1296820 九、發明說明： 【發明所屬之技術領域】 本發明係有關於積體電路 ^ 路7^件之雷射標示技術，特別 係有關於一種在積體電路元 pi 旰上之雷射標記。 【先前技術】 習知積體電路元件應形成有雷射標記（iasermark)，例 如各式數字、符號或商標圖#，以利易於辨識積體電路元1296820 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a laser marking technique for an integrated circuit, and more particularly to a laser marking on an integrated circuit element pi 。. [Prior Art] Conventional integrated circuit components should be formed with an iasermark, such as various numbers, symbols or trademarks #, to facilitate easy identification of integrated circuit elements.
件之型態、批號或產製來源。-種在晶粒之背面作出雷射 標記之相關技術可參見於中華民國專利公告第395〇41號 雷射in »己之Βθ片」’-晶粒之正面（即主動面）形成有複數 個電晶體元件，晶粒之背面係形成有雷射標記，作為晶粒 身分辨識作用。 雷射標記係以細條雷射光束照射形成，通常一道雷射 光束所照射形成之寬度係無法達到一雷射標記之字元所 要求之筆畫寬度’故需利用多道雷射光移動路徑等距平行 排列之照射，始可作為一字元之可辨識筆畫寬度。 請參閱第1圖，一種習知在積體電路元件上之雷射標 記100係包含有複數個字元110，可為任意大小寫之英文 字母或是阿拉伯數字，每一字元110係具有一筆晝寬度 111，該些字元110之筆畫寬度ιη係遠大於單一道雷射光 移動路徑120之寬度。故需要重覆、密集、等距且平行地 畫上多道雷射光移動路徑120，方可達到該些字元11〇所 而的筆畫寬度111。每一道雷射光移動路徑2 20均為獨立 之雷射光移動筆畫，會有太多之起始點121與結束點122, 5 1296820 造成雷射光出光之延遲。當該些字元11〇係為非封閉環狀 字元時，如C、h、M、s等等，該些雷射光移動路徑12〇 之起始點121與結束點122分別位於字元筆畫之兩端或是 銳角轉折處’造成字元筆畫始端、終端或轉折形狀之不完 整；當該些字元110係為封閉環狀字元時，例如〇 ,該些 雷射光移動路徑120之起始點121與結束點122將相互鄰 近而不應連接，否則會有打印過深以及重覆照射造成過度 熔解擴散之問題。所以該些雷射光移動路徑12〇會分成一 段一段，易造成填不滿與交接斷線之明顯現象（如第3圖之 上層雷射標記之字元所示）。 【發明内容】 本發月之主要目的在於提供一種在積體電路元件上 之雷射標記，藉由在同一字元之筆晝寬度内包含之至少兩 平行反向或同向移動之雷射光移動路徑係為相連接於同 一雷射光移動筆晝，例如直線、曲線或是斜向連接，以減 少交接斷線。 依據本發明，一種在積體電路元件上之雷射標記，包 含至少一字元，其係形成於一積體電路元件之一表面，該 、帛元係由雷射光束所照射形成，該字元之筆畫寬度係包含 有複數個雷射光移動路徑之寬度，其中至少兩平行反向或 同向移動雷射光移動路徑係為相連接於同一雷射光移動 筆畫，以減少交接斷線。 【實施方式】 請參閱第2圖，一種在積體電路元件上之雷射標記2〇〇 1296820 。各複數個字元210。該些字元210係形成於一積體電路 兀件之一表面，例如一晶圓之背面、一晶粒之背面或是一 、體電路封政構造之頂面等等。該些字元210係由雷射光 束所二射形成，應選用波長介於200至850nm間之低能量 雷射光例如波長約在532nm之綠光雷射（green iaser)。 在本實施例中，該些字元210係包含「C」、r h」、r i」、「p」、 M」'F〇」、「S」。每一字元21〇之筆畫寬度211係數倍 於雷射光移動路徑22〇之寬度，即每一字元21〇之筆畫寬 度211係包含有複數個雷射光移動路徑22〇之寬度，其中 至少兩平行反向或同向移動雷射光移動路徑22〇係為相連 接於同一雷射光移動筆畫，故可以減少雷射光移動筆畫數 (即減少雷射光移動路徑22〇之起始點223與結束點224 之數目），進而減少交接斷線。如第3圖所示，第3圖下層 圖案係為本發明具體實作之雷射標記2〇〇，第3圖上層圖 案係為習知雷射標記100，本發明之雷射標記2〇〇有顯著 能減少交接斷線之功效。 請再參閱第2圖，當該些字元21〇係為非封閉環形字 元，例如「C」、「h」、「i」、「p」、「M」、「s」等等，在同— 雷射光移動筆畫之兩平行雷射光移動路徑220係以直線咬 曲線連接，例如U形彎折連接。如第2圖之連接處22ι所 示’其中該兩相鄰平行反向移動之雷射光移動路徑22〇廉 為相反方向的移動’並加以連接成同一雷射光移動筆查 故能增進字元尾端形狀之完整。當該些字元21〇你 1承馬封閉 環形字元，例如「〇」（英文字母之其中一種、、「 ^} υ」（以阿 1296820 拉伯數字表示之「零」）等等，在同一雷射光移動筆畫之兩 平行同向移動之雷射光移動路徑220係為斜向連接，例如 第2圖之斜向連接處222，其中該兩相連之雷射光移動路 徑220應為同一平行向的移動與彎曲。以上之雷射光移動 路徑220可利用電腦輔助緣圖（例如Aut〇Cad程式）儘量設 計成一線到底，可以降低雷射光移動路徑22〇之起始點223 與結束點224設計之不完整，又可提高雷射標示設備之機 台效率。 本發明之保護範圍當視後附之申請專利範圍所界定 者為準，任何熟知此項技藝者，在不脫離本發明之精神和 la圍内所作之任何變化與修改，均屬於本發明之保護範 圍0 【圖式簡單說明】 元件上之雷射標記之示意圖。 具體實施例，一種在積體電路元 第1圖：習知在積體電路 第2圖：依據本發明之_ 件上之雷射標記之示意圖。 第3圖：比對習知盥太恭 /、 發月之雷射標記，兩者照相圖 【主要元件符號說明】 100雷射標記 111筆晝寬度 121起始點 110字元 120雷射光移動路徑 122結束點 200雷射標記 210字元 211筆晝寬度 1296820 220雷射光移動路徑 221連接處 222斜向連接處 223起始點 224結束點The type, batch number or source of production. - Related techniques for making laser markings on the back side of the grain can be found in the Republic of China Patent Bulletin No. 395〇41, laser in » 己之Βθ片"'--the front side of the grain (ie the active surface) is formed in a plurality of In the transistor element, a laser mark is formed on the back side of the crystal grain to serve as a grain identification function. The laser marking is formed by the irradiation of a thin laser beam. Usually, the width of a laser beam is not able to reach the stroke width required by a laser marker. Therefore, it is necessary to use multiple laser light moving paths equidistantly parallel. The illumination of the arrangement can be used as the identifiable stroke width of a character. Referring to FIG. 1 , a conventional laser marker 100 on an integrated circuit component includes a plurality of characters 110, which may be English letters of any suffix or Arabic numerals, and each character 110 has a stroke. The width 111 111 of the characters 110 is much larger than the width of the single-track laser light moving path 120. Therefore, it is necessary to draw a plurality of laser light moving paths 120 in a repeated, dense, equidistant and parallel manner to achieve the stroke width 111 of the characters 11〇. Each of the laser light moving paths 2 20 is an independent laser light moving stroke, and there are too many starting points 121 and ending points 122, 5 1296820 to cause a delay of the laser light exiting. When the characters 11 are non-closed ring characters, such as C, h, M, s, etc., the starting point 121 and the ending point 122 of the laser light moving paths 12 are respectively located in the character strokes The ends of the two corners or the acute angle turn point cause the incompleteness of the beginning, end or transition shape of the character stroke; when the characters 110 are closed loop characters, such as 〇, the laser light moving path 120 starts from The start point 121 and the end point 122 will be adjacent to each other and should not be connected, otherwise there will be a problem that the printing is too deep and the repeated irradiation causes excessive melting and diffusion. Therefore, the laser light moving path 12〇 is divided into a section, which is easy to cause a significant phenomenon of filling and disconnection (as indicated by the character of the upper laser mark in Fig. 3). SUMMARY OF THE INVENTION The main object of the present month is to provide a laser mark on an integrated circuit component that is moved by at least two parallel reverse or co-directional laser light movements within a pen width of the same character. The path is connected to the same laser light moving pen, such as a straight line, a curve or an oblique connection to reduce the disconnection. According to the present invention, a laser mark on an integrated circuit component includes at least one character formed on a surface of an integrated circuit component formed by a laser beam. The width of the stroke of the element includes a width of a plurality of laser light moving paths, wherein at least two of the parallel reverse or the same direction moving the laser light moving path are connected to the same laser light moving stroke to reduce the disconnection. [Embodiment] Please refer to Fig. 2, a laser mark 2〇〇 1296820 on an integrated circuit component. Each of the plurality of characters 210. The characters 210 are formed on one surface of an integrated circuit component, such as a back side of a wafer, a back side of a die or a top surface of a body circuit embossed structure, and the like. The characters 210 are formed by a laser beam, and a low-energy laser light having a wavelength between 200 and 850 nm, for example, a green iaser having a wavelength of about 532 nm, should be used. In the present embodiment, the characters 210 include "C", r h", r i", "p", M"'F〇", and "S". The stroke width 211 of each character 21〇 is equal to the width of the laser light moving path 22〇, that is, the stroke width 211 of each character 21〇 includes the width of the plurality of laser light moving paths 22〇, at least two of which The parallel reverse or co-directional moving laser light moving path 22 is connected to the same laser light moving stroke, so that the number of laser light moving strokes can be reduced (ie, the starting point 223 and the ending point 224 of the laser light moving path 22 are reduced). The number), thereby reducing the disconnection. As shown in FIG. 3, the lower layer pattern of FIG. 3 is a laser marking 2 具体 for the specific implementation of the present invention, and the upper layer pattern of FIG. 3 is a conventional laser marking 100, and the laser marking of the present invention is 2〇〇. Significantly reduce the effect of handover disconnection. Please refer to Figure 2 again. When these characters 21 are non-closed ring characters, such as "C", "h", "i", "p", "M", "s", etc. The two parallel laser light moving paths 220 of the laser light moving stroke are connected by a straight bite curve, for example, a U-shaped bending connection. As shown in the connection diagram 22 of Fig. 2, the laser light moving path 22 in which the two adjacent parallel reverse movements is in the opposite direction, and is connected to the same laser light moving pen to improve the character tail. The shape of the end is complete. When the characters 21 are closed to you, such as "〇" (one of the English letters, "^} υ" ("zero" in the 1296820 Rabble number), etc. The two parallel moving directions of the same laser light moving strokes are obliquely connected, for example, the oblique connecting portion 222 of FIG. 2, wherein the two connected laser light moving paths 220 should be in the same parallel direction. Moving and bending. The above laser light moving path 220 can be designed as a line to the bottom by using a computer-aided edge map (for example, Aut〇Cad program), which can reduce the design of the starting point 223 and the ending point 224 of the laser light moving path 22〇. The integrity of the machine can be improved, and the scope of the invention can be improved. The scope of the invention is defined by the scope of the appended claims, and anyone skilled in the art will be able to do without departing from the spirit and scope of the invention. Any changes and modifications made within the scope of the present invention are within the scope of protection of the present invention. [Simplified illustration of the drawings] Schematic diagram of the laser markings on the components. DETAILED DESCRIPTION OF THE INVENTION A first embodiment of an integrated circuit element The conventional circuit is shown in Fig. 2: a schematic diagram of the laser marking on the _piece according to the invention. Fig. 3: Comparison of the conventional 盥太恭/, the laser marking of the moon, both photographs [mainly Component symbol description] 100 laser mark 111 pen width 121 starting point 110 character 120 laser light moving path 122 end point 200 laser mark 210 character 211 pen width 1296820 220 laser light moving path 221 joint 222 oblique Connection point 223 starting point 224 end point