1296494 17776twf.doc/y 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種印刷電路板（Printed Circuit Board，PCB)，且特別是有關於一種可撓性印刷電路板 (Flexible Printed Circuit Board，FPCB)。 【先前技術】 筆記型電腦(Notebook PC)是目前使用最普遍的可攜 式電腦(portable computer) ’筆記型電腦大致上可分為超薄 型(Super thin type)與全功能型(A11 in 〇ne)兩大型態，不論 是何種型態的筆記型電腦都必須配備輸入裝置，一般的輸 入裝置以人機介面裝置(Human Interface以―，_)為 主，常見的人機介面裝置如滑鼠、鍵盤、手寫/語音辨識系 統等’而許多制程式的操作都必須借重上 習知鍵財印卿路_的製作_ _丁 ::、絕緣薄膜的製作、將絕緣薄膜^ 二沖孔等步驟。線路薄膜的製作是在-薄膜上 所需之接點與線路。而絕緣薄膜的：路薄膜上 孔’以形成多個對應於上述接點之開口，在一薄_行沖 圖1為習知-種印刷電路薄膜 -般來說，印刷電路薄膜5 G的線、=、圖。心照圖1 ’ 線路薄膜H)以及第二線路薄膜2() 大致上可分為第-10以及第二線路薄膜20上分別息^份。第一線路薄膜 之接點12、22，以及連接於各接點、^個與按鍵位置對應 12、22之間的線路14、 6 1296494 l7776twf.doc/y 、％喻碍m製作$墓、 口 16之後，便是先將 緣薄m 3G上形成開 放置於第-綠路薄旗i0，對禮，然後將絕緣薄膜30 行絕緣薄膜30與線路 線路薄膜20之間，再進 詳細地來說，第'd;訝位。 上之線路佈局(％〇ut)彼此10以及第二線路薄膜2〇 二線路薄臈10、20上的接點f關連性。換言之’第一、第 口 16相對應。因此，㈣2與絕緣薄膜3〇上之開 即是使第-線路薄膜1〇以^30與線路薄膜疊合對位 12、22與開口 Μ互相野位，路薄膜2〇上的接點 薄膜。 …、後二合絕緣薄膜30與線路 在、’d物30與鱗薄賴 一線路薄膜K)、絕緣薄膜30以及第二的步，，可先在第 別形成黏著層40。_，疊合第'^路_ 20之間分 3〇以及第二線路薄膜2〇 10、絕緣薄膜 ，0與第一、第二線路薄膜 =丁沖孔，以形成定位孔，而定位 2的。最後再 於按鍵之定位機構。 〕大小與位置係對應 然而，在印刷電路薄膜50的製程中^ 開孔16與第一、第二線路薄膜10、20的接t緣薄膜3〇的 候會難以精準地對位（如圖1之A處）!:^、。22有時 而造成絕緣薄膜的開孔16盥第一、 ^ *製耘的疏失 的接點12、22對位不精準，接點1==膜1〇、2〇 ^的正中央。當接點12與接點 1296494 17776twf.doc/y 不良的現象，印刷電路薄膜5〇無法有效作用，因此浪費膜 片同日守增加製作成本。此外，一般絕緣薄膜都是外購， 且外購之絕緣薄膜的開孔16較經由沖孔形成，而沖孔的 價格昂貴，使得製作成本無法有效降低。 【發明内容】 接點是提供—種可撓性印刷電路板，以提高 制你ίί明之另—目的是提供—種可撓性印刷電路板的 I作方法，以簡化製程步驟。 為達上述或是其他目的，本發明提出一種適用於 刷電:!反，此可撓性印刷電路板包括-第- 膜且有-第第二印刷電路薄膜。第—印刷電路薄 置；第一 導體層以及-絕緣層，其中絕緣層配 牵：：層上’而絕緣層具有多個暴露出部分 圖安二導體層之開孔，且開孔與被暴露出之部分第一 二j電二;多觸窗。第二印刷電路薄膜位於第 二圖案化導體：:：_弟-圖案化導體層與第 位於= 二之:ir例中，第-圖案化導體層包括多個 之二第一印刷2窗之第—接點，以及連接第一接點 對應二本二=之中’第二，_體層包括多個 ”、、 接點，以及連接弟—接點之一第二 8 1296494 17776twf.doc/y 印刷電路。 圖 脂 案化導體層銀第-圖案化導體層與第^ 在本發明之—實爾，絕緣層之材，包括柄化樹 本發明另提dl -種可撓性印 方法包括下列之步驟··首先，提供 、製作方法，此 其中第-印刷電路薄膜具有 安：刷電路薄獏， 表層而、％緣層配置料1案化導體 ^及-絕 分之第-圖案化導體層。然後，提供一第：二暴露出部 其中第二印刷電路薄膜具有-第二圖案化導體/路薄膜， :合第-印刷電路薄膜與第二印刷電路薄膜，後， 性印刷電路板。 义成可撓 在本發明之—實_中，第—印猶路薄膜之 \匕括下列之步驟：首先，提供H膜 -薄膜上形成第-圖案化導體層，其中第一圖案化挪第 $括多個第一接點以及一連接第一接點之第一印刷電=層 取後’於第-®案化導體層上形成—絕緣層，其中。 J有多個開孔’且開孔暴露出第-接點，以形成多铜 在本發明之一實施例中，第一薄膜與第二薄膜之 包括聚碳酸醋、聚對苯二甲酸乙醋、聚甲基丙烯酸賢 丙烯-丁二烯-苯乙烯樹脂或聚碳酸酯與烯_ 丁二烯、 樹脂之組合。 I296491fd〇c/y 在本發明之一實施例中，於第一印刷電 絕緣層之方法包括網版印刷。 a杲上形成 在本發明之—實施例中，第二印刷電路 純括下列之步驟：首先，提供1296494 17776twf.doc/y IX. Description of the Invention: [Technical Field] The present invention relates to a printed circuit board (PCB), and more particularly to a flexible printed circuit board (Flexible Printed Board) Circuit Board, FPCB). [Prior Art] Notebook PC is the most commonly used portable computer. 'Notebooks can be roughly classified into Super thin type and full-function type (A11 in 〇) Ne) Two large states, no matter what type of notebook computer must be equipped with input devices, the general input device is mainly human interface device (Human Interface is -, _), common human-machine interface devices such as Mouse, keyboard, handwriting/speech recognition system, etc.' and many of the programs must be operated by the customary key 财印卿路_ _ ding::, the production of insulating film, the insulating film ^ two punching steps . The wiring film is fabricated on the contacts and lines required on the film. And the insulating film: the film on the upper hole 'to form a plurality of openings corresponding to the above-mentioned contacts, in a thin row 1 is a conventional printed circuit film - in general, the printed circuit film 5 G line , =, map. The heart pattern 1 '' line film H) and the second line film 2 () can be roughly divided into the -10th and second line films 20, respectively. The contacts 12 and 22 of the first line film, and the lines 14 and 6 connected to the contacts, 12 and 22 corresponding to the button positions, 1 1296494 l7776twf.doc/y, % 碍 m m making a tomb, mouth After 16th, the opening of the edge thin m 3G is first placed on the first green road flag i0, and then the insulating film 30 is between the insulating film 30 and the line film 20, and then in detail , 'd; surprised. The upper circuit layout (% 〇ut) is related to each other 10 and the contact frity of the second line film 2 〇 two line thin lines 10, 20. In other words, the first and the first 16 correspond. Therefore, the opening of the (4) 2 and the insulating film 3 is a contact film on which the first-line film 1 is overlapped with the wiring film by the alignment film 12, 22 and the opening ,. The adhesive film 40 is formed on the first, the second insulating film 30 and the wiring, the thin film K, the insulating film 30, and the second step. _, the overlap of the '^路_20 is divided into 3〇 and the second line film 2〇10, the insulating film, 0 and the first and second line film = Ding punch to form the positioning hole, and the positioning 2 . Finally, the positioning mechanism of the button is used. The size and the position are corresponding. However, in the process of the printed circuit film 50, the opening of the hole 16 and the first and second line films 10, 20 are difficult to accurately align (see Fig. 1). A))::^,. 22 Sometimes the opening of the insulating film is 16盥, and the misalignment of the contacts 12, 22 of the ^* system is not accurate, and the contact 1 == the center of the film 1〇, 2〇 ^. When the contact 12 and the contact 1296494 17776twf.doc/y are inferior, the printed circuit film 5〇 cannot function effectively, so the waste film is increased in the same day. Further, the general insulating film is commercially available, and the opening 16 of the commercially available insulating film is formed by punching, and the punching is expensive, so that the manufacturing cost cannot be effectively reduced. SUMMARY OF THE INVENTION The contact is to provide a flexible printed circuit board to improve the process of providing a flexible printed circuit board to simplify the process steps. To achieve the above or other objects, the present invention provides a suitable for brushing: the reverse printed circuit board comprises a - film and a second printed circuit film. The first printed circuit is thin; the first conductor layer and the insulating layer, wherein the insulating layer is disposed on the layer: and the insulating layer has a plurality of openings exposing a portion of the second conductor layer, and the opening is exposed Part of the first two j electric two; more touch the window. The second printed circuit film is located in the second patterned conductor::::- patterned conductor layer and the first located in the second: ir example, the first patterned conductor layer includes a plurality of first printed 2 windows - the contact, and the connection of the first contact corresponds to two two = in the 'second, the _ body layer includes a plurality", the contact, and the connection brother - one of the contacts second 8 1296494 17776twf.doc / y printing The present invention relates to a silver-first patterned conductor layer and a material of the present invention, which comprises a stalk tree. The present invention further provides a DL-type flexible printing method comprising the following First, the first method and the manufacturing method are as follows: wherein the first printed circuit film has an anode: a brush circuit, a surface layer, a % edge layer material 1 and a first-patterned conductor layer. Then, a second: exposed portion is provided, wherein the second printed circuit film has a second patterned conductor film, a first printed circuit film and a second printed circuit film, and then a printed circuit board. It can be flexed in the present invention - the actual - the first - the ink film The following steps: first, providing a first patterned conductor layer on the H film-film, wherein the first patterning includes a plurality of first contacts and a first printed electrical layer connected to the first contacts Forming an insulating layer on the first--case conductor layer, wherein J has a plurality of openings and the openings expose the first contacts to form a plurality of copper in an embodiment of the invention, first The film and the second film include polycarbonate, polyethylene terephthalate, polymethacrylic acryl-butadiene-styrene resin or a combination of polycarbonate and ene-butadiene, resin. I296491fd〇 c/y In one embodiment of the invention, the method of first printing an electrically insulating layer comprises screen printing. A is formed in the embodiment of the invention, the second printed circuit purely comprises the following steps: ,provide
二缚膜上形成第二圖案化導體層，其中第二圖沪： ，括多：第二接點以及一與第二接點連接之第二印刷： ’且第二接輯於藉由接㈣與第__接點電性連接。电 “在本發明之一實施例中，壓合第一、第二印 胰的方法包括熱©化法、紫外光固化法或 / 本發明㈣—印刷電路_上形成具有開孔的絕 二，、因此可以省去使用絕緣膜片以及將絕緣膜片沖孔的制 乍成本。此外，將絕緣層直接形成在第一印刷電路薄膜上, 了以使接點精準地位於開孔内。 ▲為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂’下文特舉-實施例，並配合賴圖式，作詳細說、 如下。 【實施方式】 在本發明之-實施例中，在壓合第_、第==電 薄膜之後’更包括對接職㈣進行—防水處理。 、☆圖2A〜2E依序為本實施例之可撓性印刷電路板的製 作流程剖面^意®。請依序參考圖2A〜2E。首先如圖从 所示，提供第-薄膜110,其中第一薄膜11〇之材質可 ，聚碳酸酯、聚對苯二甲酸乙酯、聚甲基丙烯酸甲酯、汚 烯·丁二烯-苯乙烯樹脂或聚碳酸酯與烯·丁二烯_苯乙烯樹 1296494 17776twf.doc/y 脂之組合。然後，在第一薄膜11〇上貼附一具有良好導電 性之金屬層120。在本實施例中，金羼層12〇之較佳材質 為銅或銀。 然後如圖2B所示，在金屬層12〇上形成一光阻層 130,並且對光阻層13〇進行曝光與顯影，以形成預定的線 路圖案。在對光阻層130進行曝光與顯影之後，對暴露於 光阻層130下方之金屬層120進行蝕刻製程，以在第一薄 膜110上形成如圖2C所示之第一圖案化導體層122。其 中二第一圖案化導體層122包括多個第一接點122a以及連 接第一接點122a之一第一印刷電路122b。 ^接著如圖2D所示，在第一薄膜110上形成一覆蓋在 第一圖案化導體層122上的絕緣層124,而形成絕緣層124 法是網版印刷。其中，絕緣層124之材質包括光固化 樹脂，其例如是聚碳酸酯、聚對苯二甲酸乙酯、聚甲基丙 甲i曰、丙烯-丁二稀_苯乙烯樹脂或聚碳酸酯與烯·丁二 烯-苯乙烯樹脂之組合，因此吾人可以對絕緣層124照射紫 卜光使、纟巴緣層124固化。在本實施例中，利用網版印刷 方式所形成的絕緣層124具有多個開孔124a，而這些開孔 =會暴㈣第-接點1瓜，且開孔ma與其所暴露出 的弟—接點122a會形成接觸窗124b。 值得注意的是，絕緣層124為直接形成於第一薄膜丨j〇 2如此不但可以簡化習知中絕緣膜片與線路薄膜對位的 驟’還可以節省黏著層的使用量以及使用絕緣膜片的成 本。此外，開孔124a與絕緣層124同時形成，因此開孔 1296494 17776twf.doc/y 124a與第一接點122a可直接對位’不但節省沖孔的成本， 還可以達到開孔124a與第一接點122a精確對位的目的， 進而有效降低可撓性印刷電路板100的製作成本。 之後如® 2E所*，提供一第二印刷電路薄膜16〇，並 且讓第-印刷電路薄膜140與第二印刷電路義16〇對 位。=後，在第二印刷電路薄膜160上塗佈一黏著層17〇, 亚將第二接點152與接㈣124b的第—接點咖對位。 此第二印刷電路薄膜16〇的製作方法包 先第二薄膜⑼，，在第二= = ^個弟一接點152a以及一第二印刷電路咖所構成之 ::::化導體層152。其中’第二印刷電路薄膜160的 ^ A、方法及材質’與第一印刷電路薄膜14〇的形成 ^、方法及材質皆相同，於此便不再詳述。此外，且 ^，的絕緣層124也可以是形成於第二薄膜15(/上， 復盍第二圖案化導體層152，並且暴霖出 4 : = =可咖時繼賴 ^ ^ 122& 路菌胺η p刷電路缚膜140以及第二印刷電 ，相160’便形成可撓性印刷電路板⑽。其中 印刷電路薄膜14G以及第二印刷電路薄膜 二二 括對黏著層170加熱以使黏著層⑺化的化/二 =黏著㈣照射紫外光使黏著層==光： 射法，或是使用雷射炫接法等等，吾人可依難著^ 的材質以及實際製程所需來選擇適當的方法T 6 1296494 17776twf.d〇c/y —，外’在壓合第一印刷電路薄膜140以及第二印刷電 路薄膜160以形成可撓性印刷電路板100之後，吾人還可 以對I撓性印刷電路板100進行一防水處理，以避免水或 液體滲入可撓性印刷電路板 100中，使可撓性印刷電路板 100短路。 值=注意的是，雖然上述實施例之第一印刷電路薄膜 140及第二印刷電路薄膜⑽是分別使用兩片不同的薄膜 > 1 =的。但在其他實施例中，吾人也可以Μ將一片薄 成兩個_ ’然後在兩個區域上分別形成第一圖案 化&體層122以及第二随化導體層152。之後在第一圖 案化導體層122 (及/或第二圖案化導體層I52)上形成具 f開孔124a的絕緣層124。然後，吾人將薄膜對折，使第 圖，。導體層122與第二圖案化導體層152對位之後， 再進行4 a的步驟，也可製成如圖之可撓性印刷電路 板 100 〇 士在可撓性印刷電路板100完成之後，吾人會再進行後 | 3的製程作業，並將可撓性印刷電路板1〇〇組裝至鍵盤（未 、、曰示）其中，每一個接觸窗124b與第二接點152a會對 應=鍵盤上的-按鍵。當按鍵受到按麼時，該按鍵所對應 的，-接點152a會接觸第一接點122a，使第一接點ma ’、第一接點152a電性連接以產生一電子訊號，以達到鍵入 資料的目的。 綜上所述，本發明之可撓性印刷電路板及其製作方法 至少具有下列之優點： 13 1296494 17776twf.doc/y 一、 將絕緣層直接形成於第一印刷電路薄膜或第二印 刷電路薄膜上，因此可以讓第一接點或第二接點 精確地位於開孔内。 二、 使用網版印刷的方法將絕緣層直接形成在第一印 刷電路薄膜或第二印刷電路薄膜上，以取代習知 所使用之需要沖孔的絕緣膜片，因此可以節省製 作成本。 雖然本發明已以—錢觸露如上，然其並非用以限 二視德二可t些許之更動與潤飾，因此本發明之保護範 【圖式簡單說明】 疋者為丰。 =為」習知一種印刷電路薄膜的示意圖。 作流，I剖面示I:序為本貫施例之可撓性印刷電路板的製 【主要元件符號說明】 50 :印刷電路薄膜 10 ··第一線路薄膜 12 ' 22 :接點 14 ' 24 :線路 16 20 30 開口 第二線路薄膜 絕緣薄膜 40、17〇 ··黏著層 14 17776twf.doc/y 100 可撓性印刷電路板 110 第一薄膜 120 金屬層 122 第一圖案化導體層 1296494 122a :第一接點 122b :第一印刷電路 124 :絕緣層 124a :開口 124b :接觸窗 130 :光阻 140 :第一印刷電路薄膜 150 :第二薄膜 152 :第二圖案化導體層 152a :第二接點 152b :第二印刷電路 160 :第二印刷電路薄膜Forming a second patterned conductor layer on the second bonding film, wherein the second image is: a plurality of: a second contact and a second printing connected to the second contact: 'and the second connection is connected by (4) Electrically connected to the __ contact. "In one embodiment of the present invention, the method of pressing the first and second printing pancreas comprises a thermal chemical method, an ultraviolet curing method or/the present invention (4) - a printed circuit _ is formed on the printed circuit _ Therefore, the cost of using the insulating film and punching the insulating film can be eliminated. Further, the insulating layer is directly formed on the first printed circuit film so that the contact is accurately positioned in the opening. The above and other objects, features, and advantages of the present invention will become more <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; After the _ and _============================================================================================ Please refer to FIG. 2A to 2E in order. First, as shown in the figure, a first film 110 is provided, wherein the first film 11 is made of polycarbonate, polyethylene terephthalate or polymethyl methacrylate. , smectene-butadiene-styrene resin or polycarbonate and olefin A combination of butadiene-styrene tree 1296494 17776 twf.doc/y grease. Then, a metal layer 120 having good conductivity is attached to the first film 11A. In this embodiment, the metal layer 12 Preferably, the material is copper or silver. Then, as shown in FIG. 2B, a photoresist layer 130 is formed on the metal layer 12, and the photoresist layer 13 is exposed and developed to form a predetermined line pattern. After the resist layer 130 is exposed and developed, the metal layer 120 exposed under the photoresist layer 130 is etched to form a first patterned conductor layer 122 as shown in FIG. 2C on the first film 110. A patterned conductor layer 122 includes a plurality of first contacts 122a and a first printed circuit 122b connected to the first contacts 122a. Next, as shown in FIG. 2D, a first pattern is formed on the first film 110. The insulating layer 124 on the conductive layer 122 is formed by screen printing. The material of the insulating layer 124 includes a photocurable resin such as polycarbonate, polyethylene terephthalate or polymethyl. Propylene, propylene-butadiene styrene resin or poly The combination of the acid ester and the olefin-butadiene-styrene resin, so that the insulating layer 124 can be irradiated with the violet light and the striated edge layer 124. In this embodiment, the insulation formed by the screen printing method is used. The layer 124 has a plurality of openings 124a, and these openings = violent (four) first-contact 1 melon, and the opening ma and its exposed brother-contact 122a will form a contact window 124b. It is worth noting that the insulation The layer 124 is formed directly on the first film 丨j〇2, so that not only the conventional alignment of the insulating film and the line film can be simplified, but also the use amount of the adhesive layer and the cost of using the insulating film can be saved. The hole 124a is formed at the same time as the insulating layer 124, so that the opening 1296494 17776twf.doc/y 124a and the first contact 122a can be directly aligned, which not only saves the cost of punching, but also achieves the accuracy of the opening 124a and the first contact 122a. For the purpose of alignment, the manufacturing cost of the flexible printed circuit board 100 is effectively reduced. Thereafter, as in the 2E, a second printed circuit film 16 is provided, and the first printed circuit film 140 is aligned with the second printed circuit. After the second printed circuit film 160 is coated with an adhesive layer 17A, the second contact 152 is aligned with the first contact of the (four) 124b. The second printed circuit film 16 is formed by a second film (9), a second conductor layer 152a and a second printed circuit board. The formation, method and material of the second printed circuit film 160 are the same as those of the first printed circuit film 14A, and will not be described in detail herein. In addition, the insulating layer 124 may also be formed on the second film 15 (/, the second patterned conductor layer 152 is retreaded, and the violent circumstance 4: = = 可 时 ^ ^ ^ 122 & The mycelium η p brush circuit bond film 140 and the second printed circuit form a flexible printed circuit board (10), wherein the printed circuit film 14G and the second printed circuit film 22 heat the adhesive layer 170 to adhere Layer (7)ization / two = adhesion (four) irradiation of ultraviolet light to make the adhesion layer == light: shooting method, or using laser splicing method, etc., we can choose the appropriate material and the actual process needs to choose appropriate Method T 6 1296494 17776twf.d〇c/y —, externally, after the first printed circuit film 140 and the second printed circuit film 160 are pressed to form the flexible printed circuit board 100, we can also The printed circuit board 100 is subjected to a water repellent treatment to prevent water or liquid from penetrating into the flexible printed circuit board 100, thereby short-circuiting the flexible printed circuit board 100. Value = Note that although the first printed circuit film of the above embodiment 140 and the second printed circuit film (10) are respectively made Two different films > 1 =. However, in other embodiments, we can also thin a piece into two _ ' and then form a first patterned & body layer 122 and a second The conductor layer 152 is formed. Then, an insulating layer 124 having an opening 124a is formed on the first patterned conductor layer 122 (and/or the second patterned conductor layer I52). Then, the film is folded in half to the figure. After the conductor layer 122 is aligned with the second patterned conductor layer 152, the step of 4 a is performed, and the flexible printed circuit board 100 can be made as shown in the figure. After the flexible printed circuit board 100 is completed, the person The process of 3 will be performed again, and the flexible printed circuit board will be assembled to the keyboard (not shown, shown), and each contact window 124b will correspond to the second contact 152a = on the keyboard - button. When the button is pressed, the button 152a contacts the first contact 122a, so that the first contact ma ' and the first contact 152a are electrically connected to generate an electronic signal. In order to achieve the purpose of typing data. In summary, the flexibility of the present invention The brush circuit board and the manufacturing method thereof have at least the following advantages: 13 1296494 17776twf.doc/y 1. The insulating layer is directly formed on the first printed circuit film or the second printed circuit film, so that the first contact or the first The two contacts are precisely located in the opening. Second, the insulating layer is directly formed on the first printed circuit film or the second printed circuit film by screen printing to replace the insulating film required for punching. The invention can save the production cost. Although the invention has been exposed to the above-mentioned money, it is not intended to limit the two movements and the retouching, so the protection model of the invention [simple description] 疋It is Feng. = "It is a schematic diagram of a printed circuit film. Flow, I section shows I: the order of the flexible printed circuit board of the present embodiment [main component symbol description] 50: printed circuit film 10 · · first line film 12 ' 22 : contact 14 ' 24 : line 16 20 30 opening second line film insulating film 40, 17 黏 · adhesive layer 14 17776 twf. doc / y 100 flexible printed circuit board 110 first film 120 metal layer 122 first patterned conductor layer 1926494 122a: First contact 122b: first printed circuit 124: insulating layer 124a: opening 124b: contact window 130: photoresist 140: first printed circuit film 150: second film 152: second patterned conductor layer 152a: second connection Point 152b: second printed circuit 160: second printed circuit film
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