1295759 九、發明說明： 【發明所屬之技術領域】 種供主機板的 本發明係為-種轉換卡，特別是關於 記憶體插槽❹的記憶體訊號之轉換卡。 【先前技術】 DDRII —直被視為是目前⑽ 代品，因為臓π突破了在體標準革命性替 200MHz時脈頻率），而且有^办了 士限制（DDR 400， 陲㈣爭供^日从: 見可用性、容、納更多晶片 陣列及更低㈣1的特色。_賴 說，DDRII確實比DDR來爯佟扨,,(书虱4寸〖生万面不 νς f + κ 例如：頻寬較高（4—bit vs· 2-blt prefetch)、驅動電壓較低（ 内部中斷電阻設計（GndieterminatiQn)等等·。· 2而DDRII仍然無法完全取代現有職，因現有腫 德胆板_然晋遍使用於㈣者端。 DDRII及臟的使用，主機板的晶片組也需重新設計^ Intel的915P、915G晶片組除了支援贿丨記憶體模組之 外，也能夠採用DDR記憶體模組。因此，目前市面上仍有 相當數量的915P/G主機板都是同時具備DDR與DDR丨丨記情 體插槽，甚至僅僅提供DDR插槽的也為數不少。 而以同日守支援DDR 11及DDR使用的晶片組而言，一般主機 板可能設計成以下三種型式： 1·提供4組支援DDR記憶體模組的記憶體插槽。 2. 提供4組支援DDRII記憶體模組的記憶體插槽。 3. 提供2組支援DDR記憶體模組的記憶體插槽及2組 5 1295759 支援DDRII記憶體模組的記憶體插槽。 由於DDR與DDR 11的6己憶體模組在聊位與機構均不相 容的因素下，而使得上述設計方式】僅能支援DDR記憶體 模組’而無法使用DDRII記憶體模組。上述設計方式2僅 能支援DDRII記憶體模組，而無法使用DDR記憶體模組。 上述的設計方式3則如第一圖所示，晶片組7可支援DDRI I 及DDR使用，第一記憶體插槽71可供DDRII記憶體模組插 接使用，第二記憶體插槽73可供DDR記憶體模組插接使 用，第一圖所示的設計方式在目前由DDR轉變為DDRII的 過度時期裡顯然是較佳的選擇，因可由使用者視實際使用 需求在主機板上插接DDR或DDRII的記憶體模組。不過在 上述的設計方式3中，主幾板顯然無法滿足使用者需要大 容量記憶體空間的需求，因在此方式下使用者僅能同時插 接2條DDR或2條DDRII的記憶體模組，亦及在第一圖中 使用者只能對第一記憶體插槽71或第二記憶體插槽73擇 一使用，而另一組記憶體插槽也只能空閒在那裡，形成另 一種形式的浪費。 【發明内容】 本發明所要解決的技術問題，在於提供一種記憶體訊 號之轉換卡及使用其之主機板，利用轉換卡將屬於DDrh 的記憶體訊號轉換為DDR的記憶體訊號，而使得能支援有 DDRII及DDR記憶體插接的主機板能同時完全使用到每一 個記憶體插槽的功能，讓主機板支援使用的記憶體容量能 充分發揮，以滿足使用者對於高容量記憶體空間的需求。 為了解決上述技術問題，根據本發明的一種方案，提 6 12957591295759 IX. Description of the Invention: [Technical Field of the Invention] The present invention for a motherboard is a conversion card, particularly a memory card for a memory slot. [Prior Art] DDRII - is considered to be the current (10) generation, because 臓 π breaks through the revolutionary standard for 200MHz clock frequency), and there is a limit of DDR 400, 陲 (4) From: See usability, capacity, and more wafer arrays and lower (four) 1 features. _ Lai said, DDRII is indeed better than DDR, (book 虱 4 inch 〖生万面不ς ς f + κ For example: frequency High width (4-bit vs. 2-blt prefetch), low drive voltage (internal interrupt resistor design (GndieterminatiQn), etc. 2) DDRII still can't completely replace the existing position, because of the existing swollen biliary It is used in (4). DDRII and dirty use, the chipset of the motherboard needs to be redesigned. ^ Intel's 915P and 915G chipsets can also use DDR memory modules in addition to bribe memory modules. Therefore, there are still a considerable number of 915P/G motherboards on the market that have both DDR and DDR memory slots, and even a few DDR slots are available. For the chipset used by DDR, the general motherboard may be designed to The following three types: 1. Provide 4 sets of memory slots for DDR memory modules. 2. Provide 4 sets of memory slots for DDRII memory modules. 3. Provide 2 sets of DDR memory modules. Memory slot and 2 groups 5 1295759 Memory slot supporting DDRII memory module. The above design is due to the incompatibility between the DDR and DDR 11 6 memory modules. Mode: Only DDR memory module can be supported and DDRII memory module cannot be used. The above design method 2 can only support DDRII memory module, but cannot use DDR memory module. The above design method 3 is as follows. As shown in the figure, the chipset 7 can support DDRI I and DDR use, the first memory slot 71 can be used for DDRII memory module plugging, and the second memory slot 73 can be plugged into the DDR memory module. The design method shown in the first figure is obviously a better choice in the current transition period from DDR to DDRII, because the DDR or DDRII memory module can be plugged into the motherboard according to the actual use requirements. However, in the above design method 3, the main board However, the user needs to have a large-capacity memory space, because in this mode, the user can only insert two DDR or two DDRII memory modules at the same time, and in the first figure, the user can only The first memory slot 71 or the second memory slot 73 is used alternatively, and the other set of memory slots can only be idle there, forming another form of waste. [Invention] The technical problem is to provide a memory signal conversion card and a motherboard using the same, and use the conversion card to convert the memory signal belonging to the DDRh into a DDR memory signal, thereby enabling support for DDRII and DDR memory docking. The motherboard can fully use the function of each memory slot at the same time, so that the memory capacity supported by the motherboard can be fully utilized to meet the user's demand for high-capacity memory space. In order to solve the above technical problem, according to a solution of the present invention, mention 6 1295759
i、種5己彳思體訊號之轉換卡，包括：——^體、一第一連接 ;1面及一第二連接介面。其中第一連接介面相容於DDRII 記憶體訊號傳輪，並設於該卡體，第一連接介面並包含有 複，個用來傳輸DDRn記憶體訊號的第一傳輸端。第二連 接介面相容於DDR記憶體訊號傳輸，並設於該卡體，第二 連接$面並包含有複數個用來傳輸DDR記憶體訊號的第二 傳輸端。而在第一連接介面與第二連接介面之間用來傳輸i. A conversion card of 5 kinds of singular signals, including: - body, a first connection; 1 side and a second connection interface. The first connection interface is compatible with the DDRII memory signal transmission wheel and is disposed on the card body. The first connection interface includes a first transmission end for transmitting the DDRn memory signal. The second connection interface is compatible with the DDR memory signal transmission and is disposed on the card body. The second connection is connected to the surface and includes a plurality of second transmission ends for transmitting the DDR memory signal. And used for transmission between the first connection interface and the second connection interface
相同讯號的該些第一傳輸端及該些第二傳輸端則分別透過 卡體對應電性連接。 為了解決上述技術問題，根據本發明的另一種方案， 提供一種使用記憶體訊號之轉換卡的主機板，包括：支援 使用DDRII記憶體模組及DDR記憶體模組的一晶片組。支 援DDRII記憶體模組的第一記憶體插槽。支援DDR記憶體 杈組的第二記憶體插槽。插接於該第一記憶體插槽的一記 憶體訊號之轉換卡，該轉換卡包括：一卡體、一第一連接 介面及一第二連接介面。第一連接介面係相容於DDRn記 憶體模組，並設於該卡體，第一連接介面並包含有複數個 用來傳輸DDRII記憶體訊號的第一傳輸端。第二連接介面 係相容於DDR記憶體模組，並設於該卡體，該第二連接介 面並包含有複數個用來傳輸DDR記憶體訊號的第二傳輸 立而。而在第一連接介面與第二連接介面之間用來傳輸相同 訊號的該些第一傳輪端及該些第二傳輸端係分別透過卡體 對應電性連接，且轉換卡透過第一連接介面插接於第一記 憶體插槽。 採用本發明的記憶體訊號之轉換卡及使用其之主機 板，轉換卡可將主機板中支援DDRn記憶體模組使用的記 7 1295759 憶體插槽轉換為可供支援DDR記憶體模組插接使用。而在 主機板同時提供有供DDRII記憶體模組及DDR記憶體模組 插接的記憶體插槽之情況下，藉由在支援DDRII記憶體模 組使用的記憶體插槽上插接轉換卡之後，可讓使用者同時 插接使用DDR記憶體模組在各記憶體插槽。 【實施方式】 請參閱第二圖，其係為本發明之較佳實施例之一的主 機板之元件配置連接圖。在本實施例中係針對主機板中同 時支援有DDRII及DDR不同規格的記憶體模組時，提出一 種可將DDRII記憶體訊號轉換為相容於ddr記憶體訊號的 解決方案。如弟一圖所示主機板中的晶片組1可支援j)DR11 體模組及DDR s己憶體模組使用，晶片組1提供了兩條 第一記憶體插槽11以供DDRII記憶體模組插接使用，以及 兩條弟一§己丨思體插槽15以供DDR記憶體模組插接使用。 第一記憶體插槽11是用來支援DDRII記憶體模組使 用，透過晶片組1的控制可用來傳輸兩組DDRII記憶體訊 號給弟一記憶體插槽11 ’如一RASA、一 CASA、一別EA、+ / —CLKA[0 · 2]、MDA[0 : 63]、ΜΑΑ[0 : 13]、DQSA[0 ·· 7]、 -DQSA[Q : 7]、DQMA[0 : 7]、-CSA[0 : 1]、CKEA[0 : 1] 及-RASB、-CASB、-SWEB、+/-CLKB[G : 2]、MDB[〇 : 63]、MAB[0 ·· 13]、DQSB[0 ·· 7]、-DQSB[0 ·· 7]、DQMB[0 ·· 7]、一CSB[0 : 1]、CKEB[0 : 1]等兩組 DDRn 記憶體訊號。 第二記憶體插槽15是用來支援ddr記憶體模組使用， 透過晶片組1的控制用來傳輪兩組DDR記憶體訊號給第二 記憶體插槽 15,如一RASA、〜CASA、一SWEA、+/ —CLKA[0 : 8 1295759 2]、MDA[0 : 63]、MAA[〇 : 13]、DQSA[0 : 7]、DQMA[0 : 7]、 一 CSA [ Ο · 1 ]、CKEA [ Ο : 1 ]及—RASB、— CASB、— SWEB、+ /一CLKB[0 : 2]、MDB[〇 : 63]、MAB[〇 : 13]、DQSB[0 : 7]、 DQMB[0 : 7]、一CSB[0 : 1]、CKEB[0 ·· 1]等兩組 DDR 記憶體 訊號。而第二記憶體插槽15所傳輸的DDR記憶體訊號僅比 第一記憶體插槽11少了 一DQSA[0 : 7]及一DQSB[0 : 7]的訊 號，而其餘訊號皆相容於第一記憶體插槽11傳輸的D])rη 記憶體訊號。 第一記憶體插槽11是用來供DDRII記憶體模組插接使 用，弟一 g己憶體插槽11因腳位與機構的不同並無法直接供 DDR 3己彳思體板組插接使用。而本貫施例即提供^__個記情、體 訊號的轉換卡13可用來插接於第一記憶體插槽η使用， 此轉換卡13的主要作用可將第一記憶體插槽η所傳輸的 DDRII記憶體訊號經過腳位及機構轉換處理之後，輸出成 為DDR記憶體訊號，而讓第一記憶體插槽丨丨在此轉換卡 13的插接下，可克服在腳位及機構上的限制而進一步支援 DDR記憶體模組插接使用，而以下將對轉換卡13進一步解 釋其如何工作。 請參閱第三圖，其係為本發明記憶體訊號之轉換卡的 示意圖。轉換卡13包括有—^體133、一第一連接介面131 及一第二連接介面132，第一連接介面131及第二連接介 面132分別設於卡體13上。第一連接介面131係相容於 DDRII記憶體訊號傳輸使用，並包含有複數個第一傳輸端 1311，且透過該些第一傳輸端1311來傳輸DDRII記憶體訊 號。第二連接介面132係相容於DDR記憶體訊號傳輸使用， 並包含有複數個第二傳輸端1321，且透過該些第二傳輸端 9 1295759 1321來傳輸DDR記憶體訊號。 彳在第連接介面丨31與第一連接介面132之間用來 maa[g:13]、d_:7]'_q:7]、_cs· CKEA [ 0 ]]及—rasb、_ CASB、— sweb、+ / — cl _Γ:「β[〇 : 63]、MAB[0 : 13]、D_〇 : 7]、DQMB[〇 : 7]、 料G:1]等相同訊號的該些第一傳輪端 性、轰3 弟一傳輸端1321則分別透過卡體133對應電 於。而^’-而使得第二連接介面132可供傳輸醜記憶體訊 二而本貫施例轉換卡13白勺第一連接介面131係屬於金手 1曰33而則;^連接介面132則是屬於金手指端子座，卡體 則可以為印刷電路板（PCB)。 因此當轉換卡13插接於第一記憶體插槽11時，轉換 j的第連接介面131係直接插接在第一記憶體插槽 此時的第一連接介面131與第一記憶體插槽u之間可 i輸DDRII記憶體訊號，並經由轉換卡13將第一連接介面 13^所傳輸的DDRH記憶體訊號轉換處理成為相容於ddr 記憶體訊號到第二連接介面132,而使得第二連接介面i32 即可直接支援DDR記憶體模組插接使用。 而由於習知支援有DDRII及DDR不同規格的記憶體模 組使用的主機板，主機板只能同時使用DDRn記憶體模組 或同日守使用DDRII g己憶體模組，但並無法同時使用ddrii 記憶體模組及DDR記憶體模組所插接的記憶體模組，而使 知主或板無法供使用者擴充使用到最大的記憶體容量。本 實施例所提供的轉換卡13則可解決習知的問題，如第二圖 所示，雖然第一記憶體插槽11本身只能支援1)服11記憶體 10 1295759 模組使用，但是當轉換卡13插接在第一記憶體插槽u時， 可在轉換卡13的第二連接介面132上再插接DDR記憶體模 組，因此第一記憶體插槽11經由插接轉換卡13之後即可 ί、支援DDRe憶體模組使用，再配合上在第二記憶體插槽 ’ 15直接插接DDR記憶體模組，第二圖中主機板即可同時^ - 用四條DDR記憶體模組，而可將主機板提供的記憶體使用 容量擴充到晶片組1最大的支援容量。 、職是，本發明確能藉上述所揭露之技術，提供一種迥 然=同於習知者的設計，堪能提高整體之使用價值，又其 申請前未見於刊物或公開使用，誠已符合發明專利之要 件’爰依法提出發明專利申請。 惟，上述所揭露之圖式、說明，僅為本發明之實施例 而已凡精于此項技蟄者當可依據上述之說明作其他種種 、 文良而這些改變仍屬於本發明之發明精神及以下所界 定之專利範圍中。 • 【圖式簡單說明】 第一圖係為習知支援臟II與DDR兩種記憶體的主機板之 元件配置連接圖； 第一圖係為使用本發明之較佳實施例之一的主機板之元件 配置連接圖；及 • 第二圖係為本發明記憶體訊號之轉換卡的示意圖。 【主要兀件符號說明】 1 ^ 7 晶片組 11 1295759 11 > 71 第一記憶體插槽 13 轉換卡 131 第一連接介面 132 第二連接介面 133 卡體 1311 第一傳輸端 1321 第二傳輸端 15、73 第二記憶體插槽The first transmission end and the second transmission end of the same signal are respectively electrically connected through the card body. In order to solve the above technical problem, according to another aspect of the present invention, a motherboard for using a memory signal conversion card includes: a chip set supporting the use of a DDRII memory module and a DDR memory module. The first memory slot of the DDRII memory module is supported. Supports the second memory slot of the DDR memory group. And a conversion card of the memory signal inserted in the first memory slot, the conversion card comprises: a card body, a first connection interface and a second connection interface. The first connection interface is compatible with the DDRn memory module and is disposed on the card body. The first connection interface includes a plurality of first transmission ends for transmitting DDRII memory signals. The second connection interface is compatible with the DDR memory module and is disposed on the card body. The second connection interface includes a plurality of second transmissions for transmitting DDR memory signals. The first transmission end and the second transmission end for transmitting the same signal between the first connection interface and the second connection interface are respectively electrically connected through the card body, and the conversion card is transmitted through the first connection. The interface is plugged into the first memory slot. By using the memory signal conversion card of the present invention and the motherboard using the same, the conversion card can convert the 7 1295759 memory slot used in the motherboard to support the DDRn memory module to support the DDR memory module insertion. Use it. In the case where the motherboard is provided with a memory slot for the DDRII memory module and the DDR memory module, the conversion card is inserted in the memory slot used by the DDRII memory module. After that, the user can simultaneously plug in the DDR memory module in each memory slot. [Embodiment] Please refer to the second drawing, which is a component arrangement connection diagram of a main board according to a preferred embodiment of the present invention. In the present embodiment, when a memory module having different specifications of DDRII and DDR is supported in the motherboard, a solution for converting the DDRII memory signal into a DDR memory compatible signal is proposed. As shown in Figure 1, the chipset 1 in the motherboard can support j) the DR11 body module and the DDR s memory module. The chipset 1 provides two first memory slots 11 for DDRII memory. The module is plugged in and used by the two brothers to use the DDR memory module for plugging in the DDR memory module. The first memory slot 11 is used to support the use of the DDRII memory module. The control of the chipset 1 can be used to transmit two sets of DDRII memory signals to the memory slot 11' such as a RASA, a CASA, and a different one. EA, + / —CLKA[0 · 2], MDA[0 : 63], ΜΑΑ[0 : 13], DQSA[0 ·· 7], -DQSA[Q : 7], DQMA[0 : 7], - CSA[0:1], CKEA[0:1] and -RASB, -CASB, -SWEB, +/-CLKB[G: 2], MDB[〇: 63], MAB[0 ·· 13], DQSB[ 0 ·· 7], -DQSB[0 ·· 7], DQMB[0 ·· 7], one CSB[0 : 1], CKEB[0 : 1] and other two sets of DDRn memory signals. The second memory slot 15 is used to support the use of the DDR memory module. The control of the chip set 1 is used to transmit two sets of DDR memory signals to the second memory slot 15, such as a RASA, ~CASA, and a SWEA, +/ – CLKA[0: 8 1295759 2], MDA[0: 63], MAA[〇: 13], DQSA[0:7], DQMA[0:7], a CSA [ Ο · 1 ], CKEA [ Ο : 1 ] and —RASB, — CASB, — SWEB, + / CLKB[0 : 2], MDB [〇: 63], MAB [〇: 13], DQSB [0: 7], DQMB[0 : 7], a CSB [0: 1], CKEB [0 · · 1] and other two sets of DDR memory signals. The DDR memory signal transmitted by the second memory slot 15 is only one less DQSA[0:7] and one DQSB[0:7] signal than the first memory slot 11, and the remaining signals are compatible. D]) rη memory signal transmitted in the first memory slot 11. The first memory slot 11 is used for plugging and unplugging the DDRII memory module, and the brother-in-one memory slot 11 cannot be directly connected to the DDR 3 body board group due to the difference between the pin and the mechanism. use. In the present embodiment, the conversion card 13 providing the ______ singularity and body signal can be used for plugging in the first memory slot η. The main function of the conversion card 13 can be the first memory slot η. After the transmitted DDRII memory signal is processed by the pin and the mechanism, the output becomes a DDR memory signal, and the first memory slot is inserted under the conversion card 13 to overcome the pin position and mechanism. The above limitation further supports the use of the DDR memory module plug-in, and the conversion card 13 will be further explained below how it works. Please refer to the third figure, which is a schematic diagram of the conversion card of the memory signal of the present invention. The conversion card 13 includes a first body 133, a first connection interface 131 and a second connection interface 132. The first connection interface 131 and the second connection interface 132 are respectively disposed on the card body 13. The first connection interface 131 is compatible with the DDRII memory signal transmission, and includes a plurality of first transmission terminals 1311, and transmits the DDRII memory signals through the first transmission terminals 1311. The second connection interface 132 is compatible with the DDR memory signal transmission, and includes a plurality of second transmission terminals 1321, and transmits the DDR memory signals through the second transmission terminals 9 1295759 1321.彳 between the connection interface 丨31 and the first connection interface 132 for maa[g:13], d_:7]'_q:7], _cs· CKEA [ 0 ]], and —rasb, _ CASB, — sweb , + / — cl _Γ: "β[〇: 63], MAB[0: 13], D_〇: 7], DQMB[〇: 7], material G:1] and other first signals of the same signal The wheel end, the squad 3 and the transmitting end 1321 respectively transmit electricity through the card body 133. And the second connection interface 132 is used to transmit the ugly memory body 2 and the present embodiment converts the card 13 The first connection interface 131 belongs to the gold hand 1曰33; the connection interface 132 belongs to the gold finger terminal block, and the card body can be a printed circuit board (PCB). Therefore, when the conversion card 13 is inserted into the first memory In the case of the body slot 11, the connection interface 131 of the conversion j is directly inserted into the first memory slot, and the DDRII memory signal can be transmitted between the first connection interface 131 and the first memory slot u. And converting the DDRH memory signal transmitted by the first connection interface 13 to the second connection interface 132 through the conversion card 13, so that the second connection interface i32 can directly support the DDR record. The body module is plugged in. Since the motherboard that supports the memory modules with different specifications of DDRII and DDR is used, the motherboard can only use the DDRn memory module at the same time or the same day to use the DDRII g memory module. However, the memory module plugged into the ddrii memory module and the DDR memory module cannot be used at the same time, so that the master or the board cannot be expanded by the user to use the maximum memory capacity. The conversion card 13 can solve the conventional problem. As shown in the second figure, although the first memory slot 11 itself can only support 1) the service 11 memory 10 1295759 module is used, but when the conversion card 13 is plugged in In the first memory slot u, the DDR memory module can be re-plugged on the second connection interface 132 of the conversion card 13, so that the first memory slot 11 can be inserted after the conversion card 13 is inserted. Support DDRe memory module use, and then directly plug in the DDR memory module in the second memory slot '15. In the second picture, the motherboard can simultaneously use four DDR memory modules, but Extend the memory usage capacity provided by the motherboard to the chip 1 The maximum support capacity. The job is to enable the present invention to provide a design that is as savvy as the same as the prior art, which can improve the overall use value, and is not seen in the publication or public use before the application. , Cheng has complied with the requirements of the invention patent ' 爰 filed an invention patent application. However, the above-mentioned drawings and descriptions are only examples of the present invention. Those who are skilled in the art can Other variations and modifications are still within the scope of the invention and the scope of the invention as defined below. • [Simple Description of the Drawings] The first figure is a component configuration connection diagram of a motherboard supporting conventional memory of dirty II and DDR; the first figure is a motherboard using one of the preferred embodiments of the present invention; The component configuration connection diagram; and the second diagram is a schematic diagram of the conversion card of the memory signal of the present invention. [Main component symbol description] 1 ^ 7 Chip set 11 1295759 11 > 71 First memory slot 13 Conversion card 131 First connection interface 132 Second connection interface 133 Card body 1311 First transmission end 1321 Second transmission end 15, 73 second memory slot
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