TWI297191B - Apparatus por heating and securing base plate - Google Patents

Apparatus por heating and securing base plate Download PDF

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Publication number
TWI297191B
TWI297191B TW95115375A TW95115375A TWI297191B TW I297191 B TWI297191 B TW I297191B TW 95115375 A TW95115375 A TW 95115375A TW 95115375 A TW95115375 A TW 95115375A TW I297191 B TWI297191 B TW I297191B
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Taiwan
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fixing device
plate
substrate
substrate heating
heating
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TW95115375A
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Chinese (zh)
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TW200741947A (en
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Chen Hsing Cheng
Shing I Hu
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Icf Technology Co Ltd
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Description

Ί297191 • 九、發明說明: • 【發明所屬之技術領域】 本發明涉及一種基板加熱與固定裝置,特別係用喷墨 法製作彩色濾光片用之基板加熱與固定裝置。 【先前技術】 彩色濾光片主要具有三個方面之用途,第一係應用於 影像感應器方面,譬如為電荷耦合單元;第二係應用於線 ⑩ 型感應器,譬如為晶體快門;再有係應用於顯示器上,譬 如為交錯式、超級交錯式薄膜電晶體之液晶顯示器。隨著 這些產品需求之成長,彩色濾光片之需求也隨之增加。 目前,先前技術之彩色濾光片製備方法主要有:顏料 分散方法(Pigment_dispersed Method)以及喷墨方法(ink Jet Method) 〇 顏料分散方法係將彩色光阻(C〇i〇r Resist)以旋轉塗佈 之方式塗佈於基板上,經由曝光顯影之方式製備成色塊 φ (C〇1〇rArea)。彩色光阻係將彩色顏料均勻分散於其中之光 阻,具有照光反應與熱硬化之特性。紅、綠、藍(r、G、 B)三色彩色光阻必需經過三道塗佈、曝光、顯影製程,最 後形成彩色濾光片。顏料分散方法由於製程複雜以及設備 成本咼之缺點,已逐漸被噴墨方法取代。 喷墨方法係使用一噴墨裝置將RGB彩色墨水同時喷 射於一基板上之黑矩陣内,彩色墨水被脫水後於該基板上 ,形成著色之RGB顏色層圖案。使用喷墨方法能夠一次形成 RGB顏色層,使得製備過程大量簡化,成本大幅降低。故, 7 Ί297191 噴墨方法具有製程簡化、環保、節省原料之諸多優點。 而現如今所使用之喷墨設備,喷墨頭將墨水喷射至基 板之黑矩陣後,需要將墨水中之溶劑去除,可以採用烘乾、 曝光及烘烤三種中之任一種或任兩種或三種方法。惟,將 墨水中之溶劑去除需要一定長時間,故利用該喷墨設備製 &彩色渡光片速度較慢。如果將墨水中之溶劑去除之時間 縮短,那麼製造彩色濾光片之速度就會有所提高。 【發明内容】 有鑑於此,提供一種用喷墨法製作彩色濾光片用之基 板加熱與固定装置實為必需。 一種基板加熱與固定裝置,其包括:支撐板,内部設 置有加熱器件,用以支撐並加熱基板,該支撐板厚度方向 上設置有通氣孔;真空層,設置於支撐板遠離基板之一侧, 其内部設置有/腔體,該腔體與抽真空裝置相連,支撐板 之通氣孔與該真空層之腔體連通;隔熱層,設置於真空層 遠離支撐板之/側’防止支撐板產生之熱量擴散。 相較於先前技術’所述之基板加熱與固定裝置由於支 撐板内部設置有加熱器件,可以將基板於喷墨前預熱到一 定溫度,墨水噴塗到已預熱之基板上後,墨水中之溶劑就 會蒸發掉一部分’再利用其他方法將墨水乾燥所需之時間 就會比先前有所縮短。故,製造彩色濾光片之速度得到提 高。 【實施方式】 下面將結合附圖對本發明作進一步詳細說明。 8 1297191 請-併參閱圖i及圖2,圖i係本發明基板加熱 定裝置之立體結構示意圖,_ 2係本發日月基板加熱與固〜 裝置沿圖1中n-η線之剖面結構示意圖。基板加熱與固: 裝置1包括支撐板2、真空層3、隔熱層4、冷卻板5、^ 部設置有空腔61之平板6、安裝有頂針71之升降板 旋轉機構8。支撐板2之上表面2㈣來支撐製作彩色據= 片用之基板,該上表面2〇之相鄰兩邊緣部位設置 ς 9,另外相鄰之兩邊緣部位設置有夾具1〇。該夾具1〇包祛 抵片1〇〇、彈簧1〇1、傳感器1〇2與氣壓缸1〇3,壓力傳 器102藉由彈簧1〇1與抵片1〇〇相連,傳感器1〇2遠離^ 簧101之一侧與氣壓缸103相連。該支撐板2之厚度方向 上5又置有複數通氣孔23。該支樓板2之内部設置有複數力 熱棒21及溫度傳感器22。真空層3設置於支撐板2之^ 方,該真空層3之内部設置一腔體31,該腔體;31與抽真 空裝置32相連。隔熱層4位於真空層3之下方。冷卻板5 位於隔熱層4之下方,該冷卻板5内部設置有冷卻通道5〇, 冷卻板5連接一冷卻器51,該冷卻器.51内裝有冷卻浪, 例如,水。内部設置有空腔61之平板6位於冷卻板5 I卞 方,安裝有頂針71之升降板7設置於平板6之空腔61朽’ 該升降板7連接一液壓缸72,藉由該液壓缸72產生么虡 力控制升降板7之上升或下降。平板6之底壁62上設裏濟 導引結構63,導執64與升降板7相固持,當升降板7 > 升或下降時,導軌64藉由導引結構63上下滑動。支擭板 2、真空層3、隔熱層4及冷卻板5之厚度方向上設置有谓 9 Ί297191 針孔升降板7上之頂針71藉由液壓缸7 升由頂針孔伸出。旋轉機構δ固持於平板6之 上 該旋轉機構8藉由-馬達驅動能夠帶動力’ 裝置1進行旋轉。 林加熱與固定Ί 297191 • IX. DESCRIPTION OF THE INVENTION: 1. Field of the Invention The present invention relates to a substrate heating and fixing device, and more particularly to a substrate heating and fixing device for producing a color filter by an ink jet method. [Prior Art] Color filters are mainly used in three aspects. The first system is applied to image sensors, such as charge coupled units; the second system is applied to line 10 sensors, such as crystal shutters; It is applied to displays, such as liquid crystal displays with interleaved, super-interlaced thin film transistors. As the demand for these products grows, so does the demand for color filters. At present, the prior art methods for preparing color filters mainly include: Pigment_dispersed method and ink jet method. The pigment dispersion method is to spin coat a color photoresist (C〇i〇r Resist). The cloth was applied to the substrate, and a color patch φ (C〇1〇rArea) was prepared by exposure development. The color resist is a photoresist in which a color pigment is uniformly dispersed, and has characteristics of an illuminating reaction and a heat hardening. Red, green, and blue (r, G, B) three-color color resists must undergo three coating, exposure, and development processes, and finally form a color filter. The pigment dispersion method has been gradually replaced by the inkjet method due to the complicated process and the disadvantage of equipment cost. The ink jet method uses an ink jet device to simultaneously eject RGB color ink onto a black matrix on a substrate, and the color ink is dehydrated onto the substrate to form a colored RGB color layer pattern. The RGB color layer can be formed at one time by using the inkjet method, which greatly simplifies the preparation process and greatly reduces the cost. Therefore, the 7 Ί 297191 inkjet method has many advantages such as simplified process, environmental protection and material saving. Nowadays, in the inkjet device used, after the inkjet head ejects the ink onto the black matrix of the substrate, the solvent in the ink needs to be removed, and any one or two of drying, exposure and baking may be used or three methods. However, it takes a long time to remove the solvent in the ink, so that the color of the color filter is slower by using the ink jet apparatus. If the time for removing the solvent in the ink is shortened, the speed at which the color filter is manufactured is increased. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a substrate heating and fixing device for producing a color filter by an ink jet method. A substrate heating and fixing device includes: a support plate internally provided with heating means for supporting and heating the substrate, the support plate is provided with a vent hole in a thickness direction thereof; and a vacuum layer is disposed on a side of the support plate away from the substrate, The cavity is internally provided with a cavity, and the cavity is connected to the vacuuming device, and the vent hole of the support plate communicates with the cavity of the vacuum layer; the heat insulation layer is disposed at the side of the vacuum layer away from the support plate to prevent the support plate from being generated. The heat spreads. Compared with the substrate heating and fixing device described in the prior art, since the heating device is disposed inside the support plate, the substrate can be preheated to a certain temperature before the ink is ejected, and after the ink is sprayed onto the preheated substrate, the ink is in the ink. The solvent will evaporate a portion of it. The time required to dry the ink by other methods will be shorter than before. Therefore, the speed at which the color filter is manufactured is improved. [Embodiment] Hereinafter, the present invention will be further described in detail with reference to the accompanying drawings. 8 1297191 Please-see also Figure i and Figure 2, Figure 1 is a schematic perspective view of the substrate heating device of the present invention, _ 2 is a cross-sectional structure of the substrate heating and fixing device along the n-η line in Figure 1 schematic diagram. Substrate heating and fixing: The apparatus 1 includes a support plate 2, a vacuum layer 3, a heat insulating layer 4, a cooling plate 5, a flat plate 6 provided with a cavity 61, and a lifting plate rotating mechanism 8 to which a ejector pin 71 is attached. The upper surface 2 (4) of the support plate 2 supports the substrate for producing the color data sheet, and the adjacent two edge portions of the upper surface 2 are provided with ς 9, and the adjacent two edge portions are provided with the jig 1 . The clamp 1 〇 祛 祛 〇〇 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , One side of the spring 101 is connected to the pneumatic cylinder 103. A plurality of vent holes 23 are formed in the thickness direction 5 of the support plate 2. Inside the branch floor 2, a plurality of force bars 21 and a temperature sensor 22 are disposed. The vacuum layer 3 is disposed on the support plate 2, and a cavity 31 is disposed inside the vacuum layer 3, and the cavity 31 is connected to the vacuuming device 32. The insulating layer 4 is located below the vacuum layer 3. The cooling plate 5 is located below the heat insulation layer 4, and the cooling plate 5 is internally provided with a cooling passage 5, and the cooling plate 5 is connected to a cooler 51, which is provided with a cooling wave, for example, water. The flat plate 6 having the cavity 61 is disposed on the side of the cooling plate 5, and the lifting plate 7 on which the ejector pin 71 is mounted is disposed in the cavity 61 of the flat plate 6. The lifting plate 7 is connected to a hydraulic cylinder 72 by means of the hydraulic cylinder 72 generates a force to control the rise or fall of the lift plate 7. The bottom wall 62 of the flat plate 6 is provided with a Ricci guiding structure 63, and the guide 64 is held by the lifting plate 7. When the lifting plate 7 > is raised or lowered, the guide rail 64 is slid up and down by the guiding structure 63. The gusset plate 2, the vacuum layer 3, the heat insulating layer 4, and the cooling plate 5 are disposed in the thickness direction of the ejector pin. The ejector pin 71 on the pinhole lifting plate 7 is extended by the ejector pin hole by the hydraulic cylinder 7 liter. The rotating mechanism δ is held above the flat plate 6. The rotating mechanism 8 is rotated by a motor-driven capable device 1 . Forest heating and fixing

將製作彩色濾光片用之基板放置於支標夕 :〇上,藉由失…抵片,。。與定位銷 加t之位置。其調整位置之過程為夾具1G之氣壓紅10 生壓力使抵片100推動基板前進,藉由夾具1〇之壓力傳 器102來感測基板與定位銷9相接觸之壓力,當該壓力^ 達到一定數值控制氣壓缸103停止推動抵片1〇〇且保持現 有之壓力將基板固定於定位銷9及抵片100之間,即待加 工之位置。 藉由抽真空裝置32將真空層3之腔體31内之空氣抽 出至真空,由於支撐板2之上表面20之通氣孔23與真空 層3之腔體31相通,因此,基板被吸附於支撲板2之上表 面20,控制氣壓缸103之壓力使抵片1〇〇退回離開基板。 開通加熱棒21,將基板預熱,藉由支撐板2内部之溫度傳 感器22檢測其溫度,當溫度達到所需之溫度要求時,關閉 加熱棒21,停止對基板進行加熱。隔熱層4設置於真空層 3之下方,主要係為防止熱量傳至旋轉機構8。冷卻板5内 設置有冷卻通道50,冷卻器51内之水冷卻液經過該通道 於冷卻板5内流動,將熱量帶走,於是水變成熱水,再流 入冷卻器51 ’經冷卻器51將該熱水冷卻,再流入冷卻板5 之冷卻通道50,如此循環,傳遞至冷卻板5之熱量將不能 '1297191 傳遞至旋轉機構8,保證旋轉機構δ 4玉作。旋轉機構s 可藉由馬達驅動帶動基板加熱與固定裝置丄旋轉,能 整基板之定位位置,使基板相對於噴墨設備之喷墨頭精^ 定位。 待基板加工完畢後,藉由抽真空裝置^向真空層3 =腔體31内吹入氣體,加大腔體心之氣體壓力,^體 错,支掉板2之通氣孔23將基板鬆開,控龍壓缸 升降板7上升,導執64藉由導引結構。向上^ 二= = 時不發生傾斜及旋轉,確保 基板之拆卸工作。 板之上表面20,便於 熱外,還2除可以衫加祕21對基板進行加 熱。 女、紅外加熱裝置利用紅外線對基板進行預 /φ" to 水與乙二^51θ内之冷卻液體除水之外,還可為乙 二醇或 如二氧化碳、液體等。冷卻器51内亦可裝冷卻氣體, 冷卻液體氦!1或二氧化碳與氦氣之混合氣體等。利用 動,防止2錢體於冷卻板5之冷卻通道5G内循環流 受到損壞,里$遞至旋轉機構8,能夠保證旋轉機構8不 正常工作。 之上升戈^之抵片1⑻運動之動力源與控制升降板7 失夏降之動力源為液壓缸、氣壓缸或馬達均可。 Λ 、10亦可做小放置於支撐板2上方,並不限制一 11 1297191 定要在支撐板2之外側。定位銷9之數量及位置可依基板 之大小及其他情況而定。 相較於先前技術,戶斤述之基板加熱與固定裝置1由於 支撐板2内部設置有加熱器件,可以將基板於喷墨前預熱 到一定溫度,墨水喷塗到己預熱之基板上後,墨水中之溶 劑就會蒸發掉一部分,再利用其他方法將墨水乾燥所需之 時間就會比先前有所縮短,故,製造彩色濾光片之速度有 所提高。The substrate for the color filter is placed on the yoke: 〇, by the offset... . With the positioning pin plus t position. The process of adjusting the position is that the pressure of the clamp 1G is 10, and the pressure of the clamp 100 pushes the substrate forward, and the pressure of the substrate and the positioning pin 9 is sensed by the pressure transmitter 102 of the clamp 1 when the pressure reaches A certain numerical control pneumatic cylinder 103 stops pushing the tab 1 and maintains the existing pressure to fix the substrate between the positioning pin 9 and the abutment 100, that is, the position to be processed. The air in the cavity 31 of the vacuum layer 3 is evacuated to a vacuum by the vacuuming device 32. Since the vent hole 23 of the upper surface 20 of the support plate 2 communicates with the cavity 31 of the vacuum layer 3, the substrate is adsorbed to the branch. The upper surface 20 of the flap 2 controls the pressure of the pneumatic cylinder 103 to retract the tab 1 离开 away from the substrate. The heating rod 21 is turned on, the substrate is preheated, and the temperature is detected by the temperature sensor 22 inside the support plate 2. When the temperature reaches the desired temperature requirement, the heating rod 21 is turned off to stop heating the substrate. The heat insulating layer 4 is disposed below the vacuum layer 3 mainly to prevent heat from being transmitted to the rotating mechanism 8. A cooling passage 50 is disposed in the cooling plate 5, and the water coolant in the cooler 51 flows through the passage in the cooling plate 5 to take away the heat, so that the water becomes hot water, and then flows into the cooler 51' via the cooler 51. The hot water is cooled and then flows into the cooling passage 50 of the cooling plate 5, so that the heat transferred to the cooling plate 5 will not be transferred to the rotating mechanism 8 by the '1297191, ensuring the rotation mechanism δ4. The rotating mechanism s can drive the substrate heating and the rotation of the fixing device by the motor driving, and can position the substrate to precisely position the substrate relative to the inkjet head of the inkjet device. After the substrate is processed, the gas is blown into the vacuum layer 3 = the cavity 31 by the vacuum device, the gas pressure of the cavity is increased, and the vent hole 23 of the plate 2 is loosened to loosen the substrate. The control dragon cylinder lifting plate 7 is raised, and the guide 64 is guided by the structure. When tilting up and two ==, tilting and rotation do not occur, ensuring the removal of the substrate. The upper surface 20 of the board is convenient for heat, and the substrate is heated by the addition of the secret 21. The female and infrared heating devices use infrared rays to pre-preserve the substrate, and in addition to water, the cooling liquid in the water and the water can be ethylene glycol or carbon dioxide or liquid. Cooling gas can also be installed in the cooler 51 to cool the liquid 氦! 1 or a mixture of carbon dioxide and helium. By utilizing the movement, the circulation flow in the cooling passage 5G of the cooling plate 5 is prevented from being damaged, and the reciprocating mechanism is transferred to the rotating mechanism 8, which ensures that the rotating mechanism 8 does not operate normally. The power source and the control lifting plate of the lifting piece 1 (8) movement are the hydraulic cylinder, the pneumatic cylinder or the motor. Λ, 10 can also be placed small above the support plate 2, and does not limit one 11 1297191 to the outside of the support plate 2. The number and position of the locating pins 9 can vary depending on the size of the substrate and other conditions. Compared with the prior art, the substrate heating and fixing device 1 is provided with a heating device inside the support plate 2, and the substrate can be preheated to a certain temperature before the ink is ejected, and the ink is sprayed onto the preheated substrate. The solvent in the ink evaporates a part, and the time required to dry the ink by other methods is shorter than before, so the speed of manufacturing the color filter is improved.

提出二,本發明確已符合發明專利之要件,遂依法 ., 牙僅為本發明之較佳實施例, 自不能以此限制本案之申請專 > I她例 夕人分士找 轨圍。舉凡熟悉本案技藝 蓋於以下中請專利範圍内。切效修飾或變化,皆應涵 【圖式簡單說明】Secondly, the present invention has indeed met the requirements of the invention patent, and the tooth is only a preferred embodiment of the present invention, and it is not possible to limit the application of the case by itself. Those who are familiar with the skills of this case are covered by the following patents. The effect of modification or change should be included [Simplified illustration]

圖1係本發明基板加熱與 圖0 定裝置之立體結構示意 固定裝置沿圖1中 π - π線之 支撐板 2 隔熱層 4 平板 6 圖2係本發明基板加熱與 剖面結構示意圖。 【主要元件符號說明】 基板加熱與固定裝置 1 真空層 3 冷卻板 ς 12 81297191BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the structure of the substrate of the present invention. Fig. 2 is a schematic view showing the structure of the heating and the cross-sectional structure of the substrate of the present invention. [Main component symbol description] Substrate heating and fixing device 1 Vacuum layer 3 Cooling plate ς 12 81297191

升降板 7 旋轉機構 定位銷 9 夾具 支撐板上表面 20 加熱棒 溫度傳感器 22 通氣孔 腔體 31 抽真空裝置 冷卻通道 50 冷卻器 空腔 61 底壁 導引結構 63 導軌 頂針 71 液壓缸 抵片 100 彈簧 壓力傳感器 102 氣壓缸 10 21 23 32 51 62 64 72 101 103Lifting plate 7 Rotating mechanism locating pin 9 Clamping support plate surface 20 Heating rod temperature sensor 22 Venting cavity 31 Vacuuming device Cooling channel 50 Cooler cavity 61 Bottom wall guiding structure 63 Rail ejector 71 Hydraulic cylinder pad 100 Spring Pressure sensor 102 pneumatic cylinder 10 21 23 32 51 62 64 72 101 103

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Claims (1)

1297191 4 十、申請專利範圍: 1. 一種基板加熱與固定裝置,其包括: 支撐板,内部設置有加熱器件,用以支撐並加熱基板, 該支撐板厚度方向上設置有通氣孔, 真空層,設置於支撐板遠離基板之一侧,其内部設置有 一腔體,該腔體與抽真空裝置相連,支撐板之通氣孔與 該真空層之腔體連通; 隔熱層,設置於真空層遠離支撐板之一侧,防止支撐板 > 產生之熱量向隔熱層遠離真空層之一側擴散。 2. 如申請專利範圍第1項所述之基板加熱與固定裝置,其 中,該支撐板之加熱器件為加熱棒或紅外加熱裝置。 3. 如申請專利範圍第1項所述之基板加熱與固定裝置,其 中,該支撐板内設置有溫度傳感器。 4. 如申請專利範圍第1項所述之基板加熱與固定裝置,其 中,進一步包括一冷卻板,設置於隔熱層遠離真空層之 | 一侧。 5. 如申請專利範圍第4項所述之基板加熱與固定裝置,其 中,該冷卻板内設置有複數冷卻通道,該複數冷卻通道 與冷卻器相連。 6. 如申請專利範圍第5項所述之基板加熱與固定裝置,其 中,該冷卻器内裝有冷卻液體或冷卻氣體。 , 7.如申請專利範圍第6項所述之基板加熱與固定裝置,其 中,該冷卻液體包含水、乙二醇中任意一種或其混合液 14 1297191 4 - 8.如申請專利範圍第6項所述之基板加熱與固定裝置,其 . 中,該冷卻氣體包含二氧化碳、氦氣中任意一種或其混 合氣體。 9. 如申請專利範圍第4項所述之基板加熱與固定裝置,其 中,進一步包括一内部設置有空腔之平板及一安裝有頂 針之升降板,該平板位於冷卻板遠離隔熱層之一側,升 降板設置於平板之空腔内。 10. 如申請專利範圍第9項所述之基板加熱與固定裝置,其 中,進一步包括一旋轉機構,該旋轉結構設置於平板遠 離冷卻板之一側。 11. 如申請專利範圍第9項所述之基板加熱與固定裝置,其 中,該升降板與第一動力源相固持,且藉、由該第一動力 源於平板之空腔内上升或下降。 12. 如申請專利範圍第11項所述之基板加熱與固定裝置, 其中,該支撐板、真空層、隔熱層及冷卻板之厚度方向 • 上設置有頂針孔,升降板藉由第一動力源上升時,其頂 針由該頂針孔伸出將基板頂起。 13. 如申請專利範圍第11項所述之基板加熱與固定裝置, 其中,平板之底壁上設置有導引結構,與升降板相固持 之導軌於該導引結構中上下滑動。 14. 如申請專利範圍第11項所述之基板加熱與固定裝置, • 其中,該第一動力源為氣壓缸、液壓缸或馬達。 . 15.如申請專利範圍第1項所述之基板加熱與固定裝置,其 15 1297191 中,該支撐板上表面之邊緣部設置有定位銷及夾具,將 基板固定於支撐板上。 16. 如申請專利範圍第15項所述之基板加熱與固定裝置, _ 其中,該夾具包括抵片、彈簧、傳感器與動力源,傳感 器藉由彈簧與抵片相連,傳感器遠離彈簧之一側與第二 動力源相連。 17. 如申請專利範圍第16項所述之基板加熱與固定裝置, k 其中,該第二動力源為氣壓缸、液壓缸或馬達。1297191 4 X. Patent application scope: 1. A substrate heating and fixing device, comprising: a support plate internally provided with heating means for supporting and heating the substrate, wherein the support plate is provided with a vent hole and a vacuum layer in a thickness direction thereof; The utility model is disposed on a side of the support plate away from the substrate, and a cavity is disposed in the cavity, the cavity is connected to the vacuuming device, and the vent hole of the support plate communicates with the cavity of the vacuum layer; the heat insulation layer is disposed on the vacuum layer away from the support One side of the plate prevents the heat generated by the support plate from diffusing toward the side of the heat insulating layer away from the vacuum layer. 2. The substrate heating and fixing device according to claim 1, wherein the heating device of the support plate is a heating rod or an infrared heating device. 3. The substrate heating and fixing device according to claim 1, wherein the support plate is provided with a temperature sensor. 4. The substrate heating and fixing device of claim 1, further comprising a cooling plate disposed on a side of the heat insulating layer away from the vacuum layer. 5. The substrate heating and fixing device of claim 4, wherein the cooling plate is provided with a plurality of cooling passages connected to the cooler. 6. The substrate heating and fixing device of claim 5, wherein the cooler is provided with a cooling liquid or a cooling gas. 7. The substrate heating and fixing device according to claim 6, wherein the cooling liquid comprises any one of water and ethylene glycol or a mixture thereof. 14 1297191 4 - 8. As claimed in claim 6 In the substrate heating and fixing device, the cooling gas contains any one of carbon dioxide and helium or a mixed gas thereof. 9. The substrate heating and fixing device of claim 4, further comprising a flat plate internally provided with a cavity and a lifting plate mounted with a thimble, the flat plate being located at one of the cooling plates away from the thermal insulation layer On the side, the lifting plate is disposed in the cavity of the flat plate. 10. The substrate heating and fixing device of claim 9, further comprising a rotating mechanism disposed on a side of the flat plate away from the cooling plate. 11. The substrate heating and fixing device of claim 9, wherein the lifting plate is held by the first power source and is raised or lowered by the first power source in the cavity of the plate. 12. The substrate heating and fixing device according to claim 11, wherein the thickness direction of the support plate, the vacuum layer, the heat insulation layer and the cooling plate are provided with a thimble hole, and the lifting plate is first When the power source rises, the ejector pin protrudes from the ejector pin to lift the substrate. 13. The substrate heating and fixing device according to claim 11, wherein the bottom wall of the flat plate is provided with a guiding structure, and the guide rail held by the lifting plate slides up and down in the guiding structure. 14. The substrate heating and fixing device according to claim 11, wherein the first power source is a pneumatic cylinder, a hydraulic cylinder or a motor. 15. The substrate heating and fixing device according to Item 1, wherein the edge portion of the surface of the support plate is provided with a positioning pin and a jig to fix the substrate to the support plate. 16. The substrate heating and fixing device according to claim 15, wherein the jig comprises a pad, a spring, a sensor and a power source, and the sensor is connected to the pad by a spring, and the sensor is away from the side of the spring The second power source is connected. 17. The substrate heating and fixing device of claim 16, wherein the second power source is a pneumatic cylinder, a hydraulic cylinder or a motor. 1616
TW95115375A 2006-04-28 2006-04-28 Apparatus por heating and securing base plate TWI297191B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI417497B (en) * 2008-09-25 2013-12-01 Tokyo Electron Ltd Reduced-pressure drying device and reduced-pressure drying method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI417497B (en) * 2008-09-25 2013-12-01 Tokyo Electron Ltd Reduced-pressure drying device and reduced-pressure drying method

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