TWI303856B - - Google Patents

Download PDF

Info

Publication number
TWI303856B
TWI303856B TW95127917A TW95127917A TWI303856B TW I303856 B TWI303856 B TW I303856B TW 95127917 A TW95127917 A TW 95127917A TW 95127917 A TW95127917 A TW 95127917A TW I303856 B TWI303856 B TW I303856B
Authority
TW
Taiwan
Prior art keywords
tool
voltage
voltage value
eccentricity
height
Prior art date
Application number
TW95127917A
Other languages
Chinese (zh)
Other versions
TW200807594A (en
Inventor
Du-Cheng Li
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to TW95127917A priority Critical patent/TW200807594A/en
Publication of TW200807594A publication Critical patent/TW200807594A/en
Application granted granted Critical
Publication of TWI303856B publication Critical patent/TWI303856B/zh

Links

Landscapes

  • Machine Tool Sensing Apparatuses (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Description

1303856 九、發明說明: 【發明所屬之技術領域】 本發明非接觸式晶圓切割刀之刀高磨損與刀具偏心量 测補償方法,主要疋應用於晶圓切割刀的非接觸式刀高磨 損與刀具偏心的量測與補償技術上。 【先前技術】 按,晶圓切割機為半導體晶圓封裝測試時之前段設備 ,其功用疋將a日圓切成一顆顆晶粒,以利後續之封裝測試 。因此穩定的切割品質是機台必備的。 當產品在切削時會使得刀具產磨耗,為了使每次切削 時切割深度的一致,就必須做刀高的補償。 刀具的偏心量是判斷刀具是否為真圓的指標,也可作 為切削參數的調整。為了防止切削時刀具有不均勻磨耗的 情況,保持切削品質的穩定,偏心量測為一種重要的功能 Ο 惟’傳統習用的接觸式的刀高與偏心量測方法,無法 達到自動化功能,為其既存尚待克服解決的問題與缺失。 【發明内容】 本發明人目前從事相關產品的製造、設計,累積多年 的實務經驗與心得,針對傳統習用的接觸式的刀高與偏心 量測方法所既存的問題與缺失,積極地投入創新與改良的 精神,終於完成的一非接觸式晶圓切割刀之刀高磨損與刀 具偏心量測補償方法。 本發明解決問題所應用的技術手段以及對照先前技術 1303856 的功效係在於:利用非接觸式的刀高與刀具偏心量測法, 量測出刀具的磨耗量與偏心量,並做刀高與進刀速度的補 償,達到晶圓切割機上的一項自動化的功能。 【實施方式】 為使專精熟悉此項技藝之人仕業者易於深入瞭解本發 - 明的裝置内容以及所能達成的功能效益,茲列舉一具體實 施例,並配合圖式詳細介紹說明如下: 一種非接觸式晶圓切割刀之刀高磨損與刀具偏心量測 • 補償方法,敬請參閱第一圖所示··係本發明之量測架構示 意圖。主要是利用兩個潛望鏡式的光纖感測器10、2〇 ,固定在特定距離的兩端,而光纖感測器1〇、2 0表面 黏貼透光性極高之藍寶石玻璃11、21,以阻絕切削過 程中之水氣以污染。而切割過程中會一直在藍寶石玻璃1 1、21表面喷水,避免粉塵黏附其上。 兩條光纖感測器10、2 0後端與光電放大器3 〇連 • 接。此光電放大器3 0可有一輸出以及輸入孔位;輸出孔 位可產生穩定的紅色光源’而輸入孔位可將接收到的光強 度轉換成電壓值,因此其中一個光纖感測器1〇一端可發 ‘ 射出一穩定強度的光束,而另一個光纖感測器2 〇—端則 接收光束。光電放大器3 0的類比輸出連接到電腦4 〇的 訊號擷取卡,利用電腦4 〇將接收到的光強度訊號做處理 ,以軟體進行雜訊的濾除。 敬研參閱第^一圖所不·係本發明磨耗前、後之電壓與 Z軸位置圖。當刀具5 〇由上而下經過光纖感測器丄〇、 5 1303856 2 0時,紀錄Z軸位置與透光量,可得第二圖z a _ z b 曲線。X麵Z a和Z b的距離即為光束的直徑大小。當 刀具5 0磨耗後由於刀具5 0直徑變短了,當由上而下經 過光纖感測器10、2 0時’必須多下降磨耗量的高度才 能遮到光纖感測器10、2 0,此時可得第二圖2 a Z b'曲線。 敬請參閱第三圖所示:係本發明内插計算之示意圖。 Y轴為電壓值’即光纖感靡i 〇、2 G接收到之透光量 。當刀具5 0未磨耗,刀具5 〇下降至同—高度時,透光 量必相近’因此其電壓值幾乎-致。而當刀具5 〇磨耗後 ,欲接收到與磨耗前相同的光量,刀具5 〇必須更下降更 深才能達到此目的’故此下降的距離即為其磨耗量。我們 利用内插法計算二條曲線每一點的距離。 Z1為未磨耗前的刀具5 〇位置,V1為其對應之電 壓值。Z2 ’ V2 ’ Z3 ’ V3亦同。在相同電壓V1下,兩 條曲線的距離差為⑵—z 〇。如第二圖所示:1303856 IX. Description of the invention: [Technical field of the invention] The high-wear and tool eccentricity measurement compensation method of the non-contact wafer dicing blade of the invention mainly applies to the non-contact knife height wear of the wafer dicing blade and Tool eccentricity measurement and compensation technology. [Prior Art] Press, the wafer cutting machine is a device in the previous stage of the semiconductor wafer package test, and its function is to cut a yen into a single die to facilitate subsequent package testing. Therefore, stable cutting quality is a must for the machine. When the product is cut, it will cause the tool to wear. In order to make the cutting depth consistent at each cutting, the tool height must be compensated. The eccentricity of the tool is an indicator of whether the tool is a true circle or as an adjustment to the cutting parameters. In order to prevent uneven wear of the knife during cutting and to maintain stable cutting quality, eccentricity measurement is an important function. However, the conventionally used contact height and eccentricity measurement method cannot achieve automation function. Existing problems and shortcomings that have yet to be resolved. SUMMARY OF THE INVENTION The present inventors are currently engaged in the manufacture and design of related products, accumulating practical experience and experience for many years, and actively investing in innovations and problems existing in the traditional methods of contact-type knife height and eccentricity measurement. Improved spirit, finally completed a non-contact wafer cutting knife knife high wear and tool eccentricity measurement compensation method. The technical means applied by the present invention to solve the problem and the effect of the prior art 1303856 are: using the non-contact knife height and the tool eccentricity measurement method, measuring the wear amount and the eccentricity of the tool, and making the knife height and the advance The compensation of the knife speed achieves an automated function on the wafer cutting machine. [Embodiment] In order to make it possible for a person skilled in the art to have a thorough understanding of the present invention to understand the contents of the device and the functional benefits that can be achieved, a specific embodiment will be enumerated and described in detail as follows: A high-wear and tool eccentricity measurement and compensation method for a non-contact wafer dicing cutter, please refer to the first figure, which is a schematic diagram of the measurement architecture of the present invention. Mainly using two periscope-type fiber optic sensors 10, 2〇, fixed at both ends of a certain distance, and the surface of the optical fiber sensor 1〇, 20 is adhered to the highly transparent sapphire glass 11, 21 to It prevents the water vapor in the cutting process from being polluted. During the cutting process, water will be sprayed on the surface of sapphire glass 1 and 21 to prevent dust from sticking to it. The back ends of the two fiber sensors 10 and 20 are connected to the photo-amplifier 3. The photo-amplifier 30 has an output and an input hole position; the output hole position can generate a stable red light source' and the input hole position converts the received light intensity into a voltage value, so one of the fiber-optic sensors has one end It can emit 'a beam of stable intensity, while the other end of the fiber sensor 2 receives the beam. The analog output of the photoelectric amplifier 30 is connected to the signal capture card of the computer 4 ,, and the received light intensity signal is processed by the computer 4 , to filter the noise by the software. For the study, refer to the figure of Fig. 1 for the voltage and Z-axis position before and after the wear of the present invention. When the tool 5 经过 passes through the fiber sensor 丄〇, 5 1303856 2 0 from top to bottom, the Z-axis position and the amount of light transmission are recorded, and the second graph z a _ z b curve is obtained. The distance between the X faces Z a and Z b is the diameter of the beam. When the tool 50 is worn out, the diameter of the tool 50 becomes shorter. When the fiber sensor 10, 20 is passed from top to bottom, the height of the wear amount must be lowered to cover the fiber sensor 10, 20, At this point, the second Figure 2 a Z b' curve is obtained. Please refer to the third figure: a schematic diagram of the interpolation calculation of the present invention. The Y-axis is the voltage value', that is, the amount of light transmitted by the fiber 靡i 〇 and 2 G. When the tool 50 is not worn, the tool 5 〇 drops to the same height, the amount of light transmission must be close, so the voltage value is almost constant. When the tool 5 is worn, and the same amount of light as before the wear is received, the tool 5 must be lowered and deeper to achieve this purpose. The distance that is reduced is the amount of wear. We use interpolation to calculate the distance of each point of the two curves. Z1 is the 5 〇 position of the tool before the wear, and V1 is the corresponding voltage value. Z2 ’ V2 ’ Z3 ’ V3 is also the same. At the same voltage V1, the distance difference between the two curves is (2) - z 〇. As shown in the second figure:

Zl -Z2 V2-V1 V2-VI V2—V3 Z3- Z2 V2-V3 所以(Zl-ΖΓ)即可得。計算出每—點的距離差 ’再算其平均距離即磨耗量。 本發明所提供之一種非接觸式刀具偏心量測法, 測量補償時,其方式為: 如第五圖所示’將刀具5 G降至光束路徑上的任一固 1303856 定點,若刀具5 0旋轉時為真圓,則光束通過的量為一固 定值,所以測得之電壓值亦為_固定值v。,雜⑺ 與時間(Time)的關係如第六圖之實線所示。 田刀具產生不均钱耗時,因刀具轉動時每個位置所 遮到的光量並不-致,所以接收到的電壓(v)與時間(Zl -Z2 V2-V1 V2-VI V2-V3 Z3- Z2 V2-V3 So (Zl-ΖΓ) is available. Calculate the distance difference between each point and calculate the average distance, that is, the amount of wear. The non-contact tool eccentricity measuring method provided by the present invention measures the compensation in the following manner: as shown in the fifth figure, 'the tool 5 G is reduced to any fixed point 1303856 on the beam path, if the tool 5 0 When it is rotated, it is a true circle, and the amount of light passing through is a fixed value, so the measured voltage value is also a fixed value v. The relationship between (7) and time (Time) is shown by the solid line in the sixth figure. When the tool of the field produces uneven weight, the amount of light blocked by each position is not caused by the rotation of the tool, so the received voltage (v) and time (

• Time)關係圖會呈現―週期性出現的曲線。假設刀具轉速 為wRPM (每分鐘…轉),表示每秒鐘會轉w/6〇次; 若電壓取樣頻率(sampHng freq_cy)為f (每秒取^ 籲-人電壓值)’則刀具每轉一圈可取到f/ (w/6〇)次電壓值 則此週期性出現的曲線其頻率為,週期AT 為w/(60*f)。如第六圖之虛線所示。其電壓變化量為 〇 於是我們就可利用此一特性來對偏心量計量。第六⑷ 圖疋當刀具固定在光束通區域中之固定位置所抓取的電壓 值。因為主轴和-些機台的震動會產生低頻的雜訊,如第 鲁圖六圖之虛線所示。而電路所造成的高頻雜訊也會混 雜在其中’第六(a )圖之實線的鋸齒狀毛邊即是。高頻和 低頻雜訊和刀具絲不均所造成的電觀化量全都混雜在 起’但我們必須將刀具偏心所造成的電壓變化量解析出 來’所幸偏心量的頻率f/(w/6〇)是我們知道的。因此我們 可利用一個南通濾波器(High-Pass Filter)將低頻的雜 訊;慮除’相同的再利用一個低通濾波器(Low-Pass Filter )可將向頻的雜訊過濾掉。所以刀具偏心造成的電壓變化 量就可求得。 7 1303856 移動平均法(Moving Average)是-種t見的低通遽 波方法,可有效的將高頻雜訊濾除。其運作方式為]“ V[nHV[n - k]+V[n-k+l]+…+V[n]+…^[n+k])//、,、、其中: d=2%U,k為整數,d代表共取幾點之點數 利用前後點平均的方式來將雜訊平均掉。原始電壓訊 號經過此步驟後,其絲如第六⑻圖之實線所^,鑛齒 狀的高頻雜訊已被濾除。 而我們想要的訊號還騎在低頻的雜訊上,如第五(b) 圖=虛線所示。所以我們必須設計一種高通濾、波器,讓比 較高頻的訊號通過,將低頻的訊號過濾掉。 週期波(如sin波)有一種特性,其特性是將整個週 期相加,可得其基準值。而我們可將整個訊號的基準線( 第六(b)圖之虛線)算出來,再將經過低通濾波後的訊號 減掉這條基準線,即可得到刀具偏心的電壓變化曲線。相 減之圖形如第六(c)圖所示。 而基準線的算法為• Time) The graph will present a “periodic curve”. Assume that the tool speed is wRPM (transfers per minute), which means that w/6 turns per second; if the voltage sampling frequency (sampHng freq_cy) is f (receives the voltage per person - the voltage value), then the tool rotates. The voltage of f/(w/6〇) times can be taken in one turn, and the frequency of this periodic curve is frequency, and the period AT is w/(60*f). As shown by the dotted line in the sixth figure. The amount of voltage change is 〇 so we can use this feature to measure the eccentricity. Figure 6 (4) Figure shows the value of the voltage captured by the tool at a fixed position in the beam pass region. Because the vibration of the main shaft and some of the machines will produce low-frequency noise, as shown by the dotted line in Figure 6 of Lutu. The high-frequency noise caused by the circuit is also mixed with the jagged edges of the solid line of the sixth (a) figure. The amount of electrical and high-frequency noise caused by high-frequency and low-frequency noise and unevenness of the tool wire are all mixed up in the 'but we must analyze the amount of voltage change caused by the eccentricity of the tool'. The frequency of the eccentricity f/(w/6〇 ) is what we know. Therefore, we can use a High-Pass Filter to filter low-frequency noise; the same reuse of a Low-Pass Filter can filter out-frequency noise. Therefore, the amount of voltage change caused by the eccentricity of the tool can be obtained. 7 1303856 Moving Average is a low-pass chopping method that can effectively filter high-frequency noise. Its operation mode is] V[nHV[n - k]+V[n-k+l]+...+V[n]+...^[n+k])//,,,, where: d=2 %U,k is an integer, and d represents the number of points taken in common. The average of the front and back points is used to average the noise. After the original voltage signal passes through this step, the wire is as the solid line of the sixth (8) figure. The high-frequency noise of the mineral tooth has been filtered out. The signal we want is also on the low frequency noise, as shown in the fifth (b) diagram = dotted line. So we must design a high-pass filter, wave device Let the higher frequency signal pass and filter out the low frequency signal. Periodic waves (such as sin wave) have a characteristic, which is to add the whole period to get the reference value. We can benchmark the whole signal. The line (the dotted line of the sixth (b) figure) is calculated, and then the low-pass filtered signal is subtracted from the reference line to obtain the voltage variation curve of the tool eccentricity. The subtraction pattern is as shown in the sixth (c). The figure shows the algorithm of the baseline

Dc[n]KV[n-k]+V[n-k+l]+”.+v[n]+".+v[n+k])/ ΔΤ,其 中· △Τβ^κ+Ι為一個週期的長度,k為整數。 將第六(c )圖上的訊號任意取Λτ長度的訊號出來, 什算其最大值與最小值之差,再除以2即可得電壓變化量 △V °為了得到較精確的結果,我們可取多段的電壓變化 量作平均,可以制很穩定的結果。 得到電壓變化之後還必須知道電壓變化量和位置變化 關係。而賴變化和位置變化_係可自帛二_之曲線求 1303856 得。我們計算偏心量時每次都將刀具移至光束的正中央, 知其電壓變化量△¥,若光束正巾央之斜料m,則偏心量 為fV=’即可算辣。得知每把刀具量之後,可 以没疋每把刀具之進刀速度之參數,增加刀具之壽命,提 高工作效率。 一敬請參閱第四®所示:係本發明刀高磨損量測之流程 示意,。本發明所提供之—種非接觸式刀高磨損量測法與 偏心量測方法,在實際測量補償時,其步驟為: …將刀具5 0移至量峨構上方,喷水喷氣步 雜完成之後,將刀具下降到一固^位置,量測刀具5 〇未 遮到光束時的電壓值vs。 二、 將刀具5 0往下移動G. _ (lmierQ meter), 以取樣頻率Λ截取電壓值。若刀具旋轉速度為w RpM,則 截取刀具旋轉-周(即撕/>v點)的電壓值總和,取其 平均電壓值。紀錄本次電壓值。 三、 重複步驟二,直到刀具5 〇完全遮斷光束且達到 指定的位置。 四、 量測刀具5 0完全遮斷光束時的電壓值v e。 五、 刀具5 0移至原點。 六、 利用Vs,Ve將量測到的電壓訊號做規一化(Dc[n]KV[nk]+V[n-k+l]+”.+v[n]+".+v[n+k])/ ΔΤ, where △Τβ^κ+Ι is a The length of the period, k is an integer. The signal on the sixth (c) diagram is randomly taken out from the signal of the length of τ, and the difference between the maximum value and the minimum value is calculated, and the voltage change amount ΔV ° is obtained by dividing by 2 In order to get more accurate results, we can take a multi-stage voltage variation for averaging, which can produce very stable results. After the voltage change is obtained, we must also know the relationship between the voltage change and the position change. The curve of the second _ is 1303856. When we calculate the eccentricity, we move the tool to the center of the beam every time, knowing the voltage change amount △ ¥, if the beam is slanting m, the eccentricity is fV=' It can be considered as spicy. After knowing the amount of each tool, you can increase the tool life and improve the working efficiency without the parameters of the tool feed speed of each tool. Please refer to the fourth®: the high wear of the blade The flow of measurement is illustrated by the non-contact knife high wear measurement method and the eccentricity measurement method provided by the present invention. When the actual measurement is compensated, the steps are as follows: ... move the tool 50 to the top of the measuring mechanism, and after the water jet step is completed, lower the tool to a fixed position and measure the voltage of the tool 5 when the beam is not blocked. Value vs. 2. Move the tool 50 down G. _ (lmierQ meter), cut the voltage value at the sampling frequency 。. If the tool rotation speed is w RpM, intercept the tool rotation-week (ie tear/>v point The sum of the voltage values, take the average voltage value. Record the current voltage value. 3. Repeat step two until the tool 5 〇 completely interrupts the beam and reaches the specified position. IV. Measuring tool 5 0 when the beam is completely blocked The voltage value ve. 5. The tool 50 moves to the origin. 6. Using Vs, Ve will normalize the measured voltage signal (

Nonnalize)。紀錄當電壓為〇· 5時之電壓與位置 斜率m,以及z轴位置Zc,以作為偏心量計算之 參數。 七若本-人為第一次測高,則紀錄本次電壓與位置曲 1303856 f作為測回之基準。否則利用内插法計算出同 亚電壓下刀具5 〇的高度差。計算不同電廢時的 平均南度差’以計算出之平均高度差作刀高補償 〇 八將刀具移至Ze位置,準備計算偏心量。 九以取樣頻率fs抓取多次電屢值並紀錄。 十、經過高通與低通濾波器後,計算出平均電壓變化 量Δν〇 十一、計算出此刀之偏心量。 上述量測方法可得到穩定的,,電壓,,―”位置,,曲線 圖。同時’在測高過程中會—直噴高壓乾燥氣體,保持環 境的穩定與避免水滴滑落影響量測值。 综合上述所陳之本發明,係在提供一種非接觸式晶圓 切割刀之刀高磨損與刀具偏心量測補償方法,經過本發明 人實際製作完成以及反覆操糊試之後,證實的確可以達 到本發明所職的魏处,同時又為目前糊尚無見聞 之首先創作」,具有「產業上的利用價值」,誠然已經 符合發明專利之成立要義,爰依專利法之規定,向…月 提出發明專利之申請。 釣局 【圖式簡單說明】 第一圖:係本發明之量測架構示意圖。 第二圖··係本發明磨耗前、後之電壓與Ζ轴位置圖。 第三圖··係本發明内插計算之示意圖。 第四圖··係本發明刀高磨損量測之流程示意圖。 1303856 第五圖:係本發明之刀具降至光束路徑示意圖。 第六圖:係本發明刀具真圓與偏心旋轉時所測得之電 壓與時間的關係圖。 第六(a)圖:係第六圖受到高頻雜訊與低頻雜訊干擾之電 壓與時間的關係圖。 • 第六(b)圖:係第六圖利用低通濾波器將高頻雜訊過濾後 之電壓與時間的圖係圖。 第六(c )圖:係第六圖利用高通濾、波器將低頻雜訊過濾、後 • 之電壓與時間的圖係圖。 【主要元件符號說明】 10 光纖感測器 11 藍寶石玻璃 20 光纖感測器 21 藍寶石玻璃 30 光電放大器 4 0 電腦 5 0刀具 11Nonnalize). Record the voltage and position slope m when the voltage is 〇·5, and the z-axis position Zc as the parameter for the eccentricity calculation. Seven Ruo Ben-Man is the first time to measure the height, then record the current voltage and position curve 1303856 f as the benchmark for the round. Otherwise, the height difference of the tool 5 同 under the same sub-voltage is calculated by interpolation. Calculate the average south difference when different electrical wastes are used to calculate the average height difference for the tool height compensation. 八 Eight Move the tool to the Ze position and prepare to calculate the eccentricity. Nine grabs multiple times and counts the number of times with the sampling frequency fs. 10. After passing through the high-pass and low-pass filters, calculate the average voltage variation Δν〇 11. Calculate the eccentricity of the knife. The above measurement method can obtain stable, voltage, "" position, and curve diagram. At the same time, 'in the process of height measurement, it will directly spray high pressure dry gas to maintain the stability of the environment and avoid the influence of water droplets falling down. The invention described above provides a method for correcting the high wear of the non-contact wafer dicing blade and the eccentricity measurement of the tool. After the actual production of the inventor and the repeated operation test, it is confirmed that the invention can be achieved. At the same time, Wei, who is at the same time, has created the first use of the industry, and has the "utility value of the industry". It is already in line with the founding of the invention patent, and according to the provisions of the Patent Law, the invention patent is filed in ... Application. Fishing Bureau [Simplified description of the drawings] The first figure is a schematic diagram of the measurement architecture of the present invention. Fig. 2 is a diagram showing the voltage and the axis position before and after the abrasion of the present invention. The third figure is a schematic diagram of the interpolation calculation of the present invention. The fourth figure is a schematic flow chart of the high wear measurement of the blade of the present invention. 1303856 Fig. 5 is a schematic view showing the reduction of the tool of the present invention to the beam path. Fig. 6 is a graph showing the relationship between the voltage measured by the tool of the present invention and the eccentric rotation. Figure 6 (a): Figure 6 is a graph of voltage versus time for high frequency noise and low frequency noise interference. • Figure 6(b): Figure 6 is a diagram of the voltage versus time after filtering high frequency noise using a low pass filter. Figure 6 (c): Figure 6 is a diagram of the voltage and time of the high-pass filter and filter to filter the low-frequency noise. [Main component symbol description] 10 Optical fiber sensor 11 Sapphire glass 20 Optical fiber sensor 21 Sapphire glass 30 Photoelectric amplifier 4 0 Computer 5 0 tool 11

Claims (1)

1303856 十、申請專利範圍: νί · —種非接觸式晶圓切割刀之刀高磨損與刀具偏心 里測補償方法’主要是在特定距離的兩端,固定兩個潛望 鏡式的光纖感測器,其中一個光纖感測器發射出一穩定強 度的光束,另一個光纖感測器接收光束,兩個光纖感測器 • 後端與光電放大器連接,此光電放大器可有一輸出以及輸 入孔位;輸出孔位可產生穩定的紅色光源,而輸入孔位可 將接收到的光強度轉換成電壓值,光電放大器的類比輸出 > 連接到電腦的訊號擷取卡,利用電腦將接收到的光強度訊 號做處理,以軟體進行雜訊的濾除;其刀高磨損與刀具偏 心量測補償步驟如下: 一、將刀具移至量測機構上方,等待喷水噴氣步驟完 成之後’將刀具下降到一固定位置,量測刀具未遮到光束 時的電壓值Vs; 一、將刀具往下移動0· 001m (lmicro meter),以取 > 樣頻率厶截取電壓值。若刀具旋轉速度為w RPM,則截取 刀具旋轉一周(即(6〇*f)/w點)的電壓值總和,取其平均 電壓值。紀錄本次電壓值; 三、 重複步驟二,直到刀具完全遮斷光束且達到指定 的位置; 四、 量測刀具完全遮斷光束時的電壓值V e ; 五、 刀具移至原點; 六、 利用V s,V e將量測到的電壓訊號做規一化( Normalize),紀錄當電壓為〇· 5時之電壓與位置 12 1303856 ,率’叹z轴位置Zc,以作為如量計算之 參數; 七右本—人為第一次測高,脉纪錄本:欠電麼與位置曲 線作為測兩之基準,否則利用内插法計算出同 ,電廢下刀具的高度差,計算不同電壓時的平均 南又差J^U十异出之平均高度差作刀高補償; 八、 將刀具移至Ze位置,準備計算偏心量; 九、 以取樣頻率fs抓取多次電壓值並紀錄; 十、經過咼通與低通濾波器後,計算出平均電壓變化 量Δν; Η^一、計算出此刀之偏心量。 2·如申請專利範圍帛1項所述之非接觸式晶圓切割 刀之刀高賴制猶枝,其巾域_絲面黏貼透 光性極高之藍寶石玻璃,切割過程中並在藍寶石玻璃表面 噴水與喷高壓乾燥氣體,避免粉塵黏附其上,及保持環境 的穩定與避免水滴滑落影響量測值。 131303856 X. Patent application scope: νί · A non-contact wafer cutter with high wear and tool eccentricity compensation method' is mainly used to fix two periscope fiber optic sensors at both ends of a certain distance. One of the fiber optic sensors emits a beam of stable intensity, the other fiber optic sensor receives the beam, and the two fiber optic sensors • the back end is connected to a photo-amplifier, which has an output and an input hole; the output hole The bit produces a stable red light source, and the input hole position converts the received light intensity into a voltage value. The analog output of the photo-amplifier> is connected to the computer's signal capture card, and the computer receives the received light intensity signal. Processing, filtering the noise by software; the steps of tool height wear and tool eccentricity measurement compensation are as follows: 1. Move the tool to the top of the measuring mechanism, wait for the water jet step to complete, and then lower the tool to a fixed position. , measure the voltage value Vs when the tool does not cover the beam; 1. Move the tool down 0· 001m (lmicro meter) to fetch the image frequency Rate 厶 intercept voltage value. If the tool rotation speed is w RPM, the sum of the voltage values of the tool rotation (ie (6〇*f)/w point) is intercepted, and the average voltage value is taken. Record the current voltage value; 3. Repeat step 2 until the tool completely interrupts the beam and reaches the specified position. 4. The voltage value V e when the measuring tool completely interrupts the beam; 5. The tool moves to the origin; Use V s, V e to normalize the measured voltage signal, record the voltage and position 12 1303856 when the voltage is 〇·5, and rate the sigh z-axis position Zc as the calculation. Parameter; Seven Right--the first time for human height measurement, pulse record book: Under-power and position curve are used as the benchmark for measuring two. Otherwise, the interpolation method is used to calculate the difference between the height of the tool and the electric waste. When calculating different voltages The average south difference is J^U, and the average height difference is used as the knife height compensation; 8. Move the tool to the Ze position and prepare to calculate the eccentricity; 9. Capture the voltage value and record it at the sampling frequency fs; After passing through the low-pass filter, the average voltage change amount Δν is calculated; Η^1, and the eccentricity of the knife is calculated. 2. The non-contact wafer cleaver blade according to the scope of patent application 帛1 is highly sturdy, the sapphire glass is adhered to the sapphire glass, and the sapphire glass is cut during the cutting process. The surface is sprayed with water and sprayed with high-pressure drying gas to prevent the dust from sticking to it, and to maintain the stability of the environment and to prevent the drop of water from affecting the measured value. 13
TW95127917A 2006-07-31 2006-07-31 Measurement compensation method for high abrasion and cutter bias of non-contact wafer dicing blade TW200807594A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95127917A TW200807594A (en) 2006-07-31 2006-07-31 Measurement compensation method for high abrasion and cutter bias of non-contact wafer dicing blade

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95127917A TW200807594A (en) 2006-07-31 2006-07-31 Measurement compensation method for high abrasion and cutter bias of non-contact wafer dicing blade

Publications (2)

Publication Number Publication Date
TW200807594A TW200807594A (en) 2008-02-01
TWI303856B true TWI303856B (en) 2008-12-01

Family

ID=44766692

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95127917A TW200807594A (en) 2006-07-31 2006-07-31 Measurement compensation method for high abrasion and cutter bias of non-contact wafer dicing blade

Country Status (1)

Country Link
TW (1) TW200807594A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7037964B2 (en) * 2018-03-09 2022-03-17 東京エレクトロン株式会社 How the system operates to inspect the measuring instrument and focus ring
CN109877689B (en) * 2019-03-27 2023-05-26 南京春辉科技实业有限公司 Automatic grinding wheel cutting device for continuously circumferentially cutting cylindrical rod piece and compensation method
CN113053770B (en) * 2021-03-15 2024-03-08 上海华力微电子有限公司 Wafer cutting method
CN114986725B (en) * 2022-05-25 2024-03-22 光力瑞弘电子科技有限公司 Dicing saw cutting method, dicing device, dicing saw and medium
CN116653142A (en) * 2023-06-01 2023-08-29 江苏京创先进电子科技有限公司 Method and device for detecting eccentric amount of cutter blade of dicing saw and dicing saw

Also Published As

Publication number Publication date
TW200807594A (en) 2008-02-01

Similar Documents

Publication Publication Date Title
TWI303856B (en)
US9841352B2 (en) System and method for monitoring gear and bearing health
CN100568448C (en) A kind of etching terminal checkout gear and method of plasma etching equipment
EA017182B1 (en) Arrangement and process for the detection of the sharpness of chopper knives
Simon et al. Multispectral near‐IR reflectance imaging of simulated early occlusal lesions: Variation of lesion contrast with lesion depth and severity
EP2250963A3 (en) Pulmonary monitoring system
JP2007523756A5 (en)
CN103968973A (en) Shock excitation method for vibrating wire sensor
CN110653223A (en) Laser cleaning monitoring device and monitoring method thereof and laser cleaning machine
JP2011069821A (en) Method for detecting and filtering out random noise signals
WO2013003739A3 (en) Sonar method and apparatus for determining material interfaces in wheel servicing equipment
JP2007170941A (en) Distortion measuring device, method, program and recording medium
WO2012055542A3 (en) Apparatus and method for monitoring cleaning
US9013697B2 (en) Band detection sensor and detection method therefor
FR2896518A1 (en) METHOD AND MEANS FOR CONTROLLING THE FOCATION OF A NEEDLE MAKER
CN108015665A (en) Machinery grinding machine abnormity detecting instrument and method for detecting, machinery grinding machine
MX2021014812A (en) A method and arrangement for estimating a material property of an object by means of a laser ultrasonic (lus) measurement equipment.
SG130984A1 (en) Real time monitoring of particulate contamination in a wafer processing chamber
CN108088482B (en) Atmospheric environment double-parameter synchronous measurement method and system
EP1674823A8 (en) Tunable laser for dynamic measurement
CN115931885A (en) Cutter notch detection method and device
EP2548016B1 (en) Method and device for characterizing sensory properties of fabrics
TW201617534A (en) Method of determining parallelism between two sliding rails of ball screw feeding system with embedded sensor module
JP2010120117A (en) Method for estimating machining surface and device for estimating the same
EP1464435A1 (en) Method for controlling the quality of an industrial laser process

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees