1303544 九、發明說明·· 【發明所屬之技術領域】 本發明係關於一種印刷冑路板焊接結構，且特別係一種 ^生印刷電路板與適合各種印刷铋板焊接而成祕板焊接 【先前技術】 近年來，权性印刷電路板被廣泛地應用在消費性電子產 品領域中，例如··行動電話、個人數位賴、触相機、筆記 型電腦及平板顯示器等。 由於軟性印刷電路板具有輕薄及可撓曲等特性，使得產 口口得以5又计的越來越輕薄短小。一般軟性印刷電路板主要由聚 亞醯氨_(PI，線路板的—縣材），雜鮮劑，再與裸銅 基板壓合而成。然而為了避免裸銅基板表面受損，在裸銅基板 表面上會再覆蓋防焊層，供保護及絕緣裸銅基板上之線路。 如圖1所示，為習知二塊軟性印刷電路板貼合之正視圖。 第一印刷電路板10在覆膜覆層18上挖設有至少一焊接區域 12，供第二印刷電路板2〇之焊接區域24相對應設置。這些焊 接區域12、24即為裸銅基板，在裸銅基板上設置具有已圖樣 化之導電膜（圖未繪示）。又請同時參考圖2所示，習知焊接方 式係將第一印刷電路板10之焊接區域12中挖設圓孔μ，並 貝牙至弟一印刷笔路板20焊接區域24之表面，施以溶融之焊 料30連接，待其固化後而彼此連接。 習知以挖設圓孔14的方式焊接，將第一、第二印刷電路 板10、20連接固定，然而，由於挖設圓孔μ的方式，其開口 5 1303544 較小，故可供焊料30進入 自身表面張力軸+编狹小，再加上焊料30 刷雷尬m Γ 使焊料30不易完全流入第一、第二印 刷電路板10、20空間中。·〜 ^ 1 孔3?，、隹偷& 口此，各易造成焊接不全而形成空 〜g線路的斷路或裸崎裂的情形發生。 【發明内容】 產品#目_於提供—種基板焊接轉，可增加 精簡另—目的在於提供—種基贿接結構，具有較 於焊之另—目的在概供—種基板焊接結構，具有易 本發明之另—目的在於提供—種基板焊接結構，更容易 導入生產流程。 本發明之-種基板焊接結構，包含一第一配線板。此第 -配線板進-步具有至少—電連接墊及至少—焊接槽。每一 電連接墊设置於配線板上，且每一電連接墊具有二側邊。每 一焊接槽係形成於每一電連接墊上，並連通二側邊。 在較佳實施例中，此第一配線板更包含有覆層及基層， 覆層係覆蓋電連接墊之表面，基層係成形並連接於電連^墊 之下方。此外，每一焊接槽連通二側邊後較佳係形成矩形。 也就是說’此矩形較佳係貫穿電連接塾及基層。 本發明更長：供一弟一配線板，供與第一配線板焊接。然 而第二配線板更具有第二電連接墊。第二電連接墊之位置係與 第一電連接墊之部分位置疊合，且與焊接槽對應設置。因此，' 6 '1303544 . 當將熔融之低熔點金屬被膜施以第一電連接墊及第二電連接 墊之空間中時，第一配線板及第二配線板待金屬被膜固化後會 彼此連接。 【實施方式】 本發明係一種軟性印刷電路板與適合各種印刷電路板焊 接而成的基板焊接結構。此基板焊接結構包含第一配線板及與 第二配線板。第一配線板及第二配線板分別包含至少一第一電 • 連接墊及至少一第一焊接槽。每一第一電連接墊設置於第一配 線板上，且每一第一電連接墊具有二側邊。在如圖8所示之較 佳實施例而言，第一配線板較佳為單面板軟性印刷電路板 (FPC) ’第二配線板較佳則包含單面板、雙面板或多層板等軟 性印刷電路板(FPC)，甚至於硬性印刷電路板(pCB)。在此所 言之第一配線板及第二配線板所應用之產品，包含：行動電 話、個人數位助理、數位相機、筆記型電腦及平板顯示器等電 子產品。以下即配合所附圖式，進一步說明本發明之各具體實 Φ 施例及步驟： 、 圖3及圖4所示為本發明第一較佳實施例之部分正視及 为解圖。在此實施例中，基板焊接結構係為使用具有單一第 電連接塾202之弟一配線板200，而與其它電路板（圖未繪 不)連接。第一配線板200包含第一覆層208、第一電連接墊 202、苐基層210以及弟一焊接槽204。其中第一電連接塾 202設置於第一配線板2〇〇上，且第一電連接墊2〇2具有二側 邊206。第一焊接槽204貫穿於第一覆層208、第一電連接墊 202、第一基層210，並連通第一電連接墊2〇2之二側邊2〇6。 7 1303544 -、Γ =第一焊接槽204使每一側邊206均截斷為不連續之 在如圖4所示之實施例中，第一覆層施及第一基 分別位於第—電連接塾202之上、下表面，用以保 二覆芦==!!並具絕緣的作用。進—步而言，挖掉第 卩形成弟一電連接墊202之焊接區域230;第一焊 ^她4 接區域230再分別貫穿並延伸至第一電連1303544 IX. OBJECT DESCRIPTION OF THE INVENTION · Technical Field of the Invention The present invention relates to a printed circuit board soldering structure, and in particular to a soldering circuit board and a soldering board suitable for soldering various printed boards. In recent years, proprietary printed circuit boards have been widely used in the field of consumer electronics, such as mobile phones, personal digital cameras, touch cameras, notebook computers, and flat panel displays. Due to the thinness and flexibility of the flexible printed circuit board, the mouth of the product can be made thinner and lighter and shorter. Generally, the flexible printed circuit board is mainly made up of polyamidamine _ (PI, circuit board - county material), freshener, and then pressed with bare copper substrate. However, in order to avoid damage to the surface of the bare copper substrate, a solder resist layer is overlaid on the surface of the bare copper substrate for protecting and insulating the wiring on the bare copper substrate. As shown in FIG. 1, it is a front view of a conventional two flexible printed circuit boards. The first printed circuit board 10 is provided with at least one soldering region 12 on the film coating 18 for the corresponding soldering regions 24 of the second printed circuit board 2 to be disposed. These soldering regions 12 and 24 are bare copper substrates, and a patterned conductive film (not shown) is provided on the bare copper substrate. Please also refer to FIG. 2 at the same time. The conventional soldering method is to dig a hole μ in the soldering region 12 of the first printed circuit board 10, and to apply a surface to the surface of the soldering region 24 of the printed circuit board 20 of the first printed circuit board 10. They are connected by molten solder 30 and are connected to each other after they are cured. Conventionally, the first and second printed circuit boards 10 and 20 are fixed by soldering in a manner of arranging the circular holes 14. However, since the opening 5 1303544 is small in the manner of arranging the circular holes μ, the solder 30 is available. Entering the surface tension axis of the self-body, the knitting is small, and the solder 30 brush thunder m Γ makes it difficult for the solder 30 to completely flow into the spaces of the first and second printed circuit boards 10 and 20. · ~ ^ 1 hole 3?, 隹 steal & mouth, each easy to cause welding is not complete and the formation of empty ~ g line of open circuit or bare cracking occurs. [Summary of the Invention] Product #目_ Providing a kind of substrate welding turn, can increase the streamlined another - the purpose is to provide a kind of bridging structure, which has a soldering structure compared with the other purpose of the welding - the substrate is welded Another object of the present invention is to provide a substrate soldering structure that is easier to introduce into the production process. The substrate soldering structure of the present invention comprises a first wiring board. The first wiring board has at least an electrical connection pad and at least a soldering groove. Each of the electrical connection pads is disposed on the wiring board, and each of the electrical connection pads has two sides. Each soldering groove is formed on each of the electrical connection pads and communicates with the two sides. In a preferred embodiment, the first wiring board further comprises a coating layer covering the surface of the electrical connection pad, and a base layer formed and connected under the electrical connection pad. In addition, each of the weld grooves preferably forms a rectangle after communicating the two sides. That is to say, the rectangle preferably extends through the electrical connection layer and the base layer. The invention is longer: for a younger one wiring board for welding with the first wiring board. However, the second wiring board further has a second electrical connection pad. The position of the second electrical connection pad is overlapped with a portion of the first electrical connection pad and is disposed corresponding to the soldering slot. Therefore, when the molten low melting point metal film is applied to the space of the first electrical connection pad and the second electrical connection pad, the first wiring board and the second wiring board are connected to each other after the metal film is cured. . [Embodiment] The present invention is a substrate soldering structure in which a flexible printed circuit board is soldered to various printed circuit boards. The substrate soldering structure includes a first wiring board and a second wiring board. The first wiring board and the second wiring board respectively comprise at least one first electrical connection pad and at least one first soldering groove. Each of the first electrical connection pads is disposed on the first wiring board, and each of the first electrical connection pads has two sides. In the preferred embodiment shown in FIG. 8, the first wiring board is preferably a single-panel flexible printed circuit board (FPC). The second wiring board preferably includes a flexible printed circuit such as a single-panel, double-panel or multi-layer board. Board (FPC), even hard printed circuit boards (pCB). The products used in the first and second wiring boards include mobile phones, personal digital assistants, digital cameras, notebook computers, and flat panel displays. In the following, the specific embodiments and steps of the present invention will be further described with reference to the accompanying drawings: FIG. 3 and FIG. 4 are a partial front view and a schematic view of the first preferred embodiment of the present invention. In this embodiment, the substrate soldering structure is connected to other circuit boards (not shown) using a wiring board 200 having a single first electrical connection port 202. The first wiring board 200 includes a first cladding layer 208, a first electrical connection pad 202, a base layer 210, and a soldering groove 204. The first electrical connection port 202 is disposed on the first wiring board 2〇〇, and the first electrical connection pad 2〇2 has two side edges 206. The first soldering groove 204 penetrates through the first cladding layer 208, the first electrical connection pad 202, the first base layer 210, and communicates with the two side edges 2〇6 of the first electrical connection pad 2〇2. 7 1303544 -, Γ = the first soldering groove 204 cuts each side 206 into discontinuities. In the embodiment shown in FIG. 4, the first cladding is applied to the first electrical connection. Above and below the 202, it is used to protect the two layers of the reed ==!! and has the function of insulation. In the step of stepping, the soldering region 230 of the first electrical connection pad 202 is cut out; the first soldering region 4 is further penetrated and extended to the first electrical connection.
样9iU，弟一基腠210。其中連通第一覆層208之第一焊接 二形成之表面積較佳係大於貫穿第一電連接墊2〇2及第 ^層210所形成之表面積。此外，第一焊接槽2〇4形狀較 二矩形。然而在其它不同的實施例中，第-焊接槽2〇4亦 12 ”、、橢_、長方形或其它包含非圓形的形狀。 八^圖5及圖6所示，為本發明第二較佳實施例之組立及 ^圖。具體而言，本發明更提供—種第二配線板删，並供 ^配線板2〇〇焊合。換言之，本實施例中，進一步說明 弟一配線板2°°與第二配線板3。〇之焊接結構及其焊接關 本只轭例中，第二配線板300具有第二電連接墊306。 $電連接墊_之位置係與第一電連接墊逝之部分位置 &合三在如圖6所示之實施例中，第二配線板較佳係已 挖除第-制304,而形成_較大面積之第二電連接墊3〇6(如 剖面線所示），以便於與第一電連接墊202焊合。然而在其它 不同的實施例中，亦可挖除與第一電連接墊202表面積相應 大小之第一覆層304表面積（即第二電連接墊306形成之面 積）。換言之，第二電連接墊3〇6之表面積較佳係大於第一電 連接墊202之表面積。然而在不同的實施例中，第二電連接 墊之表面積亦可小於或等於第一電連接墊2〇2之表面 8 1303544 積三在如圖5及目6所示之實施射，由於第-焊接槽204 於第一電連接塾202上形成連通二側邊206，並使每一側邊 206均截斷為不連續之二部分。因此第一焊接槽204係可從第 一覆層208連通至第一電連接墊202、第一基層210，直到第 二配線板300之第二覆層3〇4。 ,在如圖5、圖6及圖7所示之實施例中，第一焊接槽204 &狀。在實際的細上，在此所言技形四角會 以圓孔連接而成近似矩形。然而在其它不同的實施例中，第 接槽204亦可為橢圓形、長方形或其它包含非圓形的形 狀。在本實施例中，第一焊接槽2〇4在如圖7之剖視圖中係 形成一工字形。換言之，第一電連接墊2〇2形成之表面積較 佳係與第一電連接墊3〇6之表面積相似。然而在如圖5所示 ^上視圖中，由於第一焊接孔2〇4之截面積較佳係呈一矩形， 意即第一電連接墊202及第一基層21〇之截面積為矩形。因 此當貼合並焊接第一配線板200及第二配線板300時，金屬 被膜400十刀谷易流入此呈矩形之第一焊接槽204内，拍曰 同時增加焊接強度。換言之，當金屬被膜400流入呈矩形面 積之第一焊接槽2〇4時，金屬被膜400首先填充於第一覆層 208，流入第一電連接墊2〇2、第一基層21〇，直至填滿第二 覆層304。待金屬被膜4〇〇固化後即使第一配線板2〇〇及第二 配線板300焊合而彼此電性連通。在此所言之金屬被膜4〇〇 包含低熔點之焊錫、鉛錫合金或其它焊接材料。需特別說明 者是，在此所言之第二配線板300較佳係與第一配線板2〇〇 均為單面板之軟性印刷電路板(FPC)，如圖7所示。然而在如 圖8所示之實施例中，第二配線板30〇則可為雙面板、多層 1303544 • 板或其他結構之軟性電路板，亦或者為印刷電路板(PCB)。 圖9及圖10所示為本發明第三較佳實施例之組立及分解 圖。本發明更提供具有複數個第一電連接墊202之第一配線 板200與複數個第二電連接墊3〇6之第二配線板焊接結 構。在圖9所示之實施例中，第一配線板2〇〇具有成對設置 之第一電連接墊202。每一第一電連接墊2〇2具有二侧邊 206。每一第一焊接槽204設置在每一第一電連接墊2〇2上， 並連接二侧邊206，以分別形成诨接區域23〇。在如圖1〇所 籲示之實施例中’每二個第-焊接槽204中間具有絕緣部咖 間隔。換言之，每二個第一焊接槽204間並不切除，使在焊 接過程中第一配線板2〇〇不會翹曲而易於施焊。其中絕緣部 220之面積大小較佳係為第二配線板3〇〇之兩個第二電&連^ 塾306之間隔大小。然而在其它不同的實施例中，'絕緣部咖 之面積大小亦可大於兩個第二電連接墊3〇6之間隔大小。 外，第二配線板3〇〇較佳亦具有第二電連接墊3〇6。第二 接墊306之位置係與第一電連接墊2〇2之部分位置疊、 參 與第一焊接槽’之位置相對應設置。其它結構請參二上^ 陳，在此不再贅述。 " 所 目此當第-配線板200與第二配線板3〇〇貝占合並進 接時，每-第-電連接墊202之焊接區域23〇係對應第:曰 線板300之第二電連接墊306。呈矩形之第一焊接孔配 別對應每-第二電連接塾306，以利焊接。金屬被膜4⑽:刀 順利地流入並填充至呈矩形之第一焊接槽2〇4内之第一^糸可 接塾202及第二電連接塾寫之間，請同時參考圖8 所示。是故，第-焊接孔204面積較大而解決金屬被媒_ 10 1303544 容易因流體表面張力不易流入，造成電連接墊裸露而發生線 路斷路等問題。 一般而言，第一配線板200及第二配線板300之第一/第 二覆層208、304及第一/第二基層210、310之絕緣材質包含 由橡膠混合物、塑膠混合物或特殊飽和聚酯樹脂，並經機器 將第一/第二電連接墊202、306之導電性層熱壓疊合而成。 以較佳實施例而言，第一/第二電連接墊202、306材料較佳 為鑛錫銅材料、銅合金或其它相關導電性材料。 在此需強調的是，第二配線板300與第一配線板200可 為單面板之軟性印刷電路板(FPC)，其剖面如圖7所示。然而 在不同的實施例中，第二配線板300可為雙面板、多層板或 其匕結構之軟性電路板(如圖8所示），或是一般之印刷電路 板(PCB) 〇 如圖11所示，為本發明焊接兩部品之狀態示意圖。在如 圖11所示之較佳實施例中，為顯示面板丨00之第一配線板2〇〇 與應用在發光二極體之第二配線板3〇〇之焊接狀態示意圖。 然而在其它不同的實施例中，兩部品之第一、第二配線板 200、300，亦可分別為行動電話、個人數位助理、數位相機、 筆。己型龟％及平板顯示器等電子商品。此外，在較佳的焊接 過程中，通常會將第一配線板2〇〇及第二配線板3〇〇以膠帶 (圖未緣示)黏貼後，再施以焊接。換言之，即將第一電連接 墊202之第一焊接槽204與第二電連接墊3〇β的第二焊接槽 302相互對應設置，俾利施焊。 、本發明已由上述相關實施例加以描述，然而上述實施例僅 為實施本發明之範例。必需指出的是，已揭露之實施例並未限 11 1303544Sample 9iU, brother one base 210. The surface area formed by the first solder 2 connecting the first cladding layer 208 is preferably greater than the surface area formed by the first electrical connection pads 2〇2 and the second layer 210. Further, the first welding groove 2〇4 has a shape of two rectangles. However, in other different embodiments, the first-welding groove 2〇4 is also 12′′, elliptical—, rectangular, or other shape including a non-circular shape. FIG. 5 and FIG. 6 show the second comparison of the present invention. In particular, the present invention further provides a second wiring board for cutting and soldering the wiring board. In other words, in this embodiment, the wiring board 2 is further illustrated. °° and the second wiring board 3. The welding structure of the crucible and the welding thereof are only in the yoke example, the second wiring board 300 has the second electrical connection pad 306. The position of the electrical connection pad is the first electrical connection pad In the embodiment shown in FIG. 6, the second wiring board is preferably excavated from the first system 304 to form a second electrical connection pad 3〇6 of a larger area ( As shown by the hatching, in order to be soldered to the first electrical connection pad 202. However, in other different embodiments, the surface area of the first cladding layer 304 corresponding to the surface area of the first electrical connection pad 202 may also be removed ( That is, the area formed by the second electrical connection pad 306. In other words, the surface area of the second electrical connection pad 3〇6 is preferably greater than the first The surface area of the connection pad 202. However, in different embodiments, the surface area of the second electrical connection pad may also be less than or equal to the surface of the first electrical connection pad 2〇2, which is shown in FIG. 5 and FIG. The first soldering trench 204 is detachable from the first soldering trench 204 by forming the two side edges 206 on the first electrical connecting port 202 and cutting each of the side edges 206 into two discontinuous portions. A cladding layer 208 is connected to the first electrical connection pad 202, the first base layer 210, to the second cladding layer 3〇4 of the second wiring board 300. In the embodiment shown in FIGS. 5, 6, and 7. The first welding groove 204 & in the actual fineness, the four corners of the technical shape are connected by a circular hole to be approximately rectangular. However, in other different embodiments, the first groove 204 may also be an ellipse. Shape, rectangle or other shape comprising a non-circular shape. In the present embodiment, the first welding groove 2〇4 is formed in an I-shape in a cross-sectional view as shown in Fig. 7. In other words, the first electrical connection pad 2〇2 is formed. The surface area is preferably similar to the surface area of the first electrical connection pad 3〇6. However, as shown in FIG. In the figure, since the cross-sectional area of the first soldering hole 2〇4 is preferably a rectangle, that is, the cross-sectional area of the first electrical connection pad 202 and the first base layer 21〇 is rectangular. Therefore, when the first wiring board is pasted and welded, 200 and the second wiring board 300, the metal film 400 is easy to flow into the rectangular first welding groove 204, and the welding strength is increased at the same time. In other words, when the metal film 400 flows into the first welding groove having a rectangular area 2〇4, the metal film 400 is first filled in the first cladding layer 208, and flows into the first electrical connection pad 2〇2 and the first base layer 21〇 until the second cladding layer 304 is filled. After the metal film 4 is cured Even if the first wiring board 2 and the second wiring board 300 are soldered together, they are electrically connected to each other. The metal film 4 在 described herein contains a low melting point solder, a lead tin alloy or other solder material. It is to be noted that the second wiring board 300 as described herein is preferably a flexible printed circuit board (FPC) which is a single panel of the first wiring board 2, as shown in FIG. However, in the embodiment shown in Fig. 8, the second wiring board 30〇 may be a double panel, a multilayer 1303544 • board or other flexible circuit board, or a printed circuit board (PCB). 9 and 10 show an assembly and an exploded view of a third preferred embodiment of the present invention. The present invention further provides a second wiring board soldering structure having a plurality of first electrical connection pads 202 of the first wiring board 200 and a plurality of second electrical connection pads 3〇6. In the embodiment shown in Fig. 9, the first wiring board 2 has the first electrical connection pads 202 disposed in pairs. Each of the first electrical connection pads 2〇2 has two sides 206. Each of the first soldering slots 204 is disposed on each of the first electrical connection pads 2〇2 and connects the two side edges 206 to form the splicing regions 23〇, respectively. In the embodiment as claimed in Fig. 1A, there is an insulating portion interval between every two first-welding grooves 204. In other words, each of the two first soldering grooves 204 is not cut off, so that the first wiring board 2 is not warped during the soldering process and is easy to be soldered. The area of the insulating portion 220 is preferably the size of the interval between the two second electric & 塾 306 of the second wiring board 3〇〇. However, in other different embodiments, the area of the insulating portion may be larger than the interval between the two second electrical connecting pads 3〇6. In addition, the second wiring board 3 〇〇 preferably also has a second electrical connection pad 3〇6. The position of the second pad 306 is disposed in a position overlapping with a portion of the first electrical connection pad 2〇2 and corresponding to the position of the first soldering groove ′. For other structures, please refer to 2. Chen, no longer repeat them here. " When the first wiring board 200 and the second wiring board 3 are combined, the welding area 23 of each of the first electrical connection pads 202 corresponds to the second: the second of the third board 300 Electrical connection pad 306. The first soldering holes in a rectangular shape correspond to each of the second electrical connections 306 to facilitate soldering. The metal film 4 (10): the blade smoothly flows into and fills between the first electrode 202 and the second electrical connection in the rectangular first soldering groove 2〇4, as shown in Fig. 8. Therefore, the area of the first-welding hole 204 is large, and the solution of the metal medium _ 10 1303544 is liable to flow due to the surface tension of the fluid, causing the electric connection pad to be exposed and the line to be broken. In general, the insulating materials of the first/second cladding layers 208, 304 and the first/second base layers 210, 310 of the first wiring board 200 and the second wiring board 300 are composed of a rubber mixture, a plastic mixture or a special saturated poly The ester resin is formed by heat-pressing the conductive layers of the first/second electrical connection pads 202, 306 by a machine. In the preferred embodiment, the first/second electrical connection pads 202, 306 are preferably mineral tin copper materials, copper alloys or other related electrically conductive materials. It should be emphasized here that the second wiring board 300 and the first wiring board 200 may be a single-panel flexible printed circuit board (FPC), and its cross section is as shown in FIG. However, in different embodiments, the second wiring board 300 can be a double-panel, multi-layer board or a flexible circuit board of the same structure (as shown in FIG. 8), or a general printed circuit board (PCB), as shown in FIG. Shown is a schematic view of the state of welding two parts of the present invention. In the preferred embodiment as shown in Fig. 11, a schematic view of the welding state of the first wiring board 2A of the display panel 丨00 and the second wiring board 3〇〇 applied to the light-emitting diode is shown. However, in other different embodiments, the first and second wiring boards 200, 300 of the two products may also be mobile phones, personal digital assistants, digital cameras, and pens, respectively. Electronic products such as % turtles and flat panel displays. Further, in the preferred soldering process, the first wiring board 2 and the second wiring board 3 are usually adhered by a tape (not shown) and then soldered. In other words, the first soldering groove 204 of the first electrical connection pad 202 and the second soldering groove 302 of the second electrical connection pad 3β are disposed corresponding to each other to facilitate welding. The present invention has been described by the above related embodiments, but the above embodiments are merely examples for implementing the present invention. It must be pointed out that the disclosed embodiments are not limited to 11 1303544
之修改及均料置均包含;神及範 【圖式簡單說明】 圖1為先前技藝中軟板之貼合之正視圖； 圖2為習知軟板焊接結構剖面圖； 圖3為本發明第一較佳實施例之部分正視圖； 圖4為圖3之A-A剖視圖； 馨 目5為本發明第二較佳實施例之部分貼合圖； 圖6為圖5之分解示意圖： 圖7為圖5之B-B剖面圖； 圖8為圖5之另一較佳實施例圖； 圖9為本發明第三較佳實施例之部分組立示意圖； 圖10為圖9之分解示意圖；及 圖11為本發明基板焊接結構之使用狀態示意圖。 Φ 【主要元件符號說明】 100顯示裝置 200第一配線板 202第一電連接墊 204第一烊接槽 206側邊 208第一覆層 210第一基層 220絕緣部 12 1303544 230焊接區域 300第二配線板 304第二覆層 306第二電連接墊 310第二基層 400金屬被膜BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front view of a prior art soft board bonding; FIG. 2 is a cross-sectional view of a conventional soft board welding structure; Figure 4 is a partial cross-sectional view of the second preferred embodiment of the present invention; Figure 6 is an exploded view of Figure 5: Figure 7 is an exploded view of Figure 5; Figure 5 is a cross-sectional view of another preferred embodiment of Figure 5; Figure 9 is a partial schematic view of a third preferred embodiment of the present invention; Figure 10 is an exploded perspective view of Figure 9; A schematic view of the state of use of the substrate solder structure of the present invention. Φ [Main component symbol description] 100 display device 200 first wiring board 202 first electrical connection pad 204 first splicing groove 206 side 208 first cladding layer 210 first base layer 220 insulation portion 12 1303544 230 welding region 300 second Wiring board 304 second coating 306 second electrical connection pad 310 second base layer 400 metal film