TWI295295B - Organic anti-reflective coating polymers, anti-reflective coating composition comprising the same and preparation methods thereof - Google Patents

Organic anti-reflective coating polymers, anti-reflective coating composition comprising the same and preparation methods thereof Download PDF

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TWI295295B
TWI295295B TW90127504A TW90127504A TWI295295B TW I295295 B TWI295295 B TW I295295B TW 90127504 A TW90127504 A TW 90127504A TW 90127504 A TW90127504 A TW 90127504A TW I295295 B TWI295295 B TW I295295B
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reflective coating
compound
patent application
coating composition
organic
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TW90127504A
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Chinese (zh)
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Ho Jung Min
Chang Jung Jae
Su Lee Geun
Ki-Soo Shin
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Hynix Semiconductor Inc
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1295295 案號 90127504__年月曰_修正_ 五、發明說明(1) 技術領娀 本發明係有關於一有機抗反射聚合物,其可避免較低 膜層之被反射與消除由於光阻厚度與光的改變所造成之駐 波’及利用193 nm氟化氬(ArF)微影的光阻製造超微細圖 案之製程與其製備方法。更特別地是,本發明亦係有關於 一種用於64 Μ、256 Μ、1 G及4 G DRAM半導體裝置之超微 細圖案的有機抗反射聚合物。並有關於一種包括此有機抗 反射聚合物之組合物、其所製成之抗反射塗層及其製備方 法。 技術背景 在製備半導 低膜層之光學特 生駐波與反射凹 造成的CD (臨界 導入可利用導入 之有機材料,以 4/L反射塗層 射塗層,或視其 對於使用卜line 無機抗反射塗層 作吸收系統,而 在使用氟化 使用氮氧化矽當 射膜的你丨it?. 體裝置超微細圖案之製程中,由於晶圓較 性及感光膜厚度之變化,將不可避免地發 口;此外’由較低膜層繞射光與反射光所 尺寸)變化會有其他問題。因此,已建議 在當作光源之光波長區域中具有高吸收度 避免在較低膜層之背反射的抗反射塗層。 y視所使用之材料而分為無機與有機抗反 操作機制而分為吸收與干涉抗反射塗層, (365 nm波長)輻射而言,可明顯地使用 ’因,可利用氮化鈦(TiN)與非結晶碳當 $用氮氧化矽(Si〇N)當作干涉系統。 氣(KrF)雷射製作超細圖案之製程中,已 $無機抗反射膜;然而,在使用無機抗反 1295295 __案號90127504 年月日 格企_ 五、發明說明-- 時可控制干涉。因此,有許多努力係利用有機化合物當作 抗反射塗層。 為成為良好的有機抗反射塗層,必須符合下列條件: (1) 在微影製程中必須不發生因在溶劑中的溶解所造 成之光阻層剝落’為達成此目標必須設計一模塗層 (molded coating)以不產生任何副產物化學物質而 聯結構。 (2) 如酸或胺之化學物質必須不會遷移至抗反射塗層 内或自抗反射塗層遷移出來,這是因為當酸自抗反射塗層 遷移時,在基底會發生如胺遷移,且在圖案的較低部份合 發生底切(undercut)。 θ (3) 抗反射塗層的蝕刻速率必須快於上方的感光膜, 以利用感光膜當作一遮罩而進行蝕刻製程。 (4 )因此,抗反射塗層必須儘可能地薄 反射塗層的程度。 乍抗1295295 Case No. 90127504__年月曰_Amendment_ V. INSTRUCTION DESCRIPTION (1) Technical Aspect The present invention relates to an organic anti-reflective polymer which can prevent the lower film layer from being reflected and eliminated due to the thickness of the photoresist The standing wave caused by the change of light and the process of manufacturing ultra-fine pattern by using the photoresist of 193 nm argon fluoride (ArF) lithography and its preparation method. More particularly, the present invention is also directed to an organic antireflective polymer for ultrafine patterns of 64 Μ, 256 Μ, 1 G, and 4 G DRAM semiconductor devices. There is also a composition comprising the organic antireflective polymer, an antireflective coating made thereof, and a method of preparing the same. BACKGROUND OF THE INVENTION The CD produced by the optically specific standing wave and the reflective concave in the preparation of the semiconducting low film layer (critically introduced can be introduced into the organic material, coated with a 4/L reflective coating, or as it is used for the use of The anti-reflective coating is used as an absorption system, and in the process of using ultra-fine patterns of fluorination using argon oxynitride as a film, it will be inevitable due to changes in wafer properties and thickness of the film. The mouth of the ground; in addition, 'the size of the diffracted light and the reflected light from the lower film layer' will have other problems. Therefore, an anti-reflective coating having high absorbance in the wavelength region of light as a light source to avoid back reflection at a lower film layer has been proposed. y Depending on the materials used, it is divided into inorganic and organic anti-back-action mechanisms and is divided into absorption and interference anti-reflection coatings. For (365 nm wavelength) radiation, it can be clearly used, because titanium nitride can be used. ) with amorphous carbon when using yttrium oxynitride (Si〇N) as an interference system. In the process of making ultra-fine patterns of gas (KrF) laser, it has been made of inorganic anti-reflection film; however, it can control interference when using inorganic anti-reverse 1295295 __ case number 90127504 _ _ _ 5, invention description -- . Therefore, there are many efforts to utilize organic compounds as anti-reflective coatings. In order to be a good organic anti-reflective coating, the following conditions must be met: (1) The photoresist layer peeling due to dissolution in a solvent must not occur in the lithography process. A mold coating must be designed to achieve this goal. (molded coating) joins the structure without producing any by-product chemicals. (2) Chemicals such as acids or amines must not migrate into or escape from the antireflective coating because, as the acid migrates from the antireflective coating, amine migration occurs at the substrate, And undercut occurs in the lower part of the pattern. The θ (3) anti-reflective coating must be etched at a faster rate than the upper photosensitive film to perform an etching process using the photosensitive film as a mask. (4) Therefore, the anti-reflective coating must be as thin as possible to reflect the extent of the coating. Anti-anti

現有的有機抗反射塗層主要分為兩種類型,特別是 (1)包括發色基團(chromophore)、交聯聚合物之交聯劑 (單分子)及添加劑(熱可變氧化劑)之聚合物與(2)可自我 交聯,並包括發色基團及添加物(熱可變氧化劑)之聚合 物。但這兩種抗反射材料有一問題:幾乎不能控制k值, 這疋因為在聚合作用時根據原始設計的比例所定義之發色 基含量。因此,若想改變k值,必須要再合成。 發明概述The existing organic anti-reflective coatings are mainly classified into two types, in particular, (1) polymerization comprising a chromophore, a crosslinking agent (single molecule) of a crosslinked polymer, and an additive (thermally variable oxidizing agent). And (2) a polymer which is self-crosslinkable and which includes a chromophoric group and an additive (thermally variable oxidizing agent). However, there is a problem with the two antireflective materials: the k value can hardly be controlled because of the chromophore content defined by the ratio of the original design at the time of polymerization. Therefore, if you want to change the k value, you must re-synthesize. Summary of invention

5i42.4459PFl.ptc 第6頁5i42.4459PFl.ptc Page 6

修正 曰Fix 曰

Jf;_η 本發明亦提供—白把a i 製備方法。 匕括則迷聚合物的抗反射塗層組合物與其 成之rd;供::利用次微米微影之抗反射塗層所形 、 ,、中在半導體裝置上形成圖案。 較佳實施例之詳述Jf;_η The present invention also provides a method for preparing a white. The anti-reflective coating composition of the polymer is formed into a rd; for: forming a pattern on the semiconductor device by using an anti-reflective coating of sub-micron lithography. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

塗層分別提供具有如式1與式2的下列化合物用於一抗反射 式1 在上式1中:The coatings are respectively provided with the following compounds having the formulas 1 and 2 for an anti-reflection type 1 in the above formula 1:

Ra ’ Rb為個別獨立的氣或曱基· R ,R為個別獨立的-H、-oh…叫、、 -CH2〇H ’或為取代基或非取代基,或為直鍵的或分支的烧 基或具有1至6個碳原子之烷氧基; η表示自1、2、3、4與5所選之整數; X,y個別代表自0· 01至〇· 99之莫耳分率。Ra ' Rb is an individual independent gas or thiol · R, R is an individual -H, -oh..., -CH2〇H ' or a substituent or an unsubstituted group, or a straight or branched An alkyl group or an alkoxy group having 1 to 6 carbon atoms; η represents an integer selected from 1, 2, 3, 4, and 5; X, y each represents a molar fraction from 0·01 to 〇·99 .

12952951295295

此外,在上式2中,riq與Rii個別為獨立的直鏈或分 取代烷氧基;及 又 r12為氫或甲基。 由聚合(曱基)丙烯醛而製備式2化合物,以使所得之 聚合產物與具有1至1〇個碳原子之分支或直鏈的取代烷氧 基反應並得到聚曱基丙烯醛。 更詳細一點,(甲基)丙烯醛首先在有機溶劑中溶解, 將聚合反應起始劑加入至其中,並在6〇至7〇艺的真空下實 行聚合反應4至6小時。接著,以三氟甲基磺酸 (trifluoromethylsulfonic acid)當作觸媒在室溫下,將 所得之聚合產物與具有1至1〇個碳原子的分支或直鏈取代 烷氧基反應。 在上述製程中,自包括四氫呋喃 (tetrahydrofuran)(THF)、環己_(CyCi〇hexanone)、二 甲基甲醢胺(dimethylformamide)、二甲基亞楓 (dimethylsulfoxide)、二氧六環(dioxane)、丁酮 (methylethylketone)、苯(benzene)、甲苯(toluene)、 二曱苯(xylene)與其混合物的群組中選擇適當的有機溶 劑。至於聚合反應起始劑,可為2, 2-偶氮基觸媒 (2, 2~azobisisobutyronitrile)(AIBN)、過氧 4匕二苯甲酸Further, in the above formula 2, riq and Rii are each independently a linear or a substituted alkoxy group; and further, r12 is hydrogen or a methyl group. The compound of the formula 2 is prepared by polymerizing (fluorenyl) acrolein so that the obtained polymerization product is reacted with a branched or linear substituted alkoxy group having 1 to 1 carbon atom to give a polydecyl acrolein. In more detail, (meth)acrolein is first dissolved in an organic solvent, a polymerization initiator is added thereto, and polymerization is carried out for 4 to 6 hours under a vacuum of 6 to 7 art. Next, the obtained polymerization product is reacted with a branched or linear substituted alkoxy group having 1 to 1 carbon atom at room temperature with trifluoromethylsulfonic acid as a catalyst. In the above process, it includes tetrahydrofuran (THF), CyCi〇hexanone, dimethylformamide, dimethylsulfoxide, dioxane. An appropriate organic solvent is selected from the group consisting of methylethylketone, benzene, toluene, xylene, and mixtures thereof. As the polymerization initiator, it can be 2, 2-azobis catalyst (2, 2~azobisisobutyronitrile) (AIBN), peroxydibenzoic acid

1295295 --案號,誦_一束曰s 修正_ 五、發明說明(5) (benzoylperoxide)、過氧化乙醯(acetyiperoxide)、過 氧化月桂基(laurylperoxide)、三級丁基過醋酸酯 (t-buty lperacetate)、三級丁基過氧化氫 (卜butyl hydroperoxide)或二-三級-丁基過氧化物 (di-t-butylperoxide)等,而具有1至1〇個碳原子之該烧 基醇的較佳實施例為乙醇或曱醇。 ~兀 式2的較佳化合物可由包括下列式3至6化合 A31295295 -- Case number, 诵 _ bunch 曰 s correction _ 5, invention description (5) (benzoylperoxide), acetyiperoxide (acetyiperoxide), laurylperoxide, tertiary butyl peracetate (t -buty lperacetate), butyl hydroperoxide or di-t-butylperoxide, etc., and having 1 to 1 carbon atom of the alkyl group A preferred embodiment of the alcohol is ethanol or decyl alcohol. Preferred compounds of formula 2 may be compounded by the following formulas 3 to 6 A3

5142-4459PFl.ptc 1295295 1 號 90127504 五、發明說明(6)5142-4459PFl.ptc 1295295 No. 1 90127504 V. Description of invention (6)

〇ch2ch3〇ch2ch3

h3ch2co 醇基聚合物的 上述式3至式6化合物可在酸與其他具有 狀況下固化。 式1聚合物可藉由在一有機溶劑中使乙醯氧基笨乙烯 (acetoxy styrene)單體與氫氧基烷基丙烯酸醋土 (hydroxyalkylacrylate)單體反應而製備,接著將所得之 化合物與聚合反應起始劑聚合反應。在此製程中可使^任 何傳統有機溶劑,但是較佳的溶劑係從包括四 苯、苯、丁嗣、二氧六環及其混合物的群組心出南的甲 至於聚合反應起始劑可使用傳統基(radical)聚合反應起 始劑,但最好是使用自包括2, 2,-偶氮基觸媒、過氧^乙 酿、過氧化月桂基及三級丁基過氧化氫的群組所選出之化 合物。上述的聚合反應最好在約50至90它的溫度範圍下進 行,而各單體的莫爾分率範圍為〇· 〇卜〇. 99。 本發明亦為一組合物,包括一式丨聚合物與式2聚合物 成分之抗反射塗層。 本發明之一有機抗反射塗層的製備方法,包括下列步 驟:在一有機溶劑中溶解式1聚合物與式2化合物、過濾所 得之溶液、將濾液塗佈在較低層且硬烤此塗佈層。此^, 在此製程中可使用任何傳統的有機溶劑,但最好是自包括 乙基3-乙氧基丙g旨、曱基3-乙氧基丙g旨、環己酮The compound of the above formula 3 to formula 6 of the h3ch2co alcohol-based polymer can be cured under acid and other conditions. The polymer of Formula 1 can be prepared by reacting an acetoxy styrene monomer with a hydroxyalkyl acrylate monomer in an organic solvent, followed by polymerization of the resulting compound. The reaction initiator is polymerized. In this process, any conventional organic solvent can be used, but a preferred solvent is from the group of tetraphenyl, benzene, butyl hydrazine, dioxane and a mixture thereof to the polymerization initiator. A conventional radical polymerization initiator is used, but it is preferably used from a group including 2, 2,-azo catalyst, peroxydiethyl ether, lauryl peroxide, and tertiary butyl hydroperoxide. The selected compounds of the group. The above polymerization is preferably carried out at a temperature ranging from about 50 to 90, and the molar fraction of each monomer is in the range of 〇·〇卜〇. The invention is also a composition comprising an anti-reflective coating of a monoterpene polymer and a polymer component of formula 2. A method for preparing an organic anti-reflective coating according to the present invention comprises the steps of: dissolving a polymer of formula 1 and a compound of formula 2 in an organic solvent, filtering the resulting solution, coating the filtrate on a lower layer, and baking the coating. Cloth layer. In this process, any conventional organic solvent may be used, but it is preferred to include ethyl 3-ethoxypropyl g, decyl 3-ethoxypropyl g, cyclohexanone.

jg5295 时 90_ 年月 a w 五、發明說明(7) (cyclohexanone)及丙二醇甲鍵乙酸鹽 (propyleneglycol methyl ether acetate)的群組中所選之 溶劑,且視所使用抗反射塗層樹脂的總重量,上述較佳溶 劑最好的使用量範圍自約200至約5000重量%,最好的硬烤 溫度範圍自約100至約300 °C。 本發明亦為自前述本發明之任何抗反射塗層組合物製 備一半導體裝置。Jg5295 when 90_ year month aw 5, invention description (7) (cyclohexanone) and propylene glycol methyl ether acetate (propyleneglycol methyl ether acetate) selected in the group, and depending on the total weight of the anti-reflective coating resin used, The preferred solvents described above are preferably employed in amounts ranging from about 200 to about 5000% by weight, with the preferred hard roasting temperatures ranging from about 100 to about 300 °C. The present invention also provides a semiconductor device from any of the anti-reflective coating compositions of the present invention.

首先合成兩種具有大尺寸發色基的單體(乙醢氧基笨 乙烯單體、氫氧基院基丙烯酸酯單體),使自此兩單體所 得之聚合物可在193 nm具有高吸收率;此外,為生產一具 有改良性質之有機抗反射塗層,如良好的模特性、空氣^ 合度(air-tightness)與抗溶解性,可導入環氧樹脂基, 以在塗佈步驟後之硬烤步驟增加交聯反應,所得之聚合物 可視為第一聚合物(式丨之化合物)。此外,第二聚合物(式 2之化合物),亦可合成可在與樹脂中之醇基反應時形成交 聯的化合物,以利用熱反應形成具有第一聚合物之交聯產 特別地,使用交聯劑之形式為設計具有最大交聯反應 效率之聚合物,t特別地說,可利用控制第—聚合物之分 率而自由地調整抗反射膜之k值。 、 此外抗反射塗層樹脂在所有的烴溶劑中具有良好的 Γ 3性二5在硬烤步驟時在任何溶劑中均具有抗溶解性。 此外’在圖案化製程中不會有底切或基座的產生First, two kinds of monomers having large chromophores (ethoxylated styrene monomer, hydroxyloxy acrylate monomer) are synthesized, so that the polymer obtained from the two monomers can be high at 193 nm. Absorption rate; in addition, in order to produce an organic anti-reflective coating with improved properties such as good moldability, air-tightness and resistance to dissolution, an epoxy resin base can be introduced to allow for the coating step. The hard baking step increases the crosslinking reaction, and the resulting polymer can be regarded as the first polymer (the compound of the formula). Further, the second polymer (the compound of the formula 2) may also synthesize a compound which can form a crosslink upon reaction with the alcohol group in the resin to form a crosslinked product having the first polymer by thermal reaction, in particular, The form of the crosslinking agent is to design a polymer having the maximum crosslinking reaction efficiency, and in particular, the k value of the antireflection film can be freely adjusted by controlling the fraction of the first polymer. Further, the antireflective coating resin has a good bismuth in all hydrocarbon solvents. The bismuth 5 has resistance to solubility in any solvent in the hard baking step. In addition, there will be no undercut or pedestal in the patterning process.

5142.4459PFl.ptc 第11頁 甘特別.是1丙烯酸醋樹脂所製成之抗反射塗層 '曰,一在1^呈中相對於感光膜可具有較高的蝕刻速 1295295 案號 90127504 五、發明說明(8) 率,因此可改善蝕刻選擇率。 下述實施例對熟於此技藝之人士可更清楚地顯示本發 明之理論與實際狀況,此外,這些實施例並非用以限制本 發明’而僅為較佳實施例之說明。 ^醯氧基茉乙 j烯酸2 -羥乙酯)1共聚合 實施例 施例1 物之組合物 —一50 0 ml圓底瓶容器在攪拌時填充〇· 1莫耳的乙醯氧 基苯乙稀/0· 1莫耳的丙烯酸2 -羥乙酯,並將30 0 g個別製 備的四氮11夫喃添加至完全混合物中,之後,添加0 · 1〜3 · 0 克的2, 2’ —偶氮基觸媒以在60至75 °C的氮氣氣氛下聚合反 應5至20小時。在反應完成後,所得之溶液與乙醚或新己 烧,液沉殿’隨後過濾並乾燥以得到如下式7之聚[乙醯氧 基苯乙稀一(内烯酸2 -羥乙酯)]樹脂(產率:82%)。 式75142.4459PFl.ptc Page 11 Gan special. It is an anti-reflective coating made of 1 acrylic vinegar resin, which can have a higher etching rate relative to the photosensitive film in 1^295. Case No. 90127504 V. Invention Explain the (8) rate, thus improving the etching selectivity. The embodiments of the present invention will be more apparent from the following description of the preferred embodiments of the invention. ^N-oxyethyl methacrylate 2-hydroxyethyl ester) 1 copolymerization example Example 1 Composition - a 50 0 ml round bottom container filled with 〇·1 mol acetoxy group while stirring Benzene oxide / 0. 1 molar 2-hydroxyethyl acrylate, and 30 0 g of the individually prepared tetrazo 11 pentane was added to the complete mixture, after which 0, 1 to 3 · 0 g of 2 was added. 2'-Azo catalyst was polymerized for 5 to 20 hours under a nitrogen atmosphere at 60 to 75 °C. After the completion of the reaction, the resulting solution is washed with diethyl ether or fresh hexane, and then filtered and dried to obtain a poly[acetoxy phenethyl acetonate (2-hydroxyethyl acrylate)] Resin (yield: 82%). Equation 7

例2 一 氣基笨乙嬌-(丙烯酸3 -錄丙酯U共...I.金 物之組合物Example 2 A gas-based stupid---(3-acrylic acid urethane-I-gold composition)

I III II

5142-4459PFl.ptc 第12頁 1295295 90127504 年_Μ, 曰 修正 五、發明說明(9) 一500 ml圓底瓶容器在攪拌時填充〇· 1莫耳的乙醯氧 基苯乙烯/0· 1莫耳的丙烯酸3-羥丙酯,並將300 g個別製 備的四氫呋喃添加至完全混合物中,之後,添加〇.卜3. 〇 克的2, 2’-偶氮基觸媒以在60至75 °C的氮氣氣氛下聚合反 應5至2 0小時。在反應完成後,所得之溶液與乙醚或新己 统溶液沉澱’隨後過渡並乾燥以得到如下式8之聚[乙酿氧 基苯乙烯_(丙烯酸3 -羥丙酯)]樹脂(產率:80%)。 式85142-4459PFl.ptc Page 12 1295295 90127504 _Μ, 曰Revision 5, invention description (9) A 500 ml round bottom bottle container is filled with 〇·1 mol acetoxy styrene/0·1 while stirring Mohr 3-hydroxypropyl acrylate, and 300 g of the individually prepared tetrahydrofuran is added to the complete mixture, after which the bismuth 2, 2'-azo catalyst is added at 60 to 75 The polymerization was carried out under a nitrogen atmosphere at ° C for 5 to 20 hours. After the completion of the reaction, the resulting solution was precipitated with diethyl ether or a neohexyl solution. Then, the mixture was subsequently subjected to a transition and dried to obtain a poly [ethylene styrene styrene (3-hydroxypropyl acrylate)] resin of the following formula 8 (yield: 80%). Equation 8

# 乙 f施例3 —聚上乙醯 物之組合物 基笨底瓶容器在授拌時填充0.1莫耳的乙酿氧 :沾-吐莫耳的丙烯酸4_經丁酯,並將300 g個別製 偽喃Λ加至完全混合物中,之後,添加。·卜3.〇 m氮ί觸媒以在60至75t的氮氣氣氛下聚合反 小時。在反應完成後’所得之溶液與乙醚或新己 ::ί::澱’ ΐ後過濾並乾燥以得到如下式9之聚[乙醯氧 基本乙烯-(丙烯酸4-羥丁酯)]樹脂(產率:79%)。 5142.4459PFl.ptc 第13頁 1295295 案號 90127504 曰 修正 五、發明說明(10) Μ#乙f例例3—Composition of a mixture of acetamidine bases The bottom-bottomed bottle container is filled with 0.1 mole of B-oxygen in the mixing: dip-tomox acrylic 4_ butyl ester, and 300 g Individual pseudo-purines are added to the complete mixture and then added. · Bu 3. 〇 m Nitro ί catalyst was polymerized in a nitrogen atmosphere at 60 to 75 t for an hour. After the completion of the reaction, the resulting solution was filtered and dried with diethyl ether or fresh hexane:: 淀: 淀 ΐ to obtain a poly [ethylene ethoxylated ethylene-(4-hydroxybutyl acrylate)] resin of the following formula 9 ( Yield: 79%). 5142.4459PFl.ptc Page 13 1295295 Case No. 90127504 修正 Amendment V. Invention Description (10) Μ

實施例4 —聚「乙醯氣基笨乙烯-(甲基丙烯酸2-羥乙酯)1共 聚合物之組合物 一 500 ml圓底瓶容器在攪拌時填充0.1莫耳的乙醯氧 基苯乙烯/0· 1莫耳的甲基丙烯酸2-羥乙酯,並將303 g個 別製備的四氫呋喃添加至完全混合物中,之後,添加 0.;1〜3.0克的2, 2’-偶氮基觸媒以在60至75 °C的氮氣氣氛下 聚合反應5至20小時。在反應完成後,所得之溶液與乙醚 或新己烷溶液沉澱,隨後過濾並乾燥以得到如下式1 0之聚 [乙醯氧基苯乙烯-(甲基丙烯酸2-羥乙酯)]樹脂(產率: 83%)。 式10Example 4 - Composition of Poly(Ethylene Oxide-Based Styrene-(2-Hydroxyethyl Methacrylate) 1 Copolymer - A 500 ml round bottom bottle container was filled with 0.1 molar acetoxybenzene when stirred Ethylene/0·1 molar 2-hydroxyethyl methacrylate, and 303 g of the individually prepared tetrahydrofuran was added to the complete mixture, after which 0.; 1 to 3.0 g of 2, 2'-azo group was added. The catalyst is polymerized for 5 to 20 hours under a nitrogen atmosphere at 60 to 75 ° C. After completion of the reaction, the resulting solution is precipitated with diethyl ether or a new hexane solution, followed by filtration and drying to obtain a polycondensation of the following formula [10] Ethyloxystyrene-(2-hydroxyethyl methacrylate) resin (yield: 83%).

5142-4459PFl.ptc 第14頁 1295295 _案號 90127504 五、發明說明(Π) 年月曰 修正 Η5142-4459PFl.ptc Page 14 1295295 _ Case No. 90127504 V. Invention Description (Π) Year Month 修正 Correction Η

c=o 1 了 (CH2): 0 1 0=0 ! ch3 OH 實施例5 —聚「乙醯氣基笨乙烯_(曱基丙烯酸3-羥丙酯)1共 φ 聚合物之組合物 一 500 ml圓底瓶容器在攪拌時填充0.1莫耳的乙醯氧 基苯乙烯/0.1莫耳的甲基丙烯酸3-羥丙酯,並將300 g個 別製備的四氫咲喃添加至完全混合物中,之後,添加 0.卜3.0克的2, 2’ _偶氮基觸媒以在60至75 °C的氮氣氣氛下 聚合反應5至20小時。在反應完成後,所得之溶液與乙醚 或新己烷溶液沉澱,隨後過濾並乾燥以得到如下式11之聚 ~ [乙醯氧基苯乙烯-(曱基丙烯酸3 -羥丙酯)]樹脂(產率: 84%)。 式11 _c=o 1 (CH2): 0 1 0=0 ! ch3 OH Example 5 - Composition of a mixture of "Ethylene gas-based stupid ethylene_(3-hydroxypropyl methacrylate) 1 total φ polymer-500 The ml round bottom bottle container was filled with 0.1 mol of ethoxylated styrene / 0.1 mol of 3-hydroxypropyl methacrylate while stirring, and 300 g of the individually prepared tetrahydrofuran was added to the complete mixture. Thereafter, 3.0 g of a 2,2'-azo catalyst was added to carry out polymerization for 5 to 20 hours under a nitrogen atmosphere at 60 to 75 ° C. After the reaction was completed, the resulting solution was mixed with diethyl ether or new one. The alkane solution was precipitated, followed by filtration and drying to obtain a poly([ethoxy styrene-(3-hydroxypropyl methacrylate))] resin of the following formula 11 (yield: 84%).

5142-4459PFl.ptc 第15頁5142-4459PFl.ptc Page 15

1295295 案號 90127SfU 玉、發明說明(12)1295295 Case No. 90127SfU Jade, invention description (12)

〇 — 500 ml圓底瓶容器在攪拌時填充〇· t莫耳的乙醯氧 基苯乙烯/〇· 1莫耳的曱基丙烯酸4-羥丁酯,並將30〇 g個 別製備的四氫呋喃添加至完全混合物中,之後,添加 〇·卜3·0克的2,2’ —偶氮基觸媒以在60至75 °C的氮氣氣氛下 聚合反應5至20小時。在反應完成後,所得之溶液與乙醚 或新己烷溶液沉澱,隨後過濾並乾燥以得到如下式1 2之聚 [乙醢氧基苯乙烯-(甲基丙晞酸4 -經丁酯)]樹脂(產率·· 78%)。 式12〇—The 500 ml round bottom bottle container is filled with 〇·t molar ethoxylated styrene/〇·1 molar 4-hydroxybutyl methacrylate while stirring, and 30 〇g of the individually prepared tetrahydrofuran is added. To the completion of the mixture, a 2,2'-azo catalyst was added to the mixture under a nitrogen atmosphere at 60 to 75 ° C for 5 to 20 hours. After completion of the reaction, the resulting solution is precipitated with diethyl ether or a fresh hexane solution, followed by filtration and drying to obtain a poly(ethyleneoxystyrene-(methylpropionic acid 4-butylide) of the following formula 1] Resin (yield · · 78%). Equation 12

5142-4459PFl.ptc 第16頁 1295295 案號 90127504 ±_η 曰 修正 五、發明說明(13)5142-4459PFl.ptc Page 16 1295295 Case No. 90127504 ±_η 修正 Correction V. Description of invention (13)

ϋ例7 —抗反射塗層湓* 66事備 如實施例1至實施例6其中之一的式丨之聚合物與式2之 聚合物在丙二醇曱峻乙酸鹽 (propyleneglycolmethylether acetate, PGMEA)中溶 解,過濾所得之溶液,將其塗佈在晶圓上,並以100〜300 f 3烤1J 1 〇 〇 〇秒,接著,在塗層上施加感光膜,隨後進 仃例仃的超細圖案製程。 钕座在1聚合物所使用的交聯劑設計成具有最大的交聯 右嬙h ^ 2 ,可利用控制第一聚合物的比例而自由地調整 _ 單體此:由抗反射塗層樹脂包括兩個具有大尺寸發色基的 在製作i右^一發色基具有保護底切的作用,此底切乃因 芙可使二Ϊ弱鹼性膜後酸性的不平衡所造成的,且此發色 基了 3製成的聚合物在193⑽波長下具有高吸收性。色 抗反射塗層樹脂在所有的烴溶劑中均可溶解的Example 7 - Anti-Reflection Coating 湓* 66 The polymer of Formula 如 as in one of Examples 1 to 6 and the polymer of Formula 2 were dissolved in propyleneglycolmethylether acetate (PMMEA) Filtration of the resulting solution, coating it on a wafer, baking it at 100 to 300 f 3 for 1 J 1 sec., then applying a photosensitive film on the coating, followed by an ultra-fine pattern process . The cross-linking agent used in the polymer of the scorpion is designed to have the largest cross-linking right 嫱h ^ 2 , which can be freely adjusted by controlling the ratio of the first polymer _ monomer. This is included by the anti-reflective coating resin. Two chromophores having a large size chromophore have a protective undercut effect, and the undercut is caused by an acid imbalance of the weakly alkaline film, and this The polymer made of chromophore 3 has high absorbency at 193 (10) wavelength. Anti-reflective coating resin is soluble in all hydrocarbon solvents

五、發明說明(14) —_ , 很好,但在硬烤步驟時則不溶解在 圈案化製程中不會有底切或底部。:二種溶劑中,且在 射塗層由丙烯酸酯聚合物所組成,以j的疋,由於抗反 光膜之钮刻速率,i因此可改善蝕刻選擇:刻速率高於感 此處已以實施例說明本發明,必須 語僅為敘述本發明而非限制本發明,,亦:巧所使用之術 後可對本發明作各種之修饰與變化,目此要=上述揭示 下述之中請專利範圍的料中,’只要在 現本發明。 疋敘迷外,皆可實 #V. INSTRUCTIONS (14) — _ , very good, but not dissolved in the hard-bake step. There is no undercut or bottom in the looping process. : In the two solvents, and the shot coating is composed of acrylate polymer, the 疋 of j, due to the button-etching rate of the anti-reflective film, i can improve the etching selection: the engraving rate is higher than the feeling here has been implemented The present invention is intended to be illustrative of the present invention and not to limit the invention, and it is intended that various modifications and changes can be made to the present invention after the use of the invention. In the material, 'as long as the invention is present.疋 迷 迷 迷 , , , , , , , , ,

Claims (1)

1295295 六、申請專利範__ 構: 種有機抗反射塗層聚合1295295 VI. Application for Patent __ Structure: Organic anti-reflective coating polymerization 修与 今 11 ^ 務列八 1的 處I Ra Rb c=o (R··-c-R"J】 CH3 r , K 心為各自獨立的氯或甲基; -COOH、及只”為各自獨立,且自包括_H、—011、_0C0Cil3、 石山;§ /〜CH2〇H、具有1至6個碳原子的烷基及具有1至6個 '、、的垸氧基的群組中所選出; n為自1至5的一整數; X及7代表自〇· 01至0· 99之莫耳分率。 ^如申請專利範圍第1項所述之有機抗反射塗層聚合 物’係聚[乙醯氧基苯乙烯-(丙烯酸2-羥乙酯)]之化合 其中Ra及Rb為各自獨立的氫,R’及R"為各自獨立的 氫,η為2,且x ' y各為〇· 5。 3 _如申請專利範圍第1項所述之有機抗反射塗層聚合 物,係聚[乙醯氧基苯乙烯-(丙烯酸3-羥丙酯)]之化合 物,其中Ra及Rb為各自獨立的氫,及1^為各自獨立的 氫’ η為3,且X、y各為〇· 5。I Ra Rb c=o (R··-c-R"J] CH3 r , K heart is independent chlorine or methyl; -COOH, and only "for each Independent, and includes from _H, -011, _0C0Cil3, Shishan; § /~CH2〇H, an alkyl group having 1 to 6 carbon atoms, and a group having 1 to 6 ',, and a decyloxy group n is an integer from 1 to 5; X and 7 represent the molar fraction from 〇 01 to 0·99. ^ The organic anti-reflective coating polymer 'system as described in claim 1 a compound of poly(ethoxylated styrene-(2-hydroxyethyl acrylate)] wherein Ra and Rb are each independently hydrogen, R' and R" are each independently hydrogen, η is 2, and x ' y are each有机·5. 3 _ The organic anti-reflective coating polymer according to claim 1 is a compound of [ethoxylated styrene-(3-hydroxypropyl acrylate)], wherein Ra and Rb is independently hydrogen, and 1^ is independently hydrogen 'η is 3, and X and y are each 〇·5. 5142-4459-PF2.ptc 第19頁 1295295 ----- 案號 --—-^修正 六、申請專利範圍 4·如申請專利範圍第1項所述之有機抗反射塗層聚合 物’係聚[乙醯氧基苯乙烯-(兩烯酸羥丁酯)]之化合 其中Ra及Rb為各自獨立的氫’ R及Rn為各自獨立的 氣’ η為4,且X、y各為〇· 5。 5 ·如申請專利範圍第1項所述之有機抗反射塗層聚合 物’係聚[乙醯氧基苯乙烯甲基丙烯酸2-羥乙酯)]之化 ^物,其中Ra為氫及Rb為曱基氫,R’及R"為各自獨立的 氣,η為2,且X、y各為〇· 5。5142-4459-PF2.ptc Page 19 1295295 ----- Case No.----^ Amendment VI. Patent Application Range 4. The organic anti-reflective coating polymer 'system as described in claim 1 a combination of poly[acetoxystyrene-(hydroxybutyrate)] wherein Ra and Rb are each independently hydrogen 'R and Rn are independent gases 'η4, and X and y are each 〇 · 5. 5. The organic antireflective coating polymer according to claim 1 of the invention is a compound of poly [acetoxystyrene methacrylate 2-hydroxyethyl ester]], wherein Ra is hydrogen and Rb It is a mercapto hydrogen, R' and R" are independent gases, η is 2, and X and y are each 〇·5. 6·如申請專利範圍第1項所述之有機抗反射塗層聚合 物’係聚[乙醯氧基苯乙烯-(曱基丙烯酸3—羥丙酯)]之化 合物,其中Ra為氫及Rb為曱基,R,及R"為各自獨立的氫,η 為3,且X、y各為〇· 5。 7·如申請專利範圍第1項所述之有機抗反射塗層聚合 物’係聚[乙醢氧基苯乙浠—(4甲基丙烯酸4一輕丁酯)]之化 合物,其中Ra為氫及Rb為甲基,R,及R"為各自獨立的氫,η 為4,且X、y各為〇· 5。 8. —種有機抗反射塗層聚合物的製備方法,用以製備 如申請專利範圍第1項所述之聚合物,該方法包括:6. The organic antireflective coating polymer according to claim 1, wherein the compound is a compound of [ethoxylated styrene-(3-hydroxypropyl methacrylate)], wherein Ra is hydrogen and Rb It is a fluorenyl group, R, and R" are independent hydrogens, η is 3, and X and y are each 〇·5. 7. The compound of the organic anti-reflective coating polymer according to claim 1, wherein the compound is a compound of [ethoxyphenylidene 4-(4 butyl methacrylate)], wherein Ra is hydrogen. And Rb is a methyl group, R, and R" are each independently hydrogen, η is 4, and X and y are each 〇·5. 8. A method of preparing an organic anti-reflective coating polymer for preparing a polymer according to claim 1, wherein the method comprises: 在一溶劑中使乙醯氧基苯乙烯單體與氫氧基烷基丙烯 ^酉日單體反應以得到一產物;以及 利用一聚合反應起始劑聚合該產物。 9 ·如申請專利範圍第8項所述之有機抗反射塗層聚合 一的製備方法,其中自包括四氫呋喃、曱苯、苯、丁酮、 一氧六烧及其混合物的群組中選出該溶劑。The ethoxylated styrene monomer is reacted with a hydroxyalkyl propylene monomer in a solvent to obtain a product; and the product is polymerized using a polymerization initiator. 9. The method for preparing an organic anti-reflective coating layer according to claim 8, wherein the solvent is selected from the group consisting of tetrahydrofuran, toluene, benzene, methyl ethyl ketone, hexaoxane and mixtures thereof . 1295295 _ 案號90127504_年 ι 日 修正_____ 六、申請專利範圍 I 0 ·如申請專利範圍第8項所述之有機抗反射塗層聚合 物的製備方法,其中自包括2, 2’ -偶氮基觸媒、過氧化乙σ 醯、過氧化月桂基、三級-丁基過氧化物及其混合物的群 組中選出該聚合反應起始劑。 II ·如申請專利範圍第8項所述之有機抗反射塗層聚合 物的製備方法,其中在50至90 °C的溫度範圍下進行該聚合 反應。 1 2. —種抗反射塗層組合物,包括如申請專利範圍第1 項所述之聚合物之式1的化合物及如下列式2的化合物·1295295 _ Case No. 90127504_Year ι Day Amendment _____ VI. Application Patent Range I 0 · A method for preparing an organic anti-reflective coating polymer as described in claim 8 of the patent application, which includes 2, 2'-even The polymerization initiator is selected from the group consisting of a nitrogen-based catalyst, acetonitrile peroxide, a lauryl peroxide, a tertiary butyl peroxide, and a mixture thereof. A method for producing an organic anti-reflective coating polymer according to claim 8, wherein the polymerization is carried out at a temperature ranging from 50 to 90 °C. 1 2. An antireflective coating composition comprising a compound of the formula 1 as described in the first aspect of the patent application and a compound of the following formula 2 Rio R” 其中R1Q及Ru為個別獨立的Cwg炫氧基或^⑴炫基’且 Rl2為氫或甲基。 一 1 3 ·如申請專利範圍第1 2項所述之抗反射塗層、组。 物,其中該式1之化合物為聚[乙醯氧基苯乙烯一(丙烯®文2一 羥乙酯)]〇 一 14.如申請專利範圍第1 2項所述之抗反射塗層組&' 物,其中該式1之化合物為聚[乙醢氧基苯乙烯一(丙、酉文3 羥丙酯)]。 1 5 ·如申請專利範圍第1 2項所述之抗反射蜜層組^ 物,其中該式1之化合物為聚[6醯氧基苯乙烯一(丙、-文Rio R" wherein R1Q and Ru are each independently Cwg methoxy or ^(1) 炫' and Rl2 is hydrogen or methyl. 1-3 · Anti-reflective coating, group as described in claim 12 The compound of the formula 1 is a poly[acetoxy styrene-(propylene® hydroxyethyl 2-hydroxyethyl ester)] 〇- 14. The anti-reflective coating group according to claim 12 &', wherein the compound of the formula 1 is poly[acetoxy styrene-(propyl, hydrazine 3 hydroxypropyl)]. 1 5 · Anti-reflective honey as described in claim 1 a group of compounds wherein the compound of formula 1 is poly[6-methoxy styrene-(C,-- 5142-4459-PF2.ptc 第21貢 1295295 _案號 901275fU__生貝 j_ 六、申請專利範圍 羥丁酯)]。 1 6 ·如申請專利範圍第1 2項所述之抗反射塗層組合 物,其中該式1之化合物為聚[乙醯氧基苯乙烯-(曱基丙烯 酸2 -羥乙酯)]。 1 7 ·如申請專利範圍第1 2項所述之抗反射塗層組合 物,其中該式1之化合物為聚[乙醯氧基苯乙烯-(曱基丙烯 酸3 -羥丙酯)]。 1 8 ·如申請專利範圍第1 2項所述之抗反射塗層組合 物,其中該式1之化合物為聚[乙醯氧基苯乙烯-(甲基丙烯 酸4 -羥丁酯)]。 1 9 · 一種抗反射塗層的製備方法,包括: 將如申請專利範圍第1項所述之聚合物之式1的化合物 與式2之化合物溶解在一有機溶劑中以得一溶液; 過滤·該溶液以得一遽液; 將該濾液塗佈在基板的較下層之上,以在該較低層上 沉積一塗層;以及 硬烤該塗層。 2 0 ·如申請專利範圍第1 9項所述之抗反射塗層的製備 方法,其中自包括乙基3 -乙氧基丙酸酯、甲基3 -乙氧基丙 酸酯、環己酮及丙二醇甲醚乙酸鹽的群組中選出該有機溶 劑。 2 1 ·如申請專利範圍第1 9項所述之抗反射塗層的製備 方法’其中該有機溶劑的使用量視所用之該抗反射塗層的 總重量而為2 0 0至5 0 00wt%。5142-4459-PF2.ptc 21st tribute 1295295 _ case number 901275fU__ raw shell j_ six, the scope of patent application hydroxybutyl ester)]. The anti-reflective coating composition according to claim 12, wherein the compound of the formula 1 is poly[acetoxystyrene-(2-hydroxyethyl methacrylate)]. The anti-reflective coating composition of claim 1, wherein the compound of the formula 1 is poly[acetoxystyrene-(3-hydroxypropyl methacrylate)]. The antireflective coating composition of claim 1, wherein the compound of the formula 1 is poly[acetoxystyrene-(4-hydroxybutyl methacrylate)]. 1 9 · A method for preparing an anti-reflective coating comprising: dissolving a compound of the formula 1 of the polymer according to claim 1 of the patent application and a compound of the formula 2 in an organic solvent to obtain a solution; The solution is obtained as a mash; the filtrate is coated on a lower layer of the substrate to deposit a coating on the lower layer; and the coating is hard baked. The preparation method of the anti-reflective coating layer according to claim 19, wherein self-contained ethyl 3-ethoxypropionate, methyl 3-ethoxypropionate, cyclohexanone The organic solvent is selected from the group consisting of propylene glycol methyl ether acetate. 2 1 The method for preparing an anti-reflective coating according to claim 19, wherein the organic solvent is used in an amount of from 200 to 50,000 wt% depending on the total weight of the anti-reflective coating used. . 5142-4459-PF2.ptc 1295295 號 90127504 六、申請專利範圍 2 2 ·如申睛專利範圍第1 g項 方法’其中該硬烤步騍係在10() 行。 23· —種半導體裝置,由如 之抗反射塗層組合物所製備。 24· —種半導體裝置,由如 之抗反射塗層組合物所製備。 25. —種半導體裝置,由如 之抗反射塗層組合物所製 26· 一種半導體楚置,由如 之抗反射塗層組合物所製 27· —種半導體筆 、置,由如 之抗反射塗層組合物所製偌 28. —種半導體妒 侑。 之抗反射塗層組合物;’由* 29. —種半導體裝 。 之抗反射塗層組合物6夏,由如申請專利範圍第1 8項所述 所製備。5142-4459-PF2.ptc No. 1295295 No. 90127504 VI. Patent Application Range 2 2 · For example, the scope of the application of the patent scope is 1 g, where the hard-baked step is at 10 (). A semiconductor device prepared from, for example, an anti-reflective coating composition. A semiconductor device prepared from, for example, an anti-reflective coating composition. 25. A semiconductor device made of, for example, an anti-reflective coating composition. A semiconductor device is made of, for example, an anti-reflective coating composition.涂层28. A semiconductor 妒侑 fabricated by a coating composition. Anti-reflective coating composition; 'by * 29. - a semiconductor package. The anti-reflective coating composition 6 was prepared as described in item 18 of the patent application. 所述之抗反射塗層的製備 至300 °c的溫度範圍下進 申請專利範圍第1 2項所述 申請專利範圍第1 3項所 述 申請專利範圍第1 4項所述 申請專利範圍第1 5項所述 申請專利範圍第1 6項所述 申請專利範圍第1 7項所述The preparation of the anti-reflective coating is up to a temperature range of 300 ° C. The patent application scope of claim 1 is the patent application range. 5 of the above-mentioned patent application scope of claim 17 5142-4459-PF2.ptc 第23頁 1295295 述 六、申請專利範圍 22·如申請專利範圍第19 方法,其中該硬烤步驟係在i 行。 23· —種半導體裝置,由 之抗反射塗層組合物所製備< 24. —種半導體裝置,由‘ 之抗反射塗層組合物所 25. -種半導體裝置備由 之抗反射塗層組合物 26•-種半導體d 之抗m物所‘ 27· —種丰導體褽置, 之抗反射塗層組合私^ ’由 插主道%戶斤Μ備( 28· —種+導體裝 之抗反射塗層、址合物’由 29. —種半導體裴表備£ 之抗反射塗層組合从 < ’由 物所製傷。 項所述之抗反射塗層的製備 00至300 °c的溫度範圍下進 如申請專利範圍第1 2項所述 如申請專利範圍第1 3項所述 ) 如申請專利範圍第14項所述 ) 如申請專利範圍第1 5項所述 > 如申請專利範圍第1 6項所述 如申請專利範圍第1 7項所 如申請專利範圍第1 8項戶斤述5142-4459-PF2.ptc Page 23 1295295 Representation VI. Scope of Application 22 · The method of claim 19, wherein the hard roasting step is in the i line. 23. A semiconductor device prepared from an anti-reflective coating composition. 24. A semiconductor device comprising: an anti-reflective coating composition. Material 26•-A kind of anti-m material of semiconductor d' 27·--------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- The reflective coating, the address compound 'from the anti-reflective coating combination of the semiconductor type 从 从 从 从 从 ' ' ' ' ' ' ' ' ' 。 。 。 。 。 。 。 。 。 。 00 00 00 00 00 00 00 00 00 00 00 00 00 00 The temperature range is as described in item 12 of the patent application scope as described in item 13 of the patent application scope) as described in item 14 of the patent application scope) as described in item 15 of the patent application scope > If the scope of Article 16 is as described in Article 17 of the scope of application, the scope of the patent application is the 18th item. 5142-4459-PF2.ptc 第23頁5142-4459-PF2.ptc Page 23
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115873176A (en) * 2021-09-28 2023-03-31 上海新阳半导体材料股份有限公司 Bottom anti-reflection coating for DUV lithography and preparation method and application thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115873176A (en) * 2021-09-28 2023-03-31 上海新阳半导体材料股份有限公司 Bottom anti-reflection coating for DUV lithography and preparation method and application thereof
CN115873176B (en) * 2021-09-28 2023-09-26 上海新阳半导体材料股份有限公司 Bottom anti-reflection coating for DUV lithography and preparation method and application thereof

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