafer cleaning system of the present invention can pass wafers into each of the cleaning and rinsing procedures of the surface-polished wafer by means of separate and independent cleaning stations and a processing station. The waiting time required for a cleaning station is minimized, whereby the productivity of the wafer is significantly improved due to this delay in the overall wafer fabrication process. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view of a configuration of a respective portion of a semiconductor wafer cleaning system in accordance with the present invention, and peripheral devices such as a polishing module and a wafer receiving module connected in the same plane. . Figure 2 is a perspective view of a preliminary cleaning station for removing large particles by a water curtain sprayer applied to a deionized water of a cleaning system in accordance with the present invention. , 口口<- Figure 3 shows the cross section along the section line in Figure 2

4 is a perspective view of the main structure of the cleaning station and the second cleaning station which are applied to the wet brush according to the present invention. The 5 series shows a vertical sectional view of the flow structure of the deionized water in the brush of 25, l3〇5658 applied to the first washing station and the 青^qing washing station. For performing the wafer transfer, FIG. 6 is a rinsing process after the cleaning process of the first cleaning station disposed between the first cleaning station and the second cleaning station, and a main structure of the first rinsing station for redirecting the direction Stereo picture. Fig. 7 is a schematic top view showing the state of the wafer fed into the first processing station by the conveyor belt after being cleaned by the first cleaning station.

Fig. 8 is a schematic side view showing a state in which the wafer is lifted from the conveyor belt by the steering between the belts and the rise of the conveying roller. Figure 9 is a schematic top view showing a state in which the wafers on the steering and transport rollers are fed to the second cleaning station in a direction change direction when the steering and transport rollers are rotated. Fig. 10 is a perspective view showing the main structure of a second flushing station which is followed by a flushing process after the cleaning process is executed by the second washing station. Figure 11 is a perspective view showing the main structure of a drying station applied to the centrifugal force of the present invention. [Main component symbol description] c Semiconductor wafer cleaning system (cleaner module) P polishing module F wafer RAT steering and SRD drying station 1 crystal _ round module (device front end module) transfer roller device ( Right angle conversion) (rotary rinse drying) 2 platform 3 loading device 26 1305658

4 Machine stage 5 Robot arm 10 Preliminary cleaning station 11 Support plate 1 la Ascending and descending guide track 12 Cylinder 12a Piston rod 13 Ascending and descending plate 14 Motor 14a Drive pulley 15a Belt 15b Belt 16 Guide roller 16a Roller 16b Pulley driven wheel 16c Pulley driven wheel 16d Bearing 17 Housing 17a Cover 18 Deionized water sprayer (DIW knife) 18a Deionized water supply hole 20 First cleaning station 2 1 Brush 21a Fine contact protrusion 27 1305658

22 Brush shaft 22a Flow path 22b 23 Guide roller 23a Roller shaft 24 Pivot 25 Housing 26 Chemical sprinkler 26a Flow path 26b Spray nozzle 30 First washing station 31 Steering and conveying roller 32 Roller bracket 33 Rising and lowering plate 37 Cleaning liquid sprayer 37a Flow path 37b Spray nozzle 40 Second cleaning station 50 Second washing station 51 Cleaning liquid sprayer 51b Spray nozzle 60 Drying station 61 Grip finger 62 Finger cantilever 28 1305658 63 Center pin 64 Operating lever 64a Hinge pin 65 Central rotating shaft 66 Drive unit 70 Conveyor belt 71, 71a Conveyor belt pulley 72 Conveyor belt belt 73 Conveyor belt bracket

29

Claims (1)

.1305658 X. Patent Application Range: 1. A semiconductor wafer cleaning system comprising: a preliminary cleaning station for pre-clearing particles on a wafer by spraying deionized water on a wafer; a first cleaning station for frictionally rotating a pair of brushes configured to be in contact with the front and back surfaces of the wafer, and spraying the chemical onto the wafer by a separate chemical spray Cleaning the remaining particles; a first rinsing station for spraying the surface of the crystal JD that has been subjected to the first cleaning on the first cleaning station to perform a rinsing process; a second cleaning station Using the same structure and manner as the first cleaning station for spraying chemicals onto the surface of the wafer that has been first rinsed at the first flushing station by a separately disposed chemical sprinkler To clean the particles remaining on the front and back surfaces of the wafer a second time; a second processing station for spraying the cleaning liquid onto the surface of the wafer that has been cleaned a second time at the second cleaning station On, in order to carry out the flushing procedure And, a drying station, which rotates at high speed has been rinsed in the rinsing station of the second crystal circle 'generated by the centrifugal force, drying of the residual cleaning liquid. 2. The semiconductor wafer cleaning system of claim 2, wherein the first processing station further comprises a turning and conveying device for comparing the wafer that has been cleaned for the first time A 90 degree change is made in the direction of entering the first flushing station, changing the moving direction of the wafer that has been cleaned for the first time into the next program, and feeding the wafer that has been cleaned for the first time into the next program. The semiconductor wafer cleaning system of claim 2, wherein the steering and conveying device comprises: a rising and falling plate that is vertically disposed 'and raised by a specific linear motion device And the lower IV, a plurality of roller carriages are vertically fixed to one side wall of the ascending and descending plates in a manner that the fixed gaps are parallel to each other and are installed between the conveyor belts for use in the roller carriages and the conveyor belts. In the case of no interference, the wafer is transferred from the month; and, a plurality of steering and conveying rollers are supported in such a manner that the steering and conveying rollers are respectively disposed inside the roller carriage So that both ends of the steering and conveying rollers can roll between one of the side walls of the ascending and descending plates and one end of the roller carriage. 4Hf Patent Range 帛1 The semiconductor wafer cleaning system j 'where the preliminary cleaning station includes: a wafer gripping and rotating device; the deionized water sprayer' is disposed above the wafer, the main function is When the feed high pressure is removed from the concentrated (four)-water curtain-like deionized water, the large particles are removed. The Japanese yen grasping and rotating device includes: along the side: the selection plate, - rise And the descending guide track / mouth f is formed in the vertical direction. π road warfare, a rising and falling flat plate, J1 盥 rising and the lower object track are combined, so that the two upper: and the lower-pressing red, which is made vertically vertical... Guided by the guide rail; lowering the flat plate....receiving the 'to increase and decrease the rise and the tenth plate, and, a plurality of guide rollers, rotating at the same time, so that the zigzag, j, and the temple are driven by one or more driving sources Twisting the wafer being gripped, at this time, the guide rolls $α @田Load or release the wafer board from the rise and the squat cake will rise and fall flattened so as not to occur with the wafer interference. 5) The semiconductor wafer cleaning system 31 1305658, as described in the patent application, wherein the first cleaning station and the second cleaning station respectively comprise: a pair of brushes respectively; Contacting, cleaning the wafer, the brushes are made of a wet sponge that has a wetting effect, which relies on the flow of deionized water and only through the channel supplying the deionized water when the brush is inactive. - A chemical sprayer that is symmetrically mounted toward both sides of the wafer and that allows only chemicals to pass and spray chemicals. The semiconductor wafer of claim i wherein the drying station comprises: a central rotating shaft extending axially, = rotating by a power transmitted by a driving device disposed at a bottom of the shaft; 'It is equal to the longitudinal direction of the circumference of the central axis of rotation, formed at the top of the central axis of rotation; the operating lever, = up, at the same distance and can be cut along the cutting line D in the direction of the five incisions; a cantilever that is embossed and threaded by a - hinge pin 'each finger cantilevered to be rotatable:: sighed by the 'lever-end of the lever' so that when each lever moves, the arm can In combination with each of the operating rods; the gripping fingers, the female-finger-like suspension arms are integrally formed, and at the top of the finger cantilever, the two respectively have a groove with the finger, and the groove can be sleeved The edge of the wafer each gripping finger has a top cymbal, connecting element disposed on the hinge pin of the finger cantilever, and a central pin of the head in the connecting element, 2 between the gripping fingers ; a plate is used to support the wafer, and acts as a ~ when the load is loaded, the pin is connected The relative swing between the cantilever and the gripping finger is performed to perform the fingering, the pattern, and the like. 32