TWI296240B - Ink marking mechanism - Google Patents

Ink marking mechanism Download PDF

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Publication number
TWI296240B
TWI296240B TW94117456A TW94117456A TWI296240B TW I296240 B TWI296240 B TW I296240B TW 94117456 A TW94117456 A TW 94117456A TW 94117456 A TW94117456 A TW 94117456A TW I296240 B TWI296240 B TW I296240B
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Taiwan
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damper
stamping
ink
head
rti
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TW94117456A
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Chinese (zh)
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TW200640707A (en
Inventor
Yi Shao Lai
Hsiao Chuan Chang
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Advanced Semiconductor Eng
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Priority to TW94117456A priority Critical patent/TWI296240B/en
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Publication of TWI296240B publication Critical patent/TWI296240B/en

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1296240 > 九、發明說明: 【發明所屬之技術領域】 本發明係有關一種油墨蓋印裝置,更特別有關一種氣壓 缸油墨蓋印裝置。 【先前技術】 私子凡件或半導體晶片在組裝完成後,常會以封膠體封 裝成塊狀的封裝構造(Package),藉由引腳(iead)或錫球 _ (Solder Ball)與外部電路做電性連結。由於許多不同的晶片 係大致封裝<某4員型的封裝構造,封裳後的晶片通常會 印上產品的相關資訊。此-資訊一般包括產品的類型、封 裝形式以及晶片的規格等資訊。 一般來說’ f見的打印方式有雷射打印、網板印刷以石 油墨移印等方式。雷射打印有著圖案精細以及不易抹去考 優點,已為不少高階產品所採用。然而,雷射打印有著養 用較兩、不易製作高對比的圖案以及無法快速的大量㈣ 寺缺點。網板印刷與油墨移印,則有大量、快速以及低成 本等優點,已廣為各個電子廠與半導料所使用。 第1圖為習用油墨移印方式之蓋印裝置100的示音圖 i^^(Γ^tΓΓI(markinδ pad)i3〇^^«t;;i (圖未不)上,使該圖案中的油墨移印至該膠頭130 e 接耆將壓桿120下壓,使固定於隸110上的該 盍印在蓋印表面’在該蓋印表面上顯示出相應的圖案。 上述移印動作可利用自動化的裝置來完成。例如 拽械裝置使該壓桿120往復地上下運動,配合著輪送二 01027-TW/ASEK-1360 1296240 作業讓蓋印動作不停的執行,藉 運到大量蓋印的目的。 為了呈現最佳的蓋印品質,最好 上一…曰 好讓膠頭停留在蓋印表面 丰又時間,以得到較大的油墨轉旦 得的兹e^ 里。但是,以現有可 仔的移印式蓋印裝置,僅飼服馬達驅 見有了 盍印時間,氣壓虹式的蓋印裝置由於复'κι可调整 盈法1 m -g π c + + ;囡有之機械動作, 不易提升。 田㈣間’因而蓋印品質BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink stamping apparatus, and more particularly to a pneumatic cylinder ink stamping apparatus. [Prior Art] After the assembly of the personal parts or semiconductor wafers, the package is often packaged in a package, which is made of a pin (iead) or a solder ball (Solder Ball) and an external circuit. Electrical connection. Since many different wafers are packaged in a package structure of a 4-member type, the wafer after the package is usually printed with information about the product. This information generally includes information such as the type of product, the form of the package, and the specifications of the wafer. Generally speaking, the printing methods of seeing are laser printing, screen printing, and stone ink printing. Laser printing has a fine pattern and is not easy to erase. It has been adopted for many high-end products. However, laser printing has the disadvantage of using two more, not easy to make high-contrast patterns, and not being able to quickly (4) the temple. Screen printing and ink pad printing have the advantages of large quantity, rapidity and low cost, and have been widely used by various electronics factories and semi-conductive materials. Fig. 1 is a diagram showing the sound image i^^(Γ^tΓΓI(markinδ pad)i3〇^^«t;;i (not shown) of the printing device 100 of the conventional ink pad printing method, so that the pattern is The ink is printed onto the plastic head 130 e, and the pressing rod 120 is pressed down, so that the printing on the stamping surface is displayed on the stamping surface to display a corresponding pattern on the stamping surface. It is completed by an automatic device. For example, the mechanical device moves the pressing rod 120 up and down, and cooperates with the wheeling 20027-TW/ASEK-1360 1296240 to perform the stamping operation continuously, and borrows a large amount of stamping. The purpose of the best stamping quality, it is best to let the plastic head stay on the stamping surface for a long time, in order to get a larger ink turn-on. The pad printing device can be used for printing. Only the feeding motor drive has a stamping time. The pressure-type rainbow stamping device can be adjusted by the complex κιη 1 m -g π c + +; Action, not easy to improve. Tian (four) between the 'print quality

有鑑於此,便有需將氣壓缸蓋印装 時間,以提升蓋印品質。 良為 可調整蓋印 【發明内容】 〜本發明之目的在於提供—種油墨蓋印裝置,藉由一阻月 益凋整蓋印停留時間,得到最佳的蓋印品質。 為達上述㈣,本發明提供一種油墨蓋印裝置,盆自 壓板,界定兩相對之表面;—壓桿,其—端與該塵 .'、表面接合;至少一個膠頭,設於該壓板的另一表面 t:以及“阻尼器(damper),設於該壓桿上。當該壓桿下 ,時’該等膠頭亦隨之移動,使其與蓋印表面接觸。於此 日寸刻,該阻尼器開始作用,使該等膠頭停留在蓋印表面上 一段時間,藉此得到最佳的蓋印品質。 θ根據本發明之油墨蓋印裝置,其阻尼器可為彈簧式、液 壓式與氣壓式等。藉由該阻尼器所具有之阻尼調整裝置, 凋整该阻尼器之阻尼係數(coefficient of 叫),改變該 膠頭停遠在盍印表面的時間以及施予蓋印表面的壓力,以 斗于到最佳的蓋印品質。 01027-TW/ASEK-1360 6 1296240 為了讓本發明之上述和其他目的、特徵、和優點能更明 顯’下文特舉本發明實施例,並配合所附圖示,作詳細說 明如下。 【實施方式】 現請參’考第2a、2b、2c、Μ、2e與2f圖,其顯示根據 本么明之油墨蓋印裝置200之一實施例。該油墨蓋印裝置 匕έ · 一壓板210,界定兩相對之表面;一壓桿22〇, 其一端與該壓板210的一表面接合;至少一個膠頭23(), 設於該壓板210的另一表面上;以及一阻尼器 (Per)240,没於该壓桿220上。當該壓桿220開始下壓 時^該等膠頭230亦隨之移動(見第2a圖)。該壓桿22〇 繼?向下移動,使該等膠頭23〇與蓋印表面接觸,此時該 壓桿220的位置為接觸點c (見第2b圖)。於此時刻,該 阻尼益240開始作用,使該等膠頭23〇於蓋印表面上施予 壓力。該壓桿220繼續向下移動,使該等膠頭23〇於蓋印 表面上所施予的壓力亦逐漸變大。當該壓桿22〇到達下死 點^時(見第2c圖),此時該阻尼器24〇的作用為最大, 該等膠頭230施予蓋印表面㈣力亦最大。接著該壓桿 開始向上移動(見第2d圖),該等膠頭23g施予蓋印表面 的壓力逐漸減小。該壓# 22()繼續向上移動,當再度 該接觸點C時(見第2e圖),該等膠頭23()將盥蓋印表面 分開且該阻尼器240的作用亦將消失。該壓桿22〇回:上 死點(見第2f圖)後將往τ運動,因此完成—個完整的行 程〇 · 01027-TW/ASEK-1360 1296240 當該壓桿2?n + α 下死點D Θ 接觸點C運動至該下死點D再由該 於蓋e I 该接觸點C時,此期間為該等膠頭230作用 %蓋印表面的時間 m 應大於2秒鐘。此外;:蓋印品質之因素,-般來說, 亦為影響蓋卩表㈣壓力, 的距離亦料蓋印品f,—般來說,該距離應小於 嗲阻尸據本’:明之油墨蓋印裝置2。°之較佳實施例,可藉由 rm所具有之阻尼調整裝置(圖未示),調整該阻 二:„ &amp;阻尼係數’改變該等膠頭230停留在蓋印表面 所 p表面的壓力,以得到最佳的蓋印品 貝〇 …第,與3b圖為根據本發明之彈簧式阻尼器24〇,之油墨 盍印奴置200的示意圖。該阻尼器240,包含一外套310、 内套320以及一彈| 33〇。該外套31〇套在該内套似 的:卜彈黃330置於該外* 31〇與該内套32〇之間。 =等膠頭23G未與蓋印表面接觸時’該阻尼器Μ。,内的彈 κ 330亚未作用(見第3a圖)。當該壓桿下壓而使該 等膠頭230與蓋印表面接觸時,該彈簧33()開始壓縮而此 時該阻尼器24G,發生作’使該等膠頭23()於蓋印表面上 施予壓力(見第3b圖)。待該壓桿22()向上移動而使該等 膠頭230離開蓋印表面日夺,該彈簧33G回復原狀而使該等 膠頭230料蓋印表面的壓力肖失。若欲改變該阻尼器 240’的阻尼係數,可藉由該阻尼調整裝置調整該阻尼器 240之彈H 330所具有之彈力常數,改變該阻尼器24〇,之 01027-TW/ASEK-1360 8 1296240 阻尼係數。· 根據本發明之油墨蓋印裝置,其 的阻尼哭之. 时1矛馬弹!式 何阻尼二置?液壓式、氣厂堅式阻尼器以及具㈣ 益,亦可藉由所具有之阻居喟榦壯里 、〈阻尼 係數,改變膠頭停留在調整阻尼器的阻尼 的壓力,以〜t 時間以及施予蓋印表面 乂传到最佳的蓋印品質。 *卜精於本發明所屬技術領域之技藝者應瞭解,雖狄 =動式蓋印裝置可調整蓋印時間,但若輔以本發明實 =中所揭示之阻尼器,將可對施予的蓋印壓: :性:調整,對於蓋印品質的改善,有著加分的效果更: :,本發明之油墨蓋印裝置,並不限於使用在汽知式,亦 口用在例如馬達驅動式等其他形式。 3雖然前述的描述及圖示已揭示本發明之較佳實施例,必 解到各種增%、修改和取代可能使用於本發明較佳實 &amp;例,’而不會脫離如所时請專利範圍所界定的本發明原 理之精神及範圍。熟悉該技藝者將可體會本發明可能使用 於很多形式、結構、佈置、比例、材料、元件和組件的修 改。因此,本文於此所揭示的實施例於所有觀點,應被視 為用以說明本發明,而非用以限制本發明。本發明的範圍 應由後附申請專利範圍所界定,並涵蓋其合法均等物,並 不限於先前的描述。 01027-TW/ASEK-1360 1296240 【圖式簡單說明】 第1圖:為習用油墨蓋印裝置之示意圖。 第2a至2f圖:為根據本發明實施例之氣壓缸油墨蓋印 裝置之示意圖。 第3a與3b圖:為根據本發明實施例之具有彈簧式阻尼 器之氣壓缸油墨蓋印裝置之示意圖。In view of this, it is necessary to print the cylinder head to improve the quality of the stamp. </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> <RTIgt; In order to achieve the above (4), the present invention provides an ink stamping device, the basin self-pressing plate defines two opposite surfaces; the pressing bar, the end of which is engaged with the dust, and the surface; at least one plastic head is disposed on the pressing plate The other surface t: and the "damper" are disposed on the pressing rod. When the pressing rod is under, the plastic heads are also moved to make contact with the stamping surface. The damper acts to allow the glue head to stay on the stamping surface for a period of time, thereby obtaining an optimum stamping quality. θ According to the ink stamping device of the present invention, the damper can be spring-loaded or hydraulic. With the damper adjustment device of the damper, the damping coefficient (coefficient of call) of the damper is changed, the time for the rubber head to stop at the printing surface is changed, and the stamping surface is applied. The above-mentioned and other objects, features, and advantages of the present invention will become more apparent from the <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> <RTIgt; With the accompanying drawings, a detailed description such as [Embodiment] Reference is now made to the drawings 2a, 2b, 2c, Μ, 2e and 2f, which show an embodiment of the ink stamping device 200 according to the present invention. The ink stamping device 匕έ a platen 210, defining two opposite surfaces; a pressing rod 22〇 having one end engaged with a surface of the pressing plate 210; at least one plastic head 23() disposed on the other surface of the pressing plate 210; and a damper (Per 240, not on the pressing rod 220. When the pressing rod 220 starts to press down, the plastic head 230 also moves (see Figure 2a). The pressing rod 22 then moves downward to make the The rubber head 23 is in contact with the stamping surface, and the position of the pressing rod 220 is the contact point c (see Fig. 2b). At this moment, the damping benefit 240 starts to act, so that the plastic heads 23 are placed on the cover. Pressure is applied to the printing surface. The pressing rod 220 continues to move downward, so that the pressure applied by the plastic head 23 to the stamping surface is gradually increased. When the pressing rod 22 reaches the bottom dead center ^ (See Figure 2c). At this time, the damper 24 〇 has the largest effect, and the rubber head 230 applies the stamping surface (4) to the maximum force. Then the pressure rod is opened. Moving upward (see Figure 2d), the pressure applied to the stamping surface by the glue head 23g is gradually reduced. The pressure #22() continues to move upwards, when the contact point C is again (see Figure 2e), The plastic head 23() separates the stamping surface and the action of the damper 240 will also disappear. The pressure rod 22 is turned back: the top dead center (see Figure 2f) will move toward the τ, thus completing - complete The stroke 〇· 01027-TW/ASEK-1360 1296240 When the pressure bar 2?n + α bottom dead center D Θ contact point C moves to the bottom dead center D and then the cover point e I the contact point C, this The time m during which the % of the stamping surface is applied to the head 230 should be greater than 2 seconds. In addition;: the quality of the stamping, in general, also affects the pressure of the cover (4), the distance is also expected to cover the printed matter f, in general, the distance should be less than the 嗲 尸 尸 according to the ': Ming ink Stamping device 2. In the preferred embodiment, the resistance can be adjusted by the damping adjustment device (not shown) of the rm: „ &amp; damping coefficient ′ changes the pressure of the plastic head 230 staying on the surface of the stamping surface p For the best stampings, the first and third figures are schematic diagrams of the ink-type damper 24 according to the present invention. The damper 240 includes a jacket 310, Set 320 and a bomb | 33 〇. The jacket 31 〇 is placed in the inner sleeve: the bulge yellow 330 is placed between the outer * 31 〇 and the inner sleeve 32 。 = = the plastic head 23G is not stamped When the surface is in contact, the damper Μ 330 does not act (see Figure 3a). When the pressure bar is pressed to bring the rubber head 230 into contact with the stamping surface, the spring 33() At the beginning of the compression, the damper 24G, at this time, causes the plastic head 23 to apply pressure on the stamping surface (see Figure 3b). The pressure bar 22() is moved upward to make the glue The head 230 leaves the stamping surface, and the spring 33G returns to the original state so that the pressure of the stamping surface of the plastic head 230 is lost. If the damping of the damper 240' is to be changed The coefficient can be adjusted by the damping adjustment device to adjust the spring constant of the damper 240 of the damper 240, and the damping coefficient of the damper 24〇, 01027-TW/ASEK-1360 8 1296240 is changed. · The ink according to the present invention The stamping device, its damping is crying. When the 1 spear horse bomb! How to dampen two sets? Hydraulic, gas plant firm damper and (4) benefits, can also be stabilized by the < Damping coefficient, changing the pressure at which the glue head stays in the damper of the adjustment damper, and the embossed surface is imparted to the optimum stamping quality at ~t time. * Those skilled in the art to which the present invention pertains should It is understood that although the Di=moving stamping device can adjust the stamping time, if it is supplemented by the damper disclosed in the present invention, the stamping pressure can be applied: : Sex: Adjustment, for stamping quality The improvement has the effect of extra points: : The ink stamping device of the present invention is not limited to use in the vapor-sense type, but is also used in other forms such as a motor-driven type. 3 Although the foregoing description and illustration have been The preferred embodiments of the present invention are disclosed, and various solutions must be The invention may be used in the spirit and scope of the present invention as defined by the scope of the invention as claimed in the appended claims. Modifications of the various forms, structures, arrangements, ratios, materials, components, and components are used. Therefore, the embodiments disclosed herein are to be considered as illustrative of the invention and not to limit the invention. The scope of the present invention should be defined by the scope of the appended claims, and covers the legal equivalents thereof, and is not limited to the prior description. 01027-TW/ASEK-1360 1296240 [Simplified Schematic] Figure 1: Conventional ink A schematic view of the stamping device. 2a to 2f are schematic views of a pneumatic cylinder ink capping apparatus according to an embodiment of the present invention. 3a and 3b are schematic views of a pneumatic cylinder ink stamping apparatus having a spring type damper according to an embodiment of the present invention.

【圖號說明】 100 油墨蓋印裝置 110 壓板 120 壓桿 130 膠頭 200 油墨蓋印裝置 210 壓板 220 壓桿 230 膠頭 240 阻尼器 240? 阻尼器 310 外套 320 内套 330 彈簣 01027-TW/ASEK-1360 10[Description of the number] 100 ink stamping device 110 pressure plate 120 pressure bar 130 plastic head 200 ink stamping device 210 pressure plate 220 pressure bar 230 plastic head 240 damper 240? damper 310 jacket 320 inner sleeve 330 magazine 01027-TW/ ASEK-1360 10

Claims (1)

12962401296240 應用於蓋印在蓋印表面 該油墨盖 十、申請專利範園: 1、一種油墨蓋印裝置 印裝置包含: 一壓板,界定兩相對之表面; 一壓桿,其一端與該壓板的一表面接合; 至少一個膠頭,設於該壓板的另一表面上·The ink cap is applied to the stamping surface. Patent application: 1. An ink stamping device printing device comprises: a pressing plate defining two opposite surfaces; a pressing rod having one end and a surface of the pressing plate Engagement; at least one plastic head disposed on the other surface of the pressure plate 一阻尼器,設於該壓桿上,以便當兮厭 ^ 1文田4壓椁下壓而使得 该膠頭與該蓋印表面接觸時,因該阻尼器之作用而使嗲 膠頭能施予該蓋印表面一緩衝之壓力,藉此延長蓋印時 間,其中該阻尼器包含有一阻尼調整裝置,用以調整該 阻尼器之阻尼係數。 人 2、依申請專利範圍第丨項之油墨蓋印裝置,其中該阻尼器 為彈箐式阻尼器。a damper is disposed on the pressing rod, so that when the rubber head is pressed down to make the rubber head contact the stamping surface, the silicone head can be applied due to the action of the damper The stamping surface is a buffering pressure, thereby extending the stamping time, wherein the damper includes a damping adjustment device for adjusting the damping coefficient of the damper. 2. The ink stamping device according to the scope of the patent application, wherein the damper is a magazine damper. 依申請專利範圍第2項之油墨蓋印裝置,其中該阻尼調 整裝置係藉由調整該阻尼器之彈簧所具有之彈力常數 來改變該阻尼器之阻尼係數。 4、 依申請專利範圍帛i項之油墨蓋印裝置,其中該阻尼器 為液壓式阻尼器。 &quot; 5、 依申請專利範圍帛1項之油墨蓋印裝置,其中該阻尼器 為氣壓式阻尼器^ 加 01027-TW/ASEK-I360. 11The ink stamping device of claim 2, wherein the damping adjustment device changes the damping coefficient of the damper by adjusting a spring constant of the spring of the damper. 4. The ink stamping device according to the patent application scope ,i, wherein the damper is a hydraulic damper. &quot; 5, according to the patent application scope 帛 1 of the ink stamping device, wherein the damper is a pneumatic damper ^ plus 01027-TW/ASEK-I360. 11
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TWI585933B (en) * 2015-07-29 2017-06-01 日月光半導體製造股份有限公司 Method and apparatus for ink marking
CN112440590A (en) * 2020-11-18 2021-03-05 淄博职业学院 Seal using method
CN112406334A (en) * 2020-11-18 2021-02-26 淄博职业学院 Stamp

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