TWI298026B - Method, apparatus, and system for bi-solvent based cleaning of precision components - Google Patents

Method, apparatus, and system for bi-solvent based cleaning of precision components Download PDF

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TWI298026B
TWI298026B TW94137800A TW94137800A TWI298026B TW I298026 B TWI298026 B TW I298026B TW 94137800 A TW94137800 A TW 94137800A TW 94137800 A TW94137800 A TW 94137800A TW I298026 B TWI298026 B TW I298026B
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solvent
tank
cleaning
recovery
mixture
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TW94137800A
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TW200624186A (en
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Mouser Wayne
Manchester Russell
Barrett William
Bergman Fredrick
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Forward Technology A Crest Group Company
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1298026 九、發明說明: 【發明所屬之技術領域】 本:職线錢㈣申請案第6Q/623,847號之優先 核,其係2004年10月29日提出申枝Hg Γ ,η 疋Ώ甲%,標題「以非揮發 性有機化合物為主來清潔精密組件之方法 '裝置及户、 統」’將该篇專利就未與本揭示内交 '、 文為參考資料。 ㈤丁内-不-致的範圍併入本 本發明大致侧於-種用於精密㈣零件之以溶劑為 主的清潔系統。特定言之,本_日$ # ”、、 制如—、、 明係關於一種利用溶劑再 衣程序於減少總體溶劑排放之用 潔系統。 < 用方、精松零件的雙溶劑清 【先前技術】 精密清潔及乾料統典型係_相#多#之包含 溶劑、清潔劑、或其他水性混合物的清潔溶液。此料统 、㈣呆作而清紅錢各種裝置或零件諸 儀器、晶圓、PC板、混成電路、磁碑避u t置7^子 兹磲機組件、精密機械 或電機械組件、或其類似物。 許多先前技藝系統利用經歸類為voc或揮發性有機化 合物的溶劑。VOC係具高蒸氣壓的有機化學物質,因此霞 可在環境温度及壓力下容易地形成蒸氣。雖然voc可成功 用於精料潔系統中,但由於關於由V Q C之暴露及/或排 放所產生之有害環境及健康影響的顧慮,因而觀的使用 及處置受到高度的管制。 【發明内容】 326XP/發明說明書(補件)/95-02/94】3 7800 5 1298026 本發明之一目的為產生一種用於清潔精密組件,同時利 用溶劑再製程序於降低溶劑排放,同時並回收溶劑供^利 用及/或處置之適當的清潔系統及適當的清潔方法。本發 =包括一種使用兩溶劑於移除污物及其他污染物之用於" 清潔精密組件的雙溶劑設計。在一代表性具體例中,兩溶 劑可包括不含V0C之第一溶劑及不含v〇c之第二溶劑,= 中不含V0C之溶劑大致與voc溶劑同等有效。—操^模^ 春包括於不含voc之第一溶劑内清潔精密組件以將任何 物、顆粒物質、油脂、鬆散物或其他污染物自精密組件移 隨後再於包含不含voc之第二溶劑的第二槽内沖洗精 被组件’以將任何由不含V0C之第一溶劑殘留於精密组: 上之薄膜移除。在此操作模式中,清潔及沖洗步驟各可包 括使精密組件於相關的溶劑内接受振盪及超音波引I的L 空泡現象(cavitation),以進一步促進清潔及沖洗。溶劑 回收模式包括自不含V0C之第二溶劑分離不含v〇c之第一 鲁溶劑,其經移除作為沖洗步驟之部分。在一代表性具體例 中,不含V0C之第二溶劑可能較不含v〇c之第一溶劑更為 =貝,以致回收及再製不含v〇c之第二溶劑供再利用,同 時可將不含V0C之第一溶劑以及任何在不含voc之第—溶 劑内之污染物適當地處置。 4 在一些代表性具體例中,揭示内容說明一種利用具有溶 劑再製系統之雙溶劑清潔系統清潔精密組件之方法。 在一些代表性具體例中,揭示内容說明一種用於清潔精 在組件同時並提供兩溶劑之回收及/或處置的雙溶劑清 326XP/發明說明書(補件)/95-02/94137800 6 1298026 潔系統。 在一些代表性具體例中’揭示内容說明一種包括槽及相 關管件以利於利用具有溶劑回收系統之雙溶劑清潔系統 清潔精密組件之清潔裝置。 在一些代表性具體例中’揭示内容說明一種利用雙溶劑 清潔糸統處置不含V0C之第一溶劑及回收不含vqc之第二 k 溶劑之方法。 在本揭示内容之各處中所使用之術語「不含V〇c之溶 ⑩劑」係經定義為包括經美國環保署(United States1298026 IX. Description of invention: [Technical field to which the invention belongs] This is the priority of the sixth line of the application (4) application No. 6Q/623, 847, which was proposed on October 29, 2004, for the purpose of the application of Hg Γ, η 疋Ώ The heading "Methods for cleaning precision components based on non-volatile organic compounds" and the apparatus and households are not referred to in this disclosure. (V) In-Down-Non-Incorporated Scope The present invention is generally oriented to a solvent-based cleaning system for precision (four) parts. In particular, this _ day $ # ”, ,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, Technology] Precision cleaning and dry material system is a typical solution containing solvents, detergents, or other aqueous mixtures. This system, (4) stay and red money, various devices or parts, instruments, wafers , PC boards, hybrid circuits, magnetic barriers, precision mechanical or electromechanical components, or the like. Many prior art systems utilize solvents classified as voc or volatile organic compounds. VOC is an organic chemical with high vapor pressure, so Xia can easily form vapor at ambient temperature and pressure. Although voc can be successfully used in concentrate cleaning systems, it is generated due to exposure and / or emissions from VQC. The use and disposal of the harmful environment and health effects are highly regulated. [Abstract] 326XP/Invention Manual (Supplement)/95-02/94] 3 7800 5 1298026 One of the objects of the present invention Produces an appropriate cleaning system and appropriate cleaning method for cleaning precision components while using solvent re-manufacturing procedures to reduce solvent emissions while recovering solvents for use and/or disposal. The present invention includes a use of two solvents for migration. Decontamination and other contaminants for " cleaning of precision components in a dual solvent design. In a representative embodiment, the two solvents may include a first solvent that does not contain V0C and a second solvent that does not contain v〇c, The solvent containing no V0C is roughly equivalent to the voc solvent.—The control module includes cleaning the precision components in the first solvent without vocal to remove any substances, particulate matter, grease, loose matter or other contaminants. The precision component is then rinsed in a second tank containing a second solvent free of voc' to remove any film remaining on the precision group from the VOC-free first solvent: in this mode of operation The cleaning and rinsing steps may each include an L-cavitation that allows the precision components to undergo oscillation and ultrasonic induction in the relevant solvent to further facilitate cleaning and rinsing. The formula comprises separating the first Ru solvent containing no v〇c from the second solvent without V0C, which is removed as part of the rinsing step. In a representative specific example, the second solvent containing no VOC may be less The first solvent containing v〇c is more than 贝, so that the second solvent containing no v〇c is recovered and reused for reuse, and the first solvent containing no VOC and any solvent not containing voc can be used. The contaminants within are properly disposed of. 4 In some representative embodiments, the disclosure illustrates a method of cleaning precision components using a dual solvent cleaning system having a solvent reconstitution system. In some representative embodiments, the disclosure illustrates a use. Double solvent cleaning 326XP/invention manual (supplement)/95-02/94137800 6 1298026 cleaning system for cleaning and cleaning of components. In some representative embodiments, the disclosure describes a cleaning apparatus that includes a tank and associated tubing to facilitate cleaning of precision components using a dual solvent cleaning system having a solvent recovery system. In some representative embodiments, the disclosure illustrates a method of treating a first solvent that does not contain VOC and a second k solvent that does not contain vqc using a dual solvent cleaning system. The term "dissolving 10 doses of V〇c" as used throughout this disclosure is defined to include the United States Environmental Protection Agency (United States).

Environmental Protection Agency)判定具有可忽略的光 化學反應性且明確說明於美國聯邦法規法典(United States Code of Federal Regulations) 40 C.F.R. 51· 100(s)(將其併入本文為參考貧料)中之有機化合物。 以上之本發明之各種具體例的概述並非要說明本發明 之各說明具體例或每種實行法。在隨後之詳細說明中之附 圖更特定地例示此等具體例。 【實施方式】 &gt; 圖1及2中說明揭示内容之雙溶劑清潔系統1〇〇。雙溶 劑清潔糸統10 0係經設計及適於清潔諸如,比方々兒,醫療 裝置、光學儀器、晶圓、PC板、混成電路、;E兹碟機組件、 精密機械或電機械組件、或其類似物的精密纟且件。在—此 目前較佳的具體例中,雙溶劑清潔系統100包括一完備的 單一整合系統,以致不需要在雙溶劑清潔系統之組件之間 的實質互連。舉例來說,可將雙溶劑清潔系統I置於單一 326XP/發明說明書(補件)/95-02/94137800 7 1298026 滑材(skid)或框架上及/或容納於單一外殼、容器或隔室 中0 如圖1及2中所說明,雙溶劑清潔系統100可包括系統 外殼102、清潔部分104、沖洗部分106及溶劑回收部分 108。包括清潔部分104、沖洗部分106及溶劑回收部分 108之各種組件可於系統外殼102内操作互連,以致可測 ,試、運送及裝設單一聯合結構。 清潔部分104 —般包括清潔槽110、第一溶劑112及第 • 一再循環迴路114。清潔槽110可包括由適當材料諸如不 錄鋼、钽、鈦、石英或聚合物諸如PEEK及其他適當材料 所構成的開放槽。清潔槽110可進一步包括至少一用於促 進清潔程序的超音波轉換器116。超音波能量於第一溶劑 112内引起低壓及高壓相的交替型態。在低壓相中,形成 氣泡或真空空泡。在高壓相中,氣泡劇烈地向内破裂。此 氣泡產生及向内破裂的過程一般被稱作空泡現象。空泡現 赢象沿精密組件之表面產生強烈的滌洗程序,而導致將任何 的顆粒自零件移除。空泡現象中所產生的氣泡微小,因此 1 其可穿透微觀的缝隙,以相較於簡單的浸泡或攪動清潔程 序提供增進的清潔作用。在一代表性具體例中,超音波轉 換器116係可在28 KHz與2. 5 MHz之間之適當頻率下提 供超音波能量的Crest Ultrasonic Corp.陶瓷增進轉換 器。超音波轉換器116可藉由諸如環氧黏著劑的黏著劑直 接黏合至清潔槽110的外部。 第一再循環迴路114包括一流動系統,其中第一溶劑 326XP/發明說明書(補件)/95-02/94137800 8 1298026 112+再循環通過第一過濾器系統118,以將當清潔精密組 件所引入的顆粒移除。過濾器系統1丨8可.包括一或多個 用於移除此等顆粒之適當的過渡器配置。過濾器系統 可包括預組裝的過濾器,其包括可移除尺寸小至0 03微 米之顆粒的過濾器介質,例如聚醚砜、Teflon⑧、PVDF、 聚醋、或聚丙;I#。第一再循環迴路進一步包括闕119及第 ’:再循環泵120。閥119可包括自動閥諸如,比方說,電 -修磁閥、或以手引動的手動閥。第一再循環泵可使第一 ,劑112連續再循環通過第一過濾器系統118。第一再循 %迴路114可進-步包括當將第一溶劑112再引入至清潔 'uo日^•用於將其連續加熱的第一熱交換器122。透過使 用,-熱父換器122,由於經由傳導、對流及輕射損失的 熱能經取代’因而可將清潔槽110維持在連續溫度下。 、,在一目前較佳的具體例中,第一溶劑112可包含具有可 Θ進為如污物顆粒、油及油脂之污染物之移除之溶劑特 _性之適當的不含V0C之溶劑。舉例來說,第一溶劑112可 •具有約6G之卡里T_aributanGl)值。在—代表性具體 例中’第一浴劑112包含以大豆為主的不含v〇c之溶劑, ,諸如,比方說,購自 AgEnVlronmentalPr〇ducts〇f〇maha, £之滞點333°C的S〇yclear 15GG。第—溶劑112係生物 可降解及/或非危險性較佳。大豆基質溶·一⑽ 物ent)之優點為此等類型溶劑由於大豆的易取得特 性,因而一般為廉價。再者,例如當清潔槽11〇内之油及 /或油脂之含量達到夠高之值,將第—溶劑ιΐ2棄置並更 326XP/發明說明書(補件)/95-02/94137800 〇 1298026 時,—般不需要特殊及/或昂貴的處置設備及/ :“處置大旦基質溶劑。大豆基質溶劑可使用傳統的 人〉处置’諸如’比方說,於焚化爐中燃燒或與加熱油結 5於鋼爐内使用作為燃料物流來源。 中洗4刀106 -般包括沖洗槽i 24、第二溶劑i 26及回 收迴路128。除了第二溶齊U26之外,沖洗槽124亦可包 ‘=、二以精么組件上之薄膜引入至沖洗槽1%之殘留量的 .第、:谷劑112。沖洗槽124可包括由與第一清潔槽刚相 同或類似之材料(例如,適當的材料諸如不銹鋼、鈕、鈦、 石英或聚合物諸如醜及其他適#_)所構成的開放 槽。沖洗槽12 4可進-步包括至少一用於在沖洗槽124内 引發空泡現象以進一步促進清潔程序的超音波轉換哭 116。 … 、回收迴路128包括一流動系統,其中第二溶劑126以及 殘留的第一溶劑112再循環通過第二過濾器系統130,以 籲將顆粒自沖洗槽124移除。第二過濾器系統13〇可包括一 或夕個用於移除此等顆粒之適當的過濾器配置。回收迴路 128進一步包括複數個閥131a、131b、131c、131d及第 二再循環泵132。閥131a、131b、131c、131d可包括自 動閥諸如,比方說,電磁閥、或以手引動的手動閥。第二 再猶環泵132可基於閥131a、131b、131c、131d的操作 模式及操作狀態而將適當的液體選擇性地泵送通過回收 迴路128。回收迴路128可進一步包括用於冷卻第二溶劑 126及殘留苐一溶劑n2之第二熱交換器134。 326谢發明說明書(補件)/95·02/94丨37800 10 1298026 在一目前較佳的具體例中,第二溶劑126可包含具有可 增進任何由第一溶劑Π2殘留於精密組件上之薄膜移除 之〉谷劑特性之適當的不含V0C之溶劑。舉例來說,第二溶 劑126可具有在約10至約150之間的卡里丁醇值。在一 代表性具體例中,第二溶劑126包含工程溶劑諸如,比方 說,可由美國3M公司(3M C⑽pany 〇f St. Paul,丽)購 得之 Novec Engineered Fluid HFE-7200。HFE-7200 具有 61 C之沸點及自-135°C至61t之寬廣液體範圍,而使其 成為供蒸氣脫脂應用用的優良溶劑。此外,HFE_72〇〇不 消耗臭氧,全球暖化能力極低,提供降低的溫室氣體排 放不疋V0C ’其乃經美國環保署重大新替代品政 策計(Significant New Alternatives Pr〇gram)認可而 不受限制者。 溶劑回收部分108可包括回收槽136、回收加熱器138、 冷凝螺管139及廢棄物槽140。回收槽136可包括由與第 馨一清潔槽100及沖洗槽124相同或類似之材料(例如,適 當的材料諸如不銹鋼、鈕、鈦、石英或聚合物諸如卯肢 及其他適當材料)所構成的開放槽。回收槽136係以一溢 流堰142與沖洗槽124實質相連並分離。因此,回收槽^ 136及沖洗槽124共有共同的蒸氣毯1 μ。 當經完全組裝及整合時,雙溶劑清潔系統丨⑽可經構造 用於自動、半自動或手動操作。除了前述及經說明的植件 雙溶劑清潔系統進-步包括—藉由將零件置於托架或 籃143内而使精密零件在清潔槽u〇與沖洗槽124之間移 j26XP/發明說明書(補件)/95-02/94丨37800 11 1298026 動的精密組件處理系統。此精密組件處理系統可包括手動 系統’其中操作人員簡單地將精密組件置於正確的槽内, 或其可包括用於使籃143自清潔槽110移至沖洗槽124的 自動零件處理系統。此外,雙溶劑清潔系統100可包括用 於手動操作雙溶劑清潔系統1〇〇之適當的光源、按鈕及開 關。或者,雙溶劑清潔系統100可進行自動操作,諸如, * 比方說,經微處理器、個人電腦、可程式化邏輯控制器(PLC) 專專控制及引發的操作。 /在一較佳具體例中,雙溶劑清潔系統100係完全容納於 系統外殼102,諸如,比方說,櫥櫃化的外殼内,以呈現 院人、美觀的外觀。在此一櫥櫃化系統中,使用者僅需提 供第一溶劑112、第二溶劑126、待清潔之精密組件及 源。 在操作過程中,雙溶劑清潔系統100可以兩種模式的其 中一種運轉,第一種模式係用於正常操作,其中如圖i中 ·=說明清潔及沖洗精密組件;及第二種模式包括如圖2所 况明的多步驟程序,其係用於先分離第一溶劑及第二 洛劑126,隨後再將第一溶劑112移除並作可能的處置, 及再製第二溶劑126供再利用於雙溶劑清潔系統1〇〇内。 關於在第-模式及第二模式中之第二沖洗組件⑽及回 收組件108的操作,特別參照圖3 —1〇,將其進一步說 於下。 乂 σ 〈正常操作〉 如圖卜3及4所說明,經由先開始雙溶劑清潔系統之 326ΧΡ/發明說明書(補件)/95-02/94137800 η 1298026Environmental Protection Agency) has negligible photochemical reactivity and is clearly stated in the United States Code of Federal Regulations 40 CFR 51·100(s), which is incorporated herein by reference. Organic compound. The above summary of the various embodiments of the invention is not intended to The specific examples are more specifically illustrated in the accompanying drawings in the following detailed description. [Embodiment] &gt; The two-solvent cleaning system disclosed in Figs. 1 and 2 will be described. The Dual Solvent Cleaning System 10 is designed and suitable for cleaning such as, for example, medical devices, optical instruments, wafers, PC boards, hybrid circuits, E-disc components, precision mechanical or electromechanical components, or The precision of the analog is a piece. In the presently preferred embodiment, the dual solvent cleaning system 100 includes a complete single integrated system such that substantial interconnection between components of the dual solvent cleaning system is not required. For example, the dual solvent cleaning system I can be placed on a single 326XP/invention manual (supplement)/95-02/94137800 7 1298026 skid or frame and/or housed in a single housing, container or compartment. Medium 0 As illustrated in FIGS. 1 and 2, the dual solvent cleaning system 100 can include a system housing 102, a cleaning portion 104, a rinsing portion 106, and a solvent recovery portion 108. The various components including the cleaning portion 104, the rinsing portion 106, and the solvent recovery portion 108 can be operatively interconnected within the system housing 102 such that a single joint structure can be tested, tested, transported, and installed. The cleaning portion 104 generally includes a cleaning tank 110, a first solvent 112, and a first recirculation loop 114. The cleaning tank 110 may comprise an open trough made of a suitable material such as stainless steel, tantalum, titanium, quartz or a polymer such as PEEK and other suitable materials. The cleaning tank 110 can further include at least one ultrasonic transducer 116 for facilitating a cleaning procedure. The ultrasonic energy causes an alternating pattern of low pressure and high pressure phases in the first solvent 112. In the low pressure phase, bubbles or vacuum vacuoles are formed. In the high pressure phase, the bubbles violently rupture inward. The process of bubble generation and inward rupture is generally referred to as cavitation. The empty bubble now produces a strong scrubbing process along the surface of the precision component, which causes any particles to be removed from the part. The bubbles generated in the cavitation phenomenon are so small that they can penetrate microscopic gaps to provide enhanced cleaning compared to simple soaking or agitation cleaning procedures. In a representative embodiment, the ultrasonic transducer 116 is a Crest Ultrasonic Corp. ceramic boost converter that provides ultrasonic energy at an appropriate frequency between 28 KHz and 2.5 MHz. The ultrasonic transducer 116 can be directly bonded to the outside of the cleaning bath 110 by an adhesive such as an epoxy adhesive. The first recirculation loop 114 includes a flow system in which the first solvent 326XP / invention specification (supplement) / 95-02 / 94137800 8 1298026 112 + is recirculated through the first filter system 118 to be used when cleaning precision components The introduced particles are removed. The filter system 1 可 8 may include one or more suitable transitioner configurations for removing such particles. The filter system can include a pre-assembled filter comprising a filter media that can remove particles having a size as small as 0.03 microns, such as polyethersulfone, Teflon 8, PVDF, polyester, or polypropylene; The first recirculation loop further includes a crucible 119 and a ' recirculation pump 120. Valve 119 may include an automatic valve such as, for example, an electro-magnetic valve, or a hand-actuated manual valve. The first recirculation pump may continuously recirculate the first agent 112 through the first filter system 118. The first recirculation of the % loop 114 may include, when the first solvent 112 is reintroduced to the cleaning unit, the first heat exchanger 122 for continuously heating it. By use, the hot parent exchanger 122 can maintain the cleaning bath 110 at a continuous temperature due to the thermal energy loss via conduction, convection, and light loss. In a presently preferred embodiment, the first solvent 112 may comprise a solvent-free solvent having a solvent that is removable to remove contaminants such as dirt particles, oils, and greases. . For example, the first solvent 112 can have a value of about 6G of card T_aributanGl). In the representative example, the first bath 112 contains a soybean-based solvent containing no v〇c, such as, for example, from AgEnVlronmentalPr〇ducts〇f〇maha, a stagnation point of 333 ° C S〇yclear 15GG. The first solvent 310 is biodegradable and/or non-hazardous. Advantages of Soybean Matrix Solvent One (10) ent) These types of solvents are generally inexpensive because of their readily available properties. Further, for example, when the content of oil and/or grease in the cleaning tank 11 is at a high enough value, the first solvent ιΐ2 is disposed and further 326XP/invention specification (supplement)/95-02/94137800 〇1298026, Generally no special and/or expensive disposal equipment is required and /: "Disposal of large denier matrix solvents. Soy matric solvents can be treated using conventional people" such as, for example, burning in incinerators or heating with oil 5 The steel furnace is used as a fuel logistics source. The medium washing 4 knife 106 generally includes a flushing tank i 24, a second solvent i 26 and a recovery circuit 128. In addition to the second melting U26, the flushing tank 124 may also include '=, Second, the film on the fine component is introduced into the residual amount of the rinsing tank by 1%. The granule 112. The rinsing tank 124 may include a material that is just the same as or similar to the first cleaning tank (for example, a suitable material such as An open tank of stainless steel, button, titanium, quartz or polymer such as ugly and other suitable for use. The flushing tank 124 can further include at least one for inducing cavitation in the flushing tank 124 to further facilitate cleaning. The program's ultrasonic conversion is crying 116. ..., recycled back The path 128 includes a flow system in which the second solvent 126 and the remaining first solvent 112 are recirculated through the second filter system 130 to urge the particles to be removed from the rinse tank 124. The second filter system 13 can include a Or a suitable filter configuration for removing such particles. Recovery circuit 128 further includes a plurality of valves 131a, 131b, 131c, 131d and a second recirculation pump 132. Valves 131a, 131b, 131c, 131d may include An automatic valve such as, for example, a solenoid valve or a manually actuated manual valve. The second resuscitation pump 132 can selectively pump the appropriate liquid based on the operating mode and operating state of the valves 131a, 131b, 131c, 131d. The recovery circuit 128 can further include a second heat exchanger 134 for cooling the second solvent 126 and the remaining solvent n2. 326 Thanks for the description (supplement) / 95·02/94 丨 37800 10 1298026 In a presently preferred embodiment, the second solvent 126 can comprise a suitable VOC-free solvent having any of the characteristics of the film that enhances the removal of any of the first solvent Π2 remaining on the precision component. In terms of The second solvent 126 can have a caributanol value of between about 10 and about 150. In a representative embodiment, the second solvent 126 comprises an engineering solvent such as, for example, 3M C(10) pany(R) from the United States. f St. Paul, Li) purchased Novec Engineered Fluid HFE-7200. HFE-7200 has a boiling point of 61 C and a wide liquid range from -135 ° C to 61 t, making it an excellent solvent for vapor degreasing applications. . In addition, HFE_72 does not consume ozone, has a very low global warming capacity, and provides reduced greenhouse gas emissions. V0C is recognized by the US Environmental Protection Agency's Significant New Alternatives Pr〇gram. Limiter. The solvent recovery portion 108 may include a recovery tank 136, a recovery heater 138, a condensing screw 139, and a waste tank 140. The recovery tank 136 may comprise a material that is the same as or similar to the first cleaning tank 100 and the rinsing tank 124 (eg, a suitable material such as stainless steel, button, titanium, quartz, or a polymer such as a shin and other suitable materials). Open slot. The recovery tank 136 is substantially connected and separated from the rinsing tank 124 by an overflow weir 142. Therefore, the recovery tank 136 and the rinsing tank 124 share a common vapor blanket of 1 μ. When fully assembled and integrated, the dual solvent cleaning system (10) can be configured for automatic, semi-automatic or manual operation. In addition to the foregoing and illustrated implantable two-solvent cleaning system, the steps include: moving the precision part between the cleaning tank and the flushing tank 124 by placing the part in the bracket or basket 143. j26XP/Inventive Manual ( Replenishment) /95-02/94丨37800 11 1298026 Dynamic precision component processing system. The precision component handling system can include a manual system 'where the operator simply places the precision components in the correct slots, or it can include an automated part processing system for moving the basket 143 from the cleaning tank 110 to the flushing tank 124. In addition, the dual solvent cleaning system 100 can include suitable light sources, buttons, and switches for manually operating the dual solvent cleaning system. Alternatively, the dual solvent cleaning system 100 can be automated, such as, for example, operated and controlled by a microprocessor, personal computer, programmable logic controller (PLC). In a preferred embodiment, the dual solvent cleaning system 100 is fully contained within the system housing 102, such as, for example, a cabinet-like housing to provide a sleek, aesthetic appearance. In this cabinet system, the user only needs to provide the first solvent 112, the second solvent 126, the precision components to be cleaned, and the source. During operation, the dual solvent cleaning system 100 can operate in one of two modes, the first mode being used for normal operation, wherein the cleaning and rinsing precision components are illustrated in Figure i; and the second mode includes The multi-step procedure illustrated in Figure 2 is for separating the first solvent and the second agent 126 first, then removing the first solvent 112 and making possible disposal, and reconstituting the second solvent 126 for reuse. In the double solvent cleaning system 1〇〇. Regarding the operation of the second rinsing assembly (10) and the retracting assembly 108 in the first mode and the second mode, reference is made in particular to Fig. 3-1, which will be further described below.乂 σ <Normal operation> As shown in Figures 3 and 4, the 326ΧΡ/inventive specification (supplement)/95-02/94137800 η 1298026 is started by starting the two-solvent cleaning system.

2壤及加熱部分以達到期望的㈣參數,㈣始雙 统刚的操作。在清潔部分104内,將第_ J 112泵送通過第—再循環迴路114,以致第—熱交換器 可將熱能加至第-溶劑112,並因此而加熱清潔槽11〇。 在操作過程中,對於SQyclear聽,將清潔槽^ 在大致恒定的溫度諸如,比方說,約赃下。熟悉技蔽 人士當明瞭清潔槽11G及第—再循環迴路114可包括適^ 的感測器、測量儀表及警報器,以致可在清潔過程中監; 及維持適當的溫度、流率、壓力及其他製程變數。2 soil and heating part to achieve the desired (four) parameters, (four) the beginning of the double operation. In the cleaning portion 104, the first J 112 is pumped through the first-recirculation circuit 114, so that the first heat exchanger can add thermal energy to the first solvent 112, and thus heat the cleaning tank 11〇. During operation, for SQyclear listening, the cleaning bath will be at a substantially constant temperature such as, say, about 赃. It is well known to those skilled in the art that the cleaning tank 11G and the recirculation loop 114 may include suitable sensors, measuring instruments and alarms so as to be monitored during the cleaning process; and maintain proper temperature, flow rate, pressure and Other process variables.

如圖3中所說明,在雙溶劑清潔系統1〇〇操作之起始開 機時,沖洗槽124及回收槽136各包含第二溶劑126。將 回收加熱器138引動以將回收# 136力口熱至第二溶劑126 之沸點,或在HFE-7200之情況中為61艺。在此同時,將 冷凝螺管139於約5°C下操作,以致在沖洗槽124及回收 槽136之正上方形成包含第二溶劑126之蒸氣的蒸氣毯 1 一44。冷凝螺管139使第二溶劑126之蒸氣凝結,以致第 一/合劑126之純餾出物連續沿壁向下流入至沖洗槽1 中。當第二溶劑126之純餾出物流入至沖洗槽丨24中時, 沖洗槽124内之第二溶劑126的液位上升直至其達到其中 第二溶劑126溢流至回收槽136中之溢流堰142的液位為 止。在正常操作過程中,閥131a、131c開啟同時閥131b、 131d關閉’以致第二再循環泵132將沖洗槽124之内容 物泵送通過第二過濾器系統13〇,以將沖洗槽124内之任 何顆粒過濾及移除。透過連續添加第二溶劑126餾出物及 326XP/發明說明書(補件)/95-02/94137800 13 1298026 自再循環泵132添加泵能量 5l〇C 下。 沖洗槽12 4之溫度維持於約As illustrated in Figure 3, the rinse tank 124 and the recovery tank 136 each contain a second solvent 126 when the dual solvent cleaning system is initially started. The recovery heater 138 is priming to heat the recovery #136 to the boiling point of the second solvent 126, or 61 in the case of HFE-7200. At the same time, the condensing coil 139 is operated at about 5 ° C so that a vapor blanket 1 - 44 containing the vapor of the second solvent 126 is formed directly above the rinsing tank 124 and the recovery tank 136. The condensing solenoid 139 condenses the vapor of the second solvent 126 such that the pure distillate of the first/mixer 126 continuously flows down the wall into the rinsing tank 1. When the pure distillate of the second solvent 126 is passed to the rinsing tank 24, the level of the second solvent 126 in the rinsing tank 124 rises until it reaches the overflow in which the second solvent 126 overflows into the recovery tank 136. The liquid level of 堰142 is up. During normal operation, the valves 131a, 131c are open while the valves 131b, 131d are closed 'so that the second recirculation pump 132 pumps the contents of the flushing tank 124 through the second filter system 13A to place the flushing tank 124 therein. Any particles are filtered and removed. By continuously adding a second solvent 126 distillate and 326XP / invention specification (supplement) / 95-02 / 94137800 13 1298026 from the recirculation pump 132 to add pump energy 5l 〇 C. The temperature of the rinsing tank 12 4 is maintained at about

在圖1所說明之正常清潔及沖洗模式中,將精密組件置 =清潔槽11G中,例如經由將精密組件置於籃⑷中。將 藍143浸沒於第-溶劑112 π,以致可將任何顆粒物質、 亏物/由油月曰及其他污染物自精密組件移除並懸浮於第 /合州112内。畜將監143及因此將精密組件浸沒於第一 溶劑112内時,超音波轉換器116可於第一溶劑ιΐ2内引 發,泡現象,以進-步增進污染物自精密組件的移除。當 將籃143使用作為自動處理系統的部分時,籃143可以: /下及/或側/側的方式連續振盪,以進一步促進自精密 組件移除污染物。第一溶劑112連續再循環通過第一再循 ,迴路114,其中可使用第一過濾器系統118將任何由精 始、組件所引入的懸浮顆粒自第一溶劑112移除。 於在清潔槽11〇中將精密組件的顆粒清除後,使用籃 143將精密組件移至沖洗槽124。當置於沖洗槽124中時, 會有少量的第一溶劑112殘留於精密組件上。第二溶劑 126將任何殘留的顆粒沖洗掉並將第一溶劑112自精密組 件溶解出。此沖洗可透過於沖洗槽124内使用超音波轉換 斋116於引起空泡現象,而於沖洗槽丨24内進一步地增 進。此外,籃143可以上/下及/或側/侧的方式振盪, 以進一步促進自精密組件移除污染物。於清潔後,將籃 143自沖洗槽124移出’其中蒸氣毯144將精密組件乾燥, 以致其不含薄膜或殘留物。接著製備精密組件以供進一步 326ΧΡ/發明說明書(補件)/95-02/94137800 14 1298026 加工或使用。 .於冲洗4曰124内,苐一溶劑126的液位維持在一穩態值 下,以致有恒定的溢流過溢流堰142及進入回收槽136 =。當精密組件於沖洗槽124中沖洗時,第二溶劑0126連 續地被溶解量的第一溶劑112以及任何其他存在於精密 組件上之〉可染物所污染。因此,如圖4所說明,溢流至回 收槽136中將第一溶劑112、第二溶劑126及任何其他污 染物之溶劑混合物146引入至回收槽136巾。由於將第一 溶劑112選擇成具有較第二溶劑126高之沸點(以高甚多 車又么)’因而第二溶劑126連續地自溶劑混合物1铛沸除, 其隨時間經過而導致第一溶劑112之量於回收槽136内累 積並增加。回收槽136内之第一溶劑112之濃度最終增加 至導致溶劑混合&amp; i 4 6 4沸點增加之點,而最 溶劑混合物146分離之點。 、 〈分離及處置操作〉 # 圖2及卜10中說明雙溶劑清潔系統1 〇〇的溶劑處置及 回,模式。如圖4所說明,雙溶劑清潔系統100之連續操 2最、、、$致回收槽i36内之第—溶劑ii2之濃度達到如由 /合刈此合物146之沸點增加所證實之不可接受的程度,諸 士〜比方。兒’增加1〇 C或以上。溶劑混合物146(包括任 何,合角午々染物)之分離係藉由於回收槽⑽内使溶劑混合 物146之/皿度冷部至5〇ΐ,以致形成兩明顯液位而達成, 其中第了劑部分148包含第一溶劑112(包括任何污物 5木)及第—溶劑部分15〇包含第二溶劑126。第一溶劑 j26XP/發明说明書(補件)/95-〇2/94】3?細 1298026 部分148及第二溶劑部分15〇 一般可以肉眼在視覺上作區 別。 於回收槽136内之冷卻係藉由將回收加熱器138關閉, 將冷凝器螺管139關閉以使蒸氣毯144消失,及藉由打開 閥131b、131d同時關閉閥131a、131c以使液體於回收槽 136内再循環通過回收迴路128,以致液體可經第二熱交 換為134冷卻而達成。當溶劑混合物146冷卻時,第二溶 釗I26不再自溶劑混合物146沸除,以致第二溶劑126之 _純顧出物停止凝結於冷凝器螺管139,且不再填充沖洗槽 124以致冲洗槽124内之第二溶劑126之液位降至溢流 堰142之高度,而不再溢流至回收槽136中,如圖4、5 及6中所說明。熟悉技藝人士當明瞭沖洗槽工%、回收槽 136及回收迴路128可包括適當的感測器、測量儀表及警 報胃、以致可在清潔過程中監測及維持適當的溫度、流 率、壓力及其他製程變數。當回收槽冷卻至5〇。〇時,溶 籲劑混合物146經分離成第一溶劑部分148及第二溶劑部分 150,如圖7中所說明。 一旦形成第一溶劑部分148及第二溶劑部分15〇,將閥 131a、131d關閉之同時,將閥131b、131c打開,以便沖 洗抬124内之第二溶劑126被泵送至回收槽,使得第 二溶劑部分150之量增加。如圖8之說明,當第二溶劑部 分150增加時,第一溶劑部分148上升直至其達到回收溢 流,152為止,其中包含第一溶劑112及任何土壤污染物 的第一溶劑部分148溢流至廢棄物槽140中。回收槽136 326XP/發明說明書(補件)/95·〇2/94】3780〇 \r 1298026 包=相對於回收溢流堰152設置的觀看口 154,以致當第 一溶劑部分148溢流過回收溢流堰152時,操作人員^對 其進行觀察較佳。當回收# ! 3 6内之第二溶劑工2 6的液位 增加時,第二溶劑部分15〇 t終接近回收溢流堪152的高 度,如圖9中所說明。在此點時,大部分的第一溶劑部分 •丨48已經導入至廢棄物槽140巾,以致將閥131a、131卜 • 11及I3ld放至正常操作的位置,^其餘的組件可重新 •開始正常操作狀態,如圖1〇中所說明。或者’可透過裝 ,適當的光學感測器諸如,比方說,光眼或照相機,以在 第一,劑部分148與第二溶劑部分15〇之間作視覺區別, 而將第一溶劑部分148的溢流自動化。 為成功彳呆作雙溶劑清潔系統1 〇〇,並不需將所有的第一 溶劑112自回收槽136移除,而僅需降低溶劑混合物146 的沸點使其接近第二溶劑丨26的沸點。接著可將廢棄物槽 140内之第一溶劑112(包括任何的溶解顆粒及污染物)適 _當地再循環、回收或處置。第一溶劑112係不含VOC的溶 劑,以致其可經焚化或使用作為燃料物流來源較佳。如已 說明,在第二溶劑126之單位價格大於第一溶劑112之單 位價格的情況下,雙溶劑清潔系統丨可能尤其在經濟上 有利。 應明瞭本發明並非要不當地受限於本文中所記載的例 示性具體例及實施例,且該等實施例及具體例係僅呈現作 為實例。 雖然本發明可作各種修改及另類形式,但已於圖式中舉 326XP/發明說明書(補件)/95-02/94137800 !298026 定細節並詳細說明之。然而’應明瞭其並非要 明的特定具體例。相對地,其係2 附申請專利範圍所定界之本發明之精神 及乾可内的修改、相等物及替代物。 【圖式簡單說明】 本發明由結切㈣考以上之本 例的詳細說明而更完全明瞭,其中: °種具脰 洗】上係本揭不内容之清潔系統的示意圖,顯示清潔及沖 處圖1清潔系統的示意圖’顯示溶劑回收及廢棄物 土圖3係圖1清潔系統之沖洗槽及回收槽於開機模式的八 思圖。 不 圖4係圖〗清㈣、狀沖洗槽及时槽 的示意圖。 〜月你杈式 ,5係圖1清織統之沖洗槽及时槽於溶劑回收 之第一步驟的示意圖。 圖6係圖1清潔系統之沖洗槽及回收槽於溶劑回 之第二步驟的示意圖。 、式 图7係圖1清春系統之沖洗槽及回收槽於溶劑回收模式 之第三步驟的示意圖。 、工 圖8 4圖1清春系統之沖洗槽及回收槽於溶劑回收模弋 之弟四步驟的示意圖。 圖9係圖1清潔系統之沖洗槽及回收槽於溶劑回收模式 發明說明書(補件)/95-02/94 ] 37800 18 1298026 之第五步驟的示意圖。 圖10係圖1清潔系統之沖洗槽及回收槽回到操作模式 的示意圖。 【主要元件符號說明】In the normal cleaning and flushing mode illustrated in Figure 1, the precision components are placed in the cleaning tank 11G, for example by placing precision components in the basket (4). The blue 143 is immersed in the first solvent 112 π so that any particulate matter, loss/oily ruthenium and other contaminants can be removed from the precision component and suspended in the /City 112. When the animal is inspected 143 and thus the precision component is immersed in the first solvent 112, the ultrasonic transducer 116 can be induced in the first solvent ι 2 to further enhance the removal of the contaminant from the precision component. When the basket 143 is used as part of an automated processing system, the basket 143 can be continuously oscillated in a /down and/or side/side manner to further facilitate the removal of contaminants from the precision components. The first solvent 112 is continuously recycled through the first recirculation, circuit 114, wherein any suspended particles introduced by the synthesis, assembly can be removed from the first solvent 112 using the first filter system 118. After the particles of the precision assembly are removed in the cleaning tank 11 ,, the precision assembly is moved to the rinsing tank 124 using the basket 143. When placed in the rinse tank 124, a small amount of the first solvent 112 remains on the precision components. The second solvent 126 rinses away any remaining particles and dissolves the first solvent 112 from the precision component. This flushing can be further effected in the flushing tank 24 by using the ultrasonic wave conversion in the flushing tank 124 to cause cavitation. Additionally, the basket 143 can oscillate up/down and/or side/side to further facilitate the removal of contaminants from the precision components. After cleaning, the basket 143 is removed from the rinse tank 124 where the vapor blanket 144 dries the precision components so that they are free of film or residue. The precision assembly is then prepared for further processing or use in the 326 ΧΡ/invention specification (supplement)/95-02/94137800 14 1298026. During the flushing 4曰124, the level of the solvent 126 is maintained at a steady state value such that there is a constant overflow through the weir 142 and into the recovery tank 136 =. When the precision component is flushed in the rinse tank 124, the second solvent 0126 is continuously contaminated with the dissolved amount of the first solvent 112 and any other > dyeables present on the precision components. Thus, as illustrated in Figure 4, the solvent mixture 146 of the first solvent 112, the second solvent 126, and any other contaminants is introduced into the recovery tank 136 into the recovery tank 136. Since the first solvent 112 is selected to have a higher boiling point than the second solvent 126 (and so much is high), the second solvent 126 is continuously boiled from the solvent mixture, which leads to the first over time. The amount of solvent 112 accumulates and increases in the recovery tank 136. The concentration of the first solvent 112 in the recovery tank 136 is eventually increased to the point where the boiling point of the solvent mixture &amp; i 4 6 4 is increased, and the most solvent mixture 146 is separated. <Separation and Disposal Operation> # Figure 2 and Table 10 illustrate the solvent disposal and return mode of the two-solvent cleaning system. As illustrated in Figure 4, the continuous operation of the two-solvent cleaning system 100, the concentration of the first solvent ii2 in the recovery tank i36 is unacceptable as evidenced by the increase in boiling point of the compound 146. The extent of the priest ~ analogy. Children's increased by 1〇C or more. The separation of the solvent mixture 146 (including any of the keratin dyes) is achieved by forming the cold portion of the solvent mixture 146 to 5 Torr in the recovery tank (10) so as to form two distinct liquid levels, wherein the first agent Portion 148 includes a first solvent 112 (including any soil 5 wood) and a first solvent portion 15A comprising a second solvent 126. The first solvent j26XP/invention specification (supplement)/95-〇2/94]3?fine 1298026 part 148 and the second solvent portion 15〇 can generally be visually distinguished by the naked eye. The cooling in the recovery tank 136 is closed by the recovery heater 138, the condenser coil 139 is closed to cause the vapor blanket 144 to disappear, and the liquid is recovered by opening the valves 131b, 131d while closing the valves 131a, 131c. The tank 136 is recirculated through the recovery loop 128 such that the liquid can be achieved by a second heat exchange 134 cooling. When the solvent mixture 146 is cooled, the second solvent I26 is no longer boiling away from the solvent mixture 146, so that the pure solvent of the second solvent 126 stops condensing on the condenser coil 139 and is no longer filled with the rinse tank 124 so that the rinse The level of the second solvent 126 in the tank 124 drops to the level of the weir 142 and no longer overflows into the recovery tank 136, as illustrated in Figures 4, 5 and 6. It will be apparent to those skilled in the art that the rinsing tank %, recovery tank 136, and recovery circuit 128 may include appropriate sensors, gauges, and alarm stomachs to monitor and maintain proper temperature, flow rate, pressure, and other conditions during the cleaning process. Process variables. When the recovery tank is cooled to 5 〇. When ruthenium, the solvent mixture 146 is separated into a first solvent portion 148 and a second solvent portion 150, as illustrated in FIG. Once the first solvent portion 148 and the second solvent portion 15 are formed, the valves 131a, 131d are closed while the valves 131a, 131d are closed, so that the second solvent 126 in the flushing 124 is pumped to the recovery tank, so that The amount of the two solvent portion 150 is increased. As illustrated in Figure 8, as the second solvent portion 150 increases, the first solvent portion 148 rises until it reaches a recovery overflow, 152 where the first solvent portion 148 containing the first solvent 112 and any soil contaminants overflows. To the waste tank 140. Recovery tank 136 326XP / invention specification (supplement) / 95 · 〇 2 / 94] 3780 〇 \ r 1298026 package = viewing port 154 set relative to the recovery overflow 152, so that when the first solvent portion 148 overflows recycling When the weir 152 is overflowed, it is better for the operator to observe it. When the level of the second solvent worker 26 in the recovery #! 3 6 increases, the second solvent portion 15〇t eventually approaches the recovery overflow 152, as illustrated in FIG. At this point, most of the first solvent portion 丨48 has been introduced into the waste tank 140 so that the valves 131a, 131, and 11 and I3ld are placed in the normal operation position, and the remaining components can be re-started. Normal operating state, as illustrated in Figure 1〇. Or 'transparently mounted, a suitable optical sensor such as, for example, a light eye or a camera, to visually distinguish between the first portion 148 and the second solvent portion 15 ,, while the first solvent portion 148 Overflow automation. For a successful two-solvent cleaning system, it is not necessary to remove all of the first solvent 112 from the recovery tank 136, but only to lower the boiling point of the solvent mixture 146 to the boiling point of the second solvent 丨26. The first solvent 112 (including any dissolved particles and contaminants) in the waste tank 140 can then be suitably recycled, recycled or disposed of. The first solvent 112 is a VOC-free solvent such that it can be incinerated or used as a fuel stream source. As already stated, in the case where the unit price of the second solvent 126 is greater than the unit price of the first solvent 112, the dual solvent cleaning system 丨 may be particularly economically advantageous. It is to be understood that the invention is not intended to be limited to the particular embodiments and examples disclosed herein. Although the invention is susceptible to various modifications and alternative forms, the details are described and described in detail in the drawings, 326 XP/Inventive Specification (Repair)/95-02/94137800 !298026. However, it should be clear that it is not specific to specific examples. To the contrary, the spirit and scope of the invention, which is defined by the scope of the claims, is intended to be modified, equivalent, and substitute. BRIEF DESCRIPTION OF THE DRAWINGS The present invention is more fully understood by the detailed description of the above example of the cut (four) test, wherein: °) is a schematic diagram of the cleaning system of the present disclosure, showing the cleaning and punching Fig. 1 Schematic diagram of the cleaning system' shows solvent recovery and waste soilFig. 3 is an eight-figure diagram of the flushing tank and the recovery tank of the cleaning system in the startup mode. Figure 4 is a schematic diagram of the clearing (4), the timely flushing tank and the timely tank. ~ month your style, 5 series Figure 1 clear weaving tank rinse tank in time slot in the first step of solvent recovery. Fig. 6 is a schematic view showing the second step of the solvent recovery of the flushing tank and the recovery tank of the cleaning system of Fig. 1. Figure 7 is a schematic diagram of the third step of the flushing tank and the recovery tank of the Qingchun system in the solvent recovery mode. Figure 8 4 Figure 1 Schematic diagram of the four steps of the flushing tank and recovery tank of the Qingchun system in the solvent recovery module. Figure 9 is a schematic illustration of the fifth step of the flushing tank and recovery tank of the cleaning system of Figure 1 in a solvent recovery mode of the invention (Supplement) / 95-02/94 ] 37800 18 1298026. Fig. 10 is a schematic view showing the flushing tank and the recovery tank of the cleaning system of Fig. 1 returning to the operation mode. [Main component symbol description]

100 雙溶劑清潔系統 102 系統外殼 104 清潔部分 106 沖洗部分 108 溶劑回收部分 110 清潔槽 112 第一溶劑 114 第一再循環迴路 116 超音波轉換器 118 第一過濾器系統 119 閥 120 第一再循環泵 122 第一熱交換器 124 沖洗槽 126 第二溶劑 128 回收迴路 130 第二過濾器系統 131a 閥 131b 閥 131c 閥 326XP/發明說明書(補件)/95-02/94137800 19 1298026 131d 閥 132 第二再循環泵 134 第二熱交換器 136 回收槽 138 回收加熱器 139 冷凝螺管 140 廢棄物槽 142 溢流堰 143 籃 144 蒸氣毯 146 溶劑混合物 148 第一溶劑部分 150 第二溶劑部分 152 回收溢流堰 154 觀看口100 Dual Solvent Cleaning System 102 System Housing 104 Cleaning Section 106 Flushing Section 108 Solvent Recovery Section 110 Cleaning Tank 112 First Solvent 114 First Recirculation Loop 116 Ultrasonic Converter 118 First Filter System 119 Valve 120 First Recirculation Pump 122 first heat exchanger 124 flushing tank 126 second solvent 128 recovery circuit 130 second filter system 131a valve 131b valve 131c valve 326XP / invention manual (supplement) / 95-02 / 94137800 19 1298026 131d valve 132 second Circulating pump 134 second heat exchanger 136 recovery tank 138 recovery heater 139 condensing coil 140 waste tank 142 overflow weir 143 basket 144 vapor blanket 146 solvent mixture 148 first solvent portion 150 second solvent portion 152 recovery overflow weir 154 viewing port

326XP/發明說明書(補件)/95-02/94137800 20326XP/Invention Manual (supplement)/95-02/94137800 20

Claims (1)

1298026 十、申請專利範圍: 1. 一種清潔精密組件之方法,包括: 將一精密組件置於經填充用於自精密組件移除污染物 之第一溶劑的清潔槽内,以清潔該精密組件; 在經填充第二溶劑的沖洗槽内沖洗該精密組件,其中該 精密組件上之任何殘留量的第一溶劑係藉由第二溶劑而 移除,以形成溶劑混合物;及 藉由冷卻溶劑混合物而將該溶劑混合物於回收槽内分 B 離成第一溶劑部分及第二溶劑部分,使得第一溶劑部分係 位於第二溶劑部分之頂端,該第一溶劑部分及第二溶劑部 分可由肉眼在視覺上作區別,且其中可將該第一溶劑部分 自回收槽移除。 2. 如申請專利範圍第1項之方法,其中該自回收槽移除 第一溶劑部分包括將溶劑混合物自沖洗槽泵送至回收槽 中,使得第一溶劑部分到達回收堰並溢流至處置槽中。 | 3.如申請專利範圍第2項之方法,其中該自沖洗槽泵送 溶劑混合物係當第二溶劑部分接近回收堰時完成。 4. 如申請專利範圍第2項之方法,其進一步包括: 將第一溶劑部分設置於處置槽内。 5. 如申請專利範圍第1項之方法,其中當回收槽中之溶 劑部分之沸點超過第二溶劑之沸點至少l〇°C時,必須溶 劑混合物。 6. 如申請專利範圍第1項之方法,其中清潔該精密組件 包括於第一溶劑内引發空泡現象(cavitation)。 326XP/發明說明書(補件)/95-02/94137800 1298026 二請ί:;範圍第1項之方法’其中清潔該精密組件 匕枯於弟一 &gt;谷劑内振盪精密組件。 二::?專利範圍第1項之方法,其中沖洗該精密組件 匕括於,合蜊混合物内引發空泡現象。 9·如申5月專利範圍第;[項之方法,其中沖洗該精密組件 包括於溶劑混合物内振盪精密組件。1298026 X. Patent Application Range: 1. A method of cleaning a precision component, comprising: placing a precision component in a cleaning tank filled with a first solvent for removing contaminants from a precision component to clean the precision component; Flushing the precision component in a rinse tank filled with a second solvent, wherein any residual amount of the first solvent on the precision component is removed by the second solvent to form a solvent mixture; and by cooling the solvent mixture The solvent mixture is separated into a first solvent portion and a second solvent portion in a recovery tank such that the first solvent portion is located at the top of the second solvent portion, and the first solvent portion and the second solvent portion are visually visible to the naked eye. The difference is made, and wherein the first solvent portion can be removed from the recovery tank. 2. The method of claim 1, wherein the removing the first solvent portion from the recovery tank comprises pumping the solvent mixture from the rinse tank to the recovery tank such that the first solvent portion reaches the recovery helium and overflows to the disposal In the slot. 3. The method of claim 2, wherein the self-flushing tank pumps the solvent mixture when the second solvent portion is near the recovery enthalpy. 4. The method of claim 2, further comprising: disposing the first solvent portion in the disposal tank. 5. The method of claim 1, wherein the solvent mixture is necessary when the boiling point of the solvent portion in the recovery tank exceeds the boiling point of the second solvent by at least 1 °C. 6. The method of claim 1, wherein cleaning the precision component comprises causing cavitation in the first solvent. 326XP / invention manual (supplement) / 95-02/94137800 1298026 two please ί:; the method of the first item 'which cleans the precision components 匕 于 弟 & &gt; two::? The method of claim 1, wherein rinsing the precision component is included in the mash mixture to cause cavitation. 9. The method of claim 5, wherein the rinsing of the precision component comprises oscillating the precision component in a solvent mixture. ι〇·種用於自精密組件移除污染物之雙溶劑清潔系 統,包括: “、’、 具有用於容納第一溶劑之清潔槽的清潔部分; 具有用於容納第二溶劑之沖洗槽的沖洗部分,該第二溶 劑^有較第-溶劑低至少WGt之第二溶劑沸點,該第 一洛劑將任何自清潔槽殘留於精密組件上之第一溶劑溶 解忒冲洗槽進一步包括在該第二溶劑上方之冷凝螺 及 具有用於容納第一溶劑及第二溶劑之溶劑混合物之回 _收槽的溶劑回收部分,該回收槽藉由一溢流堰與沖洗槽分 離,該回收槽進-步包括一熱源及一冷卻源, 其中忒熱源於沖洗槽及回收槽之上方產生共同的第二 /谷劑瘵氣毯’使得第二溶劑之純餾出物凝結於冷凝螺管上 及机入至沖洗槽中,使得第二溶劑之液位上升直至其溢流 過溢流堰及進入至回收槽中為止, 其中該回收槽中之第一溶劑之濃度隨時間增加,導致溶 剤犯合物沸點超過第二溶劑沸點至少約10。〇,使得溶劑 混合物需要分離,及 326XP/發明說明書(補件)/95_〇2/94137800 22 1298026 其中該冷卻源冷卻回收槽中之溶劑混合物,以形成各可 用肉眼在視覺上區別之第一溶劑部分及第二溶劑部分,使 得第一溶劑部分自回收槽被移除。 11. 如申請專利範圍第10項之雙溶劑清潔系統,其中該 溶劑回收部分包括一藉由一回收溢流堰而與回收槽分離 的處置槽,該第一溶劑部分流過回收溢流堰並進入處置槽 中0 12. 如申請專利範圍第10項之雙溶劑清潔系統,其中該 第一溶劑及第二溶劑之至少一者包括不含VOC的溶劑。 13. 如申請專利範圍第12項之雙溶劑清潔系統,其中該 第一溶劑包含大豆基質溶劑(soy-based solvent)。 14. 如申請專利範圍第10項之雙溶劑清潔系統,其進一 步包括一用於將精密組件自清潔槽輸送至沖洗槽的籃。 15. 如申請專利範圍第10項之雙溶劑清潔系統,其中該 清潔槽包括至少一用於在第一溶劑内產生空泡現象的超 0 音波轉換器。 16. 如申請專利範圍第10項之雙溶劑清潔系統,其中該 沖洗槽包括至少一用於在溶劑混合物内產生空泡現象的 超音波轉換器。 17. 如申請專利範圍第10項之雙溶劑清潔系統,其中該 清潔部分包括一清潔再循環迴路,其具有一清潔泵、一清 潔過濾器及一清潔加熱器,該清潔泵將第一溶劑再循環通 過清潔過濾器以移除顆粒物質,及該清潔泵將第一溶劑再 循環通過清潔加熱器以加熱第一溶劑。 326XP/發明說明書(補件)/95-02/94137800 1298026 18.如申請專利範圍第1〇項 、— 沖洗部分包括一沖、先再循、〜合劑m統,其中該 洗過、^ Γ 路,其具有—沖洗泵及一沖 娜劑混合物再循環通過沖洗過濾器 以移除顆粒物質。A dual solvent cleaning system for removing contaminants from precision components, including: ", ', a cleaning portion having a cleaning tank for containing a first solvent; having a rinse tank for containing a second solvent a rinsing portion, the second solvent having a boiling point of a second solvent lower than the first solvent by at least WGt, the first agent dissolving any first solvent remaining on the precision component from the cleaning tank, and further comprising the first solvent in the rinsing tank a condensate snail above the solvent and a solvent recovery portion having a back-receiving tank for accommodating the solvent mixture of the first solvent and the second solvent, the recovery tank being separated from the rinsing tank by an overflow raft, the recovery tank is - The step includes a heat source and a cooling source, wherein the heat source is generated above the flushing tank and the recovery tank to generate a common second/corner helium blanket', so that the pure distillate of the second solvent is condensed on the condensing coil and the machine is inserted Up to the rinsing tank, the liquid level of the second solvent is raised until it overflows the weir and enters the recovery tank, wherein the concentration of the first solvent in the recovery tank increases with time, resulting in dissolution The boiling point of the compound exceeds the boiling point of the second solvent by at least about 10. 〇, such that the solvent mixture needs to be separated, and 326 XP / invention specification (supplement) / 95_〇 2 / 94137800 22 1298026 wherein the cooling source cools the solvent mixture in the recovery tank, Forming a first solvent portion and a second solvent portion that are visually distinguishable from each of the available naked eyes such that the first solvent portion is removed from the recovery tank. 11. The dual solvent cleaning system of claim 10, wherein the solvent The recovery portion includes a disposal tank separated from the recovery tank by a recovery overflow, the first solvent partially flowing through the recovery overflow weir and entering the disposal tank. 12. 12. Double solvent cleaning as in claim 10 The system wherein at least one of the first solvent and the second solvent comprises a VOC-free solvent. 13. The dual solvent cleaning system of claim 12, wherein the first solvent comprises a soy-based solvent (soy-based) Solvent 14. The dual solvent cleaning system of claim 10, further comprising a basket for transporting the precision components from the cleaning tank to the rinse tank. A dual solvent cleaning system according to claim 10, wherein the cleaning tank comprises at least one super-sonic transducer for generating cavitation in the first solvent. 16. The double solvent as claimed in claim 10 a cleaning system, wherein the rinsing tank comprises at least one ultrasonic transducer for creating a cavitation in a solvent mixture. 17. The dual solvent cleaning system of claim 10, wherein the cleaning portion comprises a cleaning recirculation a circuit having a cleaning pump, a cleaning filter, and a cleaning heater, the cleaning pump recirculating the first solvent through the cleaning filter to remove particulate matter, and the cleaning pump recirculating the first solvent through the cleaning heating To heat the first solvent. 326XP/Inventive Manual (Replenishment)/95-02/94137800 1298026 18. As claimed in the first paragraph of the patent application, the flushing part includes a flush, a first cycle, and a mixture of m, wherein the wash, ^ Γ road It has a flushing pump and a kneading agent mixture recycled through the flushing filter to remove particulate matter. 19.如申請專利範圍第18項之雙溶劑清潔系統,其中該 沖洗再循環迴路係呈流體方式連接至回收槽,且其中該沖 洗f將溶劑混合物泵送通過冷卻源’以將溶劑混合物分離 成弟〉谷劑部分及第二溶劑部分。 20.如申請專利範圍第1〇項之雙溶劑清潔系統,其中該 回收槽包含一觀看窗,以便當第一溶劑部分自回收槽被移 除時可利用肉眼對其進行觀看。19. The dual solvent cleaning system of claim 18, wherein the flushing recirculation circuit is fluidly connected to the recovery tank, and wherein the flushing f pumps the solvent mixture through a cooling source to separate the solvent mixture into Brother> the gluten portion and the second solvent portion. 20. The dual solvent cleaning system of claim 1, wherein the recovery tank comprises a viewing window for viewing with the naked eye when the first solvent portion is removed from the recovery tank. 326XP/發明說明書(補件)/95-02/94丨37800 24326XP/Invention Manual (supplement)/95-02/94丨37800 24
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