TWI302376B - Structures of multiple module board - Google Patents

Structures of multiple module board Download PDF

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Publication number
TWI302376B
TWI302376B TW095120088A TW95120088A TWI302376B TW I302376 B TWI302376 B TW I302376B TW 095120088 A TW095120088 A TW 095120088A TW 95120088 A TW95120088 A TW 95120088A TW I302376 B TWI302376 B TW I302376B
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TW
Taiwan
Prior art keywords
circuit module
circuit
boards
board
module board
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Application number
TW095120088A
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Chinese (zh)
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TW200746385A (en
Inventor
Tengchang Lin
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Dotop Technology Inc
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Priority to TW095120088A priority Critical patent/TWI302376B/en
Publication of TW200746385A publication Critical patent/TW200746385A/en
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Publication of TWI302376B publication Critical patent/TWI302376B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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  • Combinations Of Printed Boards (AREA)

Description

1302376 九、發明說明： 【發明所屬之技術領域】 本發明是有關於-種多電路模組結構，且特別是有關 於一種介面整合的多電路模組結構。 【先前技術】 近年來/肖費性電子產業蓬勃發展，產品更新的速度也 愈來愈快，各廠商無不竭盡所能⑽新產品以紅消費者 需求。而消費性電子產品中的外接式儲存裝置(或可攜式儲 存裝置），向來以方便使用及高機動性著稱，用戶可隨時隨 地以此備份重要資料，並可作大量的資料傳輸。其中，外 接式儲存裝置具有許多種傳輸介面，例如最廣為使用的 工刪削或USB等有線傳輸介面，甚或__^ 或等無線傳輸介面，而使用者可依照本身不同的需 求’挑選適合的介面進行資料傳輸。 隨著各式各樣的電子產品紛紛推出之際，使用者的需 求愈來愈多元化，介面亦愈來愈複雜，各家公司必須因應 要求設計不同的介面，甚或必須整合多種介面於產品中， 以符合使用上的便利性。所以，在製作電子產品的過程中， 習知的作法首先便是設計電路板，將指定所需的介面功能 加以整合於一電路模組板中。因此，整合不同介面就需要 不同的電路板設計，才能符合不同的使用者需求。然而， 在每一次製作的過程中都必須重新設計電路板，才可整合 不同介面來因應不同客戶的要求，如此作法不但既浪費時 間又不符合成本效益，一直以來為各廠商相當困擾的問題。 1302376 因此，如何能在最短的時間内整合多種不同介面，滿 足客戶多元化的需求並降低產品成本，便成為每家公司極 力研發的目標。 【發明内容】 本發明之目的就是在提供一種多電路模組結構，以達 到產品客製化的需求，縮短產品製造時間，並符合成本效 益。 根據本發明之上述目的，提出一種多電路模組結構， 用以整合不同功能之電路模組。依照本發明一較佳實施 例，此多電路模組結構包含多個電路模組板，各具不同獨 立功旎，且分別為電源電路板、控制電路板、通用串列匯 流排（USB)電路板以及中央處理（cpu)電路板。再分別以頂 針或其他電性連接件，連接一電路板的零件面與另一電路 板的焊接面，使二電路板重疊。接著以此方式逐一堆疊， 將電路板以類似晶片堆疊的方式，組合成一完整電路結構。 如此作法，在整合不同介面或功能時，不需再額外進 行電路板設計的動作，只需要將電路訊號連接即可，不僅 大大地減少製作的時間，此堆疊結構也縮小了產品的體 積，節省整體電路板使用的空間，降低製造成本。另外， 此堆疊結構與習知作法不同之處在於，因為電路板採堆疊 方式’使得電路板原本會產生的電磁輻射被上下二電路板 隔絕’而最頂端與最底端電路板產生的電磁輻射，則由其 中的地線層將干擾訊號導至接地端。所以，在一般電路板 中產生的電磁干擾（EMI)、電磁相容（EMC)或靜電放電（ESD) 1302376 等問題不復存在。 依照本發明另一較佳實施例，此多電路模組結構包含 微處理（MCU)電路板、；[EEE 1394資料匯流排電路板、通用 串列匯流排（USB)電路板、電源電路板以及控制電路板。由 訊號線或其他電性連接件，將一電路板的側邊與另一電路 板的側邊連接，以類似拼圖的方式並排組合，形成一完整 電路結構。因此，本發明之多電路模組結構可依照不同需 求，選擇不同的電路板加以整合，不僅達到迅速客製化的 效果’也減低了產品製造的困難度且降低成本，並增加產 品推出的速度，符合消費者需求，可說是一舉數得。 【實施方式】 本發明提出一種多電路模組結構，每一電路模組板各 具不同獨立介面功能，以電性連接件相互連接，省卻電路 設計的步驟，用組合方式整合不同介面功能，形成一完整 電路結構。在一較佳實施例中，各電路模組板以堆疊的方 式組合成一完整電路結構。在另一較佳實施例中，各電路 杈組板則以並排的方式組合成一完整電路結構。以簡單的 電路連接方式，連接不同功能的模組板，將不同介面加以 整合，不需另行設計電路板，如此不但可輕易地達到整合 的目的，也節省產品製造的時間及成本，完成迅速客製化 的效果。 請參照第1圖，係繪示依照本發明一較佳實施例之一 種多電路模組堆疊結構之剖面圖。此堆疊結構100包含中 央處理（CPU)電路板102、通用串列匯流排（腦）電路板 1302376 104、控制電路板106以及電源電路板l〇8，其中每一電路 板均具有焊接元件的零件面112以及相對的焊接面114,且 以電性連接件110相互連接。首先，以電性連接件110(如 頂針或焊錫球）將CPU電路板102的零件面112與USB電 路板104的焊接面114作上下重疊的電性連接，以便使二 電路板的電路訊號能相互傳遞。接著，再以同樣的電性連 接方式連接USB電路板104與控制電路板1〇6 ’以及控制 電路板106與電源電路板108，以此方式逐一堆疊。 • 另外，CPU電路板102的另一面更黏接一散熱片118， 以便散出整體電路結構運作時產生的熱。且最頂端的電源 電路板108與最底端的CPU電路板102中各具一地線層， 將干擾訊號導至接地端。而此堆疊結構並非唯一的堆疊方 式或堆疊順序，習知技術者可任意將至少二不同獨立功能 的電路板作電性堆疊，形成一完整電路結構。 請參照第2圖，係繪示依照本發明另一較佳實施例之 一種多電路模組並排結構之俯視圖。此並排結構200係由 φ 微處理（MCU)電路板202、IEEE 1394資料匯流排電路板 204、USB電路板206、控制電路板208以及電源電路板210 組成。首先，以電性連接件212(如電路訊號線）將MCU電 路板202的一侧邊與IEEE 1394資料匯流排電路板204的 一側邊連接，呈水平並排組合，使二電路板間的電路訊號 能相互傳輸。接著，再分別以水平並排的方式連接MCU電 路板202與USB電路板206、MCU電路板202與控制電路 板208，以及MCU電路板202與電源電路板21〇，組合成 一完整電路結構。其中，此並排組合的電路結構並不限於 8 1302376 此並排方式或並排順序，習知技術者可任意將至少二不同 獨立功能的電路板作電性並排，形成_完整電路結構/ 雖然本發明已以一較佳實施例揭露如上，然其並非用 以限定本發明，任何所屬技術領域中具有通常知識者，在 不脫離本發明之精神和範圍内，當可作各種之更動與潤 飾’因此本發明之保護範圍當視後附之t請專利範圍^ 定者為準。 1 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之詳細說明如下： 第1圖是係繪示依照本發明一較佳實施例之一種多電 路模組堆疊結構之剖面圖。 第2圖係緣示依照本發明另一較佳實施例之一種多電 路板組並排結構之俯視圖。 114 ·焊接面 116 :地線層 :散熱片 200 :並排結構 【主要元件符號說明】 100 :堆疊結構 102 : CPU電路板 104、206 : USB 電路板 106、208 :控制電路板 1302376 108、210 :電源電路板 202 : MCU電路板 110、212 :電性連接件 204 : IEEE 1394電路板 112 :零件面1302376 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a multi-circuit module structure, and more particularly to a multi-circuit module structure for interface integration. [Prior Art] In recent years, the Xiaofei electronic industry has flourished, and the speed of product renewal has become faster and faster. All manufacturers are doing everything they can (10) new products to meet the needs of consumers. External storage devices (or portable storage devices) in consumer electronics have always been known for their ease of use and high mobility. Users can back up important data at any time and anywhere, and can transfer large amounts of data. Among them, the external storage device has a variety of transmission interfaces, such as the most widely used wired transmission or USB cable transmission interface, or even __^ or other wireless transmission interface, and the user can select the appropriate one according to different needs of the user. Interface for data transfer. With the launch of a wide variety of electronic products, users' needs are becoming more diverse and interfaces are becoming more complex. Companies must design different interfaces in response to their requirements, or even integrate multiple interfaces into their products. To meet the convenience of use. Therefore, in the process of making electronic products, the conventional method is to design a circuit board and integrate the specified interface functions into a circuit module board. Therefore, integrating different interfaces requires different board designs to meet different user needs. However, in each production process, the board must be redesigned to integrate different interfaces to meet the requirements of different customers. This practice is not only wasteful of time but also cost-effective, and has been a problem that has been plagued by various manufacturers. 1302376 Therefore, how to integrate multiple different interfaces in the shortest time to meet the diversified needs of customers and reduce the cost of products has become the goal of every company. SUMMARY OF THE INVENTION It is an object of the present invention to provide a multi-circuit module structure that meets the needs of customized products, shortens product manufacturing time, and is cost effective. According to the above object of the present invention, a multi-circuit module structure is proposed for integrating circuit modules of different functions. According to a preferred embodiment of the present invention, the multi-circuit module structure comprises a plurality of circuit module boards, each having different independent functions, and respectively being a power circuit board, a control circuit board, and a universal serial bus (USB) circuit. Board and central processing (cpu) board. Then, by using a thimble or other electrical connector, the soldering surface of the component surface of one circuit board and the other circuit board is connected to overlap the two circuit boards. This is then stacked one by one in this way, and the boards are combined into a complete circuit structure in a wafer-like stack. In this way, when integrating different interfaces or functions, no additional board design is required, and only the circuit signals need to be connected, which not only greatly reduces the production time, but also reduces the volume of the product and saves the product. The space used by the overall board reduces manufacturing costs. In addition, this stacking structure differs from the conventional method in that the electromagnetic radiation generated by the topmost and bottommost circuit boards is caused by the stacking method of the circuit board 'so that the electromagnetic radiation originally generated by the circuit board is isolated by the upper and lower circuit boards'. Then, the ground layer is used to guide the interference signal to the ground. Therefore, problems such as electromagnetic interference (EMI), electromagnetic compatibility (EMC), or electrostatic discharge (ESD) 1302376 generated in a general circuit board no longer exist. According to another preferred embodiment of the present invention, the multi-circuit module structure includes a micro processing (MCU) circuit board, [EEE 1394 data bus circuit board, a universal serial bus (USB) circuit board, a power circuit board, and Control board. The side edges of one circuit board are connected to the side edges of the other circuit board by signal lines or other electrical connectors, and are combined side by side in a jigsaw-like manner to form a complete circuit structure. Therefore, the multi-circuit module structure of the present invention can be integrated according to different requirements, and different circuit boards can be integrated, which not only achieves a rapid customization effect, but also reduces the difficulty of product manufacturing and reduces the cost, and increases the speed of product launch. In line with the needs of consumers, it can be said that it is counted. [Embodiment] The present invention provides a multi-circuit module structure, each of which has different independent interface functions, and is electrically connected to each other, eliminating the steps of circuit design, and integrating different interface functions by a combination method to form A complete circuit structure. In a preferred embodiment, the circuit module boards are combined in a stacked manner into a complete circuit configuration. In another preferred embodiment, the individual circuit boards are combined in a side-by-side manner into a complete circuit configuration. By simple circuit connection, connecting different function module boards, integrating different interfaces, no need to design a circuit board separately, so that not only can the integration purpose be easily achieved, but also the time and cost of product manufacturing can be saved, and the quick passenger can be completed. The effect of the system. Referring to FIG. 1, a cross-sectional view of a multi-circuit module stack structure in accordance with a preferred embodiment of the present invention is shown. The stack structure 100 includes a central processing (CPU) circuit board 102, a universal serial bus (brain) circuit board 1302376 104, a control circuit board 106, and a power supply circuit board 108, each of which has a solder component The face 112 and the opposing soldering surface 114 are connected to each other by an electrical connector 110. First, the component surface 112 of the CPU circuit board 102 and the soldering surface 114 of the USB circuit board 104 are electrically connected to each other by an electrical connection member 110 (such as a thimble or a solder ball) so that the circuit signals of the two circuit boards can be electrically connected. Pass each other. Then, the USB circuit board 104 and the control circuit board 1〇6' and the control circuit board 106 and the power supply circuit board 108 are connected in the same electrical connection manner, and stacked one by one in this manner. • In addition, the other side of the CPU board 102 is further bonded to a heat sink 118 to dissipate heat generated during operation of the overall circuit structure. And the topmost power circuit board 108 and the bottommost CPU circuit board 102 each have a ground layer, and the interference signal is led to the ground. The stacking structure is not the only stacking method or stacking sequence. The prior art can electrically stack at least two boards with different independent functions to form a complete circuit structure. Referring to FIG. 2, a top view of a side-by-side structure of a multi-circuit module in accordance with another embodiment of the present invention is shown. The side-by-side structure 200 is composed of a φ micro processing (MCU) circuit board 202, an IEEE 1394 data bus circuit board 204, a USB circuit board 206, a control circuit board 208, and a power supply circuit board 210. First, one side of the MCU circuit board 202 is connected to one side of the IEEE 1394 data busbar circuit board 204 by electrical connectors 212 (such as circuit signal lines), and is horizontally side by side combined to make the circuit between the two circuit boards. Signals can be transmitted to each other. Then, the MCU circuit board 202 and the USB circuit board 206, the MCU circuit board 202 and the control circuit board 208, and the MCU circuit board 202 and the power supply circuit board 21 are respectively connected in a horizontally side by side manner, and combined into a complete circuit structure. The circuit structure of the side-by-side combination is not limited to the 8 1302376 side-by-side or side-by-side sequence, and the prior art may arbitrarily connect at least two different independent functional boards side by side to form a _complete circuit structure / although the present invention has The present invention is disclosed in a preferred embodiment, and is not intended to limit the invention. Any one of ordinary skill in the art can make various changes and refinements without departing from the spirit and scope of the invention. The scope of protection of the invention shall be subject to the scope of the patent attached to it. BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, advantages and embodiments of the present invention will become more <RTIgt; A cross-sectional view of a multi-circuit module stack structure of a preferred embodiment. Figure 2 is a plan view showing a side-by-side structure of a multi-circuit board group in accordance with another preferred embodiment of the present invention. 114 · Soldering surface 116: Grounding layer: Heat sink 200: Side-by-side structure [Main component symbol description] 100: Stacking structure 102: CPU circuit board 104, 206: USB circuit board 106, 208: Control circuit board 1302376 108, 210: Power circuit board 202: MCU circuit board 110, 212: electrical connector 204: IEEE 1394 circuit board 112: part face

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Claims (1)

1302376 十、申請專利範圍： 1·一種多電路模組結構，包含·· 複數個電路模組板，其中每一該些電路模組板各 同獨立介面功能，亦均具焊接電子元件於其上之—突/、 與相對於該零件面之一焊接面；以及 零件面 —複數個電性連接件，用以電性連接該些電路模組 —電路模組板之該零件面與另—電路模組板之該焊接面， • ㈣零件面與該焊接面重疊，以如此連接方式逐—堆疊，’ 使該些電路模組板形成一堆疊之電路結構。 2.如申請專㈣1項所述之多電路模組結構，1 中該堆疊之電路結構中有一最頂端之電路模組板與一最底 端之電路模組板，且該最頂端與該最底端之電路模組板均 具一地線層，將干擾信號導入接地端。 鲁 A3.如中請專利範圍第1項所述之多電路模組結構，更 包含-散熱片黏接於該堆叠之電路結構中該最底端之電路 模組板之該焊接面上。 4·如申咕專利範圍第1項所述之多電路模組結構，其 中該些電路模組板中至少有—電路模組板具電源電路、控 制電路、中央處理電路或信號實體層之控制邏輯電路功能。 如申明專利範圍苐1項所述之多電路模組結構，其 11 1302376 中該些電路模組板為IEEE 1394、USB、SATA、IDE或SCSI 所屬之有線傳輸介面功能電路模組板。 6. 如申請專利範圍第1項所述之多電路模組結構，其 中該些電路模組板為紅外線、藍芽技術、ZigBee或WiFi 所屬之無線傳輸介面功能電路模組板。 7. —種多電路模組結構，包含： # 複教個電路模組板，其中每一該些電路模組板各具不 同獨立介面功能，且每一該些電路模組板均具一零件面焊 接電子元件於其上與一焊接面相對於該零件面；以及 複數個電性連接件，其中該些電性連接件連接該些電 路模組板中一電路模組板之一側邊與另一電路模組板之一 側邊，使該二電路模組板呈水平並排連接，以如此連接方 式逐一並排，使該些電路模組板形成一並排之電路結構。 • 8.如申請專利範圍第7項所述之多電路模組結構，其 中該些電路模組板中至少有一電路模組板具電源電路、控 制電路、中央處理電路或信號實體層之控制邏輯電路功能。 9. 如申請專利範圍第7項所述之多電路模組結構，其 中該些電路模組板為紅外線、藍芽技術、ZigBee或WiFi &quot; 所屬之無線傳輸介面功能電路模組板。 10. 如申請專利範圍第7項所述之多電路模組結構，其 12 1302376 中該些電路模組板為IEEE 1394、USB、SATA、IDE或SCSI 所屬之有線傳輸介面功能電路模組板。 11. 一種多電路模組結構，包含： 複數個電路模組板，其中每一該些電路模組板各具不同 獨立介面功能，亦各具焊接電子元件之一零件面與相對於 該零件面之一焊接面； 複數個電性連接件，用以電性連接該些電路模組板中一 泰電路模組板之該零件面與另一電路模組板之該焊接面，使 該零件面與該焊接面重疊，以如此方式逐一堆疊，使該些 電路模組板形成一堆疊之電路結構； 一地線層，分別位於該堆疊之電路結構中一最頂端與一 最底端之電路模組板中，將干擾信號導至接地端；以及 一散熱片，黏接於該堆疊之電路結構中該最底端之電路 模組板之該焊接面上。 • 12.如申請專利範圍第11項所述之多電路模組結構，其 中該些電路模組板為IEEE 1394、USB、SATA、IDE或SCSI 所屬之有線傳輸介面功能電路模組板。 13. 如申請專利範圍第11項所述之多電路模組結構，其 中該些電路模組板為紅外線、藍芽技術、ZigBee或WiFi 所屬之無線傳輸介面功能電路模組板。 14. 如申請專利範圍第11項所述之多電路模組結構，其 13 1302376 中該些電路模組板中至少有一電路模組板具電源電路、控 制電路、中央處理電路或信號實體層之控制邏輯電路功能。1302376 X. Patent application scope: 1. A multi-circuit module structure comprising a plurality of circuit module boards, wherein each of the circuit module boards has the same independent interface function, and also has soldered electronic components thereon. And a plurality of electrical connectors for electrically connecting the circuit modules - the component face of the circuit module board and the other circuit The welding surface of the module board, • (4) the part surface overlaps the welding surface, and is stacked one by one in such a way of connecting, so that the circuit module boards form a stacked circuit structure. 2. For the multi-circuit module structure described in the application (4), the circuit structure of the stack has a topmost circuit module board and a bottommost circuit module board, and the topmost end and the most The bottom circuit module board has a ground layer to introduce interference signals into the ground. Lu A3. The multi-circuit module structure of claim 1, wherein the heat sink is bonded to the soldering surface of the bottommost circuit module board of the stacked circuit structure. 4. The multi-circuit module structure according to claim 1, wherein at least one of the circuit module boards has a power circuit, a control circuit, a central processing circuit or a signal entity layer. Logic circuit function. For example, the multi-circuit module structure described in the patent scope ,1, the circuit module boards of the 11 1302376 are the wired transmission interface function circuit module boards of the IEEE 1394, USB, SATA, IDE or SCSI. 6. The multi-circuit module structure according to claim 1, wherein the circuit module board is a wireless transmission interface function circuit module board of infrared, Bluetooth technology, ZigBee or WiFi. 7. A multi-circuit module structure comprising: #复教的电路模块 board, wherein each of the circuit module boards has different independent interface functions, and each of the circuit module boards has a zero And the plurality of electrical connectors are connected to the side of one of the circuit module boards of the circuit module board and the plurality of electrical connectors The side of one of the circuit module boards is such that the two circuit module boards are horizontally connected side by side, and are arranged side by side in such a connection manner, so that the circuit module boards form a side-by-side circuit structure. 8. The multi-circuit module structure according to claim 7, wherein at least one of the circuit module boards has a control circuit of a power circuit, a control circuit, a central processing circuit or a signal entity layer Circuit function. 9. The multi-circuit module structure according to claim 7, wherein the circuit module boards are infrared, Bluetooth technology, ZigBee or WiFi &quot; wireless transmission interface function circuit module board. 10. In the multi-circuit module structure described in claim 7, the circuit module boards of 12 1302376 are wired transmission interface function circuit board boards of IEEE 1394, USB, SATA, IDE or SCSI. 11. A multi-circuit module structure comprising: a plurality of circuit module boards, each of the circuit module boards having different independent interface functions, each having a part of the surface of the soldered electronic component and relative to the part a soldering surface; a plurality of electrical connectors for electrically connecting the soldering surface of the component surface of the circuit module board and the circuit module board of the circuit module board to the soldering surface The surface overlaps the soldering surface and is stacked one by one in such a manner that the circuit module boards form a stacked circuit structure; a ground layer is respectively located at a topmost end and a bottommost end of the stacked circuit structure In the module board, the interference signal is led to the ground end; and a heat sink is adhered to the soldering surface of the bottommost circuit module board in the stacked circuit structure. 12. The multi-circuit module structure as described in claim 11, wherein the circuit module boards are wired transmission interface function circuit board boards of IEEE 1394, USB, SATA, IDE or SCSI. 13. The multi-circuit module structure according to claim 11, wherein the circuit module board is a wireless transmission interface function circuit module board of infrared, Bluetooth technology, ZigBee or WiFi. 14. The multi-circuit module structure according to claim 11, wherein at least one of the circuit module boards of the 13 1302376 has a power circuit, a control circuit, a central processing circuit or a signal entity layer Control logic circuit functions. 1414
TW095120088A 2006-06-06 2006-06-06 Structures of multiple module board TWI302376B (en)

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