TWI299643B - - Google Patents
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- Publication number
- TWI299643B TWI299643B TW94123252A TW94123252A TWI299643B TW I299643 B TWI299643 B TW I299643B TW 94123252 A TW94123252 A TW 94123252A TW 94123252 A TW94123252 A TW 94123252A TW I299643 B TWI299643 B TW I299643B
- Authority
- TW
- Taiwan
- Prior art keywords
- adapter
- circuit board
- tin
- tin solid
- mounting
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 claims description 45
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 34
- 239000007787 solid Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 20
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 2
- KJLLKLRVCJAFRY-UHFFFAOYSA-N mebutizide Chemical compound ClC1=C(S(N)(=O)=O)C=C2S(=O)(=O)NC(C(C)C(C)CC)NC2=C1 KJLLKLRVCJAFRY-UHFFFAOYSA-N 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094123252A TW200704316A (en) | 2005-07-08 | 2005-07-08 | Method to mount solid solder on printed-ciruit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094123252A TW200704316A (en) | 2005-07-08 | 2005-07-08 | Method to mount solid solder on printed-ciruit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200704316A TW200704316A (en) | 2007-01-16 |
| TWI299643B true TWI299643B (enExample) | 2008-08-01 |
Family
ID=45069749
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW094123252A TW200704316A (en) | 2005-07-08 | 2005-07-08 | Method to mount solid solder on printed-ciruit board |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW200704316A (enExample) |
-
2005
- 2005-07-08 TW TW094123252A patent/TW200704316A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200704316A (en) | 2007-01-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |