TWI299903B - Solid imaging device and method of manufacturing thereof - Google Patents

Description

1299903 IX. Description of the Invention: [Technical Field] The present invention relates to a solid-state image element, and more particularly to a solid-state image element capable of providing a quick repair and mode in a solid-state image element without damage to a pixel. . [Prior Art] In an electronic device having a pixel array, such as a CMOS sensor, a liquid crystal display, a plasma display, etc., if a pixel in the pixel array is damaged (such as a bright spot or a dark spot), Will cause errors in display or sensing. Since the data of the CMOS sensor and the liquid crystal display are instantaneous and positional, it is impossible to replace the wrong pixel in a hard manner like a memory. Generally speaking, a small amount of pixel damage may be repaired in a software manner. For example, if one pixel in the CMOS sensor is damaged and cannot receive the data it feels, it can be calculated by using the software operation method. This corrupts the value of the one pixel data. However, if an entire line of pixels in the pixel array of the EA=device is bad, it cannot be repaired by means of a narrative, then the electronic device may be scrapped, no longer used. In terms of process technology, the damage of a whole line of pixels is often low, and the probability of such a result is usually very low, which is caused by the damage of the line, column, power line, or drive. The decoder circuit is damaged, not the damage of the pixel itself. [Invention] The purpose of the present invention is to provide a solid-state image element that can provide non-a pixel damage in the solid-state image element. Fast ^

Client's Docket No.: TT^s Docket N〇:0944-A40712-TW/Draft.Finay brent/ 6/13/2006 •1299903 mode. "The present invention provides a solid-state image element comprising a pixel array, a readout or D/A circuit, a decoding circuit, a driver circuit, a power supply array, a preliminary circuit array, a filament array, and a repair arithmetic unit. The pixel array has a complex number Row of pixels, wherein each row of pixels is connected to a decoding circuit, a driving circuit, a read (four) column, an A/D circuit or an A/D circuit, a power supply line in the power supply array, and a ground line. The decoding circuit and the driving circuit are located at The _ side of the pixel array generates or receives address data for selecting and driving - pixels or complex pixels in the pixel array. The preparatory circuit (4) includes a secondary decoding circuit, a driving circuit, a readout circuit, and a plurality of preparations. Line line, multiple line preparations • Column lines, multiple lines of preparatory power lines and ground lines. When an error occurs in the row line, column line, readout circuit, the power line or the ground line of a pixel coupled to the row, a patch, selecting a preliminary row line, a preliminary column line, a preliminary readout circuit, or the preliminary power supply line from the preliminary circuit array, and replacing the original error through the fuse array Peer-to-Peer [Embodiment] Figure 1 is a schematic diagram of a first embodiment of a solid-state image sensor according to the present invention, in which the CMOS sensor has a multi-layered wire structure layer. The pixel array 15 and the power supply array 14 are only different in the wire structure. The pixel array 15 has a plurality of rows of pixels, and the pixels of each row are coupled to a power line and a ground line in the power array 14. The row decoding and driving circuit 11 receives the address data for selecting and driving a pixel row or a plurality of pixel rows in the pixel array 15, and the column decoding and driving circuit 12 for selecting and driving the pixel array 15 One pixel

Client’s Docket No·: TT^ Docket No:0944-A40712-TW/Draft-Final/ brent/ 6/13/2006 1299903 or multiple pixel columns data readout. When the pixel 2: the output circuit 17 drives the driving circuit in the pixel array 15 and the decoding circuit and the arithmetic unit 18 coupled to the pixel in the reading, when the power supply line or the ground line is faulty, the repairing path and the driving material are transmitted through the repairing circuit and the driving material. , ^ ^ ^ _ 16 towel to the job to decode the original electricity will be damaged ground wire, through the material (four) 13 replacement. The drive circuit, power line or ground line of the present invention can be placed in different wire structure layers. j 〃Backup power supply array readout ^Ready circuit (four)16 in the decoding circuit, drive circuit, Huan # power line or ground line to replace the damaged decoding circuit and drive high energy light::: Γ line or ground line replacement process In the middle, the circuit is isolated by using - or the circuit matrix, followed by the high-energy beam, and the line is lightly connected to the preliminary solution circuit and the power circuit or the ground line of the circuit. In the present invention, the filament array 13 is composed of a metal fuse, a polycrystalline fuse (poly negative), a polycrystalline germanium fuse (P?lycide fuse) or a circuit matrix. Figure 2 is a schematic illustration of a second embodiment of a solid state image sensor in accordance with the present invention in CMOS. The decoding circuit 21 receives the address data for selecting one pixel or a plurality of pixels in the pixel array 25. The driving circuit 22 has a plurality of driving units (not shown), wherein each driving unit is used to drive a pixel row. ? a pixel column, a plurality of pixel rows or a plurality of pixel rows, which are used to drive the pixel row and the pixel according to the selection result of the decoding circuit 21.

Client's Docket No.: TT^ Docket No:0944-A40712-TW/Draft-Final/ brent/ 6/13/2006 1299903 Column, plural pixel rows or plural pixel columns. The spare drive circuit 23 has a plurality of spare drive units (not shown) coupled to the fuse array 24 and the decode circuit 21 for replacing the damaged drive unit in the drive circuit 22. When a driving unit in the driving circuit 22 is damaged, the corresponding row of pixels cannot be driven. Through the repairing operation unit 27, a spare driving unit in the standby driving circuit 23 is selected to replace the damaged driving xjxy in the driving circuit 22. Early in the morning. When the damaged driving unit in the driving circuit 22 is replaced by the spare driving unit in the spare driving circuit 23, the connection of the damaged driving unit to the row of pixels is first broken by a high energy beam or a high voltage, followed by the high energy beam or The circuit matrix is applied to the fuse array 24 as a result of the patching operation such that the row of pixels is coupled to the alternate drive unit. In addition, when a power line or a ground line coupled to a row of pixels in the pixel array 25 is short-circuited or faulty, a backup power line or a backup ground line is selected from the backup power array 26, and is passed through the fuse array 23. Replace the damaged power cord or ground wire. Figure 3 is a schematic illustration of a third embodiment of a solid state image sensor in accordance with the present invention in CMOS. The decoding circuit 31 is coupled to the driving circuit 32 and the second driving circuit 37, and receives the address data for selecting one pixel in the pixel array 34. The driving circuit 32 and the second driving circuit 37 are selected according to the decoding circuit 31. Drives the selected pixels. In Fig. 3, the pixel 35 is a damaged pixel, the driving direction 38 is the driving direction of the driving circuit 32, and the driving direction 3.9 is the driving direction of the second driver circuit 3. In the conventional CMOS sensor, only the design of the drive 32 is used, so when the pixel 35

Client’s Docket No·: TT’s Docket No:0944-A40712-TW/Draft-Final/ brent/ 6/13/2006 9 1299903

The damage will result in the pixel of the row where the pixel 35 is located, and the pixel after the pixel % (in the third figure, the pixel in which the pixel 35 is located) cannot be driven. In the present invention, a second driving circuit 37 is disposed on the side of the pixel array 34 with respect to the driving circuit 32, and the row of pixels in which the pixel 35 is located is driven in the direction of the driving direction 39 according to the selection result of the decoding circuit 31. / can reduce the number of pixels that can not be driven, improving the problem of the conventional CMOS sensory benefits. Meanwhile, if the number of damaged drive units in the drive circuit exceeds the number of drive units that are allowed to be repaired, the repair operation unit 3A passes through the repair by the second drive circuit 37 to replace the damaged drive unit in the drive circuit 32. In addition, when the power line, the plurality of power lines, or a ground line or the plurality of ground lines that are coupled to the pixel array or the pixel column are faulty, a standby power line and a plurality of power lines are selected from the backup power array 36. A spare power line or a spare ground line, a plurality of spare ground line ground lines, through the fuse array 33 to replace the damaged power line or ground line. Figure 4 is a schematic illustration of a solid state image sensor in accordance with the present invention in cm. In Fig. 4, the decoding circuit 41 is in a decoding unit (the tree is magical on the picture, and its t-decoding is a single column or a plurality of rows, the county element, and the preparation code circuit 46 has a decoding unit (not shown). ), the surface-dissolving filament array 43 and the driving circuit are decoded by a decoding unit or a complex solution in the decoding circuit 41. The patching operation unit 47, the paste (four) decoding circuit 46 is early, and the transmission unit or the complex decoding is simply replaced. In the test of interest, the first solution = beam or high voltage will isolate the damaged decoding unit and its corresponding energy, order, ''歹

Client's Docket No.: TT5s Docket No:0944-A40712-TW/Draft.Finay brent/ 6/13/2006 1299903 ^Connecting the m beam or circuit matrix according to the patching result = in the bristle array 'and then (4) array 4 3 The high energy beam or high 2 voltage' causes the alternate decoding unit to be connected to the corresponding row of pixels of the corrupted decoding unit. In addition, when the pixel line 44 or the pixel line or the _ pixel rides the power line, the plurality of power lines or the ground line, or the plurality of ground lines are faulty, the repair operation unit 47 passes through the power generation switch 45. Select a spare • Xiao power cable multiple power cords or — alternate ground wire, multiple spare ground wire ground wire 'through the wire array 4 3 to replace the damaged power cord. In the embodiment of the present invention, the CM〇s sensor is taken as an example, but the use of the invention is not limited to the C Μ 感 S sensor, in the liquid crystal display, the CCD sensor, A power display or other device having a pixel array/曰曰= sub-device can be adapted to the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the present invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a first embodiment of a CMOS sensor according to the present invention. Fig. 2 is a second embodiment of a CMOS sensor according to the present invention. Fig. 3 is a third embodiment of a CMOS sensor according to the present invention

Client's Docket No.: TTJs Docket No:0944-A40712.TW/Draft-Fiiial/ brent/ 6/13/2006 11 ^ 1299903 Schematic. Fig. 4 is a schematic view showing a fourth embodiment of the CMOS sensor according to the present invention. [Description of main component symbols] 11~row decoding and driving circuit 2: 1, 3b 41~ decoding circuit 12~ column decoding and driving circuit 22, 32, 42~ drive circuit. 13, 24, 33, 43~ fuse array 14~ power array

15, 25, 34, 44 to pixel array J 16 , 26 , 36 , 45 to spare circuit array 17 to readout circuit 23 to spare drive circuit 37 to second drive circuit 35 to damaged pixel 38, 39 to drive Direction 46~ spare decoding circuit 18, 27, 3A, 47~ patching arithmetic unit

Client’s Docket No.: TT^ Docket No:0944-A40712-TW/Draft-Final/ brent/ 6/13/2006

Claims (1)

,1299903 Amendment of the case number 095121165 May 30, 1997) -rf;- Ten application patent scope: Year of the month" L A solid-state image sensor, including: One-to-one pixel array, with multiple rows of pixels a circuit that includes a plurality of readout units; an A/D circuit that includes a single or complex A/D; - a bit-position of the pixel array-sides that generates or receives rows and outputs; - or a plurality of pixel circuits, including a row of _ pixel rows and a column of pixels in the Wei_cell column; (4) each column of the matrix, having a plurality of power lines and a plurality of ground lines, the 仃 pixels being coupled to the a power line and a ground line; a circuit: a pre-two-way array 'having a preparatory drive circuit, a pre-decoding = line backup circuit, a plurality of service power lines and a plurality of pre-defined φ-fuse arrays; a repair operation unit; And when the selected row or column of pixels coupled to the decoding circuit, a driver-readout circuit, a power line or a ground line fault, the implementation of the second feed 'from the preparatory circuit array selection - preparation Decode the electric! Box:! Injury A solid-state image sensor according to claim 1, wherein the solid-state image sensor according to claim 1 is replaced by the fuse array, a preliminary power supply line, or a preliminary ground line. When an error occurs in the decoding circuit, a patch is executed, and one of the circuit arrays is selected from the standby Client's Docket No. 5/30/2008 TT^s Docket No:0944.A40712.TW/Draft.Finall/brent/ 13 1299903 The original error of the decoded electric 1f solution is replaced by the fuse array. 3. As in the patent application, the solid-state image sensor described in the second drive =\ The solid-state image sensor according to the first item of the second aspect of the image of the driving circuit, wherein the plurality of decoding units ′ each of the _ decoding units use 5 The solid-state image sensor of claim 4, wherein the further preparation-preparation circuit has a plurality of preliminary decoding units in the decoding circuit - when the solution element has an error, the preparation unit (4) is prepared through the dissolution array Originally damaged 6. The solid-state image sensor according to claim 1, wherein the fuse 4 array is a metal fuse, a polycrystalline fuse, a fusible metal A solid-state image sensor according to the invention of claim 1, wherein the repairing and transporting unit is a built-in test function circuit ( B. The solid-state image sensor according to claim 1, wherein the repairing device is a Scan Chain Insertion insertion circuit. 9. The solid-state image sensor according to claim 1, wherein the patch further comprises: isolating the original error line with a Nanneng 1 beam or a high voltage, and the plurality of Client's Docket No:: TT^ Docket No:0944-A40712-TW/Drajft-Finall/ brent/ 5/30/2008 14 1299903 Row or column line, complex column line, readout circuit, power line and the ground line; and high energy beam or high A voltage is applied to the fuse array to couple the row of pixels, the fuse array to the preliminary decoding circuit, the preliminary drive circuit, the preliminary readout circuit, the power supply line, or the ground line. 10. The solid-state image sensor according to claim 1, wherein the driving circuit comprises a plurality of driving units, wherein each of the driving units is for driving a corresponding row of pixels. 11. The solid-state image sensor according to claim 10, further comprising a preparatory driving circuit having a plurality of preliminary driving units, wherein when the driving unit has an error, a preparation is performed through the fuse array. The drive unit replaces the previously damaged drive unit. 12. The solid-state image sensor according to claim 1, wherein when an error occurs in the readout circuit, a patch is executed, and the preliminary readout circuit is selected from the preliminary circuit array, and the fuse is transmitted through the fuse The wire array replaces the Φ with the original readout circuit. 13. The solid-state image sensor according to claim 1, wherein the readout circuit comprises a plurality of readout units, wherein each of the readout sheets is used to read a corresponding row of pixels. . 14. The solid-state image sensor of claim 12, further comprising a preliminary readout circuit having a plurality of preliminary readout units that pass through the fuse array when an error occurs in the readout unit The previously damaged readout unit is replaced with a preliminary readout unit. 15. For the solid-state image sensor described in claim 1, Client's Docket No: TT^ Docket No:0944-A40712-TW/Draft-Finall/ brent/ 5/30/2008 15 1299903 includes CMOS, CCD, Amorphous Silicon, ΙΙΙ-ν family and other semiconductor imaging products designed and manufactured by the body circuit technology. The solid-state image sensor according to claim 1, comprising a single chip integrated circuit having a digital signal processing function (DSP), a micro control code memory, and a lean turn-out/input function. product. A solid-state image sensor as described in claim 1 of the patent application, Electronic devices having pixel arrays, such as digital drive, readout or analog drive, readout, etc., are included. The image display comprises: a pixel array having a plurality of rows of pixels; a power array having a plurality of power lines and a plurality of ground lines, wherein each row of pixels is coupled to the power line and a ground line; - the decoding circuit 'is located on the side of the pixel array, generates or receives - address data, (4) selects the pixel array - or a plurality of pixel rows, pixel columns; - D / A and drive circuit ' to drive the image Display pixel array; a preliminary circuit array having a -prepared D/A and driving circuit, a preliminary decoding circuit; a power line and a plurality of pre-prepared power supply arrays, having a plurality of prepared backup ground lines; a south energy beam or a high voltage fuse array; a repair operation unit; and when an error occurs in the power line of one of the row of pixel couplings, performing a patch from the preliminary circuit array - the preliminary decoding circuit , Client's Docket No·: 5/30/2008 TT5s Docket No:0944-A40712-TW/Draft-Finall/ brent/ 16 1299903 Prepare D/A and drive circuit, power supply Ground line, through the replacement fuse array of the circuit of the original error. 19. An image display according to claim 18, comprising a liquid crystal display, an OLED, a plasma display or other electronic device having a pixel array. </ RTI> 20. The image display of claim 18, wherein the package includes an electronic device having a pixel array φ column, such as digital drive, display or analog drive, display mode, and the like. 21. The image display of claim 18, wherein the patch further comprises: isolating the original wrong row line, a plurality of row or column lines, a plurality of column lines, a mechanical cut, a high energy beam or a high voltage, Decoding circuit, driving circuit, power line and the grounding line; and coupling the row of pixels, the fuse array, the preliminary decoding circuit and the driving circuit, the power line or the ground line. 22. The image display device of claim 18, wherein the repair operation unit is a built-in test function circuit. 23. The image display device of claim 18, wherein the repair operation unit is a modular test function circuit. Client’s Docket No·: TT’s Docket N〇:0944-A40712-TW/Draft-Finall/ brent/ 5/30/2008